Product Brief

X-GOLDTM616High Performance Modem Solution for Smart Phones

THe InfIneOn X-GOLDTM616 is a cellular system on chip comprising of the 2G/3G digital and analogue baseband plus the power management function all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd generation 3G baseband solution and is taking the next step in bringing enhanced modem features such as HSDPA and HSUPA to the mass market.

This modem solution is designed for an optimized smart phone system setup together with an application processor. In addition it addresses the market segments for cost optimized cellular modem solutions like PC modems, data cards, M2M modules and cellular automotive solutions. The X-GOLDTM616 provides the complete modem functionality offering HSDPA cat 8 (7.2Mbps), HSUPA cat 6 (5.7Mbps), eDGe multi slot class 33 and includes the latest OMTP security standards.

The processing of the 2G/3G cellular protocol stack is handled by an ARM® 1176 embedded microcontroller. The physical layer and the voice processing is handled by a dedicated hardware accelerator and DSP sub system.

The X-GOLDTM616 enables the XMMTM6160 platform solution; a reference design with the complete Rf engine, the integrated release 6 protocol stack and modem interface SW for the inter processor communication via various HW interfaces. The integration of all baseband and PMIC functions and the combination with Infineon’s SMARTiTMUe Rf engine heralds lowest PCB footprint, below 700mm2 for triple band 3G and quad band eDGe and offers optimized stand-by and talk times. The solution is validated with an Inter Operability Test Program at infrastructure vendors and operators, to significantly reduce the time to market for customers end product.

Modem��

HSUPA 5.7Mbps –

HSDPA 7.2Mbps –

WCDMA: 386kbps DL/UL –

eDGe: MSC33 –

Speech: nB-ARM, WB-AMR –

SAIC –

CPU��

ARM1176 –

Memory��

LPDDR1-SDRAM –

nOR, nAnD flash –

Shared-SDRAM, Dual-Ported-SDRAM –

Connectivity and Interfaces��

Digital Rf interface –

• DigRF Version 3.09

High-speed interface to SIM –

• IC-USB

USB 2.0 HS –

MIPI PTI/STP –

3xUSIf –

2xI – 2C

2xI – 2S

SD/MMC card interface –

www.infineon.com/wireless

Main features

Product Brief

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Published by Infineon Technologies AG 81726 Munich, Germany

© 2009 Infineon Technologies AG All Rights Reserved.

Legal Disclaimer The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

Information for further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

Warnings Due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Published by Infineon Technologies AG

Block Diagram

ExternalCrystal

PowerSupply

3G TX

2G/3G RX

FEM CTRL

2G TXCLK In

NOR LPDDR1Battery

MMCSDC

Analog/DigitalMicrophone

HandsfreeLoudspeaker

Earpiece

StereoHeadset

Test &Debug

Test &Debug

ApplicationProcessorInterface

Audio I/FAppProc &BluetoothControl

SIM

USB SPIMIPI

TPI/SPTOsc

ControlDAC

USIFUART

2GTX

FEControl

2G/3GRX

PA

PA

3GTX

I2C I2S

Audio

SD/MMC

32kHzXO

External MemoryInterface

DigitalRF

Interface

DigitalRF

v3.09

PowerSupplyDirect

toBattery

Memories (RAM, ROM, Cache)

Oscillator

3G/HSPALayer 1

TimerInterrupt

2G DSP TEAKlite®

FEM

ARM 1176

X-GOLDTM616

SMARTiTM-UE2G/2.5G/3G RF

XMMTM6160 Smartphone Platform SolutionSetup with triple band HSxPA and quad band eDGe

X-GOLDTM 616High Performance Modem Solution for Smart Phones

Platform featuresModem Area �� < 7cm2; ~100 components

Standby current ��

2G: 0.9mA –

3G: 1.1mA –

3GPP Release 6 Protocol stack��

HSDPA cat 8, HSUPA cat 6��

3 band HSPA, quad band eDGe��

Optional up to 5 band HSPA possible��

A-GPS interfacing��

Order Number: B153-H9337-X-X-7600 NB08-1293

note: TeAKlite® is a registered trademark of ParthusCeva, Inc.