STS SEMICON-DUCTOR
2007013265 Moon – jun young
Index
Introduce product Semiconductor product manufacturing process
Wafer backgrindingWafer sawDie attachMoldMarkSorterVisualpacking
Introduce product PKG(TSOP,SOP) Card(sdcard)
wafer
The wafer is cut into pieces called dies.
manufacturing process
Wafer backgrindingFor Uniform thickness of the wafer
manufacturing processWafer saw
○ cutting wafer for assemble the pieces of the wafers(die)
manufacturing process Die attach
attach the die on die pad using epoxy
manufacturing process Mold
the process that cover with device by plastic
manufacturing process Mark
In order to distinguish it from other things, a kind of marker is engraved process
manufacturing process Sorter
manufacturing process Visual
Checking product
manufacturing process
Packing & delivery