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© 2010 IBM Corporation

IBM Power Systems

Power a Smarter Planet with POWER7Smarter Systems for a Smarter Planet

John SheehySystems [email protected]


IBM Power Systems

2

IBMVision

Designed, integrated systems are part of the transformational story

of the next decade.


IBM Power Systems

3

IBM Systems & Technology lay the foundation

Workload Optimization

Deep Understanding of Client Needs

Approach challenge from the client’s perspective

A Comprehensive PortfolioA family of “fit-for-purpose” servers, storage & system software

Technology LeadershipInvesting in future technology for differentiation and sustained

leadership


IBM Power Systems

4

Smarter Money

Power Systems performance, security and availability are capabilities that provide the world’s largest banks with the ability to move today’s money - intangible, invisible information - from a paycheck to a bank to a retailer and back into another business account.

Smarter Cities

Cities large and small depend on the ability of Power Systems to sift through the data needed to not only solve crimes and respond to emergencies, but to help prevent them. Power Systems help manage traffic, share information across city agencies, keep citizens informed and give them access to services.

Smarter TelecomTelcos are using Power Systems to deliver new services dynamically to an exploding number of devices - and Power’s scalability means that new services can be added quickly, new clients can be billed accurately, and costs can be reduced with consolidation.


IBM Power Systems

5

Organizations are moving from “what” to “how”

How do I infuse intelligence into a system for which no one enterprise or agency is responsible?

How do I bring all the necessary constituents together?

How do I make the case for budget?

How do I get a complex solution through procurement?

How do I coalesce support with citizens?

Where should I start?

How fast should I move?

“

”


IBM Power Systems

6

Transformations to “smarter” solutions require smarter systems that:

Scale quickly and efficiently

Optimize workload performance

Flexibly flow resources

Avoid downtime

Save energy

Automate management tasks


IBM Power Systems

7

Power your planet.Smarter systems for a Smarter Planet.


IBM Power Systems

8

Source: IDC Quarterly Server Tracker Q309 release, November 2009

UNIX Server Rolling Four Quarter Average Revenue Share

POWER4Dynamic LPARsDynamic LPARs

POWER6Live Partition Live Partition

MobilityMobilityPOWER5

Micro-PartitioningMicro-Partitioning

Customers are moving to higher value…as shown by the largest shift of customer spending in UNIX History


IBM Power Systems

9

successful Power Migration Factory migrations to date. There were over 500 Power migrations during 2009, with more than 90% from Sun and HP customers (including x86 consolidation). In 4Q09 alone, Power achieved nearly 200 competitive migrations.

2,100


IBM Power Systems

•POWER7 Processor

•POWER7 Servers–Power 750

–Power 755

–Power 770

–Power 780

•Active Memory Expansion

•Upgrades

•I/O Update

Agenda….


IBM Power Systems

•Balance System Design

– Cache, Memory, and IO

•POWER7 Processor Technology

– 6th Implementation of multi-core design

– On chip L2 & L3 caches

•POWER7 System Architecture

– Blades to High End offerings

– Enhances memory implementation

– PCIe, SAS / SATA

•Built in Virtualization

– Memory Expansion

– VM Control

•Green Technologies

– Processor Nap & Sleep Mode

– Memory Power Down support

– Aggressive Power Save / Capping Modes

•Availability

– Processor Instruction Retry

– Alternate Process Recovery

– Concurrent Add & Services

POWER7 System Highlights


IBM Power Systems

Operating Systems

Power Systems Portfolio (Feb 2010)Major Features: Modular systems with linear scalability PowerVM Virtualization Physical and Virtual Management Roadmap to Continuous Availability Binary Compatibility Energy / Thermal Management

Power 755

Power 750

520

BladeCenter JS12 / JS22JS23 / JS43

595

575

Power 770

Power 780


IBM Power Systems

POWER7 Systems Technology Value…•Technology

–Roadmap

–Processor Instruction Retry

–Green Technology built in

–Common architecture from Blades to High-end

•Performance

–Power Systems scalability from blades to high end systems

–Performance leadership in a variety of workloads

–Best Performance per core

–Memory and IO bandwidth

•Virtualization

–Consolidate to higher levels

–Virtualize Processors, Memory, and I/O

–Dynamic movement of Partitions and Applications

–Reduce infrastructure costs

•RAS

–Power Systems mainframe inspired RAS features

–Hot Add support / Concurrent Maintenance

–Alternate Process Recovery

–Operating Systems Availability Leadership

Hypervisor

Virt I/O ServerShared I/O

Single SMP Hardware System


IBM Power Systems

POWER7Processor

POWER7 Processor


IBM Power Systems

Processor Technology Roadmap

2001

Dual Core Chip Multi Processing Distributed Switch Shared L2 Dynamic LPARs (32)

2004

Dual CoreEnhanced ScalingSMTDistributed Switch +Core Parallelism +FP Performance +Memory bandwidth +Virtualization

2007

Dual Core High Frequencies Virtualization + Memory Subsystem + Altivec Instruction Retry Dyn Energy Mgmt SMT + Protection Keys

2010

Multi Core On-Chip eDRAM Power Optimized Cores Mem Subsystem ++ SMT++ Reliability + VSM & VSX (AltiVec) Protection Keys+

POWER8

Concept Phase

POWER4180 nm

POWER5130 nm

POWER665 nm

POWER745 nm


IBM Power Systems

POWER5 POWER5+ POWER6 POWER7

Technology 130 nm 90 nm 60 nm 45 nm

Size 389 mm2 245 mm2 341 mm2 567 mm2

Transistors 276 M 276 M 790 M 1.2 B

Cores 2 2 2 4 / 6 / 8

Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz

L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core

L3 Cache 36 MB 36 MB 32 MB 4 MB / Core

Memory Cntrl 1 1 2 / 1 2

LPAR 10 / Core 10 / Core 10 / Core 10 / Core

Processor Designs


IBM Power Systems

POWER7 Processor Chip •Cores : 8 ( 4 / 6 core options )

•567mm2 Technology: – 45nm lithography, Cu, SOI, eDRAM

•Transistors: 1.2 B– Equivalent function of 2.7B

– eDRAM efficiency

•Eight processor cores– 12 execution units per core

– 4 Way SMT per core – up to 4 threads per core

– 32 Threads per chip

– L1: 32 KB I Cache / 32 KB D Cache

– L2: 256 KB per core

– L3: Shared 32MB on chip eDRAM

•Dual DDR3 Memory Controllers– 90 GB/s Memory bandwidth per chip

•Scalability up to 32 Sockets– 360 GB/s SMP bandwidth/chip

– 20,000 coherent operations in flight

Binary Compatibility with POWER6

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

POWER7CORE

L2 Cache

L3 Cache and Chip Interconnect

MC1MC0

Local SMP Links

Remote SMP & I/O Links

FAST

L3 REGION


IBM Power Systems

eDRAM technologyIBM’s eDRAM technology benefits: Greater density, Less power requirements, Fewer soft errors, and Better performance

Enables POWER7 to provide 32MB of internal L3 Cache

L3 Cache critical to balanced design / performance: 6:1 Latency improvement for L3 accesses vs external L3 2X Bandwidth improvement with on chip interconnect. 32B busses to and from each core

No off chip driver or receivers in L3 access path.

eDRAM is nearly as fast as conventional SRAM but requires far less space

1/3 the space of conventional 6T SRAM implementation 1/5 the standby power

Soft Error Rate 250x lower than SRAM ( Better availability ) 1.5 Billion reduction in transistors

IBM is effectively doubling microprocessor performance beyond what classical scaling alone can achieve,” said Dr. Subramanian Iyer, DE (Distinguished Engineer) DT

EDRAM Cell


IBM Power Systems

POWER7 Core64-bit PowerPC architecture v2.07

Execution Units• 2 Fixed Point Units• 2 Load Store Units• 4 Double Precision Floating Point Units• 1 Branch• 1 Condition Register• 1 Vector Unit• 1 Decimal Floating Point Unit• 6 Wide Dispatch• Units include distributed Recovery Function

Out of Order Execution

Modes: POWER6, POWER6+ and POWER7L2 Cache

IFUCRU/BRU

ISU

DFU

FXU

VSXFPU

LSU

• POWER7 continues to support VMX / Extends SIMD support with VSX– 2 VSX units that can each handle 2 Double-Precision FP instructions

– 8 FLOPS per cycles

– VSX units can also handle 4 Single Precision instructions per cycle

– VSX instruction set support for vector and scalar instructions


IBM Power Systems

AIX

Release/TL

Max Cores

& Threads Supported

POWER6 Mode

POWER7 Mode

AIX 5.3

(All TLs Supported

64 / 128 N/A

AIX 6.1 TL2, TL3

64 / 128 N/A

AIX 6.1 TL4 64 / 128 64 / 256

AIX 6.1 TL5 64 / 128 64 / 256

AIX 7.1 64 / 128 256 / 1024

POWER7 Modes: IBM i and AIX

IBM i

Release

Max Cores

& Threads Supported

POWER6 Mode

POWER7 Mode

IBM i 6.1 32 / 64 32 / 128

Special Support

64/128 32 / 128

IBM i 7.1 32 / 64 32 / 128

Special Support

64/128 64 / 256


IBM Power Systems

21

Linux Max Processors

& Threads Supported

POWER6 Mode POWER7 Mode

RHEL 5 ( Updates newer than U4) 64 / 128 N/A

SLES 10 SP# and newer 64 / 128 N/A

SLES 11 ( All Service Packs) 64 / 128 256 / 1024

RHEL 6 (Next major RHEL version) 64 / 128 256 / 1024

POWER7 Modes: Linux


IBM Power Systems

POWER7 Design

Physical Design:• 8 cores with integrated cache and

memory controllers• 4 / 6 / 8 Core options• 45nm technology

Features:• 4th Generation SMP Fabric Bus• 3rd Generation Multi-Threading• New Power Bus• Energy Optimized Design• Multiple Memory Controllers• DDR3 memory support• Enhanced GX System Buses• On-Chip L2/L3 Cache• eDRAM L3 Cache• Industry Standard IO

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

POWER

BUS

SMP

FABRIC

L3 Cache


IBM Power Systems

Transition from POWER6POWER6

Memory+

GX+ Bridge

Memory+

GX Bus Cntrl Mem

ory

Cn

trl

Mem

ory

Cn

trl

Fabric BusController

CoreAltiVec

L3Ctrl L3

L3CtrlL3

CoreAltiVec

4 MB L2

4 MB L2

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

SMP

FABRIC

POWER

BUS

POWER7

Memory++

L3 Cache


IBM Power Systems

Memory Channel Bandwidth Evolution

DDR2 @ 553 / 667 MHzEffective Bandwidth:

2.6 GB/sec

DDR3 @ 1066 MHzEffective Bandwidth:

6.4 GB/sec

DDR2 @ 553 MHzEffective Bandwidth:

1.1 GB/s

POWER5 POWER6 POWER7

Memory Performance:

2x DIMM

Memory Performance:

4x DIMM

Memory Performance:

6x DIMM

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3


IBM Power Systems

Multi-threading Evolution

Thread 1 ExecutingThread 0 ExecutingNo Thread Executing

FX0FX1FP0FP1LS0LS1BRXCRL

Single thread Out of Order


S80 Hardware Multi-thread


POWER5 2 Way SMT


POWER7 4 Way SMT

Thread 3 ExecutingThread 2 Executing


IBM Power Systems

POWER7 TurboCore Mode

• TurboCore Chips: 4 available cores

• Aggregation of L3 Caches of unused cores.

•TurboCore chips have a 2X the L3 Cache per Chip available

–4 TurboCore Chips L3 = 32 MB

• Performance gain over POWER6.–Provides up to 1.5X per core to core

• Chips run at higher frequency:–Power reduction of unused cores.

• With “Reboot”, System can be reconfigured to 8 core mode.

–ASM Menus

Unused CoreTurboCores

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

SMP

FABRIC

POWER

BUS

32 MB L3 Cache

POWER7 Chip

Power 780 TurboCore Chip


IBM Power Systems

Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

GX

SMP

FABRIC

POWER

BUS

24 MB L3 Cache

POWER7 Core / Cache options

6-Core Chip

Power 750 & Power 770


IBM Power Systems

POWER7 SMT4• Standard Cache Option

• All cores active•Requires POWER7 Mode

– POWER6 Mode supports SMT1 and SMT2

•Operating System Support– AIX 6.1 and AIX 7.1

– IBM i 6.1 and 7.1

– Linux

•Dynamic Runtime SMT scheduling– Spread work among cores to execute in

appropriate threaded mode

– Can dynamical shift between modes as required: SMT1 / SMT2 / SMT4

•LPAR-wide SMT controls– ST, SMT2, SMT4 modes

– smtctl / mpstat commands

•Mixed SMT modes supported within same LPAR

– Requires use of “Resource Groups”0

0.5

1

1.5

2

SMT1 SMT2 SMT4


IBM Power Systems

POWER7 Multi-threading Options •TurboCore option

•50% of the cores active

0

0.5

1

1.5

2

2.5

SMT4 SMT2 Single0

0.5

1

1.5

2

2.5

SMT4 SMT2 Single

•MaxCore option

•All cores active

Based of rPerf workload


IBM Power Systems

Fully Optimized POWER7 Module Packaging•Distributed Enterprise/SMB, Infrastructure Consolidation

– Low-cost organic module designed for 2/4 socket platforms

– Targets infrastructure consolidation, distributed enterprise and SMB

– Targets sweet spot of performance, scalability and reliability

– High-density, low-power options

•Large Scale Enterprise and Server Consolidation– Glass ceramic targets leadership performance, scalability and reliability

– Designed for enterprise database, ERP, CRM and decision support

– Ideal for mission-critical and highly virtualized environments

– Supports scalability up to 32 sockets

•Massive Scale-Out– Quad-chip MCM targets high octane MFLOP engines

– Targets unparalleled capacity for modeling complex systems and compute-intensive research

– Scales up to 256 w eight-core processors per server and networked clusters of thousands of servers driving >PFLOP capability

2/4s Blades and RacksSingle Chip Organic

High-End and Mid-RangeSingle Chip Glass Ceramic

Compute IntensiveQuad-chip MCM


IBM Power Systems

POWER7 Offerings…

Power 750

Power 755 Power 770

Power 780


IBM Power Systems

High-End / Mid-Range Packaging

High-End and Mid-RangeSingle Chip Glass Ceramic (61mm)

3363 Pins


IBM Power Systems

POWER7Core Offerings


IBM Power Systems

Processor Offerings for Blades / Rack / HPC

POWER7 Processor Offerings

Cores / Socket 4 6 8

PS700 / 701 / 702 Yes - Yes

Power 750 - Yes Yes (3)

Power 755 - - Yes

Configuration Options

Sockets 1 2 3 4

6 Core Chips 6 Cores 12 Cores 18 Cores 24 Cores


1-4 Socket System


IBM Power Systems

Processor Offerings for Modular Systems

POWER7 TurboCore / CoD

Processor Offerings

Cores / Socket 4 TurboCore 6 8 Base 8 Enhanced

Power 770 - Yes Yes -

Power 780 Yes - - Yes

Configuration Options

Enclosures 1 2 3 4





IBM Power Systems

Energy Management


IBM Power Systems

EnergyScale

•EnergyScale is IBM Trademark. It consists of a built-in Thermal Power Management Device (TPMD) card and Power Executive software.

•IBM Systems Director is also required to manage Energy-Scale functions.

•EnergyScale is used to dynamically optimizes the processor performance versus processor power and system workload.

•IBM Systems Director is also required to manage AEM functions and supports the following functions:

–Power Trending

–Thermal Reporting

–Static Energy Saver Mode

–Dynamic Energy Saver Mode

–Energy Capping

–Soft Energy Capping

–Processor Nap

–Energy Optimized Fan Control

–Altitude Input

–Processor Folding

37


IBM Power Systems

Definition of Terms

•Energy Trending

–EnergyScale provides continuous collection of real-time server energy consumption. This energy usage data may be displayed or exported by IBM Systems Director Active Energy Manager.

–Administrators may use such information to predict data center energy consumption at various times of the day, week, or month.

•Thermal Reporting

–A measured ambient temperature and a calculated exhaust heat index temperature can be displayed from Active Energy Manager.

–This information can help identify data center “hot-spots” that need attention.

38


IBM Power Systems

Definition of Terms (continued)

•StaticEnergy Saver Mode

–Static Energy Saver lowers the processor frequency and voltage on an Power 750 a fixed amount, reducing the energy consumption of the system while still delivering predictable performance.

–This percentage is predetermined to be within a safe operating limit and is not user configurable.

–Active Energy Manager is the recommended user interface to enable/disable Energy Saver mode.

–Energy Saver could be enabled based on regular variations in workloads, such as predictable dips in utilization over night, or over weekends.

–Energy Saver can be used to reduce peak energy consumption, which can lower the cost of all power used.

39


IBM Power Systems


•Dynamic Energy Saver Mode

–Dynamic Energy Saver varies processor frequency and voltage based on the utilization of the Power 750 POWER7 processors.

–The user must configure this setting from Active Energy Manager.

–Processor frequency and utilization are inversely proportional for most workloads, implying that as the frequency of a processor increases, its utilization decreases, given a constant workload.

–Dynamic Energy Saver takes advantage of this relationship to detect opportunities to save power, based on measured real-time system utilization.

–When a system is idle, the system firmware will lower the frequency and voltage to Static Energy Saver values.

–When fully utilized, the maximum frequency will vary, depending on whether the user favors power savings or system performance.

•If an administrator prefers energy savings and a system is fully-utilized, the system will reduce the maximum frequency to 95% of nominal values.

•If performance is favored over energy consumption, the maximum frequency will be at least 100% of nominal.

–Dynamic Energy Saver is mutually exclusive with Static Power Saver mode.

•Only one of these modes may be enabled at a given time.

40


IBM Power Systems


•Energy Capping

–Power Capping enforces a user specified limit on energy consumption.

–The user must set and enable an energy cap from the Active Energy Manager user interface.

–In most data centers and other installations, when a machine is installed, a certain amount of energy is allocated to it.

–Generally, the amount is what is considered to be a “safe” value, and it typically has a large margin of reserved, extra energy that is never used. This is called the margined power.

–The main purpose of the energy cap is not to save energy but rather to allow a data center operator the ability to reallocate energy from current systems to new systems by reducing the margin assigned to the existing machines.

41


IBM Power Systems


•“Soft” Energy Capping

–There are two power ranges into which the power cap may be set .

–When a power cap is set in the guaranteed range (described above), the system is

guaranteed to use less energy than the cap setting.

–Setting a energy cap in this region allows for the recovery of the margined power, but in many

cases cannot be used to save energy.

–Soft power capping extends the allowed energy capping range further, beyond a region that

can be guaranteed in all configurations and conditions.

–If the energy management goal is to meet a particular energy consumption limit, then soft

energy capping is the mechanism to use.

42


IBM Power Systems


•Processor Nap

–The IBM POWER7 processor uses a low-power mode called Nap that stops processor

execution when there is no work to do on that processor core.

–The latency of exiting Nap falls within a partition dispatch (context switch) such that the

Hypervisor firmware can use it as a general purpose idle state.

–When the Operating System detects that a processor thread is idle, it yields control of a

hardware thread to the Hypervisor.

–The Hypervisor immediately puts the thread into Nap.

–When the operating system yields control of the second thread and the processor core

belongs to a dedicated processor partition, the second thread enters Nap mode

43


IBM Power Systems


•Processor Nap

–If the processor core is in a shared processor pool (the set of cores being used for micro-partition dispatching) and there is no micro-partition to dispatch, the Hypervisor puts the second thread into Nap mode.

–By entering Nap mode, it allows the hardware to clock off most of the circuits inside the processor core.

•Reducing active energy consumption by turning off the clocks allows the temperature to fall, which further reduces leakage (static) power of the circuits causing a cumulative effect.

–Unlicensed cores are kept in core Nap until they are licensed and return to core Nap whenever they are unlicensed again.

44


IBM Power Systems


•Energy-Optimized Fan Control and Altitude Input

–On the Power 750, firmware will dynamically adjust fan speed based on energy consumption, altitude, ambient

temperature, & energy savings modes.

–Systems are designed to operate in worst-case environments, in hot ambient temperatures, at high altitudes, & with

high power components.

–In a typical case, one or more of these constraints are not valid.

–When no power savings setting is enabled, fan speed is based on ambient temperature, and assumes a high-altitude

environment.

–When a power savings setting is enforced (either Static Energy Saver or Dynamic Energy Saver) fan speed will vary

based on power consumption, ambient temperature, & altitude (if available).

–System altitude may be set (Active Energy Manager). If no altitude is set, system will assume a default value of 350

meters above sea level.

45


IBM Power Systems


•Processor Folding

–Processor Folding is a consolidation technique that dynamically adjusts, over the short-term, the number of processors available for dispatch to match the number of processors demanded by the workload.

–As the workload increases, the number of processors made available increases; as the workload decreases, the number of processors made available decreases.

–Processor Folding increases energy savings during periods of low to moderate workload because unavailable processors remain in low-power idle states longer.

46


IBM Power Systems

POWER7TPMD


IBM Power Systems

TPMD: Thermal Power Management Device• TPMD card is part of the base hardware configuration.

• Residing on the processor planar

• TPMD function is comprised of a risk processor and data acquisition

• TPMD monitor power usage and temperatures in real time

• Responsible for thermal protection of the processor cards

• Can adjust the processor power and performance in real time.

• If the temperature exceeds an upper (functional) threshold, TPMD actively reduces power consumption by reducing processor voltage and frequency or throttling memory as needed.

• If the temperature is lower than upper (functional) threshold, TPMD will allows POWER7 cores to “Over clock” if workloads demands are present.


IBM Power Systems

POWER7 “Over Clock” Uplift


IBM Power Systems

Active Energy Manager Benefits:

•Monitor energy consumption to allow better utilization of available energy resources.

•Can trend actual energy consumption and corresponding thermal loading of IBM Systems running in their environment with their

applications. :

–Allocate less power and cooling infrastructure to IBM servers

–Lower power usage on select IBM servers

–Plan for the future by viewing trends of power usage over time

–Determine power usage for all components of a rack

–Retrieve temperature and power information via wireless sensors

–Collect alerts and events from facility providers related to power and cooling equipment

•Better understand energy usage across your data center.

–Identify energy usage

–Measure cooling costs accurately

–Monitor IT costs across components

–Manage by department and/or user

•Active Energy Manager also provides a source of energy management data that can be exploited by Tivoli enterprise solutions

such as IBM Tivoli Monitoring and IBM Tivoli Usage and Accounting Manager.

50


IBM Power Systems

POWER7Model 750POWER7Model 750


IBM Power Systems

Power 750 Product Features

•Features of the Power 750:8233-E8B…

–POWER7 processor with multiple cores

•32-ways (8 cores/processor card x 4 processor cards)

–Industry Standard RDIMM, DDR3 1066 Mbps with enhanced memory RAS features including 64-byte marking ECC code, and ChipKill detection and correction.

•512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4 processor cards)

–8 hot plug and front access SFF SAS DASD.

–1 slim media bay for DVD.

–1 half high bay for tape drive.

–Hot plug 3 PCIe slots and two PCIX slots with Enhanced Error Handling.

–One GX+ slot and one GX++ slot (not hot pluggable)

–Hot plug and redundant power.

–Hot plug and redundant cooling.

–Support for Logical Partitioning (LPAR) and Dynamic LPAR (DLPAR).

–Embedded SAS and SATA

–Embedded four 1 Gigabit Ethernet devices or two 10 Gigabit Ethernet devices

–Embedded USB

–Service Processor FSP-1 for enhanced reliability and remote system management

–Rack mountable drawer

52


IBM Power Systems

Power 750 System 8233-E8B

POWER7 Architecture 6 Cores @ 3.3 GHz8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets

DDR3 Memory Up to 512 GBSystem Unit SAS SFF Bays

Up to 8 Drives (HDD or SSD)73 / 146 / 300GB @ 15k (2.4 TB)(Opt: cache & RAID-5/6)

System Unit IO Expansion Slots

PCIe x8: 3 Slots (2 shared)PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards

Integrated SAS / SATA YesSystem Unit Integrated Ports

3 USB, 2 Serial, 2 HMC

Integrated Virtual Ethernet

Quad 10/100/1000 Optional: Dual 10 Gb

System Unit Media Bays 1 Slim-line DVD & 1 Half HeightIO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAXCluster 12X SDR / DDR (IB technology)Redundant Power andCooling

Yes (AC or DC Power)Single phase 240 VAC or -48 VDC

Certification (SoD) NEBS / ETSI for harsh environments

EnergyScale Active Thermal Power ManagementDynamic Energy Save & Capping

4UDepth: 28.8”


IBM Power Systems

Power 750 System Overview

•8 SFF Bays•(Disk or SSD)

• Dual Power Supplies

•Half-High Bay •(tape or removable disk

• Up to 4 • Processor /

Memory Cards

• 3 PCIe & 2 PCI-X • Slots

• Fans

• TPMD

•DVD


IBM Power Systems

55

PowerSupplies

Tape DriveRemove DASD Bay

DVD Drive

Operator Panel

8 SFF DASD / SSD

Power 750 Front View


IBM Power Systems

56

SAS Port

SystemPort 1

SystemPort 2

USBPorts

HMCPorts

IVEEthernet

PCIeSlot 1

orGX++ Slot

PCIeSlot 2

orGX+ Slot

PCIeSlot 3

PCIXSlot 5

PCIXSlot 4

Power 750 Rear View

SPCN


IBM Power Systems

57

POWER7 chip Enhanced Buffer controller

4 DIMM Slots

4 DIMM Slots

Processor Card

Processor Cards6-core 3.3 GHz #8335 – 1 to 4 per server8-core 3.0 GHz #8332 – 1 to 4 per server8-core 3.3 GHz #8334 – 1 to 4 per server8-core 3.55 GHz #8336 – 4 per server

All processor cards on the same server must be identical feature code

Processor VRM

Memory VRM


IBM Power Systems

58

Power 750 System LayoutDIMMDIMM

SNDIMMDIMM

SN

DIMMDIMM SNDIMMDIMM SN

POWER7Chip



POWER7Chip

DIMMDIMM

SNDIMMDIMMSN

DIMMDIMMSNDIMMDIMMSN

POWER7Chip



POWER7Chip

PowerSupply 1

PowerSupply 2

8 SFF / SSDDASD

SLIMDVD

Tape Drive

Anchor Card

Cache RAID Card (opt)

Aux Write Cache (opt)

SPCN1SPCN2HMC1HMC2

S1S2

GX++ Slot

TPMD

SASController

DASD&

Media

BackPlane

IO ControllerUSBUSB

RJ45

RJ45ENETPHY

RJ45

RJ45ENETPHY

PCI-X S4PCIe S3

PCI-X S5

PCIe S2PCIe S1

USB

MUX

GX+ SlotFSP

Op-Panel

Ext SAS

USB

2nd Proc / Memory Card required for

GX++ Bus


IBM Power Systems

Memory Options for Power 750 / 755

FeatureSize (2 DIMM)

DIMM

Size

Memory

Speed

750 Max

Memory

8 GB 4 GB 1066 MHz 128 GB

16 GB 8 GB 1066 MHz 256 GB

32 GB 16 GB 1066 MHz 512 GB

Power 755

Power 750

Feature

Size (2 DIMM)

DIMM

Size

Memory

Speed

755 Max

Memory

8 GB 4 GB 1066 MHz 128 GB

16 GB 8 GB 1066 MHz 256 GB


IBM Power Systems

Power 750 Memory

• 8 DDR3 DIMM slots per processor card

• DIMMS: 4GB, 8GB and 16GB

• Plugged in pairs. 1 feature code = 1 pair

• Min = 1 feature per SERVER, but min 1 feat per Proc card recommended

• Can NOT mix different size DIMMs on same processor card

• Can have different size DIMMs on same server.

One proc card GB memory capacity with

DIMM size

1 Pair 2 Pair 3 Pair 4 Pair

4 GB 8 16 24 32

8 GB 16 32 48 64

16 GB 32 64 96 128

Feature Code

Feature GB

#4526 16

#4527 32

#4528 64

The following is for ONE processor card in the Power 750

# Proc card

1 2 3 4

DIMM slots 8 16 24 32

Min/Max GB

8 / 128 8 / 256 8 / 384 8 / 512


IBM Power Systems

POWER7 Memory Bandwidth (750 / 755 / Blades )

POWER7

Mem

Cntrl

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

Nova

Max Read Bandwidth: 51.168 GB/secMax Write Bandwidth: 25.584 GB/secMax Combined Bandwidth: 68.224 GB/sec

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

DDR3

Nova

Nova

Nova

Each Nova Chip (Read/Write Buffer)

supports two DIMMS

Chip Bandwidth


IBM Power Systems

Memory BandwidthL1 ( Data ) 170.4 GB/sec

L2 170.4 GB/sec

L3 113.6 GB/sec

Memory 68.224 GB/sec per Socket 272.896 GB/sec per System

Intra-NodeBuses

6.4 GB/sec

GX++ Bus (12X DDR)GX+ Bus (12X SDR)

20 GB/sec

10 GB/sec ( Shared )

GX Bus Slot 1GX Bus Slot 2

Internal IO SlotsTotal IO Bandwidth

20 GB/sec

5** GB/sec

5** GB/sec

30 GB/sec

Power 750 Bandwidth @ 3.55 GHz

** Pass thru bus


IBM Power Systems

Power 750 Information….•Physical Specifications:

–Width: 440 mm (17.3 in)

–Depth: 730.8 mm (28.8 in)

–Height: 175 mm (6.89 in)

–Weight: 54.4 kg (120 lb)

•Operating voltage: –200 to 240 V

•Operating Frequency: 50/60 Hz

•Power Consumption: 1950 watts (maximum)

•Power Factor: 0.97

•Thermal Output: 4778 Btu/hour (maximum)

•Power-source Loading–1.443 KVA (maximum configuration)

•Noise Level and Sound –Rack-mount drawer: 7.0 Bels operating


IBM Power Systems

Functional Differences

Power 550 Power 750

Up to 8 Cores (4 sockets) Up to 32 Cores (4 sockets)

Up to 256 GB Memory

32 DIMM slots

Up to 512 GB Memory

32 DIMM slots

DDR2 DIMMS DDR3 DIMMs

6 3.5 in or 8 SFF SAS disk/SSD 8 SFF SAS disk/SSD

3 PCIe & 2 PCI-X slots 3 PCIe & 2 PCI-X slots

Commercial focus Commercial & HPC focus

GX Bus & GX Passthru Slots GX Bus & GX Passthru Slots

IVE: Dual Gb

Optional: Quad Gb, or 10 Gb

IVE: Quad Gb

Optional: Dual 10 Gb

TPMD Enhanced TPMD

Guiding Light Light Path


IBM Power Systems

Comparative Information….


IBM Power Systems

Bandwidth Properties…

0

10

20

30

40

50

60

70

Memory Intra IO

Power 550 Power 750


IBM Power Systems

POWER7 / POWER6 Comparison

0

1000

2000

3000

4000

5000

6000

7000

8000

9000

Energy Consumption Thermal

Power 750 Power 550 Power 560

Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active


IBM Power Systems

Power 750 rPerf Performance …

Power 5508 Core @ 5GHz

Power 56016 Core

@ 3.6GHz

Power 75032 Core

@ 3.55GHz


IBM Power Systems

Power 750 vs Power 550 / 560

Performance* / KW Performance* / K BTU

* Calculated on rPerf, CPW results siimilar


IBM Power Systems

POWER7Model 755


IBM Power Systems

Power 755 HPC: 8236-E8C

•Power 755 / Power 750 Differences:1.Only an 8-core 3.3GHz will be offered

2.Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards).

3.No 16GB DIMM - Maximum memory is 256GB.

4.No IBM i O/S support

5.No PowerVM features (i.e. no LPAR or DLPAR)

6.No RAID feature (CCIN 57B7 & 57B8)

7.No Split Disk feature

8.No tape drive

9.No external I/O Drawers (e.g. Tres 19 Drawers)

10.No IB 12x SDR adapter (CCIN 1817)

71


IBM Power Systems

5.3 / 6.1 RHEL / SLES

Power 755 4-Socket HPC System

8236-E8CPOWER7 Architecture

4 Processor Sockets = 32 Cores8 Core @ 3.3 GHz

DDR3 Memory 128 GB / 256 GB, 32 DIMM SlotsSystem Unit SAS SFF Bays

Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB)

System Unit Expansion

PCIe x8: 3 Slots (1 shared)PCI-X DDR: 2 Slots GX++ Bus

Integrated Ports 3 USB, 2 Serial, 2 HMCIntegrated Ethernet Quad 1Gb Copper

(Opt: Dual 10Gb Copper or Fiber)System Unit Media Bay

1 DVD-RAM ( No supported tape bay )

Cluster Up to 64 nodesEthernet or IB-DDR

Redundant Power Yes (AC or DC Power)Single phase 240vac or -48 VDC

Certifications (SoD) NEBS / ETSI for harsh environments

EnergyScale Active Thermal Power ManagementDynamic Energy Save & Capping

Up to 8.4 TFlops per Rack( 10 nodes per Rack )

4U x 28.8” depth


IBM Power Systems

73

Power 755 System LayoutDIMMDIMM SNDIMMDIMM

SN

DIMMDIMM

SNDIMMDIMM SN

POWER7Core



POWER7Chip

DIMMDIMM

SNDIMMDIMMSN


POWER7Chip

DIMMDIMM

SNDIMMDIMMSN

DIMMDIMMSNDIMMDIMM

SN

POWER7Chip

PowerSupply 1

PowerSupply 2

8 SFF / SSDDASD

SLIMDVD

Anchor Card

SPCN1SPCN2HMC1HMC2

S1S2

GX++ Slot

TPMD

SASController

DASD&

Media

BackPlane

IO ControllerUSBUSB

RJ45

RJ45ENETPHY

RJ45

RJ45ENETPHY

PCI-X S4PCIe S3

PCI-X S5

PCIe S2PCIe S1

USB

MUX

FSP

Op-Panel

Ext SAS

USB


IBM Power Systems

1H / 2010

Scaling 64 nodes (32 Cores/node) 54 TFlops

Operating Systems AIX 6.1 TL 04 / 05

Linux

HPC Stack Levels xCAT v2.3.x

GPFS v3.3.x

PESSL v3.3.x

LL v4.1.x

PE v5.2.x

ESSL Beta (GA 06/2010)

ESSL v5.1

Compilers GA Levels

XLF v13.1

VAC/C++ v11.1

Power 755 HPC Cluster Node

IB-DDR Interconnect

Data Center in a RackUp to 10 Nodes per Rack

Air cooled


IBM Power Systems

POWER5+ 575 (1.9GHz)

Power 575 (4.7GHz)

Power 755

(3.3GHz)

Latency (cycles/ns) 220 cycles / 110ns 420 cycles / 90ns 336 cycles / 102ns

Bus 2 X DRAM Freq 4 X DRAM Freq 6 X DRAM Freq

Memory Controllers

per chip1 per chip 1 (2 in HE) 1

Peak Bandwidth

per chip 25GB/s 34GB/s 68 GB/s

DRAM Technology DDR2 DDR2 DDR3

Power 755 Memory


IBM Power Systems

Power 755 Power 575

Cores/chip 8 4

Total cores 32 32

Frequency 3.3 GHz 4.7 GHz

Memory (max) 256 GB 256 GB

Performance / TFlops .84 .6

Cooling Air Water

Cores/rack

Rack type

320

19”

448

24”

Power (Watts) 1650 5400

755 offers the same core count per node 40% better performance per node (Linpack) 1/3 the power per node 37% less floor space for a 64 node configuration.

Power 755 vs Power 575


IBM Power Systems

Feature 755 750Processors 32-core @ 3.3 GHz 32-core @ 3.55 GHz

6 / 12 / 18 / 24-core @ 3.3 GHz 8 / 16 / 24 / 32-core @ 3.0 GHz

Memory 128GB OR 256GB 4GB & 8GB DIMMS

512GB Max. 4GB, 8GB, 16GB DIMMS

GX slot support Yes – IB clustering YesI/O Drawer support No YesDASD Backplane No Split Backplane Split Backplane supportIntegrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbEVirtualization No PowerVM support PowerVM Std and EntDASD / Bays 8 SFF SAS HDD / SDD

10k and 15K SFF drives 8 SFF SAS HDD / SDD10k and 15K SFF drives Optional RAID

Internal Tape No YesPerformance Metric TFLOPS rPerfMisc. No IBM i Support

No H/W Raid CardsIBM i SupportH/W Raid Cards

Power 755 vs. 750 Offering Structures


IBM Power Systems

POWER7Model 770 Model 780


IBM Power Systems

Power 770 Power 770 Processor Technology 6 Cores @ 3.55 GHz

8 Cores @ 3.1 GHz

L3 Cache On Chip

Redundant Power & Cooling Yes

Redundant Server Processor Yes / Two Enclosure minimum

Redundant Clock Yes / Two Enclosure minimum

Concurrent Add Support Yes

Concurrent Service Yes

System Unit Single Enclosure 4 EnclosuresProcessors Up to 2 Sockets 8 SocketsDDR3 Memory (Buffered) Up to 512 GB Up to 2 TBSAS/SSD SFF Bays 6 24DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8Integrated Ethernet Std: Quad 1Gb

Opt: Dual 10Gb + Dual 1 Gb

Std: Four Quad 1Gb Opt: Four x Dual 10Gb +

Dual 1 GbUSB 3 1212X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X

Maint Coverage: 9 x 5

4U x 32 inches Depth


IBM Power Systems

Power 780Power 780

Processor Technology 4 Cores @ 4.1 GHz TurboCore8 Cores @ 3.8 GHz

L3 Cache On Chip

Redundant Power & Cooling Yes

Redundant Server Processor Yes / Two Enclosure minimum

Redundant Clock Yes / Two Enclosure minimum

Concurrent Add Support Yes

Concurrent Service Yes

System Unit Single Enclosure 4 EnclosuresProcessors 2 Sockets 8 SocketsDDR3 Memory (Buffered) Up to 512 GB Up to 2 TBSAS/SSD SFF Bays (CEC) 6 24DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8Integrated Ethernet Std: Quad 1Gb

Opt: Dual 10Gb + Dual 1 Gb

Std: Four Quad 1Gb Opt: Four x Dual 10Gb +

Dual 1 GbUSB 3 1212X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X

Maint Coverage 24 X 7

PowerCare Support


IBM Power Systems

POWER7Processor

Chip

16 DIMM slots

PCIe Slots

FSP

GX Slots

6 SFFBays

POWER7 Processor

Chip

Interconnect

TPMD

POWER7 Modular Layout


IBM Power Systems

POWER7 Modular Front View

FabricInterconnects

6 SFF Bays

DVD

Fans

Op Panel


IBM Power Systems

POWER7 Modular Rear View

Two GX++ Bays

IVE Ports

Two PowerSupplies

FSP Connectors

HMCPorts

PCIe

PCIe

PCIe

PCIe

PCIe

PCIe

SPCNPorts

HMCPorts

SerialPort

USBPorts


IBM Power Systems

POWER7 Modular System View

Socket

Socket

Fan

Fan

Fan

Fan

Fan

PCIe Slot

PCIe Slot

PCIe Slot

PCIe Slot

PCIe Slot

PCIe Slot

FSP & Clock

RegulatorMemory DIMMs

Qty: 8

Memory DIMMsQty: 4

Memory DIMMsQty: 4

TPMD

PowerGX++ (12X)

SFF

16 DIMM cards


IBM Power Systems

Power 770 and Power 780 Processor Options

Socket

Socket

Memory

Memory

Memory

Power 780 Processor Options (2 Sockets per enclosure )

16-core 3.86 GHz #4982 – 1 to 4 per server 8-core 4.14 GHz #4982 – 1 to 4 per server - Turbo Core

Power 770 Processor Options (2 Sockets per enclosure )12-core 3.5 GHz #4980 – 1 to 4 per server16-core 3.1 GHz #4981 – 1 to 4 per server


IBM Power Systems

Modular Block Diagram…..

RAIDBattery

RAIDBattery

SN

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

SN

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

8 SN Dimms

SN

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

SN

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

DRAM

PSI

Media

X Bus

A/B Buses8 SN

Dimms

Write Cache

Y BusZ Bus

CPU CARD

DASD Backplane

PSI

I/OBackplane

PWR7

Ext SAS

GX++

A/B Buses

GX++

Write Cache

FSPCard

SAS

SAS EXP

EXP

PCIe BusesPCIe

BusesSATA

4 x 1Gb Eth

2 x HMC

AnchorCard

PWR7

GX++ Busses

GX++ Busses

IVE

IVE

USB

PCI-X

Serial

PCI-X

IVEUSB Serial

PCIe

PCIe

PCIe

PCIe

PCIe

PCIe

TPMD

IOC2IOC2


IBM Power Systems

Cooling Domains

Air Flow Domain 1

Air Flow Domain 2

Fans (5)

Power Supply Fans(built-in)

Front Rear

POWER7 Modular supports Hot-Plug and Redundant cooling.There are five fans across the front of the box drawing in room air and is the primary cooling domain. Cool the processors, memory and I/O sub-system.TPMD controls this domain through the FSP. Control algorithm uses the processor, memory and I/O subsystem temperatures as input for fan control.

Second cooling domain, that uses fans inside of each power supplyCools the power supplies and DASD.SPCN controls the fan speed on the power supplies.If the DASD/SSD cage is not installed, SPCN relinquishes control of the fans to the power supplies.

Power supplies control fan speed based on internal power supply temperatures.Fan redundancy is limited to 1 fan fault per domain.More than one failing fan in each domain will force a drawer shutdown.


IBM Power Systems

POWER7 Modular Memory Card Options

FeatureSize (4 DIMM card)

DIMM Size

MemorySpeed

MaxMemory

32 GB 8 GB 1066 MHz 512 GB

64 GB 16 GB 1066 MHz 1 TB

128 GB 32 GB 800 MHz 2 TB

SuperNova

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3 DDR3 DDR3 DDR3 DDR3D

DR

3D

DR

3D

DR

3D

DR

3D

DR

3D

DR

3

DD

R3

DD

R3

DD

R3

DD

R3

4Q10 planned


IBM Power Systems

POWER7Chip

DIMM 1 SN

DIMM 2 SN

DIMM 3 SN

DIMM 4 SN

DIMM 5 SN

DIMM 6 SN

DIMM 7 SN

DIMM 8 SN

MemCtrl 1

MemCtrl 0

D

CB

A

AB

C

D

POWER7 Modular Memory Layout


IBM Power Systems

POWER7 Modular Memory Bandwidth

POWER7

Mem

Cntrl

DRAMs…

DRAMs…

Mem

Cntrl

Max Read Bandwidth: 102.336 GB/secMax Write Bandwidth: 51.168 GB/secMax Combined Bandwidth: 136.448 GB/sec

SuperNova

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3

DDR3 DDR3 DDR3 DDR3 DDR3 DDR3 DDR3 DDR3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

DD

R3

Nova

Nova

Nova

Nova

Nova

Nova

Nova

Nova


IBM Power Systems

Two Enclosure Fabric Topology

21

FC #3711 FC #3712


IBM Power Systems

Three Enclosure Fabric Topology

3 2

3FC #3713

Two cables

FC #3712


IBM Power Systems

Four Enclosure Fabric Topology

2

4

4

3

3

4

FC #3712

FC #3713Two cables

FC #3714Three cables


IBM Power Systems

CEC Enclosure 1

FSP/ Clock

CEC Enclosure 2FSP/ Clock

CEC Enclosure 3

Drw to DrwConnection

CEC Enclosure 4



Point to Point Cabling Three cables

Hot Drawer Add SupportAdd cables to live systemsNo disruptions

Hot Failover supportFSPClock

Concurrent Service Support

FSP Cabling Configuration ( Logical View )

FrontRear



IBM Power Systems

FSP 4 Enclosure Configuration

Enclosure 1

Enclosure 2

Enclosure 3

Enclosure 4

Cable 2

Cable 1

Cable 3


IBM Power Systems

19-inch Rack Considerations

21

Cables wider than CEC

Multi-enclosure configurations supported in IBM “Enterprise” racks: IBM 7014-T00, -T42, #0551, #0553 No problemS with a front door

(regular or acoustic), but if use rack trim, need new #6247 trim kit

For a Power 780 door with the pretty 780 label, order as feat code of 7014-T42 rack.


IBM Power Systems

POWER7 770 Bandwidth @ 3.1 GHz

Memory Bandwidth

L1 ( Data ) 148.8 GB/sec

L2 148.8 GB/sec

L3 99.2 GB/sec

Memory4 Nodes

136.448 GB/sec per socket1091.584 GB/sec

Inter-NodeBuses (4 Nodes) 158.016 GB/sec

Intra-NodeBuses (4 Nodes) 415.744 GB/sec

Int GX Bus 1 & 24 Enclosures

19.712 GB/sec78.848 GB/sec

Ext GX Bus 1 & 24 Enclosures

39.424 GB/sec157.696 GB/sec

Total IO( 4 Enclosures ) 236.544 GB /sec


IBM Power Systems


Memory Bandwidth


L2 185.28GB/sec

L3 123.52 GB/sec

Memory4 Nodes

136.448 GB/sec per Socket1091.584 GB/sec




19.712 GB/sec78.848 GB/sec


39.424 GB/sec157.696 GB/sec



IBM Power Systems


Memory Bandwidth


L2 198.72 GB/sec

L3 132.48 GB/sec

Memory4 Nodes

136.448 GB/sec per Socket1091.584 GB/sec




19.712 GB/sec78.848 GB/sec


39.424 GB/sec157.696 GB/sec



IBM Power Systems

POWER7 Modular Information….

Physical Specifications (4 EIA units) Width: 483 mm (19.0 in.) Depth: 863 mm (32.0 in.) Height: 174 mm (6.85 in) Weight: 70.3 kg (155 lb)

Operating voltage: 200 to 240 V

Operating Frequency: 50/60 Hz Power Consumption: 1600 watts (maximum)

Per enclosure with 16 cores active Power Factor: 0.97 Thermal Output: 5461 Btu/hour (maximum)

Per enclosure with 16 cores activePower-source Loading

1.649 kva (maximum configuration) Noise Level and Sound

One enclosure with 16 active cores:6.8 bels / 6.3 bels with acoustic rack doors (operating/idle)

Four enclosures with 64 active cores:7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)


IBM Power Systems

Power 770 & 780 vs Power 570 Differences

Power 570 Power 770 & 780

Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores

Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB)

DDR2 DIMMS DDR3 DIMMS

Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure

4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure

No write cache or RAID-5/6 support Write cache & RAID-5/6 support

Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers

Optional Split Backplane Standard Split backplaneOptional Tri-Split Backplane

No Power & Management Thermal Power & Thermal management TPMD support

Clock Cold FailoverNo Concurrent Maintenance of FSP/ClockConcurrent Drawer Maint restrictionsConcurrent Drawer Add cable restrictions

Clock Hot FailoverPlanned Concurrent MaintenanceNo Restrictions ( 4Q / 2010 )No Restrictions


IBM Power Systems

Comparative Information….


IBM Power Systems

Power 570/32 vs 770 Bandwidth Properties…

0

200

400

600

800

1000

1200

Memory Inter Intra IO

POWER6 POWER7


IBM Power Systems

POWER7 / POWER6 Enclosure Comparison

0

1000

2000

3000

4000

5000

6000

Power Consumption Thermal

Power 770 Power 570

POWER7: 16 Cores active / POWER6: 8 Cores Active


IBM Power Systems

rPerf / KW rPerf / KBTU

Power 780/770 vs Power 570/32


IBM Power Systems

rPerf Performance


IBM Power Systems

770 780 595POWER6

Nodes 4 4 8

Processors 12 - 48 / 16 - 64 8 – 32 / 16 - 64 8 – 64( Upgradeable to 256 Cores)

Frequency 3.1 GHz3.5 GHz ( 6 Core )

3.55 GHz4.14 Core ( 4 Core )

4.2 GHz5.0 GHz

Memory / core 21 / 16 GB 32 / 16 GB 64 GB

rPerf 493.37 / 579.39 418.64 / 685.09 553

Memory Bandwidth

1088 GB/sec 1088 GB/sec 1376 GB / sec

IO Bandwidth 236 GB /sec 236 GB/sec 640 GB/sec

Warranty 9 x 5 24 x 7 24 x 7

PowerCare No Yes Yes

IBM Power 770 / 780 Positioning


IBM Power Systems

POWER7Performance


IBM Power Systems

Simplify Web Facing Application Deployment

1 JVM

AIX TL4

64 bit

16 threads

1 JVM

Windows

64 bit

16 threads

3920Transactions/sec

IBM Power 750

8 cores3.55GHz

Nehalem EP8 cores

2260Transactions/sec

73% more work per JVM image

Simpler configurationsBetter scale for software

built on application server

Extend WebSphere Application Server to fully exploit up to 32 threads in a single process, thereby reducing the number of images required

IBM WebSphere Application Server 7

Competitive application server


IBM Power Systems

Simplify SAP Infrastructure And Reduce CostsCase Study - Support 15,000 Users

110

IBM Power 750 certification number not available at press time and can be found at sap.com/benchmarks. IBM Power System 750, 4p / 32–c / 128 – t, POWER7, 3.55 GHz, 256 GB memory, 15,600 SD users, dialog resp.: 0.98s, line items/hour: 1,704,330, Dialog steps/hour: 5,113,000, SAPS: 85,220, DB time (dialog/ update):0.015s / 0.028s, CPU utilization: 99%, OS: AIX 6.1, DB2 9.7;IBM Power 570 16p / 32-c / 64 –t, 256 GB memory, 14,432 SD users, POWER6 4.2 GHz, AIX 6.1, DB2 9.5, cert# 2008057All results are 2-tier, SAP EHP 4 for SAP ERP 6.0 (Unicode) and valid as of 2/9/2010.

DB2 on Power 750

Oracle on Sun T5440

Oracle on Sun X4640

15,600SD Users

32 coresPOWER7

4,720SD Users

32 coresUltraSPAR

C T2+

10,000SD Users

48 coresAMD

Opteron

SAP Sales and DistributionERP 6.0 EHP 2-Tier performance

Support 3.3x more users on DB2 and Power 750 than Oracle on SPARC

Infrastructure costs per user DB2 on Power 750 $100/user Oracle on Sun T5440 $185/user Oracle on Sun x4640 $123/user

SAP and DB2 on Power 750


IBM Power Systems

Power Systems rPerf Performance


IBM Power Systems

POWER4™p670

1.1 GHzrPerf: 24.46KWatts: 6.71

3.64

POWER4+™ p670


6.97

POWER5™p5-570


13.15

POWER5+™ p570


16.38

POWER6™ Power 570


23.99

POWER6™ Power 570


34.56

POWER7™ Power 780


107.04

Performance per Watt


IBM Power Systems

POWER7Odds and Ends


IBM Power Systems

POWER7 Virtualization SupportMaintain 1 to 10 ratio for Physical cores to LPARs. Power 750: Up to 160 (320) LPARS Power 755 Not Supported Power 770 / 780: Up to 160 (640) LPARs PS700 Up to 40 LPARS PS701 Up to 80 LPARs PS702 Up to 160 LPARs

Active Memory Expansion Active Memory Expansion compresses in-memory data to fit more data into

memory Increases the effective amount of memory capacity

Managed by the OS and hypervisor OS compresses and decompress data based on memory accesses

Is transparent to applications


IBM Power Systems

HMC Support

HMC V7 R710 is the minimum level for POWER7 support

HMC used to manage any POWER7 processor based server, must be a CR3 or later model rack-mount HMC or C05 or later deskside HMC.

If IBM Systems Director is used to manage an HMC or if the HMC manages more than 254 partitions, the HMC should have 3GB of RAM minimum and be a CR3 model or later rack-mount, or C06 or later deskside.


IBM Power Systems

POWER7OS Support


IBM Power Systems

POWER7 OS Software Support

AIX 5.3 with the 5300-11 Technology Level and SP2, or later

AIX 6.1 with the 6100-04 Technology Level and SP3, or later

IBM i 6.1 with 6.1.1 machine code, or later

SUSE Linux Enterprise Server 10 with SP3 for POWER

SUSE Linux Enterprise Server 11 for POWER, or later

RHEL SoD

VIOS 2.1.2.12 with Fix Pack 22.1 and Service Pack 2, or later


IBM Power Systems

POWER7 Hardware Support

TL9TL8

TL10TL11

TL12

2009 – 2011 AIX TL Roadmap04/2010 10/2010

AIX 6.1

AIX 5.3

04/2011 10/201110/2009

AIX 7.1

TL0TL1

TL2

SP

Service PackPOWER7 Support

TL2TL1

TL3TL4

TL5TL6

TL7TL8

TL12

TL5

TL9TL10

TL2TL3

TL11

TL4

SPSP

SP

SPSP

SP


IBM Power Systems

Partition Mobility

POWER6POWER6+

POWER7

Binary CompatibilityBinary Compatibility between POWER6 and POWER7 between POWER6 and POWER7

Leverage POWER6 / POWER6+ Compatibility ModeLeverage POWER6 / POWER6+ Compatibility Mode

Migrate partitions between POWER6 and POWER7 ServersMigrate partitions between POWER6 and POWER7 Servers Forward and BackwardForward and Backward


IBM Power Systems

POWER7Active Memory

Expansion

POWER7 Processor


IBM Power Systems

Active Memory Expansion

POWER7 AdvantageExpand memory beyond physical limitsMore effective server consolidation

Run more application workload / users per partition Run more partitions and more workload per server

ExpandedMemory

TrueMemory Effectively up

to 100% more memoryTrue

Memory

TrueMemory

TrueMemory

TrueMemory

TrueMemory

ExpandedMemory

ExpandedMemory

ExpandedMemory

ExpandedMemory

ExpandedMemory


IBM Power Systems

Active Memory Expansion & Active Memory Sharing

Active Memory ExpansionEffectively gives more memory

capacity to the partition using compression / decompression of the contents in true memory

AIX partitions only

Active Memory SharingMoves memory from one partition

to anotherBest fit when one partition is not

busy when another partition is busy

AXI, IBM i, and Linux partitions

Active Memory Expansion Active Memory Sharing

Supported, potentially a very nice option

Considerations Only AIX partitions using Active Memory Expansion Active Memory Expansion value is dependent upon compressibility of data

and available CPU resource

0

5

10

15#10

#9

#8

#7

#6

#5

#4

#3

#2

#1


IBM Power Systems


Innovative POWER7 technology For AIX 6.1 or later For POWER7 servers

Uses compression/decompression to effectively expand the true physical memory available for client workloads

Often a small amount of processor resource provides a significant increase in the effective memory maximum Processor resource part of AIX partition’s resource and licensing

Actual expansion results dependent upon how “compressible” the data being used in the application A SAP ERP sample workload shows up to 100% expansion, Your results will vary Estimator tool and free trial available


IBM Power Systems

Active Memory Expansion – Client Deployment

1Planning Tool

A. Part of AIX 6.1 TL4B. Calculates data

compressibility & estimates CPU overhead due to Active Memory Expansion

C. Provides initial recommendations

260-Day Trial

A. One-time, temporarily enablement

B. Config LPAR based on planning tool

C. Use AIX tools to monitor Act Mem Exp environment

D. Tune based on actual results

3Deploy into Production

A. Permanently enable Active Memory Expansion

B. Deploy workload into production

C. Continue to monitor workload using AIX performance tools

Memory Expansion

CP

U U

tiliz

atio

n Estimated Results

CP

U U

tiliz

atio

n

Memory Expansion

Ap

p.

Per

form

ance

Memory Expansion Time

Pe

rfo

rman

ce

Actual Results


IBM Power Systems

Active Memory Expansion - Planning Tool

Tool included in AIX 6.1 TL4 SP2 Run tool in the partition of interest for memory expansion. Input desired expanded memory size. Tool outputs different real memory

and CPU resource combinations to achieve the desired effective memory.

Active Memory Expansion Modeled Statistics:-----------------------Modeled Expanded Memory Size : 8.00 GB

Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate--------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB[ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46

Active Memory Expansion Recommendation:---------------------The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors.

Sample outputThis sample partition has fairly good expansion potential

A nice “sweet” spot for this partition appears to be 45% expansion

• 2.5 GB gained memory

• Using about 0.58 cores additional CPU resource


IBM Power Systems

Active Memory Expansion: Partition On / Off

With HMC, check Active Memory Expansion box and enterTrue and max memoryMemory expansion factor

To turn off expansion, unclick box

Partition IPL required to turn on or off

Active Memory Expansion Modeled Statistics:-----------------------Modeled Expanded Memory Size : 8.00 GB

Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate--------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB [ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46

Active Memory Expansion Recommendation:---------------------The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors.

5.5 true8.0 max

Sample output


IBM Power Systems

Upgrades

POWER7 Processor


IBM Power Systems

Upgrades from POWER6 and POWER6+

Power 7803.8 GHz / 4.1 GHz

POWER6+ 570/324.2 GHz

POWER6 5703.5, 4,2, 4.7 GHz

9117-MMA9117-MMB

All existing POWER6 570 systems can upgrade to POWER7

Power 7703.5 GHz

POWER6+ 5704.4, 5.0 GHz

9179-MHB

POWER6 upgrades to POWER7 POWER6+ upgrades to POWER7 Power 570/32 upgrades to POWER7

POWER7 System Upgrades


IBM Power Systems

POWER6+ 570/329117-MMA 4.2 GHz

POWER6+ 5709117-MMA 4.4, 5.0 GHz

POWER6 5709117-MMA 3.5, 4.2, 4.7 GHz

POWER6 5709406-MMA 4.7 GHz

POWER7 7809179-MHB 3.8 / 4.1 GHz

POWER7 7709117-MMB 3.5 GHz

POWER7 7709117-MMB 3.1 GHz

• No direct POWER5 upgrades to POWER7. Use 2-step upgrade, first to POWER6 then to POWER7.

• Upgrades to POWER6 570 available as long as new box sales of POWER6 570 available

• Withdrawal planned end 2010

Power 770 and Power 780 Upgrades


IBM Power Systems

I/O Upgrade ConsiderationsAll the newer IBM I/O drawers, disk, SSD and PCI adapters used on POWER6

supported on POWER7 servers May need to move 3.5-inch SAS drives and PCI-X adapters

Older I/O on POWER6 servers, but not on POWER7 servers RIO / RIO2 / HSL I/O drawers SCSI disk smaller than 69GB or SCSI drives slower than 15k rpm QIC tape drives IOPs and IOP-based PCI adapters (IBM i)

2749, 5702, 5712, 2757, 5581, 5591, 2790, 5580, 5590, 5704, 5761, 2787, 5760, 4801, 4805, 3709, 4746, 4812, 4813

Older LAN adapters: #5707, 1984, 5718, 1981, 5719, 1982 Older SCSI adapters: #5776, 5583, 5777 Telephony adapter: #6412

See planning web page www.ibm.com/systems/power/hardware/sod2.html


IBM Power Systems

Power 520 SoD for Upgrade

SoD provided in February For Power 520 (8203-E4A) 2-core or 4-core servers Upgrade to a POWER7 product preserving the serial number


IBM Power Systems

RAS

POWER7 Processor


IBM Power Systems

Power Systems: Hardware & OS RAS Leadership

Ref: ITIC 2009 Global Server Hardware and Server OS Reliability Survey


IBM Power Systems

Availability / Reliability by Design for POWER7

ProcessorsDynamic De-Allocation

PackagingInstruction Retry

Alternate Processor Recovery

First Failure Data CaptureHelp eliminates intermittent failures

Hot Plug / RemovalFans & Power Supplies

Hot Plug / RemovalPCI-X & PCIe Adapters

IO Drawers

Hot Plug / RemovalDisks

MemoryChip Kill technology with

Bit-steering

Passive backplaneNo active components

HypervisorMainframe technology

MobilityPartition MobilityWPAR Mobility

Operating SystemHot patch Kernel

Storage KeysConcurrent Add: 770/780Eliminates Upgrade outages

Concurrent Service{ 770/780Eliminates Repair Outages

Hot AddI/O racks

Dual Clocks770/780


IBM Power Systems

POWER7 Instruction Retry

Recovery Capability Array error

Error correction (ECC)Arrays with parity

o Processor restarts Instruction flow and Data flow Error

Processor restarts Control Error

Processor restarts

System Resiliency Processor states are check pointed and protected with ECC Processor states can be moved from one processor to another upon

unsuccessful recovery restart (CP Sparing)

Core

RecoveryUnit

Core restart

Core error collection

Execution Units

Load/Store

Instruction FetchDecode


IBM Power Systems

PCI Adapter

Fabric Bus Interface to other Chips and NodesECC protectedNode hot add /repair

Core RecoveryLeverage speculative execution resources to enable recoveryError detected in GPRs FPRs VSR, flushed & retriedStacked latches to improve SERAlternate Processor Recovery Partition isolation for core checkstops

L3 eDRAM ECC protected SUE handling Purge and Line delete Spare rows and columns

GX IO Bus ECC protected Concurrent add/repair

InfiniBand® Interface Redundant paths

Retry/Freeze behavior options for Internal I/O Hub Faults PHB Errors

IO Hub

PCIBridge

Advanced 64 Byte ECC on Memory Multiple chip chipkill detections and

sparings HW assisted scrubbing SUE handling CRC with retry and Dynamic data bit-line sparing on channel

interface

OSC0 OSC1Dynamic Oscillator

FailoverConcurrent Repair

BUF

BUF

BUF

BUF

X8 Dimms

Fabric Interface

POWER7 770/780: RAS Features


IBM Power Systems

Power 750 / 755 Memory RAS FeaturesMemory RASPower 750 supports memory Scrubbing, 64-byte Marking ECC and Chipkill. Memory errors are usually classified as either soft or hard. Hard errors can be caused by defects within the DRAM

package among other reasons (e.g. defect in the silicon), and are usually permanent once they occur.

Soft errors are caused by charged particles or radiation, and are usually transient.

Memory scrubbing corrects soft single bit errors in background while memory is idle preventing multiple bit errors.

Memory ECC is able to detect and correct single bit memory errors, which make up the majority of memory errors. It can also isolate a single Chipkill to a bad DRAM chip.

Memory Chipkill has the ability to correct the single bit errors that standard ECC memory can correct but also multi-bit (2, 3, 4 bits) memory errors and by doing so it increases server availability/reliability even further.

Selective Memory Mirroring is where an amount of memory is reserved and sections of the memory to select for mirroring in the reserved memory are dynamically determined. The selected sections of the memory contain critical areas. The selected sections of the memory are mirrored in the reserved memory.

137


IBM Power Systems

Guiding Light vs. Light PathUser interface and repair action simplificationPOWER6 Guiding light: Console Monitored System

Used in POWER6 systemsTechnician used the HMC or ASMI to see what happened and what to replaceFRUs and their locations are found in the error logUsed HMC or ASMI to enter location code to activate identify LEDs from console to verify where FRUs are

Exchange FRUs (CM or dedicated) per procedure instructionsSystem Attention LED is persistent after power cycle until cleared by technician.

POWER7 Light Path: Console-less HW service simplicity (fast and easy)Used in POWER7 systemsNo need to view logs, just replace the FRUs with their LED on

o LEDs are activated automatically when error is detected.Friendly, color coded labels on Power 750 cover show how to pull and plug partsExternal LED indicates a failure inside the unitInternal LEDs per FRU indicate what to replace

o FRUs are either Hot Plug or system has to be powered offo Gold cap powers fault LEDs when system power is removed

Replacing a FRU automatically resets the fault LEDs

138


IBM Power Systems

POWER7 Processor

POWER7 Servers Power 750 Power 755 Power 770 Power 780


I/O

Upgrades

Summary


IBM Power Systems

This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area.

Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.

IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA.

All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied.

All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions.

IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.

IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.

All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.

IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.

Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment.

Current: 1Q 2010

Special notices


IBM Power Systems

IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, CacheFlow, ClusterProven, DB2, ESCON, i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere, xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, Micro-Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER7, pureScale, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME 10, TurboCore, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml

The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries or both.Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both.AMD Opteron is a trademark of Advanced Micro Devices, Inc.Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC).NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.AltiVec is a trademark of Freescale Semiconductor, Inc.Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others.

Current: 1Q 2010

Special notices (cont.)


IBM Power Systems

The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor.

IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .

All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.

For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.

TPC http://www.tpc.org SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc VolanoMark http://www.volano.com STREAM http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/benchmark/ Oracle Applications http://www.oracle.com/apps_benchmark/ PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly Siebel http://www.siebel.com/crm/performance_benchmark/index.shtm Baan http://www.ssaglobal.com Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ Ideas International http://www.ideasinternational.com/benchmark/bench.html Storage Performance Council http://www.storageperformance.org/results

Notes on benchmarks and values

Current: 1Q 2010

http://www.ibm.com/systems/p/hardware/system_perf.html

http://www.tpc.org/

http://www.spec.org/

http://www.netlib.org/benchmark/performance.pdf

http://www.proe.com/

http://www.spec.org/gpc

http://www.volano.com/

http://www.cs.virginia.edu/stream/

http://www.sap.com/benchmark/

http://www.oracle.com/apps_benchmark/

http://www.siebel.com/crm/performance_benchmark/index.shtm

http://www.ssaglobal.com/

http://www.fluent.com/software/fluent/index.htm

http://www.top500.org/

http://www.ideasinternational.com/benchmark/bench.html

http://www.storageperformance.org/results


IBM Power Systems

The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor.

IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html .

All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3 or AIX 5L were used. All other systems used previous versions of AIX. The SPEC CPU2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.

For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc STREAM http://www.cs.virginia.edu/stream/ Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ AMBER http://amber.scripps.edu/ FLUENT http://www.fluent.com/software/fluent/fl5bench/index.htm GAMESS http://www.msg.chem.iastate.edu/gamess GAUSSIAN http://www.gaussian.com ANSYS http://www.ansys.com/services/hardware-support-db.htm

Click on the "Benchmarks" icon on the left hand side frame to expand. Click on "Benchmark Results in a Table" icon for benchmark results.ABAQUS http://www.simulia.com/support/v68/v68_performance.php ECLIPSE http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest& MM5 http://www.mmm.ucar.edu/mm5/ MSC.NASTRAN http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm STAR-CD www.cd-adapco.com/products/STAR-CD/performance/320/index/html NAMD http://www.ks.uiuc.edu/Research/namd HMMER http://hmmer.janelia.org/

http://powerdev.osuosl.org/project/hmmerAltivecGen2mod

Current: 1Q 2010

Notes on HPC benchmarks and values

http://www.ibm.com/systems/p/hardware/system_perf.html

http://www.spec.org/

http://www.netlib.org/benchmark/performance.pdf

http://www.proe.com/

http://www.spec.org/gpc

http://www.cs.virginia.edu/stream/

http://www.fluent.com/software/fluent/index.htm

http://www.top500.org/

http://amber.scripps.edu/

http://www.fluent.com/software/fluent/fl5bench/index.htm

http://www.msg.chem.iastate.edu/gamess

http://www.gaussian.com/

http://www.ansys.com/services/hardware-support-db.htm

http://www.simulia.com/support/v68/v68_performance.php

http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest&

http://www.mmm.ucar.edu/mm5/

http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm

http://www.cd-adapco.com/products/STAR-CD/performance/320/index/html

http://www.ks.uiuc.edu/Research/namd

http://hmmer.janelia.org/

http://powerdev.osuosl.org/project/hmmerAltivecGen2mod


IBM Power Systems

Notes on performance estimatesrPerf for AIX

rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and should not be reasonably used in that way. The model simulates some of the system operations such as CPU, cache and memory. However, the model does not simulate disk or network I/O operations.

rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time of system announcement. Actual performance will vary based on application and configuration specifics. The IBM eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is dependent upon many factors including system hardware configuration and software design and configuration. Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems. Variations in incremental system performance may be observed in commercial workloads due to changes in the underlying system architecture.

All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM. Buyers should consult other sources of information, including system benchmarks, and application sizing guides to evaluate the performance of a system they are considering buying. For additional information about rPerf, contact your local IBM office or IBM authorized reseller.

========================================================================

CPW for IBM i

Commercial Processing Workload (CPW) is a relative measure of performance of processors running the IBM i operating system. Performance in customer environments may vary. The value is based on maximum configurations. More performance information is available in the Performance Capabilities Reference at: www.ibm.com/systems/i/solutions/perfmgmt/resource.html

Current: 1Q 2010

Documents

Power a Smarter Planet with POWER7 - e-TechServices · IBM Power Systems Power a Smarter Planet with POWER7 ... PowerVM Virtualization Physical and Virtual Management ... Virt I/O