Ibm power7

Tom Presotto - October 2010

A long walk … together

S/38 August 79

IBM Vimercate

S/38 manufacturing plant.

February 79

Back to the basis

1990 – 2010

Windows

client-server

model

1979 – Mainframe and

“dumb” terminals

2010 – Cloud Computing

and browser

SOA & Cloud

4

POWER8

POWER4™180 nm

POWER5™130 nm

POWER6™65 nm

POWER745 nm

POWER5 POWER5+™ POWER6 POWER7

Technology 130 nm 90 nm 60 nm 45 nm

Size 389 mm2 245 mm2 341 mm2 567 mm2

Transistors 276 M 276 M 790 M 1.2 B

Cores 2 2 2 4 / 6 / 8

Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz

L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core

L3 Cache 36 MB 36 MB 32 MB 4 MB / Core

Memory Cntrl 1 1 2 / 1 2 / 1

LPAR 10 / Core 10 / Core 10 / Core 10 / Core

20012004

20072010

POWER4™

p670

1.1 GHz

rPerf: 24.46

KWatts: 6.71

3.64

POWER4+™

p670

1.5 GHz

rPerf: 46.79

KWatts: 6.71

6.97

POWER5™

p5-570

1.65 GHz

rPerf: 68.4

KWatts: 5.2

13.15

POWER5+™

p570

1.9 GHz

rPerf: 85.20

KWatts: 5.2

16.38

POWER6™

Power 570

4.7 GHz

rPerf: 134.35

KWatts: 5.6

23.99

POWER6™

Power 570

4.2 GHz

rPerf: 193.25

KWatts: 5.6

34.56

POWER7™

Power 780

3.8 GHz

rPerf: 685.09

KWatts: 6.4

107.04

Performance per Watt

POWER7 Core

6

Transistors: 1.2 B

Binary Compatibility with POWER6

• 4 Way SMT per core – up to 4 threads per core

• 32 Threads per chip

• L1: 32 KB I Cache / 32 KB D Cache

• L2: 256 KB per core

• L3: Shared 32MB on chip eDRAM

Eight processor

cores

POWER7 Core

7

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

L3 Cache and

Chip Interconnect

MC1MC0

12 Execution Units

• 2 Fixed Point Units

• 2 Load Store Units

• 4 Double Precision Floating Point Units

• 1 Branch

• 1 Condition Register

• 1 Vector Unit

• 1 Decimal Floating Point Unit

64-bit PowerPC architecture v2.07

Modes: POWER6, POWER6+ and POWER7

L3 Cache

eDRAM

Fast Local Regions

Shared L3 Cache

Intelligent cache management

On chip cache

benefits

6-to-1 latency

improvement

2 x bandwidth

improvement

No off-chip drv & rcv

20% energy of SRAM

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

POWER7

CORE

L2 Cache

L3 Cache and

Chip Interconnect

MC1MC0

Local SMP Links

Remote SMP & I/O Links

FAST

L3 REGION

POWER6

Memory+

GX+ Bridge

Memory+

GX Bus Cntrl Mem

ory

Cn

trl

Mem

ory

Cn

trl

Fabric BusController

CoreAlti

Vec

L3Ctrl

L3L3Ctrl

L3

CoreAlti

Vec

4 MB L2

4 MB L2

POWER7

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

SMP

FABRIC

POWER

BUS

Memory++

L3 Cache

POWER7 delivers up to 3 - 4X the performance with less energy than

POWER6

10

DDR2 @ 553 MHz

POWER5

Effective Bandwidth:

1.1 GB/s

DDR2 @ 553 / 667 MHz

POWER6

DDR3 @ 1066 MHz

POWER7

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

Effective Bandwidth:

2.6 GB/s Effective Bandwidth:

6.4 GB/s

2 memory controller

Up to 256GB of memory

11

EDRAM Cell

Greater density

Less power requirements

Fewer soft errors

Better performance

Enables POWER7 to provide 32MB of internal L3 Cache

1/3 the space of conventional 6T SRAM implementation

1/5 the standby power

1.5 Billion reduction in transistors

12

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

S

M

P

F

A

B

R

I

C

P

O

W

E

R

B

U

S

32 MB L3 Cache

POWER7 TurboCore™ Mode TurboCore Chips: 4 available cores

Aggregation of L3 Caches of unused cores.

TurboCore chips have a 2X the L3 Cache per Chip available

4 TurboCore Chips L3 = 32 MB

Provides up to 1.5X per core to core

Chips run at higher frequency

Power reduction of unused cores.

With “Reboot”, System can be reconfigured to 8 core mode.

Unused

CoreTurboCores

Power 780 TurboCore

13

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

S

M

P

F

A

B

R

I

C

P

O

W

E

R

B

U

S

24 MB L3 Cache

POWER7 Core / Cache options 6-Core Chip

Power 750 / Power 770

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

S

M

P

F

A

B

R

I

C

P

O

W

E

R

B

U

S

16 MB L3 Cache

4-Core Chip

PS700

14

Multi-threading Evolution

FX0

FX1

FP0

FP1

LS0

LS1

BRX

CRL

Single thread Out of Order

FX0

FX1

FP0

FP1

LS0

LS1

BRX

CRL

S80 Hardware Multi-thread

FX0

FX1

FP0

FP1

LS0

LS1

BRX

CRL

POWER5 2 Way SMT

FX0

FX1

FP0

FP1

LS0

LS1

BRX

CRL

POWER7 4 Way SMT

Thread 1 ExecutingThread 0 ExecutingNo Thread Executing

Thread 3 ExecutingThread 2 Executing

15

POWER7 4 way SMT

Standard Cache Option

All cores active

• POWER6 Mode supports SMT1 and SMT2

Requires POWER7

Mode

• AIX 6.1 and AIX 7.1

• IBM i 6.1 and 7.1

• Linux

Operating System Support

• Spread work among cores to execute in appropriate threaded mode

• Can dynamical shift between modes as required: SMT1 / SMT2 / SMT4

Dynamic Runtime SMT scheduling

0

0,5

1

1,5

2

SMT1 SMT2 SMT4

Active Memory Expansion

Expand memory beyond physical limits

More effective server consolidation

• Run more application workload / users per partition

• Run more partitions and more workload per server

Expanded

MemoryTrue

Memory

Effectively up to 100% more memory

True

Memory

True

Memory

True

Memory

True

Memory

True

Memory

Expanded

Memory

Expanded

Memory

Expanded

Memory

Expanded

Memory

Expanded

Memory

Active Memory Sharing

Moves memory from one partition

to another

AXI, IBM i, and Linux

partitions0

5

10

15

Night

Day

0

5

10

15

Asia

Americas

Europe

Time

Time

Me

mo

ry U

sa

ge

(G

B)

Mem

ory

Usage (

GB

)0

5

10

15#10

#9

#8

#7

#6

#5

#4

#3

#2

#1 Time

Mem

ory

Usage (

GB

)

Around the World

Day and Night

Infrequent Use

18

EnergyScale™

IBM Systems Director is also required to manage AEM functions and supports the following functions:

• Power Trending

• Thermal Reporting

• Static Energy Saver Mode

• Dynamic Energy Saver Mode

• Energy Capping

• Soft Energy Capping

• Processor Nap

• Energy Optimized Fan Control

• Altitude Input

• Processor Folding

18

EnergyScale is used to dynamically optimizes the processor performance versus processor power and system workload

TPMD:

Thermal Power Management Device

19

TPMD card is part of the base hardware configuration.

TPMD function is comprised of a risk processor and data acquisition

TPMD monitor power usage and temperatures in real time

Can adjust the processor power and performance in real time

If the temperature exceeds an upper (functional) threshold, TPMD actively reduces power consumption by reducing processor voltage and frequency or throttling memory as needed.

20

POWER7 “Over Clock” Uplift

3

3,2

3,4

3,6

3,8

4

4,2

4,4

Nominal Over Clock

If the temperature is lower than upper (functional) threshold, TPMD will allows POWER7 cores to “Over clock” if workloads demands are present.

Offerings - April 2010

Power 750 Express

Power 755

Power 770

Power 780

PS700 Express

PS701 Express

PS702 Express

Power 770

Power 750

Power 780

PS Blades

Power 755

Power 720/740

Power 710/730

HPC

Power 795

New modelsAugust 2010

Power 710 4-6-8 core

1 socket Processor module – pick ONE

4-core: 3 GHz 6-core: 3.7 GHz 8-core: 3.55 GHz

For 4-core (1 socket)

– Zero 12X I/O loops

– Max 1 4X IB Adapter

– Max 64 GB memory

– Disk-only drawers

– Fibre Channel cards ok

– IBM i P05 tier (users)

– AIX small tier

2U

For 6-/8-core (1 socket)


– Max 1 4X IB Adapter





– AIX small tier


2 sockets Processor module – pick

TWO of the same feature 4-core: 3 GHz 4-core: 3.7 GHz 6-core: 3.7 GHz 8-core: 3.55 GHz

For 8-/12-/16-core


– Max 2 4X IB Adapters


– Disk-only drawers ok


– IBM i P20 tier (5250)

– AIX small tier

2U


1 socket Processor module – pick ONE

4-core: 3 GHz 6-core: 3 GHz 8-core: 3 GHz

For 4-core



– Zero disk-only drawers



– AIX small tier

For 6-/8-core

– Max 1 12X I/O loop





– AIX small tier

4U

Power 740 4-6-8-12-16 core

1 or 2 sockets

Pick processor modules 1 or 2: 4-core: 3.3 GHz

1 or 2: 4-core: 3.7 GHz

1 or 2: 6-core: 3.7 GHz

2: 8-core: 3.55 GHz

For 4-,6-core (1 socket)

– Max 1 12X I/O loop


– IBM i P20 tier

5250 Entitlements

– AIX small tier

For 8-,12-,16-core (2 socket)

– Max 2 12X I/O loops


– IBM i P20 tier

5250 Entitlements

– AIX small tier

4U

POWER7 delivers outstanding performance

Single core CPW

NB CPW measured in maximum system and I/O configuration

3800 4700 5950

525

POWER5

550

POWER5

520

POWER6

550

POWER6

720

POWER7

740

POWER7

20,000

40,000

60,000

80,000

CPW

Power 750

28

4 Socket 4U

6 or 8 cores per socket

3.0 to 3.55 GHz

Energy-Star Qualified

29

Power 750 System Overview

8 SFF Bays(Disk or SSD)

Dual Power Supplies

Half-High Bay (tape or removable disk

Up to 4 Processor / Memory

Cards

3 PCIe & 2 PCI-X Slots

Fans

TPMD

DVD

30

Power 750 System

POWER7 Architecture6 Cores @ 3.3 GHz8 Cores @ 3. 0, 3.3, 3.55 GHzMax: 4 Sockets

DDR3 Memory Up to 512 GB

System Unit SAS SFF BaysUp to 8 Drives (HDD or SSD)73 / 146 / 300GB @ 15k (2.4 TB)(Opt: cache & RAID-5/6)

System UnitIO Expansion Slots

PCIe x8: 3 Slots (2 shared)PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards

Integrated SAS / SATA Yes

System UnitIntegrated Ports

3 USB, 2 Serial, 2 HMC

Integrated Virtual EthernetQuad 10/100/1000 Optional: Dual 10 Gb

System Unit Media Bays 1 Slim-line DVD & 1 Half Height

IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX

Cluster 12X SDR / DDR (IB technology)

Redundant Power andCooling

Yes (AC or DC Power)Single phase 240 VAC or -48 VDC

Certification (SoD) NEBS / ETSI for harsh environments

EnergyScaleActive Thermal Power ManagementDynamic Energy Save & Capping

Power 755

31

Power 755 and Power 750 hardware is very, very similar, but Power 755 offering is customized to High Performance Computing environment

32

Power 755POWER7 Architecture

4 Processor Sockets = 32 Cores8 Core @ 3.3 GHz

DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots

System UnitSAS SFF Bays

Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB)

System UnitExpansion

PCIe x8: 3 Slots (1 shared)PCI-X DDR: 2 Slots GX++ Bus

Integrated Ports 3 USB, 2 Serial, 2 HMC

Integrated EthernetQuad 1Gb Copper(Opt: Dual 10Gb Copper or Fiber)

System Unit Media Bay 1 DVD-RAM ( No supported tape bay )

ClusterUp to 64 nodesEthernet or IB-DDR

Redundant PowerYes (AC or DC Power)Single phase 240vac or -48 VDC

Certifications (SoD) NEBS / ETSI for harsh environments

EnergyScaleActive Thermal Power ManagementDynamic Energy Save & Capping

The highest performing 4-socket

system on the planet

33

POWER7 continues to break the rules with more performance

SPECint_rate

Itanium

HP rx6600

SPARC

Sun T5440

x86

HP DL585

POWER7

Power 755

with PowerVM

The most energy efficient 4-socket

system on the planet

34

Performance Per Watt

Most energy efficient systems

Itanium

HP rx6600

SPARC Sun

T5440

x86

HP DL585

POWER7

Power 755

with PowerVM

Power 770

35

12 or 16 core 4U Nodes

Up to 4 Nodes per system

3.1 and 3.5 GHz

Capacity on Demand

Enterprise RAS

36

Power 770Power 770

Processor Technology6 Cores @ 3.55 GHz8 Cores @ 3.1 GHz

L3 Cache On Chip

Redundant Power & Cooling Yes

Redundant Server Processor Yes / Two Enclosure minimum

Redundant Clock Yes / Two Enclosure minimum

Hot Add Support Yes

Hot Service Yes

System Unit Single Enclosure 4 Enclosures

Processors Up to 2 Sockets 8 Sockets

DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB

SAS/SSD SFF Bays 6 24

DVD-RAM Media Bays 1 Slim-line 4 Slim-line

SAS / SATA Controller 2 / 1 8 / 4

PCIe bays 6 PCIe 24 PCIe

GX++ Slots (12X DDR) 2 8

Integrated EthernetStd: Quad 1Gb

Opt: Dual 10Gb + Dual 1 Gb

Std: Four Quad 1Gb

Opt: Four x Dual 10Gb + Dual 1 Gb

USB 3 12

12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X

4U x 32 inches Depth

Power 780

37

New Modular High-End

Up to 64 Cores

TurboCore

3.86 or 4.14 GHz

Capacity on Demand

Enterprise RAS

24x7 Warranty

PowerCare

38

Power 780Power 780

Processor Technology4 Cores @ 4.1 GHz TurboCore8 Cores @ 3.8 GHz

L3 Cache On Chip

Redundant Power & Cooling Yes

Redundant Server Processor Yes / Two Enclosure minimum

Redundant Clock Yes / Two Enclosure minimum

Hot Add Support Yes

Hot Service Yes

System Unit Single Enclosure 4 Enclosures

Processors 2 Sockets 8 Sockets

DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB

SAS/SSD SFF Bays (CEC) 6 24

DVD-RAM Media Bays 1 Slim-line 4 Slim-line

SAS / SATA Controller 2 / 1 8 / 4

PCIe (CEC) 6 PCIe 24 PCIe

GX++ Slots (12X DDR) 2 8

Integrated EthernetStd: Quad 1Gb

Opt: Dual 10Gb + Dual 1 Gb

Std: Four Quad 1Gb

Opt: Four x Dual 10Gb + Dual 1 Gb

USB 3 12

12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X

Power 795✓New High-end

✓24 to 256 Cores

✓8 TB memory

✓TurboCore

✓3.7, 4.0 or 4.25 GHz

✓1,000 VMs* with PowerVM

✓Capacity on Demand

✓Enterprise RAS

✓24x7 Warranty

✓PowerCare

On October 7, IBM published a new SAP 2-tier Sales

and Distribution benchmark result on the

Power 795. The result is 70,032 users on a 128-core

Power 795 running AIX and DB2. This is

the highest result ever attained on this benchmark.

✓PS700 1 socket 4 core



✓3.0 GHz

Power Systems Blades

41

POWER7 PS700 Blade 4 Cores

Fiber Support Yes (via BladeCenter chassis)

Media Bays 1 BladeCenter chassis

Redundant

PowerYes BladeCenter chassis

Redundant

CoolingYes BladeCenter chassis

Service

ProcessorYes

Power &

ThermalPOWER Save / Power Cap

Architecture 4 Core Single Socket

L2 & L3 Cache On Chip


DASD / Bays 0 - 2 SAS (300/600GB)

Daughter Card

Options

CIOv & CFFh

( PCIe Adapters )

Integrated

Options

Dual Port Gbt Ethernet

Ethernet, USB

42




Redundant


Redundant


Service

ProcessorYes

Power & Thermal POWER Save / Power Cap

Architecture 8 Core Single Socket



DASD / Bays 0 - 1 SAS (300/600GB)

Daughter Card

Options

CIOv & CFFh

( PCIe Adapters )

Integrated

Options

Dual Port Gbt Ethernet

Ethernet, USB

43




Redundant


Redundant


Service

ProcessorYes

Power &

ThermalPOWER Save / Power Cap

Architecture 8 Cores/Socket Two Socket



DASD / Bays 0 - 2 SAS (300/600GB)

Daughter Card

Options

CIOv & CFFh

( PCIe Adapters )

Integrated

Options

Quad Port Gbt Ethernet

Ethernet, USB

44

i Edition Express for BladeCenter S

i Edition Express for BladeCenter S

BladeCenter PS700 or JS12

IBM i

PowerVM Express

BladeCenter S

IBM i preloaded

The i Edition Express for BladeCenter S is the perfect

alternative to a traditional rack or tower server with comparable

starting prices and enables clients to run their i applications

and consolidate x86 servers into a single BladeCenter S

chassis that supports up to six blades and over 7 terabytes of

disk storage

Power Systems Virtualization

•Support for multiple operating environmentsHypervisor

•Micro-partitioning, resource movementDynamic Logical

Partitioning

•Cap processor resources for a group of partitionsMultiple Shared Processor Pools

•Virtualizes resources for client partitionsVirtual I/O Server

•Simplifies partition management for entry systemsIntegrated Virtualization

Manager

•Supports x86 Linux applicationsLx86

•Move running AIX and Linux partitionsLive Partition Mobility

•Share a memory pool among partitionsActive Memory Sharing

Power Hypervisor

VIOS

IBM i 7.1 Highlights DB2

Support for XML and column level encryption

PowerHA Async Geographic Mirroring & LUN-level switching

Virtualization IBM i 6.1 virtualization for i 7.1 partitions

Solid State Drives Automatic movement of hot data to SSDs

Workload Capping Limit # of cores used by middleware within a partition

Open Access for RPG Extend application reach to pervasive devices

Zend Server Community Edition PHP environment preloaded with IBM i

Systems Director Richer management of IBM i via Systems Director

Power Systems

VIOS

IBM i 6.1 IBM i 7.1

Traditional IBM i Workload management

IBM i Workload Management Subsystems provide workload isolation Priorities are used to schedule work No way to cap a given application to a subset of the processor resources in

a partition

All workloads can access the full number of Cores in the Partition

Application 3 = 8 Cores



IBM i System / Partition

IBM i Workload Capping

IBM i workload capping can control workloads by limiting the number of cores that can be used by an application

Application 3 = 8 cores



IBM i System / Partition

Back to the basisBack to the future

IBM i and Cloud Computing• Best platform for “private cloud” • Centralized model• Server consolidation • Bring back the complexity into the “computer

room”• No more “personal” workstations and

company’s data stored on users’ disks• Low-TCO terminals • SOA approach to integrate third party “SaaS”

solutions

50

IBM refreshes CloudBurst line

with Power7 chips - 14 October

2010

A rack with a single Power 750 server

and 32 processor cores can run up to 160

virtual machines, while the top end

system, with 11 Power 750 servers in five

racks, can run up to 2,960 virtual

machines,

[email protected]