2830 ZT WAFER ANALYZERNon-contact determination of layer thicknessand composition
ULTIMATE CAPABILITY FOR MEASURING FILMS THICKNESS AND COMPOSITION
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer is the successor to Malvern Panalytical’s highly acclaimed PW2830. Designed specifically for the industry, it enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
The 2830 ZT Wafer Analyzer is equipped with Malvern Panalytical’s advanced 4 kW SST-mAX X-ray tube, featuring groundbreaking ZETA technology which eliminates the effects of X-ray tube aging – by far the largest contributor to instrument drift. As a result, the 2830 ZT attains the highest levels of productivity and sensitivity, with excellent light element performance. What’s more, thanks to ZETA technology, the 2830 ZT maintains these qualities throughout its entire lifetime.
Benefits
Unrivalled productivity• Continuous capability and speed.• Maximized uptime.• Superior light element capability.
Fast and cost-effective multi-layer analysis• Powerful Fundamental Parameter software.• Analysis of stacks up to 16 layers.• Simultaneous measurement of up to 24 elements.• Intuitive operation.
Seamless fab integration• Efficient, compact system design.• From manual to fully automated wafer loading. • Compliance to all relevant standards.
A complete solution• Excellent tool matching.• Complete support.
2830 ZT application examples:
• Dielectrics: BPSG, PSG, BSG, ASG
• Doped polysilicon
• �Barrier�films�and�stacks: Ta, TaN, WCxNy, TiN, Si3N4
• Silicides/salicides: TiSix, CoSix, WSix, NiSix
• �Metallization�films�and�stacks: Cu, AlCu, Ti, W, Au, Pt, AuGe, Ag, Sn, etc
• Low-k�dielectrics:�FSG,�SiOF
• �High-k�dielectrics:� HfO2,�HfAlOx, Ta2O5, etc
• �TMR�and�GMR�related�films�and�stacks:� CoFe(B),�AlOx,�Ru,�NiFe,�IrMn,�CrPtMn,�etc
• �PRAM�and�FeRAM�films:� PZT, SBT, BLT, GeSbTe
• �SAW�and�BAW�films�and�stacks: Al, Cu, AlCu, Ti, Ta, Pt
• SiGe
• �Phase�change�materials: GeSbTe,�InSbTe,�SeAgGe,�GeAsT
SUPPORTING THE SEMICONDUCTOR, DATA STORAGE AND SAW DEVICE INDUSTRY - NOW AND IN THE FUTURE
Semiconductor and data storage technology has advanced rapidly over recent years, and the rate of change continues to gather momentum. This places considerable pressure on the metrology techniques used to control production developments and meet ever more rigorous demands.
Deposited thin films and multi-layers continue to decrease in thickness while increasing in complexity. As new technologies emerge at an escalating rate, yield improvement (during process ramp up) must evolve accordingly. Flexible and cost-effective process monitoring has become increasingly critical to obtain optimal process conditions and maximum yield.
X-ray fluorescence (XRF) spectroscopy meets the key requirements of semiconductor and hard disk manufacturers. The technique is inherently suited to thin film analysis, offering exceptional precision and sensitivity for the simultaneous determination of layer thickness and composition. Moreover, XRF is compatible with a broad range of applications, facilitates straightforward stack analysis and is synonymous with high uptime and low running costs.
XRF in surface acoustic wave (SAW) device applications
SAW devices are used in electronic components to provide a number of different functions such as RF filters, oscillators, and transformers. It is widely used in telecom networks, cellular base stations, satellite navigation systems, mobile phones, automotive, and TV set-top boxes.
As smartphones are reaching Gigabit LTE speeds in 5G technology, the number of cellular bands within the phones is also rapidly increasing to provide support (current smartphones already have ~40 cellular bands). Advanced filtering technology provided by these SAW devices is needed to support carrier aggregation across a wide variety of frequency bands while managing interference issues and delivering excellent radio performance.
The thickness control of the thin films in these SAW devices is of prime importance because a very small change in the thickness can already change the operating frequency of the device. In this application space, the 2830 ZT wavelength dispersive X-ray wafer analyzer is an excellent and proven solution to meet the most stringent requirements of top SAW device manufacturers.
The�2830�ZT�is�designed�for�maximum�uptime�and�capability.�It�features�the�latest�X-ray�technology,�including:
• �Zeta�technology,�eliminating�X-ray�tube�aging,�greatly�enhancing�operational�efficiency.
• �4�kW�SST-mAX�tube�for�operation�at�160�mA�current�to give the highest sensitivities and lowest detection limits.
• �FP�Multi�software�allowing�simultaneous�analysis�of�film�thickness�and�composition�of�stacks�up�to�16�layers.
32
UNRIVALLED PRODUCTIVITY
Continuous capability and speed SST-mAX features groundbreaking ZETA technology which eliminates the effects of X-ray tube aging. ‘New tube’ performance is maintained throughout the tube’s lifetime. Together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration which increases productivity and uptime of the instrument.
Maximized uptimeConventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements. Implementation of the SST-mAX in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.
The key features to maximizing sensitvity and stability of 2830 ZT for light elements include:
• 4 kW output SST-mAX, operating at a high current of 160 mA.
• Dedicated high performance channels for light elements in the range from boron to magnesium.
• Dry (oil-free) pumps maintaining a clean, sub-Pascal vacuum within the measurement chamber.
Superior light element performance
SAVE ON COSTLY DOWNTIME HOURS
50%0 2000 4000 6000 8000 10000 12000
60%
70%
80%
90%
100%
110%
Rh L
-alp
ha in
tens
ity
Hours
SST-mAX
Typical XRFend-windowtube
THE PERIODIC TABLE OF THE ELEMENTS
11
Na22.990
10511.041
9469 0.9711.067
Sodium
55
Cs132.905
304.530.8514.286
298.5 1.87334.981
4.619
Caesium
1
H1.008
0.00009
Hydrogen1
IA R2O/RH
IIA RO/RH2
IIIB R2O3
IVB RO2
VB R2O5
VIB RO3
VIIB R2O7
VIII IB R2O
IIB RO
IIIA R2O3
IVA RO2/RH4
VA R2O5/RH3
VIARO3/RH2
VIIA R2O7/RH
3
Li6.941
0.534
Lithium
19
K39.098
620.43.312
602.4 0.8623.589
Potassium
37
Rb85.47
11.013.3731.694
101.5 1.5314.959
1.752
Rubidium
87
Fr(223)
15.185.11012.029
135.5 –97.46014.768
Francium
4
Be9.012
1110000.109
61000 1.848
Beryllium
12
Mg24.31
634.21.253
7163 1.7381.302
Magnesium
20
Ca40.08
461.63.6900.341
449.3 1.554.0120.345
Calcium
38
Sr87.62
9.314.1401.806
87.3 2.5415.833
1.871
Strontium
56
Ba137.33
271.432.0624.465
266.8 3.536.372
4.827
Barium
88
Ra226
14.087.41912.338
126.6 5.0100.113
15.233
Radium
LA
LA
21
Sc44.96
347.24.0880.395
339.4 2.9894.4600.400
Scandium
39
Y88.906
7.914.931 1.922
75.3 4.46916.735
1.995
Yttrium
22
Ti47.90
263.84.5080.452
259.5 4.544.9310.458
Titanium
40
Zr91.22
6.815.7442.042
65.1 6.5117.665
2.124
Zirconium
23
V50.94
202.44.9490.511
200.7 6.115.4260.519
Vanadium
41
Nb92.91
5.816.5812.166
56.5 8.5718.619
2.257
Niobium
24
Cr52.00
156.75.4110.573
156.8 7.195.9460.583
Chromium
42
Mo95.94
5.017.4412.293
49.2 10.2219.605
2.394
Molybdenum
25
Mn54.94
122.45.8940.637
123.8 7.46.4890.649
Manganese
43
Tc98.91
4.318.3252.424
42.9 11.5020.615
2.536
Technetium
26
Fe55.85
96.56.3980.705
98.7 7.877.0570.718
Iron
44
Ru101.1
3.819.2332.558
37.6 12.4121.653
2.683
Ruthenium
27
Co58.93
76.66.9240.776
79.3 8.97.6480.791
Cobalt
45
Rh102.905
3.320.1652.696
34.3 12.4122.720
2.834
Rhodium
28
Ni58.71
61.37.4710.851
64.2 8.908.2630.869
Nickel
46
Pd106.4
2.921.1212.838
30.0 12.0223.815
2.990
Palladium
29
Cu63.55
49.48.0400.930
52.4 8.968.9040.950
Copper
47
Ag107.87
2.522.1012.984
26.1 10.5024.938
3.150
Silver
30
Zn65.37
40.18.6301.012
43.0 7.139.5701.043
Zinc
48
Cd112.41
2.223.1063.133
23.2 8.6526.091
3.316
Cadmium
49
In114.82
1.9224.1363.286
20.9 7.3127.271
3.487
Indium
50
Sn118.69
1.6725.1913.443
18.7 5.75-7.3128.481
3.662
Tin
51
Sb121.75
1.4726.2713.604
16.7 6.6929.721
3.843
Antimony
72
Hf178.49
52.255.3827.898
55.2 13.3163.222
9.021
Hafnium
73
Ta180.95
47.757.0988.145
50.7 16.6565.212
9.342
Tantalum
74
W183.85
43.658.8568.396
46.6 19.367.233
9.671
Tungsten
75
Re186.2
39.960.6488.651
42.9 20.0269.29810.008
Rhenium
76
Os190.2
36.662.4778.910
39.5 22.5771.40110.354
Osmium
77
Ir192.2
33.664.3399.174
277.1 22.4273.54810.706
Iridium
78
Pt195.09
30.966.2419.441
257.2 21.475.73511.069
Platinum
79
Au196.97
28.468.1779.712
238.9 19.3277.97111.440
Gold
80
Hg200.59
26.270.1549.987
222.0 13.5580.24011.821
Mercury
81
Tl204.37
24.172.16710.267
206.4 11.8582.56212.211
Thallium
82
Pb207.19
22.374.22110.550
192.1 11.3584.92212.612
Lead
83
Bi208.98
20.676.31510.837
179.0 9.74787.32813.021
Bismuth
84
Po(210)
19.078.45211.129
166.8 9.3289.78113.445
Polonium
85
At(210)
17.680.62411.425
155.5 –92.28713.874
Astatine
57
La138.91
241.933.2994.650
238.6 6.1537.795
5.041
Lanthanum
58
Ce140.12
216.134.5664.839
213.8 6.6639.251
5.261
Cerium
59
Pr140.91
193.135.8605.033
191.8 6.6-6.840.741
5.488
Praseodymium
60
Nd144.24
173.137.1825.229
172.6 6.80-7.0042.264
5.721
Neodymium
61
Pm(145)
155.238.5325.432
155.4 7.2243.818
5.960
Promethium
62
Sm150.35
139.639.9115.635
140.4 7.40-7.5245.405
6.204
Samarium
63
Eu151.96
125.641.3205.845
126.9 5.24347.030
6.455
Europium
64
Gd157.25
113.442.7576.056
115.1 7.90048.688
6.712
Gadolinium
65
Tb158.92
102.444.2666.272
104.4 8.22950.374
6.977
Terbium
66
Dy162.50
92.645.7246.494
94.8 8.55652.110
7.246
Dysprosium
67
Ho164.93
83.847.2536.719
86.3 8.79553.868
7.524
Holmium
68
Er167.26
76.048.8136.947
78.7 9.06655.672
7.809
Erbium
69
Tm168.93
69.150.4067.179
71.9 9.32157.506
8.100
70
Yb173.04
62.852.0307.414
65.7 6.54-6.9759.356
8.400
Ytterbium
71
Lu174.97
57.253.6877.654
60.1 9.8461.272
8.708
Lutetium
89
Ac(227)
13.089.77312.650
118.4 10.07102.829
15.710
Actinium
90
Th232.04
12.192.17412.967
110.8 11.72105.591
16.199
Thorium
91
Pa231.04
11.394.62713.288
103.7 15.37108.409
16.699
Protactinium
92
U238.03
10.597.13113.612
97.2
Uranium
52
Te127.60
436.027.3773.769
424.7 6.2430.990
4.029
Tellurium
53
I126.90
386.128.5083.937
376.7 4.9332.289
4.220
Iodine
31
Ga69.74
32.89.2411.098
271.2 5.9-6.110.263
1.125
Gallium
32
Ge72.59
27.09.8741.188
228.1 5.3210.980
1.218
Germanium
33
As74.92
22.310.5301.282
192.5 2.0-5.7311.724
1.317
Arsenic
34
Se78.96
18.611.2071.379
163.2 4.28-4.7912.494
1.419
Selenium
35
Br79.904
15.511.9071.480
138.8 3.1213.289
1.526
Bromine
13
Al26.98
397.51.486
4764 2.6991.557
Aluminium
14
Si28.09
32821.739
3236 2.331.836
Silicon
15
P30.974
22822.013
2238 1.82-2.692.139
Phosphorus
16
S32.064
16142.307
1575 1.96-2.072.464
Sulfur
17
Cl35.453
11592.621
1127 0.00322.815
Chlorine
5
B10.81
660690.183
37111 2.34
Boron
6
C12.011
272340.277
19140 1.8-2.2
Carbon
7
N14.007
123930.392
9925
Nitrogen
8
O16.000
61590.525
5441 0.0014
Oxygen
9
F19.000
32580.677
3158
Fluorine
10
Ne20.179
18100.848
1930
Neon
36
Kr83.80
13.012.6311.586
118.5 0.003714.110
1.636
Krypton
2
He4.003
0.00018
Helium
54
Xe131.30
342.729.6664.109
335.1 0.0058933.619
–
Xenon
86
Rn(222)
16.382.84311.725
145.1 0.009794.85014.313
Radon
93
Np237.05
Neptunium
94
Pu(244)
Plutonium
95
Am(243)
Americium
96
Cm(247)
Curium
97
Bk(247)
Berkelium
98
Cf(251)
Californium
99
Es(252)
Einsteinium
100
Fm(257)
Fermium
101
Md(258)
Mendelevium
102
No(259)
Nobelium
103
Lr(262)
Lawrencium
with X-rays
Measured usingK-lines
Measured usingL-lines
#
Z0
000
0 0
Element
#
Z0
000
0 000
Element
#
Z0
000
0 000
Element
2
3
4
5
6
7
1
2
3
4
5
6
7
21
Sc44.96
347.24.0880.395
339.4 2.9894.4600.400
Scandium
Element symbol
µAl (left) and µCu (center)
of Al & Cu for Sc Kα,Be to Sb: Kα lines,Te to Pu: Lα lines)
Kα [keV]
Lα [keV] Lβ [keV]
Kβ [keV]
Atomic numberAtomic weight
Element name
Density [g/cm3]
0
0.00125 0.00169 0.00090
18.95111.281
17.217
–107.13914.953
– 13.51122.733
19.399
–109.99115.304
– –126.490
19.961
–112.99915.652
– –127.794
20.557
– – – – – – – – – – – – – – –
104
Rf(267)
– – –
Rutherfordium
105
Db(270)
– – –
Dubnium
106
Sg(269)
Seaborgium
107
Bh(270)
Bohrium
108
Hs(270)
Hassium
109
Mt(278)
Meitnerium
110
Ds(281)
Darmstadtium
111 115
Rg Mc(281) (289)
Roentgenium Moscovium
112 116
Cn Lv(285) (293)
Copernicium Livermorium
113 117
Nh Ts(286) (293)
Nihonium Tennessine
114 118
Fl Og(289) (294)
Flerovium Oganesson– – – – – – – – – – – – – – – – –– –– –– –– –– –– –– –– –– –– –– –
18
Ar39.948
842.62.957
817.9 0.001783.190
Argon
9.899.40713.942
91.1 20.25113.725
17.747
9.1101.85714.276
85.4 19.84116.943
18.291
–104.43114.615
– 13.67120.350
18.849
Thulium
Consistent and stable measurement results
The�2830�ZT�is�designed�for�maximum�uptime�and�capability.�It�features�the�latest�X-ray�technology,�including:
A�range�of�critical�features�maximize�reproducibility�and�minimize�measurement�times.�For�example,�the�laser-assisted�wafer�height�positioning�system�guarantees�consistent�and�stable�measurement�results.�This�feature�also�makes�it�possible�for�2830�ZT�to�analyze�films�on�a�large�range�of�substrate�materials�in�addition�to�Si�wafers, including piezo- and pyroelectric, glass and quartz substrates.
Save time on instrument monitor corrections with the ultimate long-term stability of SST-mAX tube. Light elements such as boron and carbon often monitored on a daily basis can now be monitored weekly or bi-monthly, minimizing instrument downtime and thus, saving money.
Zeta technology enables long term stability and limits tube replacements. Save additionally on tube cost and downtime by upgrading to SST-mAX.
11 22.990
Na Mg24.3112
1.041 1.067 1.253 1.302MagnesiumSodium
B C N O F10.81 12.011 14.007 16.000 19.0005
0.183
6
0.277
7
0.392
8
0.525
9
FluorineOxygenNitrogenCarbonBoron
0.677
54
FAST AND COST-EFFECTIVE MULTI-LAYER ANALYSIS
Analysis of stacksFP modeling allows reliable thin film analysis. Malvern Panalytical’s best-in-class algorithms model X-ray fluorescent behavior of the elements to calculate precise layer composition and thickness. This reduces the time and cost involved in setting up thin film and multi-layer analyses. System calibration requires only a minimum number of reference samples to analyze complex stacks of up to 16 layers.
Simultaneous measurement of up to 24 elementsThe 2830 ZT can be fitted with up to 24 fixed measurement channels, from boron onwards. These high performance channels allow for multi-layer analysis according to specific user requirements. Furthermore, as new channels can be added at any time, the 2830 ZT offers powerful flexibility, allowing the user to keep up with the latest technologies.
Powerful Fundamental Parameters
KEEP TRACK OF YOUR STACK
The 2830 ZT utilizes Malvern Panalytical’s proven SuperQ Thin Film software platform. This powerful, easy-to-use thin film data collection and analysis package is renowned for its highly intuitive interface and menu. It enables simple setup of standard measurement protocols and individually customized programs. User-assigned function keys or large on-screen ‘speed buttons’ permit rapid initiation of measurement for single wafers or complete batches.
Uniformity patterns and wafer maps are easily defined with user-friendly spot location selection. Click-and-drag commands allow straightforward comparison with international wafer configuration standards.
Intuitive operation
Malvern Panalytical’s Fundamental�Parameter�(FP)�software�package,�FP�Multi,�is�fully integrated into the SuperQ thin�film�platform�of�the�2830�ZT.�It�enables�the�direct�calculation�of�chemical�composition�and�thickness�of�layered�materials�and is ideal for analyzing both single�layer�thin�films�and�complex�multi-layer�film�stacks.
CoNiFeTaCoFeTaCuNiFe
Malvern�Panalytical’s�SuperQ�software�makes�it�simple�to�set�up�spot�patterns�for�uniformity�measurement�over�the�full�surface�area�of�wafers�up�to�300�mm.
Measurement�programs�are�quickly�selected�via�clearly�labeled�“speed�buttons”�on�the�built-in�touch�screen�monitor.
66 7
SEAMLESS FAB INTEGRATION
Efficient, compact system design With a footprint comparable to that of 200 mm XRF wafer analyzers, the 2830 ZT occupies a minimum amount of valuable cleanroom space. A very narrow face print contributes further to space savings. The 2830 ZT can even be flush-mounted into a cleanroom wall, leaving only the loading port panel apparent within the workspace.
In accordance with normal fab procedures, the 2830 ZT measures wafers in a surface-up orientation. A transfer robot and notch/flat alignment unit position samples on the x-y wafer stage. Vacuum pumps can be installed remotely for convenient maintenance.
The system integrates readily into plant-wide process control and quality assurance networks, using SECS/GEM protocols to communicate with the host computer.
From manual wafer loading to full automation2830 ZT accepts 100 mm to 300 mm wafers, and smaller wafers or fragments can be measured using adaptors. To ensure integration into any fabrication environment, various wafer-handling options are available:
• Manual loading • Open cassette loading with the robot in the cleanroom
atmosphere• Single or dual FOUP loading with robot and alignment
unit in an ISO class 1 mini-environment • Single or dual SMIF loading with robot and alignment
unit in an ISO class 1 mini-environment • Any combination of SMIF, FOUP and open cassette
loading
Single load port FOUP and SMIF systems can be equipped with an internal reference position which can harbor a cassette with frequently used reference wafers. The reference position accommodates three wafer sizes in a range of 100 to 300 mm.
Compliance to all relevant standards
Malvern�Panalytical’s�PW2830�was�the�first�X-ray�metrology�system�to�comply�with�all�300�mm�standards.�This�led�to�its�rapid�establishment�as�the�system�of�choice�for�automated�wafer�analysis. Now, the 2830 ZTbuilds on this reputation, and is designed to accommodate�all�relevant�industry�norms�and�standards.
Importantly,�the�2830�ZT�is�fully�compliant�with�SECS/GEM�(Semiconductor�Equipment�Communication�Standards/Generic�Equipment�Model),�GEM300,�and�AMHS�(Automatic�Material�Handling�System).�
IMPROVING SAFETY IN SEMICONDUCTOR MANUFACTURINGAs the semiconductor industry expands and gets more complex, the safety requirements in the manufacturing environment becomes even stricter. More and more semiconductor fabs require full compliancy to the SEMI-S2 standard.
WHAT IS THE SEMI-S2 STANDARD? SEMI-S2 is in fact the most well-known standard in semiconductor manufacturing equipment for EHS. It covers 22 specific EHS categories, including regulatory requirements; electrical, mechanical, fire, chemical, radiation, noise, and ergonomics hazards; emergency shutdown, ventilation, and exhaust specifications; hazard warnings and more.
2830 ZT SEMI-S2 COMPLIANCEThe 2830 ZT Wafer Analyzer has been certified as compliant to the latest SEMI-S2 standard. This means that the 2830 ZT instrument can be trusted as being a completely safe instrument, helping you to ensure and improve safety in the semiconductor manufacturing environment.
8
COMPLETING THE SOLUTION
Metrology accuracy, reproducibility and repeatability are essential for accurate results within a fab. However, many organizations operate fabs at multiple locations. With different fabs making the same product, consistency of results is essential. 2830 ZT can be placed at different fab locations and matched to a ‘gold standard’ reference tool using a universal set of reference wafers.
This provides easy multi-production line quality control of thin film deposition and other processes. Excellent tool matching is the result of the high quality optical components, in combination with robust software algorithms.
Malvern Panalytical understands the importance of continuity in production control. The 2830 ZT is based on proven concepts, established throughout the company’s XRF thin film metrology product line.
However, technology is only part of a successful process control solution. To make sure that users maximize the benefit of the 2830 ZT, Malvern Panalytical provides excellent technical, software and application support.
2830 ZT users can take advantage of a large knowledge base when creating new applications, training new users, or solving technical issues. Malvern Panalytical takes great pride in offering outstanding customer service, and values the trust users repeatedly place in the organization. A range of service contracts, including 24/7 coverage in most areas, is available, delivered by the largest X-ray support and service force in the market.
Excellent tool matching Complete support
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Tel. +44 1684 892456Fax. +44 1684 892789
Lelyweg 1, 7602 EA Almelo, The Netherlands
Tel. +31 546 534 444Fax. +31 546 534 598
MALVERN PANALYTICAL
WHY CHOOSEMALVERN PANALYTICAL? Malvern Panalytical provides the global training,
service and support you need to continuously drive your analytical processes at the highest level. We help you increase the return on your investment with us, and ensure that as your laboratory and analytical needs grow, we are there to support you.
Our worldwide team of specialists adds value to your business processes by ensuring applications expertise, rapid response and maximum instrument uptime.
• Local and remote support
• Full and flexible range of support agreements
• Compliance and validation support
• Onsite or classroom-based training courses
• e-Learning training courses and web seminars
• Sample and application consultancy
We are global leaders in materials characterization, creating superior, customer-focused solutions and services which supply tangible economic impact through chemical, physical and structural analysis.
Our aim is to help you develop better quality products and get them to market faster. Our solutions support excellence in research, and help maximize productivity and process efficiency.
Malvern Panalytical is part of Spectris, the productivity-enhancing instrumentation and controls company.
www.spectris.com
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at th
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ctne
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rmat
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amag
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with
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use
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is m
ater
ial.
Mal
vern
Pan
alyt
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e co
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eria
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Mal
vern
Pan
alyt
ical
. Thi
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atio
n or
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por
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ther
eof m
ay n
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pied
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PN12
150
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