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The top documents tagged [design automation slide]
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Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported
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Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power Hao Yu, Yiyu Shi and Lei He Electrical Engineering Dept. UCLA,
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Reconfigurable Computing: What, Why, and Implications for Design Automation André DeHon and John Wawrzynek June 23, 1999 BRASS Project University of California
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