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Working with cEDM
in Industrialization
Eric Roskin, Pepric
October, 4rd 2013
Content
1. Who is Eric Roskin?
2. Collaboration with cEDM: an overview
3. Benefits of collaboration
4. Case 1: RoHS (ICOS)
5. Case 2: Design for Manufacturing/Reliability
6. Case 3: Risk assessment (Septentrio)
7. Case 4: Green Mold Compound
8. Conclusion
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1. Who is Eric Roskin?
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More info: www.linkedin.com/in/ericroskin
1. Who is Eric Roskin?
– From July 2013:
• Pepric (Product Development Manager)
– Jan 2009 - June 2013:
• Septentrio (Industrialization Group Manager)
– June 1995 – Dec 2008:
• ICOS (Sr Q&R Engineer)
Main task: Product Industrialization
High Quality – High Reliability – Low Cost
Challenge: electronics miniaturization for high reliable products
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Pepric – www.pepric.com
Pepric develops instrumentation for quantitative
detection of magnetic nanoparticles.
The method provides the capability of quantifying
cells, and is complementary to MRI being used for cell
location.
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Septentrio – www.septentrio.com
Septentrio Satellite Navigation NV, designs,
manufactures, high-end GNSS receivers.
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ICOS – KLA Tencor – www.kla-tencor.com
• KLA Tencor designs and manufactures inspection
equipment for semiconductor packaging and
interconnect applications.
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2. Collaboration with cEDM: an overview
• ICOS IMEC&WTCM
– RoHS EU / China
• (awareness – roadmap)
target: product compliancy
– Design for Manufacturing / Reliability
• (PBA evaluation – IPC-A-610 / X-ray)
target: improve reliability
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2. Collaboration with cEDM: an overview
• Septentrio cEDM
– Failure risk assessment
• (BOM evaluation)
• (PBA evaluation – IPC-A-610 / X-ray / SEM-EDX)
target: improve FPY
– Green Mold Compounds
• (Simulation reliability BGA - WLCSP)
target: design for manufacturing / reliability
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3. Benefits of collaboration
• Why collaborate?
• Access to commercially independent knowledge about PCB/PBA
manufacturing and reliability
• Science based not only experience solutions are provided fast,
problems get eliminated, problems are predicted and avoided.
• Helicopter view on supply chain. Overall optimization.
• Access to fast support for development and failure root cause
analysis
• Access to analysis tools
• Analyses are defined and results are interpreted with electronic
design, material and manufacturing knowledge
• Possibility for funding (ex. KMO Portefeuille – 75%)
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4. Case 1: RoHS EU / China
17/11/2005 – Seminar: Introduction RoHS
21/03/2006 – Seminar: Lead-free Soldering
29/06/2006 – Seminar: Farewell to lead
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4. Case 1: RoHS EU / China
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4. Case 1: RoHS EU / China
Roadmap to RoHS
Phase1: Identify the hazardous substances
Phase2: Implementation of RoHS components
Phase3: Design for RoHS Manufacturing
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5. Case 2: PCB/ PBA
Design for Manufacturing / Reliability
Visual / X-ray evaluation
Risk assessment: Press-fit connector on NiAu finish PCB
Possible Problem: Ni cracking oxidation unreliable
Corrective action: soldering of press-fit connector
Evaluation: soldering not conform IPC-A-610
Corrective action1: Company training IPC-A-610
Corrective action2: Press-fit connector replaced by solder-connector
Result: improvement MTBF - reduction field defects
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6. Case 3: PCB/PBA
Failure risk assessment
BOM evaluation - visual/X-ray/SEM-EDX analysis
Risk assessment: use of 0.5mm BGA pitch
Possible problem: soldering reliability
Evaluation: voiding
Preventive action1: adapting paste
Preventive action2: PCB improvement – flatness micro via in pad
Result: improvement FPY/reliability - reduction production cost
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6. Case 3: PCB/PBA
Failure risk assessment (BoM evaluation)
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6. Case 3: PCB/PBA
Failure risk assessment
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7. Case 4: Green Mold Compound -
Simulation
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Simulation PBGA & WLSCP
Risk assessment: thermal expansion mismatch between PCB and
PBGA/WLCSP
Possible Problem: solder joint fatigue failed solder joint
Evaluation: simulation limited lifetime
Corrective action1: add under-fill
Preventive action2: Full grid array BGA
Preventive action3: 0.65 / 0.8 / 1mm BGA
Result: improvement reliability/MTTF – satisfied customers
7. Case 4: Green Mold Compounds -
Simulation
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7. Case 4: Green Mold Compounds -
Simulation
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7. Case 4: Green Mold Compounds -
Simulation
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7. Case 4: Green Mold Compounds –
Simulation
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8. Conclusion
• cEDM is an excellent partner to improve your
product to the highest Quality & Reliability
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