W-LAN + Bluetooth ModuleData Sheet

< Specification may be changed by Murata without notice >Murata Manufacturing Co., Ltd.

W-LAN + Bluetooth Module Data Sheet

Qualcomm Chipset for 802.11a/b/g/n/ac + Bluetooth 4.2

Tentative P/N : LBEE5U91CQ-TEMP

Preliminary Specification Number: SP-U91CQ-C1 / 20


The revision history of the product specificationIssuedDate

RevisionCode

RevisionPage Changed Items Change Reason

8, Apr, 2015 - - - First Issue27.Jul.2017 A 12 Reference Circuit Corrected

30.Mar.2018 B

Top page

7

11

12

Bluetooth version from BT4.1 to BT4.2

6.2 External Sleep clock timing

8.3.2.Tx characteristics

8.4 DC/RF Characteristics for Bluetooth LE

Updated

Added

Corrected

Added

14.May.2018 C 3 2. Sample part NumberHeader

CorrectedCorrected



TABLE OF CONTENTS1. Scope ...................................................................................................................................................... 32. Part Number ......................................................................................................................................... 33. Block Diagram....................................................................................................................................... 34. Dimensions, Marking and Terminal Configurations ......................................................................... 45. Rating .................................................................................................................................................... 76. Operating Condition ............................................................................................................................. 77. Digital logic characteristics.................................................................................................................. 88. Electrical Characteristics..................................................................................................................... 9

8.1. DC/RF Characteristics for WLAN 2.4GHz................................................................................... 98.1.1. DC Characteristics .................................................................................................................. 98.1.2. Tx Characteristics ................................................................................................................... 98.1.3. Rx Characteristics ................................................................................................................. 10

8.2. DC/RF Characteristics for WLAN 5GHz.................................................................................... 108.2.1. DC Characteristics ................................................................................................................ 108.2.2. Tx Characteristics ................................................................................................................. 108.2.3. Rx Characteristics ..................................................................................................................11

8.3. DC/RF Characteristics for Bluetooth...........................................................................................118.3.1. Power Consumption ...............................................................................................................118.3.2. Tx Characteristics ..................................................................................................................118.3.3. Rx Characteristics ..................................................................................................................11

8.4. DC/RF Characteristics for Bluetooth LE.................................................................................... 128.4.1. Tx Characteristics ................................................................................................................. 128.4.2. Rx Characteristics ................................................................................................................. 12

9. Reference Land pattern...................................................................................................................... 1310. Reference Circuit .............................................................................................................................. 1411. Tape and Reel Packing ..................................................................................................................... 1512. NOTICE............................................................................................................................................. 18

12.1. Storage Conditions:.................................................................................................................... 1812.2. Handling Conditions: ................................................................................................................. 1812.3. Standard PCB Design (Land Pattern and Dimensions): ........................................................ 1812.4. Notice for Chip Placer:............................................................................................................... 1812.5. Soldering Conditions:................................................................................................................. 1912.6. Cleaning:..................................................................................................................................... 1912.7. Operational Environment Conditions: ..................................................................................... 1912.8. Input Power Capacity: ............................................................................................................... 19

13. PRECONDITION TO USE OUR PRODUCTS............................................................................... 20

Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.



1. Scope

This specification is applied to the W-LAN [IEEE802.11a/b/g/n/ac] + Bluetooth [4.2] module.

- Qualcomm QCA6174A- Compliant with IEEE802.11a/b/g/n/ac

- Compliant with Bluetooth specification v4.2 - Supports PCIe host interface for W-LAN - Supports UART interface for Bluetooth - Surface mount type 11.0 x 8.8mm , H=1.15mm Max

- Weight : TBD- MSL : 3- RoHS compliant

2. Part Number

Sample Part NumberLBEE5U91CQ-TEMP

3. Block Diagram

ANT_0

ANT_1

VDD(3.3V)

PCIe(L1SS)-IF

32KHz_CLK_IN

PCM-IF

UART-IF

VDD_IOCoupler

Coupler

Diplexer

Diplexer

SAW

5GHz FEM

5GHz FEMQCA6174A

5G W-LAN Tx_1

5G W-LAN Rx_1

2G W-LAN Tx/Rx_0& BT

5G W-LAN Tx_0

PDET

5G W-LAN Rx_0

PDET

2G W-LAN Tx/Rx_1

QoW(for WiPower)

Geofencing

LTE Coex

SAW



4. Dimensions, Marking and Terminal Configurations

<TOP View> <Side View> <Bottom View>

MarkingMarking Meaning

A Murata LogoB Inspection NumberC Module TypeD #1 Pin Marking

Dimensions (unit : mm)Mark Dimensions Mark Dimensions Mark Dimensions

L 11.0 +/- 0.1 W 8.8 +/- 0.1 T 1.15 max.a1 0.25 +/- 0.1 a2 0.475 +/- 0.1 a3 0.25 +/- 0.1a4 0.8 +/- 0.1 b1 0.3 +/- 0.1 b2 0.3 +/- 0.1b3 0.3 +/- 0.1 b4 0.3 +/- 0.1 c1 0.55 +/- 0.1c2 0.55 +/- 0.1 c3 0.55 +/- 0.1 c4 0.8 +/- 0.1e1 0.275 +/- 0.1 e2 0.25 +/- 0.1 e3 0.25 +/- 0.1e4 0.25 +/- 0.1 e5 0.75 +/- 0.1 e6 0.6 +/- 0.1e7 1.05 +/- 0.1 e8 0.6 +/- 0.1m1 (0.4) m2 (0.4)

(1)(18)

(19)

(34)

(35) (52)

(53)

(68)

(69)(70)(71)(72)(73)(74)

(75)

(76)

(77) (78) (79) (80) (81) (82)

(83)

(84)(85)(86)(87)(88)

(89) (90) (91) (92)

b1c1e1a1e2

b2a2e3a3e4

b3 c2 e5 a4 e6

b4c3

e7

c4

e8

m1

m2

L T

W

1CQAB1234567

D

C

B

A



Terminal Configurations< TOP View >

(1) (18)

(35)(52)

(53)

(68)

(74)(73)(72)(71)(70)(69)

(84)

(83)

(82) (81) (80) (79) (78) (77)

(76)

(75)(88)(87)(86)(85)

(92) (91) (90) (89)

(19)

(34)

No. Pin Name Connection to IC Terminal Description1 SWREG_IN

SWREG_IN, REG33_FB SWREG voltage input2 SWREG_IN3 GND - Ground4 BT_RF_KILL BT_RF_KILL Turn-off BT RF analog and front-end. Active low.5 VDDIO_GPIO1 VDDIO_GPIO1 Voltage supply for IO6 VDDIO_GPIO0 VDDIO_GPIO0 Voltage supply for IO7 VDD_3P3

VDD3.3V, VDDIO_GPIO0 Voltage supply (3.3V)8 VDD_3P39 PCIE_CLKREQ_L PCIE_CLKREQ_L Reference clock request for PCIe

External pull-up to VDDIO_AO at host side10 PCIE_RST_L PCIE_RST_L PCI Express reset with weak pulldown

11 PCIE_WAKE_L PCIE_WAKE_L Request to service a functioninitiatedwake event for PCIe

12 GPS_COEX_WOW GPS_COEX This signal can be used to do GPS co- existencesignal. Active high means WLAN is TX.

13 QoW QoW ( or GPIO[23] ) for W iPower14 BT_WAKEUP_HOST BT_WAKEUP_HOST Bluetooth wakeup the host. Active high.15 BT_LED BT_LED BT_LED16 GND - Ground17 LF_CLK_IN 32KHz_CLK_IN Slow-clock (32.768kHz) input18 GND - Ground19 GND - Ground20 ANT_0 - RF output of Chain021 GND - Ground22 BT_EN BT_EN Bluetooth Enable, Active high23 WL_EN WL_EN WLAN ENABLE. Active high24 GND - Ground25 VDD_FEM

- Voltage supply for 5GHz FEM26 VDD_FEM27 GND - Ground28 GND - Ground29 ANT_1 - RF output of Chain130 GND - Ground



31 LTE_PRI LTE_PRI for LTE co-ex32 LTE_SYNC LTE_SYNC for LTE co-ex33 LTE_ACTIVE LTE_ACTIVE for LTE co-ex34 GND - Ground35 BT_UART_TXD UART_TXD UART TXD signal for Bluetooth36 BT_UART_RXD UART_RXD UART RXD signal for Bluetooth37 BT_UART_CTS UART_CTS UART CTS signal for Bluetooth38 BT_UART_RTS UART_RTS UART RTS signal for Bluetooth39 PCM_SYNC PCM_SYNC Bluetooth PCM_SYNC signal40 PCM_IN PCM_IN Bluetooth PCM_IN signal41 PCM_CLK PCM_CLK Bluetooth PCM_CLK signal42 PCM_OUT PCM_OUT Bluetooth PCM_OUT signal43 VDDIO_XTAL VDDIO_XTAL Voltage supply for XTAL44 CLK_REQ_OUT CLK_REQ_OUT Clock request output.45 GPIO2 GPIO2 GPIO246 GPIO10 GPIO10 GPIO1047 GND - Ground48 PCIE_TX_P PCIE_TXP Differential transmit for PCIe49 PCIE_TX_N PCIE_TXN Differential transmit for PCIe50 GND - Ground51 PCIE_REFCLK_P PCIE_REFCLK_P Differential reference clock for PCIe52 PCIE_REFCLK_N PCIE_REFCLK_N Differential reference clock for PCIe53 GND - Ground54 PCIE_RX_N PCIE_RXN Differential receive for PCIe55 PCIE_RX_P PCIE_RXP Differential receive for PCIe56 GND - Ground57 GPIO4 GPIO4 GPIO458 GPIO3 GPIO3 GPIO359 GPIO1 GPIO1 GPIO1

60 GPIO5 GPIO5 GPIO5 (for Geofencing)

61 GPIO6 GPIO6 GPIO6 (for Geofencing)

62 GND - Ground63 SWREG_FB

SWREG_FB, VDD11D, VDD11_PCIE 1.1V voltage feedback to SWREG PMU64 SWREG_FB65 GND - Ground66 SWREG_OUT

SWREG_OUT SWREG PMU output67 SWREG_OUT68 GND - Ground69 GPIO8 GPIO8 GPIO8

70-81 GND - Ground82 GPIO0 GPIO0 GPIO083 GPIO9 GPIO9 GPIO984 GPIO7 GPIO7 GPIO7

85-92 GND - Ground



5. Rating

min. max. unitStorage Temperature -40 +85 °C

Supply Voltage

VDD_3P3 -0.3 3.63 VSWREG_IN -0.3 3.63 VVDD_FEM -0.5 3.63 VVDDIO_GPIO -0.3 3.63 VVDDIO_XTAL -0.3 3.63 V

* Stresses in excess of the absolute ratings may cause permanent damage. Functional operationis not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition.

6. Operating Condition6.1 Operationg Conditions

min. typ. max. unitOperating Temperature

Ambient -20 +25 +70 °CTop surface +85 °C

Supply Voltage

VDD_3P3 3.135 3.3 3.46 VSWREG_IN 3.135 3.3 3.46 VVDD_FEM 3.1 3.3 3.5 VVDDIO_GPIO 1.71 1.8 or 3.3 3.46 VVDDIO_XTAL 1.71 1.8 or 3.3 3.46 V

* Functionality is guaranteed but specifications require derating at extreme temperatures.

6.2 External Sleep clock (LPO) timing



7. Digital logic characteristics7.1 PCIe sequence timing



8. Electrical CharacteristicsNormal Condition: 25deg.C, Voltage supplies are typical values.IEEE802.11b 11Mbps (SISO) mode unless otherwise specified.IEEE802.11a/g 54Mbps (SISO) mode unless otherwise specified.IEEE802.11n MCS7 (SISO) mode unless otherwise specified.IEEE802.11ac MCS9 (SISO) mode unless otherwise specified.

8.1. DC/RF Characteristics for WLAN 2.4GHzItems ContentsSpecification IEEE802.11b/g/nMode DSSS / CCK / OFDMFrequency 2412 to 2472 MHz

Data rate11b; 1, 2, 5.5, 11Mbps11g; 6, 9, 12, 18, 24, 36, 48, 54Mbps11n; MCS0 ~ MCS7

8.1.1. DC CharacteristicsItems min. typ. max. unit

Tx mode

11b SISO - - 580 mATx diversity - - 1000 mA

11g SISO - - 380 mATx diversity - - 800 mA

11n SISO - - 370 mAMIMO - - 800 mA

Rx mode - - - 240 mA

8.1.2. Tx CharacteristicsNormal Condition min. typ. max. unit

Power Levels(ANT0/ANT1)

11b(Target:17dBm) 15 17 19 dBm11g(Target:14dBm) 12 14 16 dBm11n(Target:13dBm) 11 13 15 dBm

Spectrum Mask

11b 1st Side lobes - - -30 dBr2nd Side lobes - - -50 dBr

11gfc +/- 11MHz - - -20 dBrfc +/- 20MHz - - -28 dBrfc +/- 30MHz - - -40 dBr

11nfc +/- 11MHz - - -20 dBrfc +/- 20MHz - - -28 dBrfc +/- 30MHz - - -45 dBr

Modulation Accuracy (EVM)11b - - 35 %11g - - -25 dB11n - - -27 dB

Frequency Tolerance -20 - 20 ppmSpurious Emissions * 1) 30-1000MHz - - -36 dBm 2) 1000-12750MHz - - -30 dBm 3) 1800-1900MHz - - -47 dBm 4) 5150-5300MHz - - -47 dBm



8.1.3. Rx CharacteristicsNormal Condition min. typ. max. unit

Minimum Input Level *

11b (FER < 8%) 1Mbps - - -88 dBm11b (FER < 8%) 11Mbps - - -78 dBm11g (PER < 10%) 54Mbps - - -67 dBm11n (PER < 10%) / HT20 /MCS7 - - -66 dBm

Maximum Input Level

11b (FER < 8%) -10 - - dBm11g/n (PER < 10%) -20 - - dBm

8.2. DC/RF Characteristics for WLAN 5GHzItems ContentsSpecification IEEE802.11a/n/acMode OFDM

FrequencyHT20; 5180 to 5825MHzHT40; 5190 to 5795 MHzHT80; 5210 to 5775 MHz

Data rate11a; 6, 9, 12, 18, 24, 36, 48, 54Mbps11n; MCS0 ~ MCS711ac; MCS0 ~ MCS9

8.2.1. DC CharacteristicsItems min. typ. max. unit

Tx mode

11a SISO - - 430 mATx diversity - - 800 mA

11n SISO - - 350 mAMIMO - - 650 mA

11ac SISO - - 300 mAMIMO - - 500 mA

Rx mode - - - 340 mA

8.2.2. Tx CharacteristicsNormal Condition min. typ. max. unit

Power Levels(ANT0/ANT1)

11a(Target:14dBm) 12 14 16 dBm11n(Target:13dBm) 11 13 15 dBm11ac(Target:11dBm) 9 11 13 dBm

Spectrum Mask

11afc +/- 11MHz - - -20 dBrfc +/- 20MHz - - -28 dBrfc +/- 30MHz - - -40 dBr

11nfc +/- 21MHz - - -20 dBrfc +/- 40MHz - - -28 dBrfc +/- 60MHz - - -40 dBr

11acfc +/- 41MHz - - -20 dBrfc +/- 80MHz - - -28 dBrfc +/- 120MHz - - -40 dBr

Modulation Accuracy(EVM)

11a(54Mbps) - - -25 dB11n(MCS7) - - -27 dB11ac(MCS9) - - -32 dB

Frequency Tolerance -20 - 20 ppmSpurious Emissions 1) 30-1000MHz - - -36 dBm 2) 1000-12750MHz - - -30 dBm 3) 1800-1900MHz - - -47 dBm



8.2.3. Rx CharacteristicsNormal Condition min. typ. max. unit

Minimum Input Level

11a (PER < 10%) / 6Mbps - - -87 dBm11a (PER < 10%) / 54Mbps - - -67 dBm11n (PER < 10%) / HT40 / MCS7 - - -63 dBm11ac (PER < 10%) / HT80 / MCS9 - - -53 dBm

Maximum Input Level

11a (PER < 10%) -30 - - dBm11n (PER < 10%) -30 - - dBm11ac (PER < 10%) -30 - - dBm

8.3. DC/RF Characteristics for BluetoothItems ContentsFrequency 2402 to 2480 MHzNumber of RF channel 79

Operation mode (Rx/Tx) Time division multiplex either transmit or receive Frequency hopping after one Rx/Tx cycle

8.3.1. Power ConsumptionItems min. Typ max. unitPower consumption - - 100 mA

8.3.2. Tx CharacteristicsItems min. Typ max. unit

Output Power(BT power setting = 9)

BR (nomal condition) 4.5 - 11.5 dBmEDR 1.5 - 8.5 dBm

-20dB bandwidth - - 1 MHz

Modulation characteristicsδf1avg 140 - 175 kHzδf2max 115 - - kHzδf2avg/δf1avg 0.8 - - -

Initial Carrier Frequency Tolerance -75 - 75 kHz

Carrier Frequency Drift

1slot -25 - +25 kHz3slot -40 - +40 kHz5slot -40 - +40 kHzMax drift rate -20 - +20 kHz/50μs

Spurious Emissions 1) 30-1000MHz - - -36 dBm 2) 1000-12750MHz - - -30 dBm 3) 1800-1900MHz - - -47 dBm 4) 5150-5300MHz - - -47 dBmEDR Relative Power -4 - 1 dB

EDR Carrier Frequency Stability and Modulation Accuracy

Pi/4-DQPSK & 8DPSK

ωi -75 - 75 kHzω0 -10 - 10 kHzωi+ω0 -75 - 75 kHz

Pi/4-DQPSKRMS DEVM - - 20 %99% DEVM - - 30 %Peak DEVM - - 35 %

8DPSKRMS DEVM - - 13 %99% DEVM - - 20 %Peak DEVM - - 25 %

8.3.3. Rx CharacteristicsItems min Typ max unitSensitivity (BER < 0.1%) - - -72 dBmEDR Sensitivity (BER < 0.01%) 8DPSK - - -72 dBmMaximum Input Level -20 - - dBm



8.4. DC/RF Characteristics for Bluetooth LEItems Contents

Frequency (spacing) 2402 to 2480 MHz (2MHz)Number of RF channel 40

8.4.1. Tx CharacteristicsItems min typ max unit

Output power *1 Normal Condition -1 - 6 dBmModulation characteristics1) Δf1avg 225 - 275 kHz2) Δf2max 185 - - kHz3) Δf2avg / Δf1avg 0.8 - - -

Carrier frequency offset and drift1) fn – fTX, n=0,1,2,3,…k -150 - 150 kHz2) | f0 – fn |, n=2,3,4,…k - - 50 kHz3) | f1 – f0 | - - 20 kHz4) | fn – fn-5 |, n=6,7,8,…k - - 20 kHz*1: Qualcomm default setting

8.4.2. Rx CharacteristicsItems min typ max unit

Receiver sensitivity (PER < 30.8%) - - -72 dBmMaximum input signal level (PER < 30.8%) -10 - - dBmPER Report Integrity (-30dBm input) 50 - - %



9. Reference Land pattern

<Top View>

0.1250.375

0.6250.875

1.125

1.3751.625

1.875

2.125

2.3752.625

2.875

3.125

3.375

3.625

3.875

4.125

4.375

4.65

5.20

5.50

0.125

0.375

0.625

0.875

1.125

1.375

1.625

1.875

2.125

2.375

2.625

2.875

3.125

3.375

3.625

4.10

4.40

0.301.10

1.702.50

3.10

3.90

4.655.20

5.50

0.30

1.10

1.70

2.50

3.55

4.10

4.40

Unit: mm



10. Reference Circuit

1

2

3

4

5

6

7

8

A B C D E F G H I J K

1

2

3

4

5

6

7

8

A B C D E F G H I J K

LQM 2MPN1R5M G0

32.76 8kHz Input

P CM

P CIe

UA RT

fo r L TE _CO EX

WLA N_ ENA B LE

BT_ EN AB LE

fo r G P S_ COE X

fo r G eo fencing

for W iPo wer

A NT1

ANT 0

3.3V from Exte rna l DCDC-Converter Inte rs il : ISL91108 o r M urata' s DCDC (with ISL91107)

1.8V or 3.3V from PMIC

1.8V or 3.3V from PMIC

DC Supply

*N ote : P lace clo se to mod ule

PCIE _RX _N

PCIE _RX _P

NL

NL

NL

NL

NL

NL

PCIE _TX _P

PCIE _TX _N

PC IE _RE FCLK _N

PC IE _RE FCLK _P

*No te : P la ce clo se to HO S T

P CIE_ TX_ P

P CIE_ TX_ N

P CIE_ RX_ N

P CIE_ RX_ P

P CIE_ REFCL K_ N

P CIE_ REFCL K_ P

Mo d uleHOS T

Peripheral circu it of HostPeriph eral circuit o f Module

*No te : Pla ce clo se to mo duleThese circuits are o ptio nal

Rerence Circuit for PCIe lines

T he se circuits a re op tiona l. P le ase see if there is a nee d to reduce the no ise in the P CIe .

(fo r 4 AW P)

10 k

R5

1 0k

R6

10k

R7

V DD IO _GP IO

V DD _3 P3

4 .7u F

C5

1 0u F

C4

V DD IO _X TA L

4 .7u F

C6

V DD IO _GP IO

4 .7u F

C7

L2

C10

L3

C1 1

0R3

0R4

C12

C1 3

0.1uF

0.1uF

0R1

0R2

0 .1u FC8

0 .1u FC9

SW RE G_I N

1 .5u HL1

0.1 uF

C3

V DD _FEM

4 .7 uF

C14

10 0k

R8

S W REG _FB63

S W REG _FB64

S W REG _O UT66

S W REG _O UT67

S W REG _IN1

S W REG _IN2

CLK _ REQ _O UT44

LF_ CLK _IN17

P CM_I N40

P CM_CLK41

P CM_O U T42

P CM_S YN C39

P C IE_ RX_ N54

P C IE_ RX_ P55

P C IE_ REFCLK _N52

P C IE_ REFCLK _P51

P C IE_ T X_ N49

P C IE_ T X_ P48

B T _ UA RT _T XD35

B T _ UA RT _RXD36

B T _ UA RT _RT S38

B T _ UA RT _CT S37

AN

T_0

20

VD

D_F

EM2

5

VD

D_F

EM2

6

VD

D_3

P38

VD

D_3

P37

VD

DIO

_XT

AL

43

VD

DIO

_GPI

O1

5

VD

DIO

_GPI

O0

6

GPS

_CO

EX_W

OW

12

BT

_LE

D1

5

BT

_W

AK

_HO

ST

14

BT

_R

F_K

ILL

4

Qo

W1

3

GPI

O5

60

GPI

O6

61

LTE

_PR

I3

1

LTE

_SYN

C3

2

LTE

_AC

TIV

E3

3

BT

_EN

22

WL_

EN2

3

AN

T_1

29

P C IE_ RST _ L10

PC IE _CLK REQ _ L9

P C IE_ W A K E_ L 11

GND3

GND16

GND18

GND19

GND21

GND 24

GND27

GND28

GND 30

GND34

GND47

GND50

GND53

GND56

GND 62

GND 65

GND68

GND73

GPI

O8

69

GPI

O4

72

GPI

O9

71

GPI

O7

70

GN

D7

4

GN

D7

5

GN

D7

6

GN

D7

7

GN

D7

8

GN

D7

9

GN

D8

0

GN

D8

1

GN

D8

2

GN

D8

3

GN

D8

4

GN

D8

5

GN

D8

6

GN

D8

7

GN

D8

8

GP

IO10

46

GPI

O2

45

GPI

O1

59

GPI

O3

58

GPI

O0

57

T ype1 CQ

P C IE_ CLKRE Q _L

PC IE _RS T_ L

PC IE _W A K E_ L

V DD _3 P3

V DD IO _XT A L

QCA 6 17 4A MS M89 94

10 0o hm

10 0o hm

10 0o hm

R1R2

Com p Valu e Com p V alu e

L2L3C10

C11C12C13R3R4

10 o hm10 o hm1.7 n H1.7 n H

3 .9 p F

0.3 p F

0 .3 p F

3 .9 p F1 5 nH1 5 nH

V D DIO _G PIO 0

V D DIO _G PIO 1

SLE EP_ CLO CK _ 32 K

P CM_IN

PC IE _RX_ N

PCM_ SY NC

P CM _O UT

PCM _CLK

P CI E_RX _P

PC IE_ REFCLK _N

PC IE _T X_ N

P CI E_T X _P

PC IE _RE FCLK_ P

B T _UA RT _ RX D

B T _UA RT _ TX D

B T _ UA RT _RT S

B T _ UA RT _CT S

CLK _RE Q _O UT

W L_E N

B T _E N

LT E_ ACT IV E

LT E_ SY NC

LT E_ PRI

V D D_3 P3

V D DIO _X T AL

VD DIO _ GPIO 0

VD DIO _ GPIO 1

GPI O5

GPI O6

Q oW

B T _RF_ K ILL

B T _ W A K _HO S T

B T _LE D

GPI

O0

GPI

O3

GPI

O1

GPI

O2

GPI

O1

0

GPI

O8

GPI

O7

GPI

O9

GPI

O4

GP S_CO E X_ W OW



11. Tape and Reel Packing

(1) Dimensions of Tape (Plastic tape)*1. Cumulative tolerance of max. 40.0 ± 0.15 every 10 pitches

(2) Dimensions of Reel

(unit: mm)

13.0±0.2

2.0±0.5

25.4±1.0

30.4 max.

10

0

33

0

2.0±0.1

1.75

±0.1

0.30±0.05

TDBTBD

11.5±0.1

1.5+0.1/-0

24.0

+0.3

/-0.1

feeding direction

4.0±0.1

TBD

*1

TBD



(3) Taping Diagrams[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62 um in thickness

[4] Base tape : As specified in (1)

(4) Leader and Tail tape

Feeding Hole

Chip

Feeding Direction

Pin 1 Marking

Tail tape(No components)

40 to 200mm

Components No components

150mm min.

Leader tape(Cover tape alone)

250mm min.

Feeding direction

[2]

[3]

[4]

[3][1]



(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.

(6) The cover tape and base tape are not adhered at no components area for 250 mm min.

(7) Tear off strength against pulling of cover tape : 5 N min.

(8) Packaging unit : 1000 pcs./ reel

(9) material : Base tape : Plastic Reel : Plastic Cover tape , cavity tape and reel are made the anti-static processing.

(10) Peeling of force : 1.1N max. in the direction of peeling as shown below.

(11) PACKAGE (Humidity proof Packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator.

Cover tape

Base tape

165 to180°

　湿度インジケ－タ

乾燥剤

表示ラべル

防湿梱包袋

表示ラベルLabel

LabelDesiccant

HumidityIndicator

Anti-humidityPlastic Bag

1.1 N max.



12. NOTICE12.1. Storage Conditions:Please use this product within 6month after receipt.- The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials.This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours.- When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1timeThe products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant.

12.2. Handling Conditions:Be careful in handling or transporting products because excessive stress or mechanical shock may break products.Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge.

12.3. Standard PCB Design (Land Pattern and Dimensions):All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

12.4. Notice for Chip Placer:When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.



12.5. Soldering Conditions:The recommendation conditions of soldering are as in the following figure.When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.

Reflow soldering standard conditions(Example)

Please use the reflow within 2 times.Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

12.6. Cleaning:Since this Product is Moisture Sensitive, any cleaning is not permitted.

12.7. Operational Environment Conditions:Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).- In an atmosphere containing combustible and volatile gases.- Dusty place.- Direct sunlight place.- Water splashing place.- Humid place where water condenses.- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.

12.8. Input Power Capacity:Products shall be used in the input power capacity as specified in this specifications.Inform Murata beforehand, in case that the components are used beyond such input power capacity range.

Within 120s

Pre-heating

time(s)

220 deg.C

Within 60s

Cooling downSlowly

180 deg.C

150 deg.C

240to 250 deg.C

Within 3s



13. PRECONDITION TO USE OUR PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product.All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification.Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification.WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment. - Aerospace equipment - Undersea equipment.- Power plant control equipment - Medical equipment.- Transportation equipment (vehicles, trains, ships, elevator, etc.).- Traffic signal equipment. - Disaster prevention / crime prevention equipment.-Burning / explosion control equipment- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world.We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright,mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property.Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use.Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc.Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers.By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you,-deviation or lapse in function of engineering sample,-improper use of engineering samples.We disclaim any liability for consequential and incidental damages.If you can’t agree the above contents, you should inquire our sales.

Documents

W-LAN + Bluetooth ModuleData Sheet