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Welsh Centre for Printing and Coating
Plastic electronics for Smart Packaging
Dr. Davide DeganelloContact email: [email protected]
College of Engineering
Bridging Borders, 26th Sept 2013, Belfast
What is printing today?
One of the World’s largest industries
An advanced, precision volume manufacturing process
Industrial Graphic Printing
Industrial printing presses:
Web widths up to 4.5m, speeds up to 1000m/min
Printing challenges
Graphic Printing Eye “compensates”
Printed Electronics New level of
accuracy / understanding required
Welsh Centre for Printing and Coating
Fundamental research
Graphics &
Packaging
Printed
Electronics
Medical &
Biotechnology
Solutions for Industry
Centre of excellence for R&D in Industrial Printing Funded in 1994, based at Swansea University, UK
Comprehensive Facilities
R2R, sheet fed and small scale printing
Ink development and manufacture
Analysis of materials and prints
WCPC
SME
Large
Multinational
RO
Academic
NFP
UK
EU
US
GlobalTR1 TR2 TR4 TR6 TR7
Act
ivity Industry
Academia
WCPC
Converting ideas into volume products
WCPC: working with Industry
Packaging & Smart Packaging
Packaging market
Estimates: > 820B$ by 2016
Higher growth sectors: Healthcare, cosmetic, food (source:rexam)
Source: Smithers Pira
Printing Packaging technology
Substrate
Impression cylinder
Plate cylinder
Plate
Anilox rollEnclosed ink chamber
Ink feed
Ink drains
Substrate
Impression cylinder
Plate cylinder
Plate
Anilox rollEnclosed ink chamber
Ink feed
Ink drains
Substrate
Impression cylinder
Plate cylinder
Plate
Anilox rollEnclosed ink chamber
Ink feed
Ink drains
Flexography:
Ink transfer through a raised imaged photopolymer plate
Packaging
Current trends in Packaging: Premiumisation of every-day products Increased communication to the consumer Environmental considerations Cost reduction
Smart Packaging
Smart Packaging
Smart packaging:
Packaging moves from an “inert” to an active role Packaging monitors the product
Product condition, lifespan, logistic, authenticity
Packaging interacts with consumer: Increased flow of information, consumer confidence
Cost must be feasible
Smart Packaging: RFID Labels
RFID Labels: Radio frequency identification labels
Monitoring expensive/dangerous products
Reduce logistic costs: Wall-Mart mandate (2006)
Current limit to wide use: cost per RFID label ( 0.10 $)
Fully printed RFID (PolyIC) Future: roll2roll inline integration
From http://www.polyic.com/
Smart Packaging: Thermo-chromic
Thermo-chromic labels: color-changing labels which respond
to cumulative exposure to temperature.
Monitor individual item handling
Possible Issue: Subjectivity Food decay chromic sensors under development
From http://www.freshcheck.com/
Electronics & Smart Packaging
Integration of Printed electronics into packaging: Next development of smart packaging
New level of interaction between consumer and product
Improved Security of the product
A “revolution in packaging”
Electronics & Smart Packaging
Electronic & Packaging integration: Example 1
Adaptive displays
integrated in the
packaging
Courtesy of Faraday packaging
Electronics & Smart Packaging
Electronic & Packaging integration: Example 2
Active monitoring: Display information Sensors Data logging
Clear statement of quality: Objective
Courtesy of Faraday packaging
Electronics & Smart Packaging
Why Printed electronics instead than “silicon”? Printing is affordability, larger-area, flexible substrates
But lower performance (micron-features not nano)
Easy integration with current packaging production
Electronic components to be printed Displays Sensors Power sources CPU ? Touch screens (available)
Display/Lighting Technologies
Flexible OLEDs: Efficient lighting at low DC voltage Major research area Limit: Humidity & cost of vapour barriers
General Electric
Fast2Light: FP7 IP on large area OLEDs technologies R2R Flexo Printing for accurate conductive micro-networks
70±3μm
Printed Electronics
ACCUFLEX: Advancing Flexo for Printed Electronics TSB Funded project Improved registration, uniformity
Plate resistance to solvents
Partners: Innovia Films Asahi Photoproducts UK (Ltd) Tectonic International Gwent Electronic materials Millenium lasers Timsons Ltd
Display/Lighting Technologies
Electroluminescence Lighting: Commercial reality Flexible, thin, lasting... Continuous progress Current limit: High AC Voltage
http://www.youtube.com/user/Swanseaprinting
Display/Lighting Technologies
Novel solution: Printable micro silicon-LEDs
Micro LED printed between 2 conductive layers Low DC voltage & lasting NthDegree patented technology
Display/Lighting Technologies
Printed display: e-inks, bi-stable inks on flexible substrate
Energy required only to change status
Complex image, complex driver electronics
From http://www.ntera.com/
From http://www.plasticlogic.com
Active sensors
R2R printed ZnNW sensors (P)
Large area high sensitivity
Potassium sensing (P)
(P): patented
Printed sensors: Quantitative, affordable Humidity, temperature Gas and biological compounds
Pharmaceutical market, Food market Integrated in packaging would allow a continuous
monitoring throughout the chain
From http://www.arkray.co.jp/
Power
Printed Batteries: flexible and thin Adapt to required shape/space
Collaborative project with HDM Stuttgart &
Power
Printed photovoltaic: flexible and thin, several manufacturers Efficiency vs. Lifespan
Large area solar cells on steel
cladding
Partnership Swansea Uni, TATA
Printed micro-networks
Packaging Applications of printed micro-networks on flexible films
R2R printed see-through RFID R2R printed micro-heaters
R2R Strain gauges
Magnetic coils (energy transfer)
What about Intelligence?
Creating devices require a control unit: CPU
Printed CPU: CIKC forefront Complex construction (not easy integration) Limited performance vs silicon
Lifespan issues micron-features not nano
Integrating silicon with high speed Printing•Basic chips are economic (<1 p)•Issue : connecting silicon to plastic • R2R Pick&Place machines
What about Intelligence?
Fine lines <10um
Not for mass-production
Research in advanced microcircuits
New equipment at WCPC:
Aereosol printer
Improving security
Counterfeiting: key issue for suppliers & manufacturers Not only high-end, pharmaceutical products
Memory circuits for brand protection
From
Improving security
Antibodies for brand protection R2R Printing of antibodies on plastic developed for bio-sensing
Issues solved: adhesion on plastic and lifespan (patent)
Antibodies are invisible until specific reagent introduced Highly safe counterfeiting system
New technologies: 3D Bioplotter
Creation of 3D bio-scaffolds (e.g. bones) through a
computer controlled filament deposition of bio-polymers
GRAPHENEX: Digital printing pristine graphene polymer inks
Graphene RFID
3D Bioplotter
And ......... 3D Chocolate ...........www.youtube.com/user/Swanseaprinting
Conclusions
Introduction to WCPC Providing solutions for Industry
How smart will be our packaging? New technologies/demonstrators are now reality Manufacturing integrations under development
Welsh Centre for Printing and Coating
College of Engineering
Thank You
Dr. Davide Deganello