TSUNAMI AND EARTHQUAKE ALERT SYSTEM USING GSMPROJECT REPORT

2014-15

Submitted to Uttar Pradesh Technical University (U.P.T.U) for the fulfillment of the requirement for the Degree of

Bachelor of Technology

(Electrical and Electronics)

DEPARTMENT OF ELECTRICAL AND ELECTRONICS

Prashant Shukla Mayank Kumar Shashikant Dubey Virender Yadav

(1109621047) (1109621034) (1109621060) (1109621072)

Dr. H.C. Sharma Mr. Saurabh Tiwari Mr. H.K. Rajput (H.O.D) (Project Guide) (Project Co-Ordinator)

i

CERTIFICATE

Certified that Prashant Shukla, Mayank Kumar, Shashikant Dubey and Virender Yadav have

completed the project entitled “TSUNAMI AND EARTHQUAKE ALERT SYSTEM USING GSM” for the

award of Bachelor of Technology from Vishveshwarya Institute of Engineering & Technology,

Dadri ( G. B. Nagar) affiliated to Gautam Buddh Technical University, Lucknow under my

supervision. The project report embodies result of original work and studies carried out by Students

and the contents of the report do not form the basis for the award of any other degree to the

candidates or to anybody else.

ii

DECLARATION OF ORIGINALITY

This report is our own unaided work and was neither copied from nor written in collaboration with

any other person. It has never been submitted or done by any other student of any college

simultaneously and partially. We are a group of four viz.

PRASHANT SHUKLA

MAYANK KUMAR

SHASHIKANT DUBEY

VIRENDER YADAV

iii

ACKNOWLEDGEMENT

Before we get into the intricacies of the things, we would like to add a few heartfelt words for all

those who knowingly or unknowingly became a part of this project in numerous ways who gave

unending and unconditional support right from the stage the idea was conceived.

Bringing out this project was really an arduous task. But we were fortunate enough to get help and

guidance from a large number of persons. It is a pleasure to acknowledge them, though it is still

inadequate appreciation of their contributions.

We offer our profound gratitude to our project guide Rev. Mr. SAURABH TIWARI, our project

coordinator Rev. Mr. H.K. RAJPUT and our respected H.O.D. Mr. H.C. SHARMA sir for their

continuous inspiration and help, which finally helped in envisaging the project.

With thanks and regards,

PRASHANT SHUKLA

MAYANK KUMAR

SHASHIKANT DUBEY

VIRENDER YADAV

iv

ABSTRACT

Natural Disasters or Natural Calamities, whatever you name it has for long been the most dreaded

cause of mass destruction and loss of human lives, wealth and property. It destroys the beauty of

earth, lives of humans and leave behind no traces of existence. It’s so severe in its approach that

millions and billions of people and land vanishes and escape into oblivion in just a moment. But

nothing fruitful or beneficial could be done as most of the people thought that these disasters are

natural and cannot be averted. As they say, “MAN PROPOSES, GOD DISPOSES” so they have

lived on with the same thought.

But with advancement of Science and Technology and with more research and development more

and more Scientists, Engineers and Physicists concluded that although such a calamity cannot be

averted but a proper precaution can be taken from it. They said “Where there is a will there is a

way” and “Prevention is always better than cure” so with that thought they created an alarming

or a warning system which would well beforehand makes the authorities and the people aware of

the dangers so that precautionary measures can be taken and there is not much or massive loss of

lives and property.

A warning system that can well in advance detect and alarm the people of the dangers and give us

ample time to relocate ourselves so as to avoid the severity caused by the disaster. It uses sensors,

microcontrollers and radio frequency so as to transmit and receive signals. With the technology still

at its infant stage, a lot of automation needs to be done so as to prepare for a better tomorrow and

the need of the hour is to stimulate the best use of growing science and technology.

v

PREFACE

This report aims to provide a comprehensive overview of the current state of the art in Tsunami

Warning System development, application and future trends. The information would be useful to

Geologists and Meteorological Department who wishes to explore the possibility of developing

Tsunami Warning System applications.

This report consists of three sections. The basic components of the tsunami warning system are

presented in the first section along with the introduction to the system and a glossary of the

terminology used to make such a system. The second section includes the block diagram and the

circuit description as to how the whole system has been assembled and how it works in order to

implement the cause it is designed for. The last section consists of the advantages and prediction

making capabilities of the system. We shall also discuss its future scope and advancements and all

the possible applications of this system.

The growth of tsunami warning system in ASIA is increasing rapidly and we believe this

technology will be an important one in the near future.

vi

CONTENTS

GLOSSARY OF TERMS………………………………………………………….…….xi

OBJECTIVE AND MOTIVATION …………………………………………………….xii

LIST OF TABLE ...................................................................................................…….xiii

LIST OF FIGURE……………………………………………………………….……….xiv

CHAPTER 1……………………………………………………………………………..1

1. Introduction………………………………………………………………………...2

1.1. Block Diagram……………………………………………………….………..3

1.1.1. Transmitter Section…………………………………………………….3

1.1.2. Receiver Section……………………………………………………….4

1.2. Circuit Diagram……………………………….……………………………....5

1.3. Working Approach………………………………………..…………………..6

1.3.1. Power Supply Section……...……………………………..……….…...6

1.3.2. Transmitter Section…………………………………………………….6

1.3.3. Receiver Section……………………………………………………….7

1.3.4. Fully Assembled Project……………………………………………….7

CHAPTER 2. ………………………………………………….…………………….…..8

2. Power Supply…………………………………………………….……………...….9

2.1. Transformer………………………………………………………………...….9

2.2. Resistor………………………………………………...…………………...….9

2.2.1. Resistor Symbol with color coding…….………………………….......10

2.3. Capacitor…………………………………...……………………………..……11

2.3.1. Electrolytic Capacitors………………………………………...……….11

2.3.2. Ceramic Capacitors…………………………………………….………12

2.4. Bridge Rectifier…………………………………………………...………..…..13

2.4.1. Current flowing In Bridge Rectifier…..………………………………..13

2.5. Diode…………………………………………………………………………...14

2.6. Light Emitting Diode………………………………………………….……….15

2.7. Voltage Regulator……………………………………………………………...16

2.7.1. Features………………………………………………………………...16

vii

CHAPTER 3. ……………………………………………………..………………...…17

3. Transmitter Section……………………………..........................…….................18

3.1. Transistor………………………………………..........……........................18

3.1.1. Type of Transistor……………………………………...……………18

3.1.1.1. BJT…....………………………………….........19

3.1.1.2. FET……………..…………………..............…20

3.2. Encoder……………...….............................................................................23

3.2.1. Features…………………………………......…………..…………..23

3.2.2. Applications…………………………………......………..………...24

3.2.3. General Description………………………………......…..………...24

3.2.4. Block Diagram…………………………………………...........…...25

3.3. RF Transmitter…………………………………………...…......................26

3.3.1. Overview………………………….………………...…....................26

3.3.2. Features………….……………...…….….…………………....……..26

3.3.3. Applications……………….………………...……….......................26

3.4. Sensors…………………….………………...……...………....…………….27

3.4.1. Water Level Sensor…….………………………...……....…...……..27

3.4.2. Piezo electric Sensor………......................................................……27

3.4.2.1. Principle Of Operation…………………...…...27

3.4.2.1.1. Transverse Effect……………….........28

3.4.2.1.2. Longitudinal Effect………………...…28

3.4.2.2. Electrical Properties……………...…………...28

3.4.2.3. Sensor Design……………………....…………29

3.4.2.4. Sensing Materials……………………...……...30

3.5. Operational Amplifier….…………….…….………………………....……31

3.5.1. Operation ……….…………..........................................................31

3.5.2. Ideal Op-Amp……………………………..……………………....32

CHAPTER 4. …………………………………………...…………………………....33

4. Receiver Section………………………………………………………..............34

4.1. Crystal Oscillator……………………………....………………………..…34

4.2. MicroController………………………………...………..………………...36

viii

4.3. 999999Display Section…………………………………..………..……….37

4.4. Decoder……………………………….………..…………………………38

4.4.1. Features………………………………………...…………………38

4.4.2. Applications………………………………….…………………..39

4.4.3. General Description……………………………..………………..39

4.5. RF Receiver………………………………………………………………40

4.5.1. Applications……………………………………………………..40

4.6. IC ………………………………………………………………………...41

4.7. GSM MODEM…………………………………………………………….42

4.7.1. SIM300 Module Features ………………………………………42

4.7.2. GSM Modem Features…………………………………........…42

4.7.3. Interfaces……………………………………………………..…43

4.8. Buzzer…………………………………………………………………....43

4.8.1. Piezo-Electric…………………………………………………...43

CHAPTER 5………………………………………………………..……………...44

5. Development And Analysis of the Project………………………...………....44

5.1 Functional Description……………………………………….…………45

5.1.1 Tsunami by Seismicity…………………………………………..45

5.2 Solder ……………………………………………………………………46

5.2.1. Procedure of making project………………….…………….….46

5.2.2. Tools…………………………………………………………...46

5.2.3. Mounting and Soldering……………………………………….46

5.2.4. Soldering Kit…………………………………………………..47

5.2.4.1. Soldering Iron…………………………………………...47

5.2.4.2. Solder…………………………………………………....47

5.2.4.3. Fluxes or Soldering Paste…………………………….....47

5.2.4.4. Blades or Knife………………………………………….47

Costing………………………………………………………………….....48

Table of Costing…………………………………………………………...49

Full Assembled View Of the Project…………………………….……......50

CHAPTER 6.........................................................................................................52

6. Advantages and Future Applications…….…………………………....…..52

ix

6.1 Warning and Prediction………………………………………....….....53

6.2 Advantages and Future Scope…………………………………………...54

6.3 Conclusion and Future Enhancement…………………………...……....55

Appendices…………………………………………………………………56

References………………………………………………………………….59

x

GLOSSARY OF TERMS

c CapacitorD DiodeIC Integrated CircuitI/O Input and OutputLED Light Emitting DiodeISO International Standards OrganizationMHz MegaHertzMicro MicrocontrollerOSC OscillatorR ResistorRF Radio FrequencyRS232 Serial Interface StandardBJT Bipolar Junction TransistorFET Field Effect TransistorVR Voltage RegulatorTx TransmitterRx ReceiverHT 12E EncoderHT12D DecoderLCD Liquid Crystal DisplayO/p OutputOp-Amp Operational AmplifierVCC Positive SupplyGND Ground SupplySW SwitchVr Variable Resistor

xi

OBJECTIVE AND MOTIVATION

In this theory, DARWIN proposed “SURVIVAL OF THE FITTEST”, which is relevant in modern

professional setup. In order to move at a pace, with today’s technological development we were

required to make a project which was at par with national requirement. Project “Wireless Based

Tsunami And Earthquake Warning System” is the need of the hour as per both technological and

biological aspects.

The task selected wasn’t an easy one to complete all by ourselves. Mr. Hemant Kumar Rajput,

(Project Coordinator EN dept. VGI) and Mr. Saurabh Tiwari, (Asst. Professor EN dept. VGI)

were among those who have motivated us in the completion of this project. They were instrumental

in guiding and instructing us what and how we have achieved. Above all, they were the motivating

factor when our spirits were down.

xii

LIST OF TABLES

Sr. No. Table No. Table Title Page No.

1.

2.

3.

4.

5.

1.0

2.0

3.0

4.0

5.0

Encoder Selection Table

Encoder Pin Decription

Pin Description Decoder

RF Receiver Description

Costing Table

24

25

39

40

49

xiii

LIST OF FIGURES

Sr. No. Figure No. Figure Title Page No.

1.

2.

3.

4.

5.

6.

7.

8.

9.

10.

11.

12.

13.

14.

15.

16.

17.

18.

19.

1.0

2.0

2.1

2.2

2.3

2.4

2.4(a)

2.5

2.6

2.7

2.8

3.0

3.1

4.1

3.2

3.3

3.4

3.5

3.6

Circuit Diagram

Various types of transformer

Low Power Resistor

Resistor Color Coding

Electrolytic Capacitor

Ceramic Capacitor

Bridge Rectifier

Diodes

LEDs

Working Of LEDs

Voltage regulator

BJT Symbol

Working Of BJT

FET

Encoder

Block diagram (Encoder)

RF Transmitter

Piezoelectric Sensor

Schematic Symbol(Piezoelectric)

5

9

10

10

11

12

13

14

15

15

16

19

20

22

23

25

26

27

28

xiv

20.

21.

22.

23.

24.

25.

26.

27.

28.

29.

30.

31.

32.

33.

34.

35.

3.7

3.8

3.9

3.10

4.0

4.1

4.2

4.3

4.3(a)

4.4

4.5

5.0

5.1

5.2

5.3

5.4

Frequency response

Sensor Design

OP-Amp

Ideal op-Amp

Crystal oscillator

Microcontroller

LCD

Decoder

RF Receiver

IC

Piezoelectric Buzzer

Tsunami through Seismicity

Solder Tool

Solder Mounting

Full Assembled Transmitter View

Full Assembled Receiver View

29

29

31

32

34

36

37

38

40

41

43

45

46

47

52

52

xv

CHAPTER 1

1

INTRODUCTION

Previous statistics show the initial tsunami wave from the 1700 event reached the coast in 20 to 30

minutes. So time is limited. Geologic history showed waves with this event were as high as 30 feet.

So you must get at least that high above sea level.

Tectonic earthquakes are a particular kind of earthquake that are associated with the Earth's crustal

deformation; when these earthquakes occur beneath the sea, the water above the deformed area is

displaced from its equilibrium position

We are going to present advance Tsunami Warning System which helps minimize loss of life and

property. We are using piezo electric vibration sensor to sense earth quake and its intensity. Due to

earth quake the water height in sea increases so we are sensing sea water level. These two sensor

will be placed at least 20 km from the sea coast. The reading from these two sensor is transmitted

using 433Mhz FM transmitter to the coastal area. The FM receiver receives the transmitted data and

AT89C52 process the data. We are using LCD to display the earth quake and the increased water

level. If water level increased from the certain value, meaning tsunami is coming so buzzer starts

beeping.

2

1.1 BLOCK DIAGRAM

1.1.1 Transmitter Section

3

1.1.2 Receiver Section

4

GSM

MODEM

1.2 Circuit Diagram

Fig. 1.0 Circuit diagram

5

GSM MODEM

1.3 Working Approach

The whole project can be sub-divided into four basic sections. They are as follows :-

1) Power Supply Section.

2) Transmitter Section.

3) Receiver Section.

4) Fully Assembled Project.

1.3.1 Power Supply Section

This section comprises of a Transformer, Bridge rectifier, Voltage Regulator, Capacitors and

Diodes. Here a 230 V AC supply is fed into the transformer which is being step down to 12 V AC

supply through it. The Bridge Rectifier that includes four diodes in a wheat stone bridge type of

arrangement is used to convert the 12 V AC supply into 12 V DC supply. This supply is then fed

into an electrolytic capacitor that removes the spikes from the voltage supply and then introduced

into the ceramic capacitor which reduces the noise component of the supply. The supply is

regulated through a Voltage Regulator that converts the 12 V DC supply into 5 V DC supply. This

supply is used by all the components present in the project.

1.3.2 Transmitter Section

This section comprises of the electrical probes and the piezo-electric sensor use to detect water

level and vibration respectively. The vibration sensor has an operational amplifier that amplifies the

signal and fed it to the transistor that sends negative pulses into the encoder and that sends the

encoded value into the RF transmitter which transmits it to the other section on 434 MHz

frequency.

6

1.3.3 Receiver Section

This section comprises of the RF Receiver that receives signals on 434 MHz and directs it into the

decoder that sends the decoded value into a suitable form which is being used by the I/O ports of

the 8051 series Atmega AT89C52 microcontroller. The other ports are connected to the 16*2

display section LCD and one port is connected to the buzzer. There is a crystal oscillator used here

to provide timing signals and to the other port reset switch is connected to bring back the values

back to zero.

1.3.4 Fully Assembled Function of the Project

All the sections mentioned above are then assembled together and work in tandem to form the

whole working of the project. Each section i.e. Transmitter and Receiver has its own power supply

and specifications.

When power supply is applied to both the section, the probes have been designed at a different

position of sea level thereby defining the rise and fall of Tsunami. When the water level gradually

increase the probes get connected so that they start conducting. The position of probes define

different water levels as :

a) Normal Wave

b) High Wave

c) Tsunami wave/ Danger Wave

The sensor used here is a piezo-electric sensor which is senses the vibration produced by the

earthquake so when there is an earthquake along with the rising level of water, it results into a very

high and dangerous waves of tsunami. This sensor and probes converts the driving force into a

suitable form of electrical signal which is then amplified and is send to the encoder. Encoder

convert these electrical signal into its digital form and sends it to the RF transmitter which transmits

these signals as a component of frequency at 434 MHz.

Receiver receives these signal at the same frequency 434 MHz and sends it to the decoder that

again converts it into a suitable form and sends it to the microcontroller.

Thus whenever there is any rise or fall of water level an appropriate message is being displayed on

the LCD and a buzzer gets activated sending us a warning level.

7

CHAPTER 2

8

POWER SUPPLY

2.1 Transformers

For electronic devices to function it is necessary to have a DC power supply. Batteries and

rechargeable cells can fulfill the role, but a much more efficient way is to use a POWER SUPPLY.

The basic component of a power supplyr is a transformer to transform the 220V "mains" to a lower

value, say 12V. A common type of transformer has one primary winding which connects to the

220V and one (or several) secondary windings for the lower voltages. Most commonly, cores are

made of E and I laminations, but some are made of ferromagnetic material. There are also iron core

transformers used for higher frequencies. Various types of transformers are shown on the picture

below

Fig. 2.0 Various types of Transformer

2.2 RESISTOR

Resistors are the most commonly used component in electronics and their purpose is to create

specified values of current and voltage in a circuit. A number of different resistors are shown in the

photos. (The resistors are on millimeter paper, with 1cm spacing togive some idea of the

dimensions).  Photo 1.1a shows some low-power resistors, while photo 1.1b shows some higher-

power resistors. Resistors with power dissipation below 5 watt (most commonly usedtypes) are

cylindrical in shape, with a wire protruding from each end for connecting to a circuit.9

Fig. 2.1 Low Power resistor

.

The symbol for a resistor is shown in the following diagram (upper: American symbol, lower:

European symbol.)

2.2.1 Resistor symbols with colour coding

The unit for measuring resistance is the OHM. (the Greek letter Ω - called Omega).

Fig. 2.2 Resistor colour coding

2.3 CAPACITOR

Capacitors are common components of electronic circuits, used almost as frequently as resistors.

The basic difference between the two is the fact that capacitor resistance (called reactance) depends

on the frequency of the signal passing through the item. The symbol for reactance is Xc and it can

be calculated using the following formula:

10

2.3.2 Electrolytic capacitors:-

Aluminum is used for the electrodes by using a thin oxidization membrane.

Large values of capacitance can be obtained in comparison with the size of the capacitor, because

the dielectric used is very thin.

Electrolytic capacitors represent the special type of capacitors with fixed capacity value. Thanks to

special construction, they can have exceptionally high capacity, ranging from one to several

thousand µF. They are most frequently used in circuits for filtering; however they also have other

purposes.

Electrolytic capacitors are polarized components,

meaning they have positive and negative leads, which is

very important when connecting it to a circuit. The

positive lead or pin has to be connected to the point

with a higher positive voltage than the negative lead. If

it is connected in reverse the insulating layer inside the

capacitor will be "dissolved" and the capacitor will be

permanently damaged.

Explosion may also occur if capacitor is

connected to voltage that exceeds its working voltage. In order to prevent such instances,

one of the capacitor's connectors is very clearly marked with a + or -, while the working

voltage is printed on the case. Fig. 2.3 Electrolytic Capacitor

47µF (16V) [diameter 6 mm, high 5 mm]

100µF (25V) [diameter 5 mm, high 11 mm]

220µF (25V) [diameter 8 mm, high 12 mm]

1000µF (50V) [diameter 18 mm, high 40 mm]

2.3.2 Ceramic Capacitors

11

Ceramic capacitors are constructed with materials such as titanium acid barium used as the

dielectric. Internally, these capacitors are not constructed as a coil, so they can be used in high

frequency applications. Typically, they are used in circuits which bypass high frequency signals to

ground. These capacitors have the shape of a disk. Their capacitance is comparatively small.

The capacitor on the left is a 100pF capacitor with a diameter of about 3 mm.

The capacitor on the right side is printed with 103, so

10 x 103pF becomes 0.01 µF. The diameter of the

disk is about 6 mm.

Fig. 2.4 Ceramic Capacitors

.

2.4 BRIDGE RECTIFIER

A bridge rectifier makes use of four diodes in a bridge arrangement to achieve full-wave

rectification. This is a widely used configuration, both with individual diodes wired as shown and

with single component bridges where the diode bridge is wired internally.

2.4.1 Current flow in the Bridge Rectifier

12

For both positive and negative swings of the transformer, there is a forward path through the diode

bridge. Both conduction paths cause current to flow in the same direction through the load resistor,

accomplishing full-wave rectification.

While one set of diodes is forward biased, the other set is reverse biased and effectively eliminated

from the circuit. when the input connected to the left corner of the diamond is positive, and the input

connected to the right corner is negative, current flows from the upper supply terminal to the right along

the red (positive) path to the output, and returns to the lower supply terminal via the blue(negative) path.

When the input connected to the left corner is negative, and the input connected to the right corner

is positive, current flows from the upper supply terminal to the right along the red (positive) path

to the output, and returns to the lower supply terminal via the blue (negative) path.

In each case, the upper right output remains positive and lower right output negative. Since this is

true whether the input is AC or DC, this circuit not only produces a DC output from an AC input, it

can also provide what is

sometimes called "reverse

polarity protection". That

is, it permits normal

functioning of DC-

powered equipment

when batteries have been installed backwards, or when the leads (wires) from a DC power source

have been reversed, and protects the equipment from potential damage caused by reverse polarity.

2.5 DIODE

A diode is a semiconductor device which allows current to flow through it in only one direction.

Although a transistor is also a semiconductor device, it does not operate the way a diode does. A

diode is specifically made to allow current to flow through it in only one direction. Some ways in

which the diode can be used are listed here.

13

A diode can be used as a rectifier that converts AC (Alternating Current) to DC (Direct Current) for

apower supply device.

Diodes can be used to separate the signal from radio frequencies.

Diodes can be used as an on/off switch that controls current.

Fig. 2.5 Diodes

This symbol is used to indicate a diode in a circuit diagram. The meaning of the symbol is

(Anode) (Cathode). Current

Devices that combine 4 diodes in one package are called diode bridges. They are used for full-wave

rectification.

2.6 Light Emitting Diode (LED)

Fig. 2.6 LEDs

14

Light emitting diodes must be chosen according to how they will be used, because there are various

kinds. The diodes are available in several colors. The most common colors are red and green, but

there are even blue ones.

The device on the far right in the photograph combines a red LED and green LED in one package.

The component lead in the middle is common to both LEDs. As for the remains two leads, one side

is for the green, the other for the red LED. When both are turned on simultaneously, it becomes

orange.

When an LED is new out of the package, the polarity of the device can be determined by looking at

the leads. The longer lead is the Anode side, and the short one is the Cathode side.

The polarity of an LED can also be determined using a resistance meter, or even a 1.5 V battery.

When using a test meter to determine polarity, set the meter to a low resistance measurement range.

Connect the probes of the meter to the LED. If the polarity is correct, the LED will glow. If the

LED does not glow, switch the meter probes to the opposite leads on the LED. In either case, the

side of the diode which is connected to the black meter probe when the LED glows, is the Anode

side. Positive voltage flows out of the

black probe when the meter is set to

measure resistance.

Fig. 2.7 Working of LEDs

2.7 Voltage RegulatorThe MC78XX/LM78XX/MC78XXA series of three terminal positive regulators are available in the

TO-220/D-PAK package and with several fixed output voltages, making them useful in a wide

range of applications. Each type employs internal current limiting, thermal shut down and safe

15

operating area protection, making it essentially indestructible. If adequate heat sinking is provided,

they can deliver over 1A output current. Although designed primarily as fixed voltage regulators,

these devices can be used with external components to obtain adjustable voltages and currents.

2.7.1 Features

• Output Current up to 1A

• Output Voltages of 5, 6, 8, 9, 10, 12, 15, 18, 24V

• Thermal Overload Protection

• Short Circuit Protection

• Output Transistor Safe Operating Area Protection

Fig.2.8 Voltage Regulator

CHAPTER 3

16

17

TRANSMITTER SECTION

3.1 TRANSISTORS

A transistor is a semiconductor device used to amplify and switch electronic signals and power. It is

composed of a semi-conductor material with at least three terminals for connection to an external

circuit. A voltage or current applied to one pair of the transistor's terminals changes the current

flowing through another pair of terminals. Because the controlled (output) power can be higher than

the controlling (input) power, a transistor can amplify a signal. Today, some transistors are

packaged individually, but many more are found embedded in integrated circuits.

The transistor is the fundamental building block of modern electronic devices, and is ubiquitous in

modern electronic systems. Following its development in the early 1950s the transistor

revolutionized the field of electronics, and paved the way for smaller and cheaper radios, 

calculators, and computers, among other things.

3.1.1 Types of Transistors

3.1.1.1 Bipolar junction transistor

Bipolar transistors are so named because they conduct by using both majority and minority carriers.

The bipolar junction transistor (BJT), the first type of transistor to be mass-produced, is a

combination of two junction diodes, and is formed of either a thin layer of p-type semiconductor

sandwiched between two n-type semiconductors (an n-p-n transistor), or a thin layer of n-type

semiconductor sandwiched between two p-type semiconductors (a p-n-p transistor). This

construction produces two p-n junctions: a base–emitter junction and a base–collector junction,

separated by a thin region of semiconductor known as the base region (two junction diodes wired

together without sharing an intervening semiconducting region will not make a transistor).

The BJT has three terminals, corresponding to the three layers of semiconductor – an emitter,

a base, and a collector. It is useful in amplifiers because the currents at the emitter and collector are

controllable by a relatively small base current." In an NPN transistor operating in the active region,

the emitter-base junction is forward biased (electrons and electron holes recombine at the junction),

and electrons are injected into the base region. Because the base is narrow, most of these electrons

18

will diffuse into the reverse-biased (electrons and holes are formed at, and move away from the

junction) base-collector junction and be swept into the collector; perhaps one-hundredth of the

electrons will recombine in the base, which is the dominant mechanism in the base current. By

controlling the number of electrons that can leave the base, the number of electrons entering the

collector can be controlled. Collector current is approximately β (common-emitter current gain)

times the base current. It is typically greater than 100 for small-signal transistors but can be smaller

in transistors designed for high-power applications.

Unlike the FET, the BJT is a low–input-impedance device. Also, as the base–emitter voltage (Vbe) is

increased the base–emitter current and hence the collector–emitter current (Ice) increase

exponentially according to the Shockley diode model and the Ebers-Moll model. Because of this

exponential relationship, the BJT has a higher transconductance than the FET.

Bipolar transistors can be made to conduct by exposure to light, since absorption of photons in the

base region generates a photocurrent that acts as a base current; the collector current is

approximately β times the photocurrent. Devices designed for this purpose have a transparent

window in the package and are called phototransistors.

Fig. 3.0 BJT

19

Fig. 3.1 Working of BJT

3.1.1.2 Field-effect transistor

The field-effect transistor (FET), sometimes called a unipolar transistor, uses either electrons (in N-

channel FET) or holes (in P-channel FET) for conduction. The four terminals of the FET are named

source, gate, drain, and body (substrate). On most FETs, the body is connected to the source inside

the package, and this will be assumed for the following description.

In a FET, the drain-to-source current flows via a conducting channel that connects the source region

to the drain region. The conductivity is varied by the electric field that is produced when a voltage

is applied between the gate and source terminals; hence the current flowing between the drain and

source is controlled by the voltage applied between the gate and source. As the gate–source voltage

(Vgs) is increased, the drain–source current (Ids) increases exponentially for Vgs below threshold, and

then at a roughly quadratic rate ( ) (where VT is the threshold voltage at which

drain current begins) in the "space-charge-limited" region above threshold. A quadratic behavior is

not observed in modern devices, for example, at the 65 nm technology node.

For low noise at narrow bandwidth the higher input resistance of the FET is advantageous.

FETs are divided into two families: junction FET (JFET) and insulated gate FET (IGFET). The

IGFET is more commonly known as a metal–oxide–semiconductor FET (MOSFET), reflecting its

20

original construction from layers of metal (the gate), oxide (the insulation), and semiconductor.

Unlike IGFETs, the JFET gate forms a p-n diode with the channel which lies between the source

and drain. Functionally, this makes the N-channel JFET the solid-state equivalent of the vacuum

tube triode which, similarly, forms a diode between its grid and cathode. Also, both devicesoperate

in thedepletion mode, they both have a high input impedance, and they both conduct current under

the control of an input voltage.

Metal–semiconductor FETs (MESFETs) are JFETs in which the reverse biased p-n junction is

replaced by a metal–semiconductor junction. These, and the HEMTs (high electron mobility

transistors, or HFETs), in which a two-dimensional electron gas with very high carrier mobility is

used for charge transport, are especially suitable for use at very high frequencies (microwave

frequencies; several GHz).

Unlike bipolar transistors, FETs do not inherently amplify a photocurrent. Nevertheless, there are

ways to use them, especially JFETs, as light-sensitive devices, by exploiting the photocurrents in

channel–gate or channel–body junctions.

FETs are further divided into depletion-mode and enhancement-mode types, depending on whether

the channel is turned on or off with zero gate-to-source voltage. For enhancement mode, the

channel is off at zero bias, and a gate potential can "enhance" the conduction. For depletion mode,

the channel is on at zero bias, and a gate potential (of the opposite polarity) can "deplete" the

channel, reducing conduction. For either mode, a more positive gate voltage corresponds to a higher

current for N-channel devices and a lower current for P-channel devices. Nearly all JFETs are

depletion-mode as the diode junctions would forward bias and conduct if they were enhancement

mode devices; most IGFETs are enhancement-mode types.

21

Fig. 4.1 Working of FET

22

3.2 ENCODER

Fig. 3.2 Encoder

3.2.1 Features

_ Operating voltage

_ 2.4V~5V for the HT12A

_ 2.4V~12V for the HT12E

_ Low power and high noise immunity CMOS

technology

_ Low standby current: 0.1_A (typ.) at

VDD=5V

_ HT12A with a 38kHz carrier for infrared

transmission medium

_ Minimum transmission word

_ Four words for the HT12E

_ One word for the HT12A

_ Built-in oscillator needs only 5% resistor

_ Data code has positive polarity

_ Minimal external components

_ HT12A/E: 18-pin DIP/20-pin SOP package

23

3.2.2 Applications

_ Burglar alarm system

_ Smoke and fire alarm system

_ Garage door controllers

_ Car door controllers

_ Car alarm system

_ Security system

_ Cordless telephones

_ Other remote control systems

3.2.3 General Description

The 212 encoders are a series of CMOS LSIs for remote control system applications. They are

capable of encoding information which consists of N address bits and 12_N data bits. Each

address/data input can be set to one of the two logic states. The programmed addresses/data are

transmitted together with the header bits via an RF or an infrared transmission medium upon receipt

of a trigger signal. The capability to select a TE trigger on the HT12E or a DATA trigger on the

HT12A further enhances the application flexibility of the 212 series of encoders. The HT12A

additionally provides a 38kHz carrier for infrared systems.

Table 4 Encoder Description

24

Fig. 3.3

Table 5 Pin Description

25

3.3 RF TRANSMITTER

3.3.1 Overview

The STT-433 is ideal for remote control applications where low cost and longer range is required.

The transmitter operates from a 1.5-12V supply, making it ideal for battery-powered applications.

The transmitter employs a SAW-stabilized oscillator, ensuring accurate frequency control for best

range performance. Output power and harmonic emissions are easy to control, making FCC and

ETSI compliance easy. The manufacturing-friendly SIP style package and low-cost make the STT-

433 suitable for high volume applications.

3.3.2 Features

· 433.92 MHz Frequency

· Low Cost

· 1.5-12V operation

· 11mA current consumption at 3V

· Small size

· 4 dBm output power at 3V

3.3.3 Applications

· Remote Keyless Entry (RKE)

· Remote Lighting Controls

· On-Site Paging

· Asset Tracking

· Wireless Alarm and Security Systems

· Long Range RFID

· Automated Resource Management

Fig. 3.4 RF Transmitter

26

3.4 SENSORS

3.4.1 Water level sensor:

This sensor is based on the fact that water is not pure water which is non conductor, but it is impure

which is slightly conductor.

Water sensor is nothing but a series of very close PCB tracks. In normal mode these tracks are not

conducting, but when some water fall on these tracks these line slightly start conducting and some

positive voltage is available at the base of transistor So NPN transistor is on and NPN transistor

provide a negative voltage as a pulse to the microcontroller.

3.4.2 Piezo Electric sensor:

The Piezo electric vibration sensor is used to sense earth quake.We use IC LM358 as a main

component. Pin no 8 is connected to the positive supply. Pin no 4 is connected to the negative

voltage. One capacitor is grounded from the pin no 3 for noise cancellation. Output is available on

the pin no 1. Sensor is connected to the pin no 3.

Fig. 3.5 Piezo electric sensor

3.4.2.1 Principle of Operation

Depending on how a piezoelectric material is cut, three main modes of operation can be

distinguished: transverse, longitudinal, and shear.

27

(a) Transverse effect

A force is applied along a neutral axis (y) and the charges are generated along the (x) direction,

perpendicular to the line of force. The amount of charge depends on the geometrical dimensions of

the respective piezoelectric element. When dimensions   apply,

,

Where  the dimension in line with the neutral axis is,   is in line with the charge generating axis

and   is the corresponding piezoelectric coefficient.

(b) Longitudinal effect

The amount of charge produced is strictly proportional to the applied force and is independent of

size and shape of the piezoelectric element. Using several elements that are mechanically in series

and electrically in parallel is the only way to increase the charge output. The resulting charge is

,

where   is the piezoelectric coefficient for a charge in x-direction released by forces applied

along x-direction (in pC/N).   is the applied Force in x-direction [N] and   corresponds to the

number of stacked elements .

3.4.2.2 Electrical Properties

Fig. 3.6 Schematic symbol and electronic model of a piezoelectric sensor

28

A piezoelectric transducer has very high DC output impedance and can be modeled as a

proportional voltage source and filter network. The voltage V at the source is directly proportional

to the applied force, pressure, or strain.[5] The output signal is then related to this mechanical force

as if it had passed through the equivalent circuit.

Fig. 3.7 Frequency response of a piezoelectric sensor; output voltage vs applied force

3.4.2.3 Sensor design

Fig. 3.8 Metal disks with piezo material, used in buzzers or as contact microphones

Based on piezoelectric technology various physical quantities can be measured; the most common

are pressure and acceleration. For pressure sensors, a thin membrane and a massive base is used,

ensuring that an applied pressure specifically loads the elements in one direction. For

accelerometers, a seismic mass is attached to the crystal elements. When the accelerometer

experiences a motion, the invariant seismic mass loads the elements according to Newton’s second

law of motion  .

29

The main difference in the working principle between these two cases is the way forces are applied

to the sensing elements. In a pressure sensor a thin membrane is used to transfer the force to the

elements, while in accelerometers the forces are applied by an attached seismic mass.

Sensors often tend to be sensitive to more than one physical quantity. Pressure sensors show false

signal when they are exposed to vibrations. Sophisticated pressure sensors therefore use

acceleration compensation elements in addition to the pressure sensing elements. By carefully

matching those elements, the acceleration signal (released from the compensation element) is

subtracted from the combined signal of pressure and acceleration to derive the true pressure

information.

Vibration sensors can also be used to harvest otherwise wasted energy from mechanical vibrations.

This is accomplished by using piezoelectric materials to convert mechanical strain into usable

electrical energy.

3.4.2.4 Sensing materials

Two main groups of materials are used for piezoelectric sensors: piezoelectric ceramics and single

crystal materials. The ceramic materials (such asPZT ceramic) have a piezoelectric constant /

sensitivity that is roughly two orders of magnitude higher than those of the natural single crystal

materials and can be produced by inexpensive sintering processes. The piezoeffect in piezoceramics

is "trained", so unfortunately their high sensitivity degrades over time. The degradation is highly

correlated with temperature. The less sensitive 'natural' single crystal materials (gallium

phosphate, quartz,tourmaline) have a much higher – when carefully handled, almost infinite – long

term stability. There are also new single crystal materials commercially available such as Lead

Magnesium Niobate-Lead Titanate (PMN-PT). These materials offer greatly improved sensitivity

(compared with PZT) but suffer from a lower maximum operating temperature and are currently

much more expensive to manufacture.

3.5 Operational Amplifier3.5.1. Operation

30

An operational amplifier ("op-amp") is a DC-coupled high-gain electronic voltage amplifier with

a differential input and, usually, a single-ended output. An op-amp produces an output voltage that

is typically hundreds of thousands times larger than the voltage difference between its input

terminals.

Operational amplifiers had their origins in analog computers where they were used in many linear,

non-linear and frequency-dependent circuits. Characteristics of a circuit using an op-amp are set by

external components with little dependence on temperature changes or manufacturing variations in

the op-amp itself, which makes op-amps popular building blocks for circuit design.

Op-amps may be packaged as components, or used as elements of more complex integrated

circuits.

The op-amp is one type of differential amplifier. Other types of differential amplifier include

the fully differential amplifier (similar to the op-amp, but with two outputs), the instrumentation

amplifier (usually built from three op-amps), the isolation amplifier (similar to the instrumentation

amplifier, but with tolerance to common-mode voltages that would destroy an ordinary op-amp),

and negative feedback amplifier (usually built from one or more op-amps and a resistive feedback

network).

Circuit notation

Fig 3.9 Circuit diagram symbol for an op-amp

The circuit symbol for an op-amp is shown to the right, where:

V+: non-inverting input

V−: inverting input

Vout: output

VS+: positive power supply

VS−: negative power supply

31

3.5.2 Ideal op-amps

Fig. 3.10 An equivalent circuit of an operational amplifier that models some resistive non-

ideal parameters.

An ideal op-amp is usually considered to have the following properties, and they are considered to

hold for all input voltages:

Infinite open-loop gain (when doing theoretical analysis, a limit may be taken as open loop

gain AOL goes to infinity).

Infinite voltage range available at the output ( ) (in practice the voltages available from the

output are limited by the supply voltages   and ). The power supply sources are called rails.

Infinite bandwidth (i.e., the frequency magnitude response is considered to be flat everywhere with

zero phase shift).

Infinite input impedance (so, in the diagram,  , and zero current flows from   to ).

Zero input current (i.e., there is assumed to be no leakage or bias current into the device).

Zero input offset voltage (i.e., when the input terminals are shorted so that  , the output is

a virtual ground or  ).

Infinite slew rate (i.e., the rate of change of the output voltage is unbounded) and power bandwidth

(full output voltage and current available at all frequencies).

Zero output impedance (i.e.,  , so that output voltage does not vary with output current).

Zero noise.

Infinite Common-mode rejection ratio (CMRR).

Infinite Power supply rejection ratio for both power supply rails.

32

CHAPTER 4

33

4. RECEIVER SECTION

4.1 Crystal Oscillator

A crystal oscillator is an electronic circuit that uses the mechanical resonance of a vibrating crystal

of piezoelectric material to create an electrical signal with a very precise frequency. This frequency

is commonly used to keep track of time, to provide a stable clock signal for digital integrated

circuits, and to stabilize frequencies for radio transmitters.

Piezoelectricity was discovered by Jacques and Pierre Curie in 1880. Paul Langevin first

investigated quartz resonators for use in sonar during World War I. The first crystal controlled

oscillator, using a crystal of Rochelle salt, was built in 1917 and patented in 1918 by Alexander M.

Nicholson at Bell Telephone Laboratories, although his priority was disputed by Walter Guyton

Cady. Cady built the first quartz crystal oscillator in 1921

Fig. 4.0 Crystal Oscillator

A crystal is a solid in which the constituent atoms, molecules, or ions are packed in a regularly

ordered, repeating pattern extending in all three spatial dimensions.

Almost any object made of an elastic material could be used like a crystal, with appropriate

transducers, since all objects have natural resonant frequencies of vibration. For example, steel is

very elastic and has a high speed of sound. It was often used in mechanical filters before quartz.

The resonant frequency depends on size, shape, elasticity, and the speed of sound in the material.

High-frequency crystals are typically cut in the shape of a simple, rectangular plate. Low-frequency

34

crystals, such as those used in digital watches, are typically cut in the shape of a tuning fork. For

applications not needing very precise timing, a low-cost ceramic resonator is often used in place of

a quartz crystal.

When a crystal of quartz is properly cut and mounted, it can be made to distort in an electric field

by applying a voltage to an electrode near or on the crystal. This property is known as

piezoelectricity. When the field is removed, the quartz will generate an electric field as it returns to

its previous shape, and this can generate a voltage. The result is that a quartz crystal behaves like a

circuit composed of an inductor, capacitor and resistor, with a precise resonant frequency.

Quartz has the further advantage that its elastic constants and its size change in such a way that the

frequency dependence on temperature can be very low. The specific characteristics will depend on

the mode of vibration and the angle at which the quartz is cut (relative to its crystallographic axes) .

Therefore, the resonant frequency of the plate, which depends on its size, will not change much,

either. This means that a quartz clock, filter or oscillator will remain accurate. For critical

applications the quartz oscillator is mounted in a temperature-controlled container, called a crystal

oven, and can also be mounted on shock absorbers to prevent perturbation by external mechanical

vibrations.

Quartz timing crystals are manufactured for frequencies from a few tens of kilohertz to tens of

megahertz. More than two billion (2×109) crystals are manufactured annually. Most are small

devices for consumer devices such as wristwatches, clocks, radios, computers, and cellophanes.

Quartz crystals are also found inside test and measurement equipment, such as counters, signal

generators, and oscilloscopes.

4.2 Microcontroller

35

The 8051 family of microcontrollers is based on an architecture which is highly optimized for

embedded control systems. It is used in a wide variety of applications from military equipment to

automobiles to the keyboard. Second only to the Motorola 68HC11 in eight bit processors sales, the

8051 family of microcontrollers is available in a wide array of variations from manufacturers such

as Intel, Philips, and Siemens. These manufacturers have added numerous features and peripherals

to the 8051 such as I2C interfaces, analog to digital converters, watchdog timers, and pulse width

modulated outputs. Variations of the 8051 with clock speeds up to 40MHz and voltage

requirements down to 1.5 volts are available. This wide range of parts based on one core makes the

8051 family an excellent choice as the base architecture for a company's entire line of products

since it can perform many functions and developers will only have to learn this one platform. The

AT89S52 is a low-power, high-performance CMOS 8-bit microcontroller with 8K bytes of in-

system programmable Flash memory. The device is manufactured using Atmel’s high-density

nonvolatile memory technology and is compatible with the industrystandard

80C51 instruction set and pin out. The on-chip Flash allows the program memory to be

reprogrammed in-system or by a conventional nonvolatile memory programmer. By combining a

versatile 8-bit CPU with in-system programmable Flash on a monolithic chip, the Atmel AT89S52

is a powerful microcontroller which provides a highly-flexible and cost effective solution to many

embedded control applications. In addition, the AT89S52 is designed with static logic for operation

down to zero frequency and supports two software selectable power saving modes. The Idle Mode

stops the CPU while allowing the RAM, timer/counters, serial port, and interrupt system to

continue functioning. The Power-down mode saves the RAM con-tents but freezes the oscillator,

disabling all other chip functions until the next interrupt or hardware reset.

Fig. 4.1 Microcontroller

4.3 Display section

36

The display section consists of 16*2 LCD, which used to display Summary of IC being Inserted

and result of test being conducted.

LCDs can add a lot to your application in terms of providing an useful interface for the user,

debugging an application or just giving it a "professional" look. The most common type of LCD

controller is the Hitatchi 44780 which provides a relatively simple interface between a processor

and an LCD.

Fig. 4.2 LCD

The LCD interface is a parallel bus, allowing simple and fast reading/writing of data to and from

the LCD. This waveform will write an ASCII Byte out to the LCD's screen. The ASCII code to be

displayed is eight bits long and is sent to the LCD either four or eight bits at a time. If four bit mode

is used, two "nybbles" of data (Sent high four bits and then low four bits with an "E" Clock pulse

with each nybble) are sent to make up a full eight bit transfer. The "E" Clock is used to initiate the

data transfer within the LCD.

Sending parallel data as either four or eight bits are the two primary modes of operation. While

there are secondary considerations and modes, deciding how to send the data to the LCD is most

critical decision to be made for an LCD interface application. Eight bit mode is best used when

speed is required in an application and at least ten I/O pins are available. Four bit mode requires a

minimum of six bits. To wire a microcontroller to an LCD in four bit mode, just the top four bits

(DB4-7) are written to. The "R/S" bit is used to select whether data or an instruction is being

transferred between the microcontroller and the LCD. If the Bit is set, then the byte at the current

LCD "Cursor" Position can be read or written.

4.4 DECODER

37

Fig. 4.3 Decoder

4.4.1 Features

_ Operating voltage: 2.4V~12V

_ Low power and high noise immunity CMOS

technology

_ Low standby current

_ Capable of decoding 12 bits of information

_ Binary address setting

_ Received codes are checked 3 times

_ Address/Data number combination

_ HT12D: 8 address bits and 4 data bits

_ HT12F: 12 address bits only

_ Built-in oscillator needs only 5% resistor

_ Valid transmission indicator

_ Easy interface with an RF or an infrared transmission

medium

_ Minimal external components

_ Pair with Holtek_s 212 series of encoders

_ 18-pin DIP, 20-pin SOP package

4.4.2 Applications

38

_ Burglar alarm system

_ Smoke and fire alarm system

_ Garage door controllers

_ Car door controllers

_ Car alarm system

_ Security system

_ Cordless telephones

_ Other remote control systems

4.4.3 General Description

The 212 decoders are a series of CMOS LSIs for remote control system applications. They are

paired with Holtek_s 212 series of encoders (refer to the encoder/decoder

cross reference table).

Fig. 6.1 Block Diagram

Table 9 Pin Description

4.5 RF RECEIVER

39

Detailed offer Description

Product name 315/433MHZ FCC CE standard RF receiver

module

Product number RY-RBX10

Voltage 12V

Current 5.7 mA

Frequency 315MHZ,433.92MHZ

Sensitive -107dBm

Data Rate 4.8Kbps

Operating Temperature -20 to 85℃

Certification ISO9001:2000

Antenna Length=22.6cm for 315MHZ; Length=17cm

for 433.92MHZ

Table 10 RF Reciever Description

4.5.1 Application:

※     Security System

※     Wireless Remote Control Car

※     Wireless Remote Control Robot

※     Automatic Power Switch Control

Fig. 4.3(a) RF Receiver

4.6 INTEGRATED CIRCUIT

Integrated circuits were made possible by experimental discoveries which showed that

semiconductor devices could perform the functions of vacuum tubes, and by mid-20th-century

40

technology advancements in semiconductor device fabrication. The integration of large numbers of

tiny transistors into a small chip was an enormous improvement over the manual assembly of

circuits using discrete electronic components. The integrated circuit's mass production capability,

reliability, and building-block approach to circuit design ensured the rapid adoption of

standardized ICs in place of designs using discrete transistors.

Fig.4.4 ICs

There are two main advantages of ICs over discrete circuits: cost and performance. Cost is low

because the chips, with all their components, are printed as a unit by photolithography and not

constructed a transistor at a time. Performance is high since the components switch quickly and

consume little power, because the components are small and close together. As of 2006, chip areas

range from a few square mm to around 350 mm2, with up to 1 million transistors per mm2.

4.7 GSM MODEM

4.7.1 SIM300 Module Features: Designed for global market, sim 300 is a tri-band gsm / gprs engine works on frequencies egsm

900.

41

Works on frequencies egsm 900 mhz, dcs 1800 mhz and pcs 1900 mhz.

SIM300 features gprs multi-slot class 10 / class 8 (optional) and supports the gprs coding

schemes.

cs-1, cs-2, cs-3 and cs-4 with a tiny configuration of 40 mm x 33 mm x 2. 85 mm

SIM300 can fit almost all the space requirements in your applications, such as smart phone, pda

phone and other mobile devices.

4.7.2 GSM Modem Features : This GSM modem is a highly flexible plug and play modem based on tri-band SIM300

GSM module.

Industrial quality PCB with adequate grounding for better performance and noise immunity.

RS232 Interface with Hardware Flow Control Support.(5 wire Serial interface with TX, RX,

RTS, CTS & GND signals).

Power ON/OFF control pin for auto-reset by Micro-controller. It will be useful for Auto-

Reset functionality in Self Monitoring Applications running 24x7x365.

Antenna connector has separate ground plane for additional safety. It will isolate modem

circuit ground plan in case antenna connector is exposed to inappropriate voltages. Modem

Circuit ground plan and antenna ground plan can be connected simply by solder jumper, if

required.

Supports features like voice, data / fax, SMS, GPRS and integrated TCP / IP stack.

Control via AT commands (GSM 07.07, 07.05 and enhanced AT commands).

AC/DC 9-12 V /1.5 A Power Input.

4 Pin 0.1" connector for Speaker & Mic connectivity.

RTC Battery holder(Optional).

Average Current consumption in normal operation 250 mA, can rise up to 500-700 mA

during Voice and GPRS connections. Current pulse can be high as 1.5-2 A.

4.7.3 Interfaces : RS-232 Interface with Hardware Flow Control support.(5 signals - TX, RX, RTS, CTS & GND

through D-type 9 connector).

Serial port baud rate adjustable 1200 to115200 BPS.

4 pin 0.1" connector for Speaker & Mic connection. 

8-pin flip type reliable SIM card holder.

DC socket for Power Adapter.

42

Rubber Duck GSM antenna or Magnetic Mount Antenna with approx. 3 mtr. cable.

LED status for Power, Signal and Incoming Call.

4.8 BuzzerA buzzer or beeper is an audio signaling device, which may be mechanical, electromechanical,

or piezoelectric. Typical uses of buzzers and beepers include alarm devices, timers and

confirmation of user input such as a mouse click or keystroke.

4.8.1 PiezoelectricA piezoelectric element may be driven by an oscillating electronic circuit or other audio signal source, driven with a piezoelectric audio amplifier. Sounds commonly used to indicate that a button has been pressed are a click, a ring or a beep.

Fig. 4.5 Piezoelectric Buzzer

CHAPTER 5

43

DEVELOPMENT AND ANALYSIS OF THE PROJECT

5.1 Functional Description

5.1.1 Tsunami generated by seismicity

Tsunami can be generated when the sea floor abruptly deforms and vertically displaces the

overlying water. Tectonic earthquakes are a particular kind of earthquake that are associated with

the Earth's crustal deformation; when these earthquakes occur beneath the sea, the water above the

deformed area is displaced from its equilibrium position.[19] More specifically, a tsunami can be

generated when thrust faults associated with convergent or destructive plate boundaries move

abruptly, resulting in water displacement, owing to the vertical component of movement involved.

Movement on normal faults will also cause displacement of the seabed, but the size of the largest of

such events is normally too small to give rise to a significant tsunami.

44

Fig.5.0(a) Drawing of tectonic plate boundary beforeearthquake

 

Fig.5.0(b) Overriding plate bulges under strain, causingtectonic uplift.

  

Fig.5.0(c) The energy released produces tsunami waves.

5.2 SOLDER

5.2.1 Procedure of Making ProjectBuilding project in the proper manner is really an art, something which must be practiced and learned through trial and error, it is not all that difficult. The main thing is to remember to take each step slowly and carefully according to the instructions giving making since that everything at it should be before proceeding further.

5.2.2 Tools: The electronics workbench is an actual place of work with comfortably & conveniently & should be supplied with compliment of those tools must often use in project building. Probably the most important device is a soldering tool. Other tool which should be at the electronic work bench includes a pair of needle nose pliers, diagonal wire cutter, a small knife, an assortment of screw driver, nut driver, few nuts & bolts, electrical tape, plucker etc. Diagonal wire cutter will be used to cut away any excess lead length from copper side of P.C.B. 7 to cut section of the board after the circuit is complete. The needle nose pliers are most often using to bend wire leads & wrap them in order to form a strong mechanical connection.

45

Fig.5.1 Solder Tool

5.2.3 Mounting & Soldering: Soldering is process of joining together two metallic parts. It is actually a process of function in which an alloy, the solder, with a comparatively low melting point penetrates the surface of the metal being joined & makes a firm joint between them on cooling & solidifying.

Fig 5.2 Solder Mounting

5.2.4 The Soldering Kit5.2.4.1 Soldering Iron:As soldering is a process of joining together two metallic parts, the instrument, which is used, for doing this job is known as soldering Iron. Thus it is meant for melting the solder and to setup the metal parts being joined. Soldering Iron is rated according to their wattage, which varies from 10- 200 watts.5.2.4.2 Solder:The raw material used for soldering is solder. It is composition of lead & tin. The good quality solder (a type of flexible naked wire) is 60% Tin +40% Lead which will melt between 180 degree to 200 degree C temperature.5.2.4.3 Fluxes or soldering paste:When the points to solder are heated an oxide film forms. This must be removed at once so that solder may get to the surface of the metal parts. This is done by applying chemical substance called Flux, which boils under the heat of the iron remove the oxide formation and enable the metal to receive the solder.5.2.4.4 Blades or knife:To clean the surface & leads of components to be soldered is done by this common instrument.

46

COSTING

Components Rating Quantities Price (in Rs.)

Transformer 12-0-12 1 120

PCB boards / Implementation 5 500

Transistor / ICs base 5 / 6 30 / 7

Resistor / Variable resistor 22 / 2 40 / 10

47

Voltage regulator / Buzzer 7805 2 / 1 40 / 10

Crystal oscillator / µ controller 8051 series Atmega AT89C51

1 / 1 50 / 300

Led’s / Diode’s 5 / 8 10 / 15

Op-amp / Reset switch 2 / 1 23 / 20

LCD display 16*2 1 200

HT12 encoder /HT12 decoder 1 / 1 70 / 70

RF Transmitter/ Receiver 434MHz 1 / 1 410/ 410

Gsm modem 1 1200

Other(wires , wooden board etc.)

1500

Total-- 7500 /-

Table 11 Costing

48

Fig. 5.3 Transmitter Section

49

Fig. 5.4 Receiver Section

CHAPTER 6

50

ADVANTAGE & FUTURE APPLICATIONS

6.1 Warnings and Predictions

Drawbacks can serve as a brief warning. People who observe drawback (many survivors report an

accompanying sucking sound), can survive only if they immediately run for high ground or seek the

upper floors of nearby buildings. In 2004, ten-year old Tilly Smith of Surrey, England, was

on Maikhao beach in Phuket, Thailand with her parents and sister, and having learned about

tsunamis recently in school, told her family that a tsunami might be imminent. Her parents warned

others minutes before the wave arrived, saving dozens of lives. She credited her geography teacher,

Andrew Kearney.

In the 2004 Indian Ocean tsunami drawback was not reported on the African coast or any other

east-facing coasts that it reached. This was because the wave moved downwards on the eastern side

of the fault line and upwards on the western side. The western pulse hit coastal Africa and other

western areas.

A tsunami cannot be precisely predicted, even if the magnitude and location of an earthquake is

known. Geologists, oceanographers, and seismologists analyse each earthquake and based on many

factors may or may not issue a tsunami warning. However, there are some warning signs of an

impending tsunami, and automated systems can provide warnings immediately after an earthquake

in time to save lives. One of the most successful systems uses bottom pressure sensors, attached to

buoys, which constantly monitor the pressure of the overlying water column.

Regions with a high tsunami risk typically use tsunami warning systems to warn the population

before the wave reaches land. On the west coast of the United States, which is prone to Pacific

Ocean tsunami, warning signs indicate evacuation routes. In Japan, the community is well-educated

about earthquakes and tsunamis, and along the Japanese shorelines the tsunami warning signs are 51

reminders of the natural hazards together with a network of warning sirens, typically at the top of

the cliff of surroundings hills.[28]

The Pacific Tsunami Warning System is based in Honolulu, Hawaiʻi. It monitors Pacific Ocean

seismic activity. A sufficiently large earthquake magnitude and other information triggers a tsunami

warning. While the subduction zones around the Pacific are seismically active, not all earthquakes

generate tsunami. Computers assist in analyzing the tsunami risk of every earthquake that occurs in

the Pacific Ocean and the adjoining land masses.

52

6.2 Advantages & Future Scope The instrument is used basically to predict the strength of the earthquake so that the people can

make aware of the danger prior the happening. These small units are placed at various earthquake

epicenters and coastal areas and can be monitored by using a central monopolized system. It can

also detect the areas which are more prone to volcanoes. It can also guide the ships by detecting in

which direction or areas of the ocean larger waves are created. Using central monitories system we

can keep eye on various other branches where the instrument is placed. It can further processed to

alarming circuits such as siren, indicators etc. For further processing the output data can be

transmitted to the satellite for transmission of data over a long distance It is somewhat affordable by

states and nation and can be implemented easily as it is less complex as compared to other large

instruments Tsunami / earthquake detector used to improve tsunami detection, forecasting, warning,

notification, preparedness and mitigation to protect life and property in the region. The project is

low cost and simple for the advanced high quality system one need to improve the sensor quality

while the cost is also

proportionally increases. This instrument is unable to place under see water while the data collected

from the see water can be connected to the system for further processing.

53

6.3 Conclusion & Future Enhancements

Overall, the result indicates the ability for an evolution of a system which can detect Tsunami in

advance based on the pressure changes under the sea. If, it is being practically implemented with

the future enhancement any natural disaster can be detected in advance without producing false

alarms. Existing system has all the facilities to detect Tsunami. Obviously it will detect Tsunami

before many hours which are going to occur by raising an alarm. But, the problem with the existing

system is, there is a chance to produce false alarms often which threatens our government and

public. So, in future Tsunami occurrence can be decided and alarm can be raised only after

checking many criteria. Four criteria to be checked out are as follows:

• Pressure inside the sea bed.

• Tide level.

• Biological changes in the marine living organisms.

• Sea shore level.

If all these four criteria get detected then it can be concluded that there is some occurrence of

natural disaster (Tsunami).

Independently it is concluded that the magnitude of the printer vibration is more as

compare to the mobile phone and landline phone. This system can further improved by adding

better quality of the sensor. Also by making the system wireless we can able to use the system at

remote location. The maximum advantages given in previous subtopics are based on the wireless

system. With the Tsunami Alarm System we will be able to live at the

Sea or visit our favorite coastal destinations, without worrying about our safety. We need to

subscribe to the Tsunami-AS and we will receive these life-saving alarms reliably and timorously

on our mobile. Telephone wherever we have GSM coverage in the world.

This tsunami alarm system to mobile is an effective means to protect the health and lives of families

and children .This is a promising attempt for the world to move ahead with new and bright hopes

into the future.

54

55

APPENDICES

'Green house

$crystal = 12000000

$regfile = "89c51cc.dat"

Config Lcd = 16 * 2

Config Lcdpin = Pin , Db4 = P2.4 , Db5 = P2.5 , Db6 = P2.6 , Db7 = P2.7 , E = P2.3 , Rs = P2.2

Dim I As Byte

Dim J As Byte

Dim K As Byte

P1 = &B11111111

P3 = 0

P2 = 0

Cls

Main:

P3.0 = 0

Locate 1 , 1

Lcd "Tsunami"

Locate 2 , 1

Lcd "Warning system"

Wait 2

Cls

Check:

If P1 = &B11111000 Then

Locate 1 , 1

Lcd "Tsunami"

For I = 0 To 10

P3. = 156

Waitms 100

P3.0 = 0

Waitms 200

Next I

Else

If P1 = &B11110100 Then

Locate 1 , 1

Lcd "Danger wave"

Else

If P1 = &B11110110 Then

Locate 1 , 1

Lcd "High wave"

Else

If P1 = &B11110111 Then

Locate 1 , 1

Lcd "Normal wave"

End If

End If

End If

end if

Goto Check

End

57

58

REFERENCES

BOOKS :-

[1] Patrick J.Sweeny II, “RFID for Dummies”, by Wiley Publishing Inc.

[2] Klaus Finkenzeller, “RFID Handbook”, by Wiley Publishing Inc., Second edition

[3] Bill Christensen, Technovelgy.com (2008, May 23). Electronic Number Plate keeps tabs on

vehicles. [Online]. Available: http://www.technovelgy.com/ct/Science-Fiction-News.asp?

NewsNum=195

[4] Roadtraffic-technology.com (2008, May 23). Tagmaster- Automatic Vehicle Identification

(AVI) for hands-free vehicle access. [Online]. Available: http://www.roadtraffictechnology.

com/contractors/access_control/tagmaster/

[5] Alan Benksy, “Short-range Wireless Communication”, Communications Engineering Series,

by Newnes, Elsevier Inc.,

[6] Basic Electronic Circuits : Malvino & Zbar

[7] Electronic Components Manual : Parsai

[8] EFY Vol.-1995

WEBSITES :-

[1] www.wikipedia.org

[2] www.efy.com

[3] www.ieee.org

[4] www.way2students.com

59