Upload
einfochips
View
1.518
Download
1
Tags:
Embed Size (px)
DESCRIPTION
At eInfochips, our deep technology expertise in Board Design and Development, Prototype Development, Testing and Certification and Reengineering sets us apart from our competitors. With 9 Reference Designs, 10 Design IPs, 11 Evaluation Modules and 30 Verification IPs, we have a 132 step checklist for production on second spin.
Citation preview
eInfochips Board & System Software Practice Overview
April 2014
2
Product Engineering Services Company
Bangalore ChennaiPune
AhmedabadNoida Tokyo
LondonBostonChicago
DallasAustin
Cedar Rapids
CincinnatiRaleigh
Sunnyvale
10 Design Centers
12 Sales Offices
1200Professionals
19 YearsSolid Track Record
Stable & SecureCash Positive, Debt-free and Profitable
BOARD DESIGN & DEVELOPMENTeInfochips Offerings
3
Product Level CapabilitiesVertex
SpartanKintex
CycloneFlexNios
A3P Series
High Speed
• USB 2.0• DDR2 / DDR3• HDMI• PCIe• SRIO• XAUI / 10G Ethernet• Serial ATA
Wireless
• GSM / CDMA• GPS• Wi-Fi a/b/g/n• Zigbee• Bluetooth• RFID
Display
• LVDS• DVI• SDI• HDMI• LCD• Component• Composite
Others
• PoE• NAND• I2C• SPI• RS232 / RS485• CAN• Touch Screen
Design Tools
•Cadence OrCAD•Mentor DxDesigner•Allegro•PADS•Expedition•Betasoft•Hyperlinx•Spectra-Quest
4
Board-Level Capabilities
•400+ Product Design•150+ Hardware Design to Prototype/Production•15+ CMs in 6 Countries
Summary
•Multi-core SoC design•Multi-processor (8 dual-core on a single board) designs•FPGA based designs
Processors
•Size: 1.5 to 140+ square inches•Layers: Up to 16 Layer PCB•Frequency: Few KHz to 3.0 Gbps•Technology: HDI (2-level micro vias, Via on Pad)
Board
•4200 + with 25 BGAs• - 1031 pins with 0.65mm pitch
Components
5%3%
71%
21%
Layout density >10.5 to 0.90.1 to 0.490.05 to 0.09<0.05
31%
28%
41%
PCB layer countUp to 8 layers8 to 10 layers10 to 16 layers
38%
35%
26%
Board Frequencies>1GHz500MHz to 1GHz<500MHz
5
Testing and Production Capabilities•Assembly Inspection•Power up•Boot prompt•Kernel Prompt
Bring-up Testing
•Peripheral test•Performance Optimization •Diagnostics Code
Functional Test
•Timing Analysis•Waveform Shaping•Performance Analysis•Boundary Conditions Testing
EDVT
•Reliability test•Thermal•Humidity•Destructive Testing
Stress Testing
•Pre-Compliance Testing•FCC, CE, IC (Class A/B)
•Environment testing (Shock, Bump, Vibration)
•Safety test (UL294 etc)
Prototype Testing
•DFM measures•Test Jig/Fixture•Penalization Requirements•Pilot Production•Ensure high first pass yields
Contract Manufacturer
6
Design PhaseDetailed design
• Use case Analysis• Component Selection• Power tree & Clock tree• Protection Circuits• Circuit Simulations
Multi-pass reviews
• Requirement Traceability Matrix
• Schematics Review Tracker• Layout Guidelines Document
Tools
• DOORS (Requirements)• PREP (Reviews)• CLEARQUEST (CRN)• ARENA (BOM)• Others (Proprietary)
Component Selection Criteria
Reusability Lead Time Cost
Product Family Package Footprint
Special Properties Vendor Alternates
Manufacturer Temperature Value
Tolerance RoHS / REACH Part Life Status
Software Re-usability
Schematic Tools
Cadence OrCAD
Mentor DxDesigner
7
Development Phase Layout• Mixed Signal Designs• PoE, Protections (ARINC), Cross Talk, • GbE, PCIe, SRIO, SDI Video, DDR3, SATA etc• Multi processor Designs• Electro-Mechanical Integration• Blind and Buried Vias• Special high performance dielectric materials
Layout
Allegro
PADS
Expedition
Thermal Analysis
Betasoft
Signal Integrity Analysis
Hyperlinx
Spectra-Quest
8
Industrial Design
Tools• Autovue• eDrawings• Solidworks
Design Experience• IP65 Designs• MIL-STD-810F• Fan-Less Designs• Power Hungry designs• High level of modularity• Aesthetics + Ergonomics
Research
• Scope•Audit• Interview•Observations•Personas
Product Goals
•Concept• Scenarios•Elements• Framework•Performance
Specifications
9
SUCCESS STORIESBoard design & Development
10
Multiprocessor Dome Camera
Key Highlights• Multi Processor, FPGA Design, Industrial Grade
Applications• Surveillancee
Processor & Peripheral Highlights• Multi-processors + FPGA based Complex Hardware Platform• TI – DaVinci• Freescale PowerPC • Maxim – Video Encoder SoC• Nethra Image Signal Processor• Sony CMOS Imager and • Altera Cyclone- III
• Gigabit Ethernet Support with POE Powered Option• USB 2.0 Interface for Mass Storage application• SATA Hard disc support (In-built Hard disc recording – DVR
functionality)• IP66 rated design
Special Features• FCC Class-B Certified Product• Wide temperature range including sub zero temperatures
11
High-Resolution Surveillance Camera
• FPGA RTL design and integration with third party IPs• Video Scaling from 4K x 3K to 320 x 240• Video Compression (H264 and MJPEG), Audio Compression (AAC)• Device driver development and porting for Linux v2.6.37• Record and/or live play of up-to four 3M pixel MJPEG streams• WebUI to configure camera parameters
• 12M Pixel surveillance camera product involving Software, Hardware and FPGA based design
• Support for Auto/manual White Balance, Auto Focus, Auto Exposure, Gain control, Flip, Tilt
• Contrast, Brightness, Sharpness support• Image Enhancement Pipeline (Pixel correction, CFA Interpolation,
Color conversion, Gamma Correction, Noise reduction, Edge enhancement etc.)
TI DM8168
TI AM3894 4 x 3MPix MJPEG
2 x 1080P HD
2 x SD
1 x QSD
FPGA
Image Sensor12M Pixel OR 4 x 3M Pixel
RAW Data
2 x HD Video Ports
PCI-ExpressImage Enhancement
Pipeline
12
Product DesignApplications:Surveillance, Video Processing
Special Features: 4x DDR3-800| 2DDR2-400| Gigabit Ethernet | Portable | SATA | HDMI |AV Encoding + Decoding |4-channel video|
13
Design before Processor was in the market!• TI DM8168 based design• One of the first few Netra Designs in the world• Multi-pass Design reviews• Reviews by Semiconductor vendors design team• Back up Plan: Dual Processor Design• Flexible architecture for 8 product variants• Fan-less Design (14W)• High Speed interconnects• Dual Processor Design• Scalable architecture
Mobile Network Video Recorder
Applications: Video Surveillance | Driver behavior Analysis
Special Features:12 IP camera recording | 3G Module with GPS | LCD connectivity | Temperature range -20°C to +60°C
14
• High Definition Recording • Seamless Connectivity • Vibration Proof (MIL-STD-810F method 514.5C)• Modular design for multiple product variants
roadmap• Scalable Architecture by cascading multiple units• RS232, USB, MicroUSB, Dual Gigabit Ethernet
Interfaces• 128GB SSD, 1TB HDD, 32GB SDHC Storage • Power to 12 Cameras on PoE• 3-axis accelerometer• Redundant Power supply
Case Study - Handheld HD Live Video StreamingApplications:Live video broadcasting over GSM network for professional applications like media coverage
Special Features:Modular design to support various video interfaces | 4 different PCAs in a system| Wide operating temperature -40°C to +85°C | Optimized power consumption | Wireless modem support
15
Processor & Peripheral Highlights:• Multi-processors + FPGA based multi board
Complex Hardware Platform• TI – DaVinci (DM6467T) , Sitara (AM3505)
and MSP430• Xilinx – Spartan-6 FPGA
• DDR3-800, NAND, SD Card• SDI, HDMI and Analog Audio/Video support• Four 3G Modems• Fast Ethernet • 802.11 b/g/n WLAN (Wi-Fi)• Bluetooth 2.1• USB 2.0 OTG and SD CARD Interface for Mass
Storage application• 4.3” LCD with Touch Screen• Battery Operated