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TEST REPORT Silanna Semiconductor Proprietary and Confidential Page 1 Patents: www.PowerDensity.com/patents Document 11075 Ver. 1.0
TEST REPORT SZ-RD12-65W
EVB Description
This test report of SZ-RD12-65W evaluation board
describes a 65 W universal input offline power supply with
programmable output voltage (5 V/3.25 A, 9 V/3.25 A, 15
V/3.25 A, 20 V/3.25 A). The power supply uses SZ1130
(Flyback PWM controller with integrated active clamp
circuit) IC, GaN Systems GS-065-008-1-L (650 V E-mode
GaN Transistor), and Weltrend WT6633P USB PD
controller. This design shows the high-power density and
efficiency that can be achieved due to the high level of
integration of the SZ1130 controller.
This document contains the power supply specification,
schematic, bill-of-materials, transformer documentation,
printed circuit layout, and performance data.
Key Specs Schematics
Input 90-265 Vac
Output Voltages 5 V, 9 V, 15 V, 20 V
Max Output Current 3.25 A
Max Output Power 65 W
Output Port USB-PD
Efficiency > 94% Full Power Efficiency
SZ1130 Features
▪ Integrated High Voltage Active Clamp FET,Active Clamp Driver, and Start-up Regulator
▪ Capable of Over 94% Efficiency
▪ Flat Efficiency Across Universal (90-265 VAC)Input Voltage and Load
▪ Tight Switching Frequency Regulation forImproved Input EMI Filter Utilization
▪ Up to 140 kHz Switching Frequency Operation
▪ OptiModeTM Cycle-by-Cycle Adaptive DigitalControl
▪ Multi-Mode Operation (Burst Mode, Quasi-Resonant, Valley Mode Switching)
▪ Advanced Valley Mode Switching for low EMI
▪ Self-Tuning Valley Detection
▪ OTP, UVLO, OVLO, PCL, OPP and OSCProtections
▪ <50mW No Load Power Consumption of the IC
▪ Up to 65 W Output Power
Applications
▪ High-Power-Density USB-PD AC/DC PowerSupplies
VBULK_S (15)
OOVP_S (16)
V5OUT (13)
GND (6)
BOOT_CL (4)
FB (12)
ISENSE COMPARATORS
OptiM
PulseLink Encoder/Decoder
Startup Regulator
VISNS_PEAK
VOOVP_TH
OOVPCOMPARATOR
SW (3)
V10 (7)
ISNS (11)GATE (8)
Main Switch DriverActive Clamp
Driver
Digital
OptiMode
VBULK COMPARATORS
VBULK_REFs
TEMP (9)
Primary
GaN SystemsGS-065-008-1-L
Active Clamp FET
V10
VNTCTH/VNTCR
VAUX_S (14)NTC COMPARATOR
QR COMPARATOR
CLAMP (1)
Sync Rec
Secondary
ADC
V5OUT
VBULK
RFB
CV5OUT
CA
Regulator1
CC*
RC2
RC1
RB2
RB1
CBST1RSENSE
RA2
RA1
CV10
Secondary FET
COUT
VOUT
NC (10)
VOUT
CBULK
RT2
DAUX*
DBST
RT1
DCL*
CB2
CA2
RDAMP*
VA
ZBST
Auxiliary
5V LDO
WAKE COMPARATOR
VWAKE_FTH /VWAKE_RTH
RGATE*
DGATERBST
CBST2
CBST3 RF
CF
Bootstrap Charging Circuit *
-t 0
[n]Silanna Semiconductor
SZ1130-00
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 2 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Warning
Disclaimers:
1. Caution – High Voltage Operation: Lethal high voltages are present when this evaluation board ispowered from AC mains. Improper contact with high voltages could lead to electrical shock, burnand/or fire hazards, risking property damage, personal injury, and death.
2. Evaluation Purpose Only: This evaluation board is intended for evaluation purpose only and not forcommercial use. Care must be taken when testing the board, and an isolation transformer should beutilized.
3. Patents: The evaluation board design, along with circuits shown in this test report, may be covered byone or more U.S. and foreign existing/pending patents.
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 3 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Contents
EVB Description .................................................. 1
SZ1130 Features ................................................ 1
Applications ......................................................... 1
Warning ............................................................... 2
Power Supply Specifications ............................... 4
SZ-RD12-65W Board Pictures ............................ 5
Schematic ........................................................... 6
Circuit Description ............................................... 7
Input Protection ........................................................ 7 EMI Filtering.............................................................. 7 Fault Protections ....................................................... 7
PCB Layout ......................................................... 8
PCB Prints ................................................................ 8 Bill of Materials (BOM) ...................................... 11
Transformer Specification.................................. 14
Common-Mode Choke Specification ................. 15
Performance Data ............................................. 16
Electrical Data......................................................... 16 Efficiency Graphs .............................................. 19
No-Load Power Consumption ........................... 20
Key Waveforms ...................................................... 21 Conducted EMI Scans ....................................... 22
Thermal Measurements .......................................... 24 Revision History ................................................ 26
Hardware Info.................................................... 26
Tables
TABLE 1: SZ1130 RECOVERY BEHAVIOR ................ 7 TABLE 2: TRANSFORMER MATERIAL LISTS ............ 14 TABLE 3: COMMON-MODE CHOKE MATERIAL LISTS
................................................................... 15 TABLE 4: LOAD EFFICIENCY REQUIREMENTS......... 16 TABLE 5: NO-LOAD POWER CONSUMPTION ........... 20
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 4 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Power Supply Specifications
The evaluation board performance data presented in this report exceeds the power supply specifications listed in the following table.
Description Symbol Min. Typ. Max. Units Comments
Input
Voltage Vin 90 115/230 265 VAC 2 Wire Input
Frequency fline 47 60/50 63 Hz
Efficiency
5 V/3.25 A η5V/3.25A 90 %
@ 115 Vac, 25 °C ambient
9 V/3.25 A η9V/3.25A 93 %
15 V/3.25 A η15V/3.25A 93 %
20 V/3.25 A η20V/3.25A 93 %
4-Point Ave Efficiency
5 V ηave_5V 82.37 %
CoC version 5 tier 2 4-point (25%, 50%, 75%,
100%) average efficiency
9 V ηave_9V 87.60 %
15 V ηave_15V 88.99 %
20 V ηave_20V 89.16 %
No-Load Input Power
Pin 75 mW @ 230 Vac, 25 °C
ambient
Programmable Output Voltage
VOUT 5 20 V
Environmental Conducted EMI
Meets CISPR22B/EN55022
Ambient Temperature
TAMB 0 40 °C No airflow, sea level.
NOTE: The circuit board needs to be evaluated for additional tests, such as ESD and Line Surge to use the evaluation board design presented in this test report as a charger/adapter. Furthermore, the layout of the board needs to be adjusted according to the target shape and form factor of the end application.
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 5 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
SZ-RD12-65W Board Pictures
Figure 1: Top Side of the EVB
Figure 2: Bottom Side of the EVB
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 6 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Schematic
Figure 3: 65W Schematic
GaN daughter
board
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 7 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Circuit Description
Input Protection
The design incorporates a slow-acting input fuse (F1) as a form of protection in case of destructive failure of any of the
downstream components. Furthermore, it has a varistor (RV1) connected between the line and neutral to absorb line surges
and minimize the voltage overshoot seen by the downstream converter components. In addition, there is a footprint for an
inrush current limiter (RT1) (negative temperature coefficient resistor) for applications which require attenuation of the inrush
current.
EMI Filtering
To meet the target EN55022 conducted EMI specification with sufficient margin with the least number of components and the
highest power processing efficiency, the design utilizes an input filter consisting of an x-capacitor (C1) and a single common-
mode choke (L1) as well as transformer (T1) construction for better EMI performance.
Fault Protections
The evaluation board features Hiccup Mode Fault Protection using SZ1130-00. Under all applicable fault conditions, the device
attempts to auto-restart. Table 1 list recovery behaviour under various fault conditions.
Table 1: SZ1130 Recovery Behavior
Fault Protection SZ1130
Input Under Voltage Lockout (UVLO)/ Brown-Out Auto-Recovery
Input Over Voltage Lockout (OVLO) Auto-Recovery
Internal Over Temp Protection (OTP) Hiccup
External Over Temp Protection (OTP) Hiccup
Peak Current Limit (PCL) Hiccup
Over-Power Protection (OPP) Hiccup
Output Short Circuit (OSC) Hiccup
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 8 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
PCB Layout
PCB Prints
Figure 4: Component side horizontal board, top
Figure 5: Solder side horizontal, bottom
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 9 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Figure 6: Component side vertical board, top
Figure 7: Solder side vertical board, middle 1 (left) and 2 (right)
Figure 8: Solder side vertical board, bottom
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 10 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Figure 9: GaN daughter card, top
Figure 10: GaN daughter card, bottom
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 11 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Bill of Materials (BOM)
Description Designator Manufacturer Manufacturer part number
Horizontal Board (USB Type-C Connector)
BRIDGE RECT 1PHASE 1KV 4A Z4-D BR1, BR2 Comchip Technology Z4DGP410L-HF
CAP CER 220NF X2 C1 W12.5H10T6
CAP ALUM 560UF 20% 25V T/H C5, C6, C20 YMIN SPE1EM681E160L
CAP CER 0.1UF 50V X7R 0603 C7, Samsung Electro-Mechanics CL10B104KB8NNNC
CAP CER 1UF 25V X7R 0603 C28 Samsung Electro-Mechanics CL10B105KA8NNNC
CAP CER 3300PF 25V X7R 0603 C31 AVX Corporation 06033C332KAT2A
CAP CER 0.047UF 25V X7R 0603 C32 AVX Corporation 06033C473KAT2A
CAP CER 8200PF 50V X7R 0603 C46 KEMET C0603C822K5RACTU
CAP CER 10UF 25V X7R 1206, C8 TDK Corporation C3216X7R1E106K160AB
CAP CER 150PF 200V NPO 0805 C10 Yageo CC0805JRNPOABN151
CAP CER 10UF 25V X5R 0603 C30, C35 Murata Electronics GRM188R61E106MA73D
CAP CER 0.1UF 50V X7R 0603 C34, C37 Samsung Electro-Mechanics CL10B104KB8NNNC
CAP CER 270PF 50V X7R 0603 C36, C38, C39, C42 Yageo CC0603KRX7R9BB271
CAP CER 1000PF 25V X7R 0603 C40 KEMET C0603C102K3RACTU
CAP CER 1UF 35V X7R 0603 C41, C48 TDK Corporation CGA3E1X7R1V105K080AC
CAP CER 0.033UF 50V X7R 0603 C43, C44, C47 Yageo CC0603KRX7R9BB333
CAP CER 0.022UF 50V X7R 0603 C45 Yageo CC0603KRX7R9BB223
C49
FUSE BOARD MNT 3A 250VAC 125VDC F1 Eaton - Electronics Division TR2/1025TD3-R
USB JACK, C TYPE, POWER ONLY, 6 J1 CUI Devices UJC-HP-3-SMT-TR
L2
100V N-FET PQFN56 Q1 ON Semiconductor FDMS86181
MOSFET N-CH 25V 124A 8PQFN Q4 ON Semiconductor FDMC2D8N025S
DNI RES 1206, DNI RES 1206, , R1, R2
RES SMD 470 OHM 1% 1/10W 0603 R8, Yageo RC0603FR-07470RL
RES 0 OHM JUMPER 1/10W 0603 R9 Stackpole Electronics Inc RMCF0603ZT0R00
RES SMD 0 OHM 1/10W 0603 R10 Yageo RC0603JR-070RL
RES SMD 84.5K OHM 1% 1/10W 0603 R14 Yageo RC0603FR-0784K5L
RES SMD 10K OHM 1% 1/10W 0603 R23 Yageo RC0603FR-0710KL
DNI R40
RES SMD 3.9K OHM 1% 1/10W 0603 R41 Yageo RC0603FR-073K9L
RES SMD 1.5K OHM 1% 1/10W 0603 R43 Bourns Inc. CR0603-FX-1501ELF
RES SMD 7.5K OHM 1% 1/10W 0603 R46 Yageo AC0603FR-077K5L
RES SMD 47 OHM 1% 1/10W 0603 R20, R36 Yageo RC0603FR-0747RL
RES 0.005 OHM 1% 1W 1206 R25 Bourns Inc. CFN1206-FX-R005ELF
RES SMD 1K OHM 1% 1/10W 0603 R35 Yageo RC0603FR-071KL
RES SMD 1M OHM 1% 1/10W 0603 R37 Yageo RC0603FR-071ML
RES SMD 5.1K OHM 1% 1/10W 0603 R38 Yageo RC0603FR-075K1L
RES SMD 10K OHM 1% 1/10W 0603 R39 Yageo RC0603FR-0710KL
RES SMD 4.7K OHM 1% 1/10W 0603 R42 Yageo RC0603FR-074K7L
RES SMD 47K OHM 1% 1/10W 0603 R44 Yageo AC0603FR-0747KL
NTC thermistor 0603 5% RT3 Vishay Dale NTHS0603N17N2003JE
VARISTOR 430V 250A 2SMD NO LEAD RV1 Littelfuse Inc. V430CH8
PC TEST POINT NATURAL TP1, TP2 TE Connectivity AMP Connectors RCU-0C
WT6633P USB PD Controller QFN16 U2 Weltrend
FAST TURN-OFF INTELLIGENT RECTIF U3 Monolithic Power Systems Inc. MP6908AGJ-P
OPTOISO 5KV TRANSISTOR SO6L U4 Toshiba Semiconductor TLP383(D4BLLTL,E
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 12 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
IC VREF SHUNT 36V 1% SOT23-3 U5 Texas Instruments ATL431AIDBZR
DIODE ZENER 24V 500MW SOD123, Z1 Diodes Incorporated DDZ24C-7,
DIODE ZENER 91V 500MW SOD123 Z3 ON Semiconductor MMSZ5270BT1G
CAP CER 2.2nF 25V X7R 0603 C50 Murata Electronics
Vertical Board
CAP ALUM 33UF 20% 400V T/H C2, C3, C26, C29 YMIN KCX(33UF-10X18P5)
CAP CER 4.7UF 25V X6S 0603 C11 Murata Electronics GRM188C81E475KE11D
CAP CER 10000PF 25V X7R 0603 C12 KEMET C0603C103K3RACTU
CAP CER 10000PF 25V X7R 0603 C14 Samsung Electro-Mechanics CL10B103KA8NNNC
CAP CER 1000PF 16V X7R 0603 C15 Yageo CC0603KRX7R7BB102
CAP CER 10000PF 25V X7R 0603 C16 Samsung Electro-Mechanics CL10B103KA8NNNC
CAP CER 39PF 50V C0G/NP0 0603 C17 KEMET C0603C390J5GACTU
CAP CER 10000PF 25V X7R 0603 C18 Samsung Electro-Mechanics CL10B103KA8NNNC
CAP CER 1UF 35V X7R 0603 C19 Taiyo Yuden GMK107AB7105KAHT
CAP CER 100PF 200V NPO 0603 C24 Yageo CC0603JRNPOABN101
CAP CER 100PF 200V NPO 0603 C25 Yageo CC0603JRNPOABN101
CAP CER 150PF 16V X7R 0603 C27 Würth Elektronik 8.85012206029E+11
CAP CER 10000PF 630V X7R 1206, C9 KEMET C1206C103KBRACTU
CAP CER 4700PF 630V X7R 1206, C13 TDK Corporation C3216X7R2J472K115AA
CAP CER 10000PF 630V X7R 1206, C22 KEMET C1206C103KBRACTU
CAP CER 10UF 35V X7R 1206 C23 Samsung Electro-Mechanics CL31B106KLHNNNE
CAP ALUM 68UF 80V 20% T/H C21 YMIN LKMC0902A190MF
CAP ALUM 47UF 20% 16V RADIAL C33 Rubycon 25YXJ47MTA5X11
DIODE GEN PURP 1KV 1A SOD123FA D1, D3 ON Semiconductor US1MFA
DIODE ZENER 4.7V 200MW D2 ON Semiconductor MM3Z4V7B
DIODE ZENER 56V 200MW SOD323F Z2 ON Semiconductor MM3Z56VB
D4
D8
50NS 1A 300V HIGH EFFICIENT RECO D6, D7
Taiwan Semiconductor
Corporation HS1FFL
DIODE SCHOTTKY 100V 250MA SOD323 D10 Nexperia USA Inc. BAT46WJ,115
FB1, FB2
CMC 9 mH 10X15 L1 CUSTOM_10X15
GS-065-008-1-L Q2 GaN Systems GS-065-008-1-L
MOSFET 2N-CH 60V 0.35A Q3 Diodes Incorporated DMN61D9UDW-7
RES SMD 24.9 OHM 1% 3/4W 1206, R6 Vishay Dale CRCW120624R9FKEAHP
RES 0.18 OHM 1% 1/4W 1206 R16 Yageo, RL1206FR-070R18L
RES 0.16 OHM 1% 1/2W 1206, R17 TE Connectivity Passive Product RLP73K2BR16FTDF
RES SMD 24.9 OHM 1% 3/4W 1206 R24 Vishay Dale CRCW120624R9FKEAHP
RES SMD 22M OHM 1% 1/4W 0805, R3, R5, R7, R30 Stackpole Electronics Inc RMCF0805FT22M0
DNI RES 0805, R4
RES SMD 475K OHM 1% 1/10W 0603 R12 Yageo RC0603FR-07475KL
RES SMD 500 OHM 1/10W 0603 R13 Yageo
RES SMD 10 OHM 1% 1/10W 0603 R15 Yageo RC0603FR-0710RL
RES SMD 14K OHM 0.1% 1/10W 0603 R18 Yageo RT0603BRD0714KL
RES 120K OHM 1% 1/10W 0603 R19 Stackpole Electronics Inc RMCF0603FT120K
RES 100K OHM 1% 1/10W 0603 R21 Stackpole Electronics Inc RMCF0603FT100K
RES SMD 10K OHM 1% 1/10W 0603 R22 Yageo RC0603FR-0710KL
RES SMD 4.7 OHM 1% 1/10W 0603 R26 Yageo RC0603FR-074R7L
RES SMD 16.2K OHM 1% 1/10W 0603 R27 Yageo RC0603FR-0716K2L
RES SMD 100 OHM 1% 1/10W 0603 R28 Yageo RC0603FR-07100RL
RES SMD 47 OHM 1% 1/10W 0603 R29 Yageo RMCF0603FT47R0
RES SMD 3.3K OHM 1% 1/10W 0603 R34 Yageo RC0603FR-073K3L
DNI R47
RES SMD 825K OHM 1% 1/10W 0603 R48
RES SMD 274K OHM 1% 1/10W 0603 R49
RES SMD 22K OHM 1% 1/10W 0603 R11 Yageo RC0603FR-0722KL
RES SMD 0 OHM 1/10W 0603 R31 Yageo RC0603JR-070RL
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 13 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
RES SMD 619K OHM 1% 1/16W 0402, R32, Yageo RC0402FR-07619KL
RES SMD 43.2K OHM 1% 1/16W 0402, R33, Yageo RC0402FR-0743K2L
R45 Yageo
THERM NTC 100KOHM 4485K 0402 RT2 Murata Electronics NCP15WL104E03RC
TRANSFORMER RM 8 T1 TBD YT-0803
Flyback PWM Controller with Integrated Active Clamp
Circuit U1 Silanna Semiconductor SZ1130
DIODE, 800V, 200mA D12 Panasonic DA2JF8100L
Gan Daugter Board
RES SMD 10K OHM 1% 1/10W 0402 Panasonic ERJ-2RKF1002X R45
RES SMD 100K OHM 0.1% 1/10W 0603 Panasonic ERJ-U02F1003X R46
CAP CER 0.022UF 50V X7R 0603 Murata Electronics GCM155R71H223JA55D C49
DIODE ZENER 5.6V 200MW SMINI2 Panasonic DZ2J056M0L D11
DIODE ZENER 10V 200MW SMINI2 Panasonic DZ2J100M0L D12
MOSFET 650V, 8A, GaN E-HEMT, 5x6 PDFN GaN Systems GS-065-008-1-L Q2
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 14 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Transformer Specification
Table 2: Transformer Material Lists
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 15 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Common-Mode Choke Specification
Table 3: Common-Mode Choke Material Lists
Material Specification Manufacturer Mfr. Part Number
Core R12.5 × 7.90 × 6.35 mm dimension (T38 -10000u)
EPCOS/TDK or equivalent B64290L0742X038 or equivalent
AWG26 Magnet wire, dual insulation layer Various
Separator PCB or Plastic
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 16 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Performance Data
Electrical Data
Efficiency
DoE Level VI and CoC Version 5 Tier-2 4-point (25%, 50%, 75%, 100%) average efficiency, along with CoC Version 5 Tier-2 10% load efficiency requirements.
Table 4: Load Efficiency Requirements
Vout/Iout DoE Level VI 4-Point
Average Efficiency
CoC V5 Tier-2 4-Point
Average Efficiency CoC V5 Tier-2 10% Efficiency
5 V/3.25 A 81.88% 81.84% 72.99%
9 V/3.25 A 86.87% 87.30% 77.60%
15 V/3.25 A 87.77% 88.85% 78.99%
20 V/3.25 A 87.54% 89.16. % 79.16%
115 Vac 4-point average efficiency (measured after the USB-PD disconnect FET)
VOUT / ILOAD_MAX = 5 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 91
89.77 75 90.86
50 90.24
25 87.18
10 84.12
VOUT / ILOAD_MAX = 9 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 93.21
92.13 75 93.05
50 92.49
25 90.20
10 84.45
VOUT / ILOAD_MAX = 15 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 93.35
93.36 75 93.72
50 93.75
25 92.63
10 87.69
TEST REPORT SZ-RD12-65W
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VOUT / ILOAD_MAX = 20 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 93.37
93.32 75 93.59
50 93.69
25 92.67
10 88.33
230 Vac 4-point average efficiency (measured after the USB-PD disconnect FET)
VOUT / ILOAD_MAX = 5 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 88.8
86.97 75 88.47
50 86.31
25 84.29
10 81.68
VOUT / ILOAD_MAX = 9 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 92.76
90.39 75 91.79
50 90.65
25 86.38
10 83.17
VOUT / ILOAD_MAX = 15 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 93.95
92.59 75 93.60
50 92.64
25 90.18
10 85.75
VOUT / ILOAD_MAX = 20 V / 3.25 A
%LOAD Efficiency (%) Average Efficiency (%)
100 94.23
93.11 75 94.04
50 93.31
25 90.89
10 85.69
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 18 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Full Load Efficiencies at 115 Vac/230 Vac; 5 V/ 9 V/ 15 V/ 20 V (measured after the USB-PD disconnect FET)
Vout = 5 V
Vin Iout Efficiency (%)
90 Vac @ 50 Hz 3.25 A 90.47
115 Vac @ 60 Hz 3.25 A 91
230 Vac @ 50 Hz 3.25 A 88.8
265 Vac @ 50 Hz 3.25 A 88.33
Vout = 9 V
Vin Iout Efficiency (%)
90 Vac @ 50 Hz 3.25 A 92.5
115 Vac @ 60 Hz 3.25 A 93.21
230 Vac @ 50 Hz 3.25 A 92.76
265 Vac @ 50 Hz 3.25 A 92.05
Vout = 15 V
Vin Iout Efficiency (%)
90 Vac @ 50 Hz 3.25 A 92.71
115 Vac @ 60 Hz 3.25 A 93.35
230 Vac @ 50 Hz 3.25 A 93.95
265 Vac @ 50 Hz 3.25 A 93.62
Vout = 20 V
Vin Iout Efficiency (%)
90 Vac @ 50 Hz 3.25 A 92.22
115 Vac @ 60 Hz 3.25 A 93.37
230 Vac @ 50 Hz 3.25 A 94.23
265 Vac @ 50 Hz 3.25 A 94.07
TEST REPORT SZ-RD12-65W
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Efficiency Graphs
The following graphs demonstrate 5 V/ 9 V/ 15 V/ 20 V efficiency results measured after the USB-PD disconnect FET.
Figure 11: Efficiency graphs for various output voltages and load currents
TEST REPORT SZ-RD12-65W
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No-Load Power Consumption
Table 5 lists no-load power consumption of the evaluation board across the input voltages. The worst case maximum no-load
power consumption is less than 75 mW.
Table 5: No-load Power Consumption
Input Voltage (Vac) No-Load Power (mW)
90 57.0
115 58.34
230 66.5
265 73.5
TEST REPORT SZ-RD12-65W
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Key Waveforms
The key waveforms for the worst case voltage conditions as seen by the primary side Gan Transistor and secondary side MOSFET are shown below. Due to the active clamp operation of SZ1130, there is practically no voltage spike at the switching node as shown in the following figures.
Vin=265 Vac, Vout=20 V, Iout=3.25 A, Vds_pri (max) = 568V
Vds_sec (max) = 77V
Vin=265 Vac, Vout=20 V, Iout=0 A, Vds_pri (max) = 548V
Vds_sec (max) = 79V
Figure 12: Voltage stress on the primary and secondary side MOSFET during worst case operating conditions
TEST REPORT SZ-RD12-65W
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Conducted EMI Scans
The following conducted EMI measurements demonstrate more than 6 dB margin is maintained under all input (115 Vac/ 230 Vac) and output voltage (5 V/ 9 V/ 15 V/ 20 V) conditions with floating output.
Vin=115 Vac, Vout=5 V, Iout=3.25 A Vin=115 Vac, Vout=9 V, Iout=3.25 A
Vin=115 Vac, Vout=15 V, Iout=3.25 A Vin=115 Vac, Vout=20 V, Iout=3.25 A
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 23 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Vin=230 Vac, Vout=5 V, Iout=3.25 A Vin=230 Vac, Vout=9 V, Iout=3.25 A
Vin=230 Vac, Vout=15 V, Iout=3.25 A Vin=230 Vac, Vout=20 V, Iout=3.25 A
Figure 13: Conducted EMI test results under various operating conditions
TEST REPORT SZ-RD12-65W
Silanna Semiconductor Proprietary and Confidential Page 24 For more information: www.PowerDensity.com Document 11075 Ver. 1.0
Thermal Measurements
The key thermal IR camera pictures and component temperatures are shown below for 90Vac/20V/65W (worst-case) operating condition after 1hr bake time. The maximum component temperatures is lower than 95 0C.
RefDes Description 90VAC 265VAC
U1 SZ1130-00 88.5°C 76.6°C
BR1 Bridge Rectifier 93.4°C 59.4°C
T1 Transformer 94.4°C 89.5°C
Q2 Primary GaN Transistor 91.1°C 94.9°C
Q1 Secondary SR MOSFET 86.3°C 81.6°C
Vin=90 Vac, Vout=20 V, Iout=3.25 A (top) Vin=90 Vac, Vout=20 V, Iout=3.25 A (bottom)
Vin=90 Vac, Vout=20 V, Iout=3.25 A (side left) Vin=90 Vac, Vout=20 V, Iout=3.25 A (side right)
Figure 14: Thermal IR pictures after 1hr bake time at 90Vac/20V/65W.
TEST REPORT SZ-RD12-65W
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Vin=265 Vac, Vout=20 V, Iout=3.25 A (top) Vin=265 Vac, Vout=20 V, Iout=3.25 A (bottom)
Vin=265 Vac, Vout=20 V, Iout=3.25 A (side left) Vin=265 Vac, Vout=20 V, Iout=3.25 A (side right)
Figure15: Thermal IR pictures after 1hr bake time at 265Vac/20V/65W.
TEST REPORT SZ-RD12-65W
Page 26 Document 11075 Ver. 1.0
Silanna Semiconductor Proprietary and Confidential
Information furnished by Silanna Semiconductor is believed to be accurate and reliable. However, no
responsibility is assumed for its use. Silanna Semiconductor makes no representation that the
interconnection of its circuits as described herein will not infringe on existing patents rights.
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Revision History
Revision Date Author Note
1.0 Feb. 24, 2021 Results collected and report generated.
Hardware Info
Info Value
Run name tag eff_RD12_008
Timestamp Feb 24, 2021
Primary IC Silanna Semiconductor Integrated Flyback PWM Controller (SZ1130-00)
Primary Switch GaN System 650 V E-mode GaN Transistor (GS-065-008-1-L)
Secondary IC Weltrend WT6633P
AC Supply Chroma, Programable AC Source, 61504
Input Meter YOKOGAWA,WT310E
Output Meter YOKOGAWA,WT330
Oscilloscope AGILENT TECHNOLOGIES,DSO-X 4024A,MY59241548,07.30.2019051435
Eff bake time per point 240
No-load bake time 240
Number of points 30 (no load efficiency)
Input voltages [(90, 60), (115, 60), (230, 50), (265, 50)]
Output voltages [5, 9, 15, 20]