Printed Sensors in Packaging
Oliver BrandSchool of Electrical and Computer Engineering
Georgia Institute of TechnologyAtlanta, GA 30332-0250
E-mail: [email protected]
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Outline
Introduction to Sensors Sensors & Electronics in Packaging
Time-Temperature Indicators Chemical Sensors RFID Tags
Georgia Tech Capabilities for Smart Packaging Micro/Nanofabrication and MEMS Sensor, Circuitry and RFID Capabilities
Summary
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Sensors are NOT new ….
Paper-Ribbon HygrometerVincenzo VivianiSecond half 17th century
Hair HygrometerHorace-Benedict de SaussureLate 18th century
AnemometerFirst half 19th century
Magnetic CompassMichael Butterfield17th century
Source: Institute and Museum of the History of Science, Florence, Italy
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
…. but they have changed!
LEGO MindStorm
OregonScientificWeatherStation
TissotT-touch
VictorinoxAltimeter
AppleiPhone 4
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Smart/Intelligent Packaging
Benefits of Smart Packaging Brand protection & anti-counterfeiting Quality & safety Brand enhancement Display and stick out Communicate Track & trace Supply chain efficiencies Tamper evidence & resistance
Source: VTT Center for Printed Intelligence
StoraEnso Pharma DDSi Package
To-Genkyo Freshness Label
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
How to Manufacture?Printed Intelligence
Use of large substrate (roll-to-roll) printing techniques
Solution-printable materials include conductive/semi-conductive polymers, nano-particle materials & chem/bio-active materials
Hot embossing, lamination, laser processing, thermal processing, etc., can be added as needed
Incorporation of classical silicon-based electronics (e.g. RFID tags) into packaging is possible S
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Source: Dimatix
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Time-Temperature Indicators (TTI) TTI monitor temperature history
by providing signal proportional to temperature “integral” over time
Output signal is color change Labels are activated at desired
time point Combination with RFID allows
to log temperature history Examples include OnVu™ TTI
(BASF), CheckPoint® (VITSAB), Food Sentinel System™ (SIRA), and MonitorMark™ (3M)
CheckPoint®Label
Food Sentinel System™ Label
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
OnVu™ TTI
Based on organic pigments that change color with time with rate affected by temperature
Activation by UV light (UV filter is added afterwards)
TTI can be applied as label or printed directly on package
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
RFID-Enabled TTIKSW Microtec VarioSens® Data Logger
RFID tag with temperature logging capabilities
Monitoring temperature-sensitive goods, e.g. pharmaceuticals and other medical products
Logging capability requires Si-based circuitry with memory (8kBit EEPROM), antenna and battery (MnO2-Zn printed battery)
Can such a system be fully printed in the future?
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
RFID-Enabled Tamper ProtectionSecurePak by CYPAK
Printed resistive loops on package to detect damage to package
Printed sealing sensor (open/close)
Tamper events stored in ASIC with timestamp
CYPAK RFID technology to retrieve data
Source: CYPAK, http://www.cypak.com/
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
From TT-Indicators to(Bio)Chemical Sensors
Time-temperature indicators and T-loggers can provide valuable information on the cold chain of perishables
However, temperature sensors still provide no direct indication on the status of perishables
This requires sensors beyond temperature sensors, in particular bio(chemical) sensors to monitor e.g. O2 content in package or chemical/biological food spoilage markers (or food freshness, ripeness)
ripeSense® Label
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
(Bio)Chemical Sensors in Packaging
What can be sensed besides oxygen penetration into package? Ammonia release by meat (e.g. Freshness Label by To-Genkyo) Printed biosensors (based on chimeric avidin) targeting detection of
small molecules or even bacteria/viruses (e.g. VTT BioFace project)
Many more analytes can be targeted with proper surface functionalization
To-GenkyoFreshness Label
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
So, where do we stand today? We have in Smart Packaging
Printed barcodes Printed time-temperature indicators Chemical sensor labels (a few) RFID technology (capable but still expensive)
What is missing? More applications of micro/nanotechnology in packaging to
increase functionality without adding much cost Mechanical structures (drop/shock sensors), (bio)chemical sensor arrays
Interdisciplinary research efforts to apply above technologies to packaging Move from devices to SYSTEMS
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
How can Georgia Tech Innovate inSmart Packaging Development?
In addition to IPST, Georgia Tech has widely acknowledged core strengths in Micro & Nanoelectronics
(Nanotechnology Research Center, www.nrc.gatech.edu)
MEMS (Center for MEMS and Microsystem Technologies, www.cmmt.gatech.edu)
Organic Electronics/Photonics (Center for Organic Photonics and Electronics, www.cope.gatech.edu)
Georgia Tech actively promotes interdisciplinary research activities
Georgia Tech Marcus Nanotechnology Building
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
What are MEMS?MEMS – Micro Electro Mechanical Systems
Use integrated circuit (IC) fabrication steps in combination with micromachining steps to fabricate miniaturized electro-mechanical components
Applied to batch fabricate microsensors, acting as “senses of electronic systems”
Current key applications: Hard disk read/write heads Inkjet nozzles Pressure sensors Accelerometers & Gyroscopes
Advantage: High volume & low cost, added functionality, circuitry integration
MEMS Market: $ 7 Billion in 2009 (Source: Yole Development)
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Accelerometers
Simple spring/mass systems with inertial mass suspended by spring system; sensed is mass deflection upon acceleration
Applications Automotive, e.g. air bag
triggering Consumer, e.g. cell phone,
game controllers Medical, e.g. pace makers
Cost in high-volume applications: <$1 per sensor
Analog DevicesADXL 202
Nintendo WiiRemote
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Bio(Chemical) Sensors
Miniaturized bio(chemical) sensors are widely investigated using MEMS (microelectro-mechanical systems) and nanotechnology processes
Microsensors based on electro-chemical, thermal, mechanical and optical techniques probe chemical (in gas and liquid) and biological analytes
Polymers and printing techniques play an ever increasing role Source: K. Suslick, UIUC
Source: A. Majumdar, UC Berkeley
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Mass-Sensitive VOC Sensors400 µm
f0 = 368 kHz∆fmin ≈ 0.1 Hz
K.S. Demirci, O. Brand et al., Transducers 2011
PIB + Toluene Resonant micro-scale
weighing analyte molecules absorbed into polymer coating
Sub-pg mass resolution enables gas-phase detection of volatile organics in low ppm range
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
How are MEMS related toSmart/Intelligent Packaging?
While traditionally mainly applied to silicon, MEMS technologies using polymers (or paper) and based on printing have been demonstrated
MEMS technologies applied to paper and polymers enable new functionalities through use of mechanical elements and micro-channels Paper-based sensors & microfluidics
G. Whitesides et al., Harvard University
Polymer-based biosensorsA. Boisen et al., DTU, Denmark
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Polymer MicromachiningProf. Paul Kohl, ChBE, Georgia Tech
Polymer-MEMS requires formation of micromechanical structures with polymers
Example: Thermal decomposition of sacrificial polymer (Unity) through polymer overcoat (Avatrel)
Application: encapsulation/protection, channels/air-gaps, microstructure release
P. Monajemi, P.J. Joseph, P.A. Kohl, F. Ayazi,J. Micromech. Microeng. 16 (2006) 742-750
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Piezoresistive PolymersProf. Oliver Brand, ECE, Georgia Tech
Fundamental investigation of piezoresistivity in conducting polymer films
Example: PEDOT:PSSpoly(3,4-ethylenedioxythiophene): poly(4-styrenesulfonate)
PEDOT:PSS shows small negative piezoresistive effect
T. Schweizer, MS Thesis, Georgia Tech
Baytron P (128 nm)
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
RFID/Sensor Module IntegrationProf. M. Tentzeris, ECE, Georgia Tech
Radiating body
Feed loop
Terminals for IC
Radiating bodies
Resistive + inductive stub
Resistive stub
Operation modesPassive Tags
System uses RF/EM power from readerSemi-Passive Tags
IC uses RF/EM power, sensor uses battery Increased node lifetime & data range (≈ 30 ft)
Active tag IC and sensor utilize battery Increased S/N & data range (>100 ft)
• Goal: All printed RFID tag (antenna, IC, battery, and sensor) on paper or polymers
• Operating frequency: UHF (900 MHz), RF (2.45 GHz), potentially up to 60 GHz
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
RFID Printed on Paper: Conductive InkProf. M. Tentzeris, ECE, Georgia Tech
PAPER• Environmental friendly and low cost; Large reel to reel processing• Compatible for printing circuitry by direct write methodologies• Can be made hydrophobic and can host nano-scale additives
(e.g. fire retardant textiles)• Dielectric constant εr (~2) close to air’sINK• Consisting of nano-spheres melting and sintering at low temperatures (100 °C)
• After melting a good percolation channel is created for electrons flow• Provides a better result than traditional polymer thick film material approach
SEM images of printed silver nano-particle ink, after 15 minutes of curing at 100°C and 150°C
IPST Executive Conference, March 9-10, 2011, Atlanta, GA
Outlook: Smart Packaging Research at Georgia Tech
Combining paper S&T, micro/nanofabrication, MEMS, and organic electronics expertise to Move beyond optical indicators
and embed printed electronic capabilities
Include mechanical features such as e.g. drop/shock sensors
Move from devices to complete systems including sensor, circuitry, power source (e.g., printed battery or solar cell), and communication (e.g., RFID)
Source: Harry Potter, The Daily Prophet