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RF GaNMarket
Applications, players, devices, and technologies 2018–2023
RF GaN Market
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REPORT OBJECTIVES
• Provide an overview of the RF GaN market.
• Analyze different players in different markets, along with their product range and technologies.
• Outline market access—market size evolution from 2017–2023 and technology split.
• Highlight the main technologies in the different applicative markets.
• Explain the needs of different RF markets and the corresponding impact on the needs for different technologies, along with geographical specificities.
RF GaN Market
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REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
RF GaN Market
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REPORT METHODOLOGY
Technology analysis methodology Information collection
RF GaN Market
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TABLE OF CONTENTS (1/4)
• Acronyms…………………………………………………………………......6
• Companies cited in this report……………………………………………...7
• Report objectives………………………...……………………………….......8
• Revision of our last GaN RF report……………………...……………….......9
– What’s new?
– Market forecast comparison
• Executive summary…………………………………………………………..12
• GaN RF devices: applications overview……………………………………30
– Applications for GaN devices in RF electronic systems
– Radio frequency band range and applications
– GaN devices: applications roadmap
– RF power applications as a function of frequency and power
– Technology trend in different markets
– What is important for a power amplifier
– RF Power devices: technology breakdown
– RF GaN devices: market size forecast
– RF GaN devices: device number forecast
– RF GaN devices: market breakdown
– Market overview (1/2)
– Market overview (2/2)
• Wireless infrastructure………………….……………………………42
– Cellular technology development
– 2017 LTE deployment, companies, and countries mapping
– Global connections by technology
– 5G technology adoption: operator’s timeline
– Operator’s dilemma
– Cellular network structure
– Future cellular network structure and base stations
– Example of a cellular network mixed with small cells
– How to expand the network capacity?
– Macro cell base station circuit
– BTS power amplifier(1/3)
– BTS power amplifier(2/3)
– BTS power amplifier(3/3)
– Small cell base station circuit
– Why small cells?
– Repeater circuit
– Typical LTE base station and cell tower
– Remote radio head circuit
– Backhaul for Point-to-Point (PtP) and Point-to-Multipoints (PtMP)
– Wireless backhaul circuit
– 5G network requirements compared to 4G
– Key enabling technologies for 5G
– Main trend
– Enhanced mobile broadband
– New radio design
– Radio network evolution
– Future development in telecom base stations
– Base station type and number forecast
– Small cell forecast
– Estimated RF GaN device need in telecom
– Estimated total market for RF GaN device in telecom
– Conclusions
RF GaN Market
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TABLE OF CONTENTS (2/4)
• Defense………………………………………………………………………..84
– GaN technology’s development history
– GaN application potential in defense market
– Military radar
– Military RF applications and frequency bands
– GaN applications in radar systems (1/2)
– GaN applications in radar systems (2/2)
– GaN applications in EW/IED jammers
– GaN applications in electrical countermeasures
– GaN RF applications in military communications
– Market drivers for GaN RF in defense applications
– Military market impact on GaN industry
– Roadmap for RF transistor volume in defense applications
– Estimated total accessible market for GaN FET in defense
– Defense: GaN product scheme
– Conclusions
• Civil radar & avionics…………………………………………………………99
– Commercial/scientific radar
– Commercial avionics
– Land mobile
– Device development trend in land mobile PA
– Weather radar
– RF GaN transistor volume in NON-military RADAR applications
– RF GaN transistor market size in NON-military RADAR applications
• CATV market…………………………………………………………………………...107
– CATV: the basics
– Market drivers for GaN electronics in CATV (1/3)
– Market drivers for GaN electronics in CATV (2/3)
– Market drivers for GaN electronics in CATV (3/3)
– Evolution of DOCSIS 3.1
– CATV market in geographical terms
– HFC and FTTH comparison
– CATV market evolution:
RF GaN devices: estimated yearly Needs for CATV Market
RF GaN devices: estimated market size for CATV Market
– Conclusions
• Satellite communications market ……………………………………………………...121
– Where do we use GaN in satellite applications?
– Market drivers for GaN RF in SATCOM
– Market drivers for GaN electronics in V-SAT
– Future development in SATCOM market
– GaN implementation in VSAT T&R unit
– RF GAN devices: estimated yearly needs for V-SAT market (units)
– RF GaN devices: estimated yearly needs for SATCOM market (units)
– RF GaN devices: estimated Market size for VSAT market
– RF GaN devices: estimated Market size for SATCOM market
– Satellite communications: GaN RF product scheme
– Conclusions
RF GaN Market
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TABLE OF CONTENTS (3/4)
• RF energy………………………………………………………….…..130
– RF GaN device for RF energy
– Microwave ovens (1/2)
– Microwave ovens (2/2)
– Plasma lighting
– Estimated yearly needs for RF energy market
– Estimated yearly Market size for RF energy market
– Conclusions
• RF GaN HEMT technology overview………………………………………138
– RF components overview (1/2)
– RF components overview (2/2)
– Power and frequency regions for different semiconductors
– GaN HEMT DEVICE structure
– GaN / SiC / Si / GaAs: material properties
– GaN / SiC / Si / GaAs: power transistor comparison
– GaN’s Added values
– Advantages at the system level for PA, LNA, and RF switch
– GaN MMIC description
– Device life model and activation energy
– Reliability test of today and the difficulties
– GaN HBT for cellphone applications?
• Package for RF GaN……………………………………………………154
– Copper flange presentation
– RF power transistor design
– Why using copper instead of other materials?
– What does “pure copper flange” mean?
– Challenges to face to switch to copper substrate
– Die attach
– Welding for GaN
– Focus on die attach: materials
– Hermetic package
– Hermetic: definition
– Non hermetic: definition
– Construction of a typical RF ceramic package
– Construction of a typical LDMOS package
– Non hermetic plastic package
– RF non-hermetic package drivers
– RF non-hermetic package barriers
– RF package type and hermeticity
– From air cavity to over molded packages
– GaN device package as of 2017
– Driver for plastic package
– Device package trend in the future
– GaN RF packaging roadmap
– Conclusions
• GaN RF devices: industrial landscape………………………………………193
– Major GaN RF players and their device frequency range (1/2)
– Major GaN RF players and their device frequency range (2/2)
– Main GaN RF players and their target applications
– Market landscape
– Mapping: american players for power RF GaN-based devices (1/2)
RF GaN Market
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TABLE OF CONTENTS (4/4)
– Mapping: american players for power RF GaN-based devices (2/2)
– Mapping: european players for power RF GaN-based devices
– Mapping: asian players for power RF GaN-based devices
– Special focus on China
– Debating between IDM and fabless in the GaN industry
– Global Industrial supply chain GaN
– GaN RF Foundry technology comparison
– Estimate of GaN RF player market share
– Global industrial supply-chain
– RF power industry
– Conclusions
• Special focus on GaN RF technology…………………………………...……210
– Commercially available gan-on-sic devices vs. gan-on-silicon devices
– GaN RF substrate diameter evolution
– GaN-on-silicon vs. gan-on-sic: comparison
– GaN-on-SiC an GaN-on-Silicon market strategies
– Gan-on-sic and gan-on-silicon: Future development scheme
– Competition trend
– Forecast of GaN on SiC/Silicon market size comparison
– Where lies the opportunity?
• General conclusions…………………………………………………………221
RF GaN Market
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Biographies & Contacts
ABOUT THE AUTHORS
Hong LIN
Dr. Hong Lin has worked at Yole Développement since 2013 as a Technology & Market Analyst. She specializes in compoundsemiconductors and provides technical and economic analysis. Before joining Yole Développement she worked as an R&DEngineer at Newstep Technologies, heading up development of PECVD cold cathodes for nanotechnology-based visible and UVlamp applications. She holds a Ph.D. in Physics and Chemistry of Materials.
Zhen Zong
Zhen Zong works at Yole Développement as an Analyst for Power Electronics and Compound Semiconductors. He graduatedfrom INSA Lyon with an Engineering degree in Material Sciences, specializing in semiconductor devices and micro/nanotechnologies.
RF GaN Market
10
Aethercomm, Alcatel-Lucent, Ampleon, Anadigics, AT&T, Bell Laboratory, Cisco, China Mobile,
China Telecom, China Unicom, Cree, Dynax, Dowa, EADS, Epigan, Ericsson, Eudyna, Freiburg/
Univ. Ulm/Fraunhofer IAF, Filtronic, Freescale, Fujitsu, Global Communication Semiconductors,
Hittite/Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Intel, IQE, KDDI, KT, LG Plus, Lockheed
Martin, M/A-COM, Microsemi, Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC, Nitronex,
Norstel, Nokia Networks, Northrop Grumman, NTT, NTT DOCOMO, NXP, OMMIC, Powdec,
Qorvo, Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, SICC, SiCrystal, SK Telecom, Softbank,
Sprint, STMicroelectronics, Sumitomo Electric, Enkris Semiconductor, Raytheon, TankeBlue, Telstra,
Thales, Thales III-V Lab, T-Mobile, Toshiba, Triquint, UMS, Unity Wireless, Verizon, Vodafone, WIN
Semiconductors, Wolfspeed, and ZTE...
LIST OF COMPANIES MENTIONED IN THIS REPORT
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RF POWER DEVICES: MARKET SIZE FORECAST
Overall market size increases from $380Mto $1.3B.
RF GaN Market
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DIFFERENT SEGMENT OF MARKET
Different markets and drivers for RF
Power development are presented
and explained.
RF GaN Market
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RF POWER TRANSISTOR DESIGN
Standard package used for LDMOS device.
We present here an example of RF device for base-station application.
Standard design of the module uses a substrate (called substrate or flange depending on the players, or even heatsink if no other heatsink is used).
Window frame and lid are made of ceramics (high thermal conductivity and electrical isolation).
Die attach material and process depend on material used for substrate.
die
Cap (Ceramic)
Ceramic frameEpoxy glue
Lead
Metal flange
Soldered or
sintered region
Package Opening side–
Optical View
Wire
bondingCu/Mo/Cu
substrate
RF GaN Market
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GAN RF PACKAGING ROADMAP
Both materials and design are evolving in RF power package
2016 2020 2025 and beyond
Flange Mateiral
Die attach
B CA
Package Case
MateiralA B C
B
A C
RF GaN Market
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BUSINESS MODE COMPARISON
IDM vs. Foundry
• Today leading players are IDMs, people would love
to have a production line inside of the company in
order to have better control of the process and
yield.
• However in the future, with the maturity of the
technology and the pressure of production
capacity, we might be seeing more foundries.
RF GaN Market
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RF POWER INDUSTRY
Supply chain and events
LDMOS foundry, enter GaN on
Si power business in 2016
GaN foundry
TriQuint
and RFMD
merged in
2014
US Department
of Defense
investment in
GaN
technology
Former TriQuint
employeesAcquired by
ADI in 2017Acquired by
ADI in 2015
Nitronex acquired
by MACOM in
2014
Licensed GaN on Si
for power application
IR acquired by
Infineon in 2014
MACOM sues Infineon
for GaN on Si IP
Ericsson’s
LDMOS
business
MACOM was licensed GaN on SiC
from GCS but later ended.
GaN foundry
GaN foundry
Partnership
NXP and Freescale
merged in 2015
Former
NXP RF
power unit
becomes
Ampleon
LDMOS
foundry
GaAs foundry
GaAs foundry
Joint
Venture
Acquired
in 2008
GaN on Si
power foundry
GaN on Si
packageGaN Power
LDMOS
GaAs
+
GaN RF
RF GaN Market
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GLOBAL INDUSTRIAL SUPPLY-CHAIN
Different business model exist in the RF power market.
Wafers Epiwafers
A
F
E
C
H
O
I
K
M
X
L
Z
Y
J
W
GPure device foundries
V
6
7
8
11
5
4
10
9
B
D
1
2
U
T
13
14
15
16
17
18
*non-exhaustive list
12
P
Q
R
S
19
*There’s no direct supply
correspondence between
different columns!
N
Material providers Devices SystemsPA Modules
Microsemi
Fabless
design
house3
RF GaN Market
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GAN ON SILICON & GAN ON SIC COMPARISON
The comparison of GaN-on-Si and GaN-on-SiChas been one of the most concerned questions in GaN RF industry.
GaN
On
SiC
GaN
On
Silicon
RF GaN Market
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RELATED REPORTS
Discover more related reports within our bundles here.
RF GaN Market
In the last couple of years, the radiofrequency (RF) GaN market experienced impressive growth and has reshaped the RF power industry landscape. By the end of 2017, the total RF GaN market was close to $380M.
The penetration rate in various markets, and in particular telecom and defense applications, had a breakout period in the last two years. The compound annual growth rate (CAGR) in these two markets is more than 20%. Another significant boost will occur around 2019–2020, led by the implementation of 5G networks. The total RF GaN market size will be a factor of 3.4 larger by the end of 2023, posting a 22.9% CAGR from 2017-2023.
This report describes GaN’s presence and development in dif ferent markets, including wireless infrastructure, defense and aerospace,
satellite communication, wired broadband, both in coaxial cables used in cable TV (CATV) and fiber-to-the-home, and other industrial, scientific and medical (ISM) radio band applications. It also offers a complete analysis covering different emerging GaN players such as Sumitomo Electric, Wolfspeed, Qorvo, M-A/COM, UMS, NXP, Ampleon, RFHIC, Mitsubishi Electric, Northrop Grumman, and Anadigics. The report looks at GaN devices developed and implemented in applications spanning radar, base transceiver stations, CATV, very small aperture terminal (VSAT) satellite ground stations, and jammers.
We invite you to read our report and discover more details about the wireless infrastructure and defense markets, as well as other applicative markets such as CATV and satellite communication.
RF GAN MARKET: APPLICATIONS, PLAYERS, TECHNOLOGY, AND SUBSTRATES 2018-2023Market & Technology report - January 2018
A THREEFOLD INCREASE OVER THE NEXT FIVE YEARS
With 5G implementation coming, RF GaN market is developing fast.
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Application market descriptions,
including wireless infrastructure such as LTE and 5G, defense, civil radars, cable TV and fiber, satellite communications
• Market size projection through 2023
• Player landscape: product and foundry service analysis, target application, business model, market share
• State-of-the-art in GaN HEMT technology
• RF GaN wafer market • Comparison between two
different GaN technologies: GaN-on-SiC and GaN-on-silicon
• RF GaN development trend: Yole Développement’s vision
WHAT’S NEW• Update of our RF GaN report
with newest market developments and technology trends
• Discussion about GaN-on-SiC and GaN-on-silicon market development
• Technology development in different RF GaN markets and the competitive landscape
• Main RF power players and their technology development status
• Different business models in the industry
CAGR + 22,9%
Military 38%
Telecom 40%
Others* 22%
2017
Military 34%
Telecom 43%
Others* 23%
2023
*Others: satellite communication, cable TV...
380M$ 1.3B$
(Yole Développement, January 2018)
TELECOM AND DEFENSE MARKETS ARE THE DRIVING FORCE
Yole Développement envisions telecom and defense
markets acting as the mainstay of the industry.
The telecom market, thanks to the increasing
development pace of 5G networks, will bring a
huge opportunity for GaN devices beginning in
2018. Compared to existing silicon LDMOS and
GaAs solutions, GaN devices are able to deliver
the power/efficiency level required for next
generation high frequency telecom networks.
Also, GaN’s broadband capability is one of the key
elements for enabling important new technologies, such as multi-band carrier aggregation. GaN HEMTs have been the candidate technology for future macro base station power amplifiers. Yole Développement estimates most sub-6GHz macro network cell implementation will use GaN devices because LDMOS can no longer hold up at such high frequencies and GaAs is not optimum for high power applications. However, because small cells do not need such high power existing technology like GaAs still has advantages. At the same time,
RF GaN device market: breakdown by application
RF GaN MARKET: APPLICATIONS, PLAYERS, TECHNOLOGY, AND SUBSTRATES 2018-2023
WHICH IS THE RIGHT WAY TO DEVELOP: INTEGRATED OR FOUNDRY-BASED MANUFACTURING? GaN-ON-SiC OR GaN-ON-SILICON?
After decades of development, GaN technology is now accessible across different continents. Leading players include Sumitomo Electric, Wolfspeed (Cree), Qorvo, as well as many other players in US, Europe and Asia.
Compound semiconductors differ from the traditional silicon-based semiconductor industry. The epitaxy process is much more important than conventional silicon processes, affecting the quality of the active region, with a huge impact on device reliability. That’s the reason why today leading companies are strong in these processes and would love to have internal production capacity, keeping technology know-how secret.
Nevertheless, fabless design houses are developing very fast with their foundry partners to provide GaN technology. With their good relationship and
sales channels, leading players like NXP and Ampleon might change the competitive landscape.
At the same time, there are also two competing technologies in the market: GaN-on-SiC and GaN-on-silicon. They use different materials as their substrates but share similar characteristics. In the theory, GaN-on-SiC has better performance and today most players are using this technology. However, companies like M/A-COM are pushing GaN-on-Silicon to be implemented in various applications. It is still early, but for now GaN-on-silicon remains a challenger to the incumbent GaN-on-SiC solution.
Our previous report covered several different scenarios and their potential impact on the overall RF GaN market and its players. In this new version we develop different scenarios, and present a new perspective on the market’s size.
market volumes will increase faster because higher frequencies reduce the coverage of each base station, and thus more transistors will be implemented.
The defense market has been the major driving force for GaN development in the past decades. Originating in the US Department of Defense, GaN devices have been implemented in new generation aerial and ground radars. GaN’s high power capability improves detection range and resolution, and designers are becoming increasingly familiar with this new technology.
Nevertheless, this military-related technology is very sensitive. And as GaN devices are becoming popular in defense applications, the development of the non-military part could be affected. This is especially true in terms of mergers and acquisitions. Governments could block deals if businesses target military applications, as in Aixtron’s acquisition by FGC Investment Fund, or Wolfspeed’s by Infineon.
We invite you to read our report and discover more details about the wireless infrastructure and defense markets, as well as other applications like wired network and satellite communication.
Business model comparison: Integrated Device Manufacturer vs. foundry
(Yole Développement, January 2018)
IDM*
IDM
2017 2023
Design house
Foundry
Design House
Foundry
Control of process + Manufacturing yield IDM majority
Technology mature + Production capacity Foundry increase
Main trends in telecom base stations 2015-2025
(Yole Développement, January 2018)
mmWave
Small cells
Massive MIMO (Multiple-Input
Multiple-Output
Carrier Aggregation
Beam Forming
III/V device like GaN and GaAs
III/V device like GaN and GaAs
Antenna Array
Broadband capability
GaN
Higher frequency and better efficiency
More compacted size
GaN
Higher power density
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)Aethercomm, Alcatel-Lucent, Ampleon, Anadigics, AT&T, Bell Laboratory, Cisco, China Mobile, China Telecom, China Unicom, Cree, Dynax, Dowa, EADS, Epigan, Ericsson, Eudyna, Freiburg/Univ. Ulm/Fraunhofer IAF, Filtronic, Freescale, Fujitsu, Global Communication Semiconductors, Hittite/Keragis, Huawei, II-VI Inc, IMEC, IMECAS Infineon, Intel, IQE, KDDI, KT, LG Plus, Lockheed Martin, M/A-COM, Microsemi, Mitsubishi Chemical, Mitsubishi Electric, Motorola, NEC, Nitronex, Norstel, Nokia Networks, Northrop Grumman, NTT, NTT DOCOMO, NXP, OMMIC, Powdec, Qorvo, Qualcomm, RFHIC, RF Lambda, RFMD, Samsung, SICC, SiCrystal, SK Telecom, Softbank, Sprint, STMicroelectronics, Sumitomo Electric, Enkris Semiconductor, Raytheon, TankeBlue, Telstra, Thales, Thales III-V Lab, T-Mobile, Toshiba, Triquint, UMS, Unity Wireless, Verizon, Vodafone, WIN Semiconductors, Wolfspeed, and ZTE...
AUTHORSZhen Zong works at Yole Développement as an Analyst for Power Electronics and Compound Semiconductors. He graduated from INSA Lyon with an Engineering degree in Material Sciences, specializing in semiconductor devices and micro/nano technologies.
Revision of our last GaN RF report 9
> What’s new?> Market forecast comparison
Executive summary 12
GaN RF devices: applications overview 30> Applications for GaN devices in RF electronic systems> Radio frequency band range and applications> GaN devices: applications roadmap> RF power applications as a function of frequency
and power> Technology trend in different markets> RF power devices: technology breakdown> RF GaN devices: market forecast> Market overview
Wireless infrastructure 42> Cellular technology development> 5G technology adoption: operator’s timeline> Operator’s dilemma> Future cellular network structure and base stations> How to expand the network capacity?> Why small cells?> Typical LTE base station and cell tower> Backhaul for Point-to-Point (PtP) and Point-to-
Multipoints (PtMP)> Key enabling technologies for 5G> Future development in telecom base stations> Base station type and number forecast > Small cell forecast > Estimated RF GaN device need in telecom> Estimated total market for RF GaN device in telecom
Defense 84> GaN application potential in defense market> Military radar> Military RF applications and frequency bands> Market drivers for GaN RF in defense applications> Military market impact on GaN industry> Roadmap for RF transistor volume in defense applications> Estimated total accessible market for GaN FET in
defense> Defense: GaN product scheme
Civil radar & avionics 99> Commercial/scientific radar > Commercial avionics> Land mobile> Device development trend in land mobile PA> Weather radar> RF GaN transistor volume & market in NON-military > RADAR applications
CATV market 107> Market drivers for GaN electronics in CATV> Evolution of DOCSIS 3.1> CATV market in geographical terms > HFC and FTTH comparison>CATV market evolution:
Satellite communications market 121> Market drivers for GaN RF in SATCOM> Market drivers for GaN electronics in V-SAT
> Future development in SATCOM market> GaN implementation in VSAT T&R unit> Satellite communications: GaN RF product scheme > Conclusions
RF energy 130> RF GaN device for RF energy> Microwave ovens> Plasma lighting> Estimated yearly needs & market size for RF energy
market
RF GaN HEMT technology overview 138> Power and frequency regions for different
semiconductors> GaN HEMT device structure> GaN / SiC / Si / GaAs: material properties & power
transistor comparison> GaN’s added values> Advantages at the system level for PA, LNA,
and RF switch> GaN MMIC description> Device life model and activation energy> Reliability test of today and the difficulties> GaN HBT for cellphone applications?
Package for RF GaN 154> Copper flange presentation> RF power transistor design> Why using copper instead of other materials? > Challenges to face to switch to copper substrate> Focus on die attach: materials> Hermetic package> Construction of a typical RF ceramic package
& LDMOS package> Non hermetic plastic package> RF non-hermetic package drivers & barriers> GaN device package as of 2017> Driver for plastic package> Device package trend in the future> GaN RF packaging roadmap
GaN RF devices: industrial landscape 193> Main GaN RF players and their target applications> Market landscape> Mapping: players for power RF GaN-based devices> Special focus on China> Debating between IDM and fabless in the GaN
industry> Global industrial supply chain GaN> Estimate of GaN RF player market share> Global industrial supply-chain
Special focus on GaN RF technology 210> GaN RF substrate diameter evolution> GaN-on-silicon vs. gan-on-sic: comparison & future
development scheme > Forecast of GaN on SiC/Silicon market size
comparison> Where lies the opportunity?
General conclusions 221
Yole Développement presentation 232
TABLE OF CONTENTS (complete content on i-Micronews.com)
Dr. Hong Lin has worked at Yole Développement since 2013 as a Technology & Market Analyst. She specializes in compound semiconductors and provides technical and economic analysis. Before joining Yole Développement she worked as an R&D Engineer at Newstep Technologies, heading up development of PECVD cold cathodes for nanotechnology-based visible and UV lamp applications. She holds a Ph.D. in Physics and Chemistry of Materials.
• RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
• Wolfspeed RF GaN HEMT CGHV40100F
• GaN Devices for Power Electronics Patent Investigation
Find all our reports on www.i-micronews.com
RELATED REPORTBenef i t f rom our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages
OBJECTIVES OF THE REPORT• Provide an overview of the RF GaN market• Analyze different players in different markets, along with their product range and technologies• Outline market access/market size evolution from 2017–2023 broken down by technology• Highlight the main technologies in the different markets• Explain the needs of different RF markets and the corresponding impact on the needs for
different technologies, along with geographical considerations
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr
MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com
REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports
CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])
© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
24©2018 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS & Sensors
Solid State Lighting(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Software
25©2018 | www.yole.fr | About Yole Développement
3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
26©2018 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
27©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
28©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
29©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors,
R&D centers
30©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
31©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent
investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
32©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/3)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors & Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Gas & Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF & Photonic Technologies for 5G Infrastructure 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− RF Front-End Modules in Smartphones
− RF GaN *
o PATENT ANALYSES – by KnowMade
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Imaging for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− CMOS Image Sensors
− Compact Camera Modules
o PATENT ANALYSES – by KnowMade
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed
33©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates
Like PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− RF Front-End SiP
− Fan-Out Packaging *
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Manufacturing Wafer Starts for More than Moore 2018
− Equipment for More than Moore: Technology & Market Trends for Lithography &
Bonding/Debonding 2018
− Equipment for More than Moore: Technology & Market Trends for Thin Film
Deposition & Etching 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Wafer Bonding Technology Overview 2018
MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
o QUARTERLY UPDATE – by Yole Développement
− Memory Market 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN 2018 – Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Power SiC Devices
− Power GaN Devices
o PATENT ANALYSES – by KnowMade
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
34©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/3)
POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
o QUARTERLY UPDATE – by Yole Développement
− Power ICs Market 2018 – Update
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
o PATENT ANALYSES – by KnowMade
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
35©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING & PHOTONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology & Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Embedded Software in Vision Systems
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology & Market Analysis 2017
36©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES & ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
o QUARTERLY UPDATE – by Yole Développement
− Power Management ICs Market 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends
37©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
38©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience. Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager
39©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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