e-Diagnostics and EEC Guidance
www.sematech.org/public/resources/ediag/index.htm
Harvey Wohlwend / [email protected], 512.356.7536
18 March 2002
e-Diagnostics OverviewKey Benefits:• Reduce time to qualify new
equipment• Reduce repair time = higher
availability = increased output
• Anticipate problems before they occur
• Provide data to support equipment continuous improvement and new product development
Supplier X Main Office
Supplier Y Main Office
Remote monitoringRemote diagnosticsRemote de-bugging/fixRemote sensingModel tool behavior
Remote monitoringRemote diagnosticsRemote de-bugging/fixRemote sensingModel tool behavior
Serial line IP Remote ControlTelnetEthernet IPVPN
Protocol Options
Equipment X Equipment Y
Firewall &Authentication• Data Security• Safety Infrastructure
Interface A
Internet• Mainstream Computing
Technologies• Open Architectures
Interface C
Goal: Significant reduction in equipment support costs
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ISMT e-Diagnostics OutputSupplier site Guidelines and
Standards
Level 2 - Analysis:Automated Reporting and Analysis
Level 3 - Prediction:Predictive Maint., Self Diagnostics
CapabilityRoadmap
Level 0 - Access & Remote Collaboration:Remote connectivity to the tool and remote collaboration
capabilities (text, audio, video)
Level 1 - Collection & Control:Remote Tool Operation, Performance
Monitoring,Equipment Configuration
Current industry maturity level
Supplier CapabilityGuidelines
Data EncryptionGuidelines
e-Diag DMZ
Data InterfaceStandards
Network SecurityGuidelines
Controlled AccessPoint Guidelines
Full Documentation Available at:http://www.sematech.org/public/resources/ediag/index.htm
ICMaker CapabilityGuidelinesICMaker site
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Focus: Improved Data• SECS/GEM – Still The Primary Equipment Control I/F• Interface A – Equipment Data Interface
– Getting more & better data from the equipment• Interface C - External Access to e-Diagnostics• Interface B – Among Applications and to FICS/MES
EES (Equipment Engineering System)
APC App 1
APC App 2
e-Diag App 1
OEE App 1
OEE App2
FDC App1
EE Applications
EEAccess Control
EE DataCollection
And StorageFICS/MES
•Equipment Control•WIP Tracking•Factory Scheduling
Global EE Data
Fire Wall
Interface B
SECS/GEMInterface
Interface ASupplier RemoteLocation
Remote monitoringRemote diagnosticsRemote de-bugging/ fixRemote sensingSpare parts Mgt.
Interface C Factory Network
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Data Acquisition Vision
UtilizationTracking
Station Controller
Equipment
Current StateHealth
Monitor R2R (APC) FDC
SECS-II/GEM data & controlsemiconductor proprietary
Custom
Desired State
UtilizationTracking
SC
Equipment
HealthMonitor R2R (APC) FDC
SECS-II/GEM
Mainstream technology (SOAP)data-only, independent of host
Data Acquisition Requirements Status
• System Requirements:– Host-independent data collection:
clients setup and collect data near-real-time independent of host on/off-line status
– Security: only factory-authorized applications permitted to collect data, single point of control is enforced at factory level
– Self-describing interface: equipment structure, implemented state models, available data items & types, events, exceptions, and alarms can be learned at runtime from the tool
– ‘Baseline’ process control data: all data currently accessible to SECS-II host, with improvements in the ability to collect sampled data for up to 50 parameters per process chamber at a frequency 1% of shortest recipe step (worst case assumption is 1000 scalar parameters at 10Hz)
– Equipment operational data: visibility into module- subsystem- and potentially actuator-level activity for facilitating equipment health monitoring and diagnostics/troubleshooting
e
UtilizationTracking
SC
Equipment
Current State
Desired State
R2R FDC
UtilizationTracking
SC
Equipment
HealthMonitor R2R FDC
SECS-II/GEM data & controlSemiconductor proprietary
SECS-II/GEM data & controlSemiconductor proprietary
CustomCustom
SECS-II/GEMSECS-II/GEM
Mainstream technology (SOAP)Data-only, independent of host
Mainstream technology (SOAP)Data-only, independ nt of host
Diag.App.
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“e” Standards Summary
• e-Mfg/EEC related standards activity is HOT!– Multiple TFs meet weekly w/good
attendance
• The e-Manufacturing related standards effort is the largest combined effort I&CC has attempted
– Global participation, including NA, Japan, Europe
• Much progress is being made– Over 20 ballots (blue and yellow) are in the system– Some have passed ballot and are now SEMI standards
• The goal is steady, rapid progress– Infrastructure standards (XML, CEM) approved – October 2002– Interim DDA solution approved - December 2002– Equipment self-description approved – March 2003– Data interface definition by Summer 2003– More activity to follow
Current Interface A - Related SpecificationsE121 – Guide for Style & Usage of XML for Semiconductor Manufacturing Applications (XML TF)
– Foundational guidelines for XML usage within SEMI
3569 – Provisional Specification for XML Message Structures– XML structures required to encode message header information for
asynchronous messages
E120 – Common Equipment Model (OBEM TF)– Abstract model of equipment physical equipment structure
3510 – Equipment Self Description (DDA TF)– Abstract model of equipment metadata describing units, types, equipment
structure, state models and events, alarms/exceptions, etc.
• 3507 – Equipment Client Authentication and Authorization (DDA TF)– Abstract model of authenticated communication and Access Control List
management
• 3509 – Data Collection Management (DDA TF)– Abstract model of Data Collection Plans, DCP management interface and state
models, and DCP reporting formats
PR8/3563 – Proposed Standard for Equipment Data Acquisition (DDA TF)– Concrete specification of SOAP 1.1 reduced-scope interface for data collection
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Data Acquisition Interim Solution• Ballot
– 3563 – Interim EDA Guide• Definition of an ‘interim’ interface to sync industry on concepts and technology• Facilitate near-term e-Diagnostic systems while specs are developed
• Phased approach:– New Technologies
• Adoption of new technologies in the industry will also involve significant learning and adjustment period for suppliers, ICM’s, and application providers
– Lead time for suppliers• Equipment supporting data collection without impacting equipment performance is
expected to require design and development time
– Interim solutions• Simpler, single-client, minimally configurable push of equipment data. Provide
access to data on new technologies while complete specifications are being designed and developed
• Not a SEMI specification (essentially a precursor to the final standards). Targets current generation of 300mm equipment
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DDA Task Force Ballot Schedule
Diagnostics Data Acquisition (DDA)#3571 - e-Diagnostics Guide (Overview) SNARF Blue Ballot Yellow Ballot#3563 - EDA Interim Interface Blue Ballot Yellow Ballot Proposed#3509 - Data Collection Std. Blue Ballot Yellow Ballot 2nd Yellow#3510 - Meta Data/Equipment Descr. Blue Ballot Yellow Ballot 2nd Yellow#3507 - Authentication/Security Blue Ballot Yellow Ballot 2nd Yellow#TBD - 3510.1 Tech. Spec (XML/SOAP) SNARF Yellow Ballot 2nd Yellow#TBD - 3507.1 Tech. Spec (XML/SOAP) SNARF Yellow Ballot#TBD - 3509.1 Tech. Spec (XML/SOAP) SNARF Yellow Ballot
Interim ItfComplete
#3571 - e-Diagnostics Guide (Overview)#3563 - EDA Interim Interface#3509 - Data Collection Std.#3510 - Meta Data/Equipment Descr.#3507 - Authentication/Security#TBD - 3510.1 Tech. Spec (XML/SOAP)#TBD - 3507.1 Tech. Spec (XML/SOAP)#TBD - 3509.1 Tech. Spec (XML/SOAP)
2nd Yellow
2nd Yellow2nd Yellow
Interface A Standardized
2004 2004 2004 2004Cycle 1
Winter Mtg US/Jpn
SEMICON Europa
Cycle 2
SEMICON West
Japan June Mtgs
Cycle 3
SEMICON
Southw est
Cycle 4
SEMICON Japan
Meet July 22Meet Mar 18 Meet July 22Meet Mar 18
2002 2002 2002 2002 2003 2003 2003 2003Cycle 1
Winter Mtg US/Jpn
SEMICON Europa
Cycle 2
SEMICON West
Japan June Mtgs
Cycle 3
SEMICON
Southw est
Cycle 4
SEMICON Japan
Cycle 1
Winter Mtg US/Jpn
SEMICON Europa
Cycle 2
SEMICON West
Japan June Mtgs
Cycle 3
SEMICON
Southw est
Cycle 4
SEMICON JapanSEMI Document/Standard
Voting (Yellow) ballots at:http://www.semi.org/web/wcontent.nsf/url/stds_ybic
Informational (Blue) ballots at:http://www.semi.org/web/wcontent.nsf/url/stds_bbic
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e-Diagnostics Leads into EEC and e-Manufacturing
Standardizing the Interface A Data Port
Equipment Supplier
Equipment
FactorEquipment
EngineeringCapability
Fault Detection & ClassificationRun-to-Run ControlMachine matchingSpare Parts ManagementPredictive Maintenance...
e-Diagnostics
e-Data
e-Manufacturing is automated,data-driven,
productivity optimization
y
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e-Diagnostic Capabilitiese-Diagnostic Capabilities
Implementation - ICMImplementation - ICM Implementation - SupplierImplementation - SupplierITIT
Network AdministrationNetwork Administration
System/Product AdminSystem/Product Admin
User ManagementUser Management
Change Control/MgtChange Control/Mgt
IS/IT Policies/ProcIS/IT Policies/Proc
TrainingTraining
ITIT
Network AdministrationNetwork Administration
System/Product AdminSystem/Product Admin
User ManagementUser Management
Change Control/MgtChange Control/Mgt
IS/IT Policies/ProcIS/IT Policies/Proc
TrainingTraining
Bus
ines
sB
usin
ess Service Level Aggr’sService Level Aggr’s
LegalLegal
Operational ProceduresOperational Procedures Bus
ines
sB
usin
ess Service Level Aggr’sService Level Aggr’s
LegalLegal
Operational ProceduresOperational Procedures
http://www.sematech.org/public/resources/ediag/guidelines/guidelines.htm
Leve
l 1Le
vel 1
Data CollectionData Collection
Data SecurityData Security
Remote Equipment Operation
Remote Equipment Operation
Leve
l 0Le
vel 0
CollaborationCollaboration
File TransferFile Transfer
e-Diagnostics System Administration
e-Diagnostics System Administration
SignOn (Login)SignOn (Login)
Leve
l 2Le
vel 2
FilteringFiltering
Data CompressionData Compression
PerformancePerformance
ReportingReporting
Data AnalysisData Analysis
Leve
l 3Le
vel 3
Self-DiagnosisSelf-Diagnosis
Decision LogicDecision Logic
NotificationNotification
Measurement & Assessment Checklist Structure
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Data Quality Needed
SEMI Task Force Focus
• Quality of Reporting of Data - The Protocol
• Quality of the Data Itself
(1) Quality of Protocol-Missing Messages-Missing Variables-Duplicate Events-Out-of-order Messages-Completion before Start-Reply to Request-Well-formed Reply-Proper Events Reported-…
(2) Quality of Data-Accuracy and Precision-Resolution-Correct Data-Correct time-stamping-Sufficient Context with Data-Data Freshness-…
SECS/GEM
EDAPort
e-Diagnostics & Interface A Prototyping
Supplier Main Office
Remote monitoringRemote diagnosticsRemote de-bugging/fixRemote sensingModel tool behavior
Supplier providedinfrastructure & pilot
EquipmentSimulator
EquipmentSimulator
or e-DiagnosticsServer
e-DiagnosticsServer
ISMT provided Infrastructure
Supplier provided pilot
InternetInternet
ISMT ProvidesNetwork infrastructure, internal firewall, hosts pilot activities, $$
Supplier ProvidesEquipment simulator or tool, e-Diagnostics pilot, remote pilotMust include OEM, but may also include 3rd party
e-Diagnostics Working Group providesPrototype (Guidebook) evaluation criteria, evaluation results
http://www.sematech.org/public/resources/e-manuf/rfp/index.htm
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Prototyping Invitation to Demonstrate1. e-Diagnostics prototyping opportunity available at
ISMTComplete solutions not expectedInfrastructure availableConfirm Guidebook integrityAccelerate industry learningLeveraging Assessment Checklist during prototypes
2. EDA Port prototyping opportunity available at ISMTConfirm integrity and completeness of SEMI document 3563 (Interface A) definitionUnderstand implications of separating control and dataUnderstand performance: XML/SOAP/HTTP, data collection plans, trace data collection, bottlenecks, etc.
Multiple Prototypes Requested
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Equipment Engineering Capabilities (EEC)
EEC is about improving equipment OEE through access to data for:e-Diagnostics, Run-to-Run Control, Fault Detection, Maintenance
Support, Recipe Control, Machine-to-Machine Matching, IM, etc.
ISMT and Selete are collaborating to set industry directionEEC Guidelines v2.5 are available:http://www.sematech.org/public/resources/ediag/guidelines/guidelines.htm
ISMT driving SEMI StandardsThe focus is on the detail and quality
of the data available from equipmentWe are leveraging new technologies
(e.g., XML) for a new “data port”Data analysis leads to enhanced
equipment control standards - RaP
Plans for 2003• Completion of Interface A and supporting Standards
• Further Prototyping/Commercialization efforts– Tied to actual standards as they are completed
• e-Diagnostics Guidebook updated and communicated– Compliance assessments, safety, security, data interface, tool interface
• Definition of Interface C– Link through factory firewall to enable supplier access to equipment data
• Education – Workshops, SEMI STEP programs, etc.
FactoryEquipment
ControlSystem
Examples: Ethernet, VPN, Authentication and Authorization
InternetInternet
• Leverage Supplier Experts• Remote Diagnostics• Remote Monitoring• Debugging Capabilities
Real-Time Diagnostic DataAccurate Historical Performance Data
IC Maker Site EquipmentSupplier Site