Visio-Standards Org Chart Oct 14-2015 / 37 Legend: TCC — the Locale has a TC Chapter of the global technical committee. CFG — the Locale has a TC Chapter Formation Group, as defined

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Organizational Chart● China● Europe● Japan● Korea● North America● Taiwan

Last updated: Oct 22, 2015

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Global Technical Committee and TC Chapters

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Legend:TCC — the Locale has a TC Chapter of the global technical committee. CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.

Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).

Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).

CFG

CFG

CFG

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Legend:TCC — the Locale has a TC Chapter of the global technical committee.CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.

Note 1: An underlined Locale has ab RSC and may also be referred as “a Region” (e.g., “Europe Region”).

Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).

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Legend:TCC — the Locale has a TC Chapter of the global technical committee. CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles). * In NA, Micropatterning is traditionally called Microlithography.** In Japan, Assembly & Packaging is traditionally called Packaging.*** In Japan, Automated Test Equipment is traditionally called Test.

CFGTCCTCC

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Regional Standards Committee (RSC) Organizations

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SEMI Europe RSC OrganizationCo-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen

Vice-chair: Frank Petzold - Trustsec

Europe Chapter of Metrics Global Technical Committee

C: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB

Europe Chapter of PV Materials Global Technical Committee

C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley

Europe Chapter of Physical Interfaces & Carriers Global Technical Committee

C: Alfred Honold - InReConC: Frank Petzold - Trustsec

Europe Chapter of Gases Global Technical Committee

C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier – Gordon F Consulting

Europe Chapter of Compound Semiconductor Materials Global Technical Committee

C: Arnd Weber - SiCrystal

Europe Chapter of Silicon Wafer Global Technical Committee

C: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic

Europe Chapter of Liquid Chemicals Global Technical Committee

C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics

Europe Chapter of Information & Control Global Technical Committee


Europe Chapter of Automation Technology Global Technical Committee

C: Christian Hoffman - PEER Group

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SEMI Japan RSC OrganizationCo-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric Co-Chair: Naoyuki Kawai - The University of Tokyo

Vice Chair: Supika Mashiro - TEL

Special Groups

Reporting to the JRSC

Japan Chapter of Gases & Facilities Technical Committee

C: Hiromichi Enami - Hitachi High-TechnologiesC: Isao Suzuki - MKS Japan

Japan Chapter of Environmental Health & Safety Global Technical Committee

C: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho

FPD Coordination Group

L: Yoshitada Nogami - SK ElectronicsL: Makoto Yamamoto - Muratec

Standardization Process Improvement (SPI)

L: Supika Mahiro -TEL

Japan Chapter of Micropatterning Global Technical Committee

C: Morihisa Hoga - Dainippon Printing

Japan Chapter of Compound Semiconductor Materials Global Technical Committee

C: Masayoshi Obara - Shin-Etsu Handotai

Japan Chapter of Physical Interfaces & Carriers Global Technical Committee

C: Tsuyoshi Nagashima - MiraialC: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKU

Japan Chapter of Test Global Technical Committee

C: Hirofumi Kaga - Renesas Electronics C: Takashi Umenaga -Teradyne

Japan Chapter of Automation Technology Global Technical CommitteeC: Terry Asakawa -TELC: Naoki Ito - Mitsubishi ElectricC: Makoto Ishikawa - Nisshinbo Mechatronics

Japan Chapter of PV Materials Global Technical Committee

C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima - GlobalWafers JapanC: Tetsuo Fukuda - AIST

Japan Chapter of FPD Materials & Components Global Technical Committee

C: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - FUJIFILM

Japan Chapter of Assembly & Packaging Global Technical Committee

C: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI

Japan Chapter of FPD Metrology Global Technical Committee

C: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics

Japan Chapter of PV Global Technical Committee

C: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - GlobalWafers JapanC: Masaaki Yamamichi - AIST

Japan Chapter of Metrics Global Technical Committee

C: Toshio Murakami – Murakami Corporation

Japan Chapter of Traceability Global Technical Committee

C: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence

Japan Chapter of Silicon Wafer Global Technical Committee

C: Naoyuki Kawai - The University of Tokyo C: Tetsuya Nakai - SUMCO

Japan Chapter of Information & Control Global Technical Committee

C: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai Electric

Japan Chapter of Liquid Chemicals Global Technical Committee

C: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions

Japan Chapter of 3DS-IC Global Technical Committee

C: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST

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NA Chapter of Metrics Global Technical Committee

C: David Bouldin - Fab ConsultingC: Mark Frankfurth - Cymer

NA Chapter of Silicon Wafer Global Technical Committee

C: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein - Intel

NA Chapter of Traceability Global Technical Committee

C: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST

SEMI North America (NA) RSC Organization - NA LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering

Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant

NA RSC Technical Architect Board

C: James Moyne - University of MichiganC: Yaw Obeng - NIST

NA Chapter of Information & Control Global Technical Committee

C: Jack Ghiselli - Ghiselli ConsultingC: Brian Rubow - CimetrixC: Lance Rist - RistTex

NA Chapter of Flat Panel Display Global Technical Committee

C: Bill Colbran - Engenuity Systems

NA Chapter of Physical Interfaces & Carriers Global Technical Committee

C: Matt Fuller - EntegrisC: Stefan Radloff - Intel

NA Chapter of Automated Test Equipment Global Technical CommitteeC: Ajay Khoche - Khoche Consulting

NA Chapter of 3DS-IC Global Technical Committee

C: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor

NA Chapter of Facilities Global Technical Committee

C: Steve Lewis - DPS Engineering

NA Chapter of Liquid Chemicals Global Technical Committee

C: Frank Flowers - PeroxyChem

NA Chapter of HB-LED Global Technical Committee

C: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco

NA Chapter of Gases Global Technical Committee

C: Tim Volin - Parker HannifinC: Mohamed Saleem - Fujikin

NA Chapter of PV MaterialsGlobal Technical Committee

C: Lori Nye - Brewer ScienceC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide

NA Chapter of Photovoltaic Global Technical Committee

C: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan

NA Chapter of MEMS/NEMS Global Technical Committee

C: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan

NA Chapter of Compound Semiconductor Materials Global Technical Committee

C: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman

NA Chapter of Environmental Health & Safety Global Technical Committee

C: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML

NA Chapter of Microlithography Global Technical Committee

C: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST

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SEMI North America RSC Organization – China LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering


China Chapter of HB-LED Global Technical Committee

C: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San’an Optoelectronic

China Chapter of PV Global Technical Committee

C: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute

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Co-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant

SEMI North America RSC Organization – Korea Locale

Korea HB-LED CFG

L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI

Korea Chapter of FPD Global Technical Committee

C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution

Korea Chapter of Information & Control Global Technical Committee C: Hyungsu Kim - Doople C: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research

Korea Chapter of Global Facilities Technical Committee

C: Kwang Sun Kim - KUT

Korea Gas & Chemicals CFG

L: TBD

Korea Chapter of FPD Metrology Global Technical Committee


Taiwan TC Chapters

Taiwan Chapter of EHS Global Technical Committee

C:Shuh-Woei Yu - SAHTECHC: Fang-Ming Hsu - TSMC

ISC Taiwan Advisor

Tzeng-Yow Lin - CMS/ITRI

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SEMI North America RSC Organization – Taiwan LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering


Taiwan Chapter of 3DS-IC Global Technical Committee

C: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE

Taiwan Chapter of Photovoltaic Global Technical Committee

C : B. N. Chuang - CMS/ITRIC : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan

Taiwan Chapter of Information and Control Global Technical Committee

C:Robert Chien - TSMC

Taiwan Chapter of Flat Panel Display Global Technical Committee

C: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA

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Organization of Each TC Chapter

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3DS-IC Global Technical Committee

Taiwan TC Chapter of 3DS-IC Global Technical Committee

C: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE

Test TF

L: Tzong-Tsong Miau - ITRIL: Roger Hwang - ASEL: Ming-Chin Tsai - KYEC

Middle End Process TF

L: Arthur Chen - NTUSTL: Erh Hao Chen - ITRIL: Jerry Yang - SEMATECH

NA TC Chapter of 3DS-IC Global Technical Committee

C: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor

3DS-IC Bonded Wafer Stack TF

L: Richard Allen - NIST

3DS-IC Inspection and Metrology TF

L: Victor Vartanian -SEMATECH L: David Read - NIST

JA TC Chapter of 3DS-IC Global Technical Committee

C: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST

Steering Group

L: Yoshihiro Tomita - IntelL: Masahiro Tsuriya - iNEMI

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Electromagnetic Characterization SG

L: Mikio Kiyono - AET

Assembly & Packaging Global Technical Committee

JA 450 mm ATDP TF

L: Akihito Kawai - DiscoL: Sumio Masuchi - Disco L: Kiyofumi Tanaka – Shin-Etsu PolymerL: Kenichi Watanabe - Lintec

3D-IC SG

L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST

Thin Chip Handling TF

L: Hideki Suzuki - Shin-Etsu PolymerL: Haruo Shimamoto - AIST

5 Year Review TF

L: Masahiro Tsuriya - iNEMIL: Kazunori Kato - AiT

Japan TC Chapter of Packaging Technical Committee

C: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI

Fiducial Mark Interoperability TF

L: Sumio Masuchi - Disco

Tape Adhesive Strength Measurement SG

L: Haruo Shimamoto - AISTL: Hideki Suzuki - Shin-Etsu Polymer

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Automation Technology Global Technical Committee

Global Equipment Interface Specification (EIS) TF

L: Makoto Ishikawa - Nisshinbo MechatronicsL: Takashi Yutani - Mitsubishi Electric

Europe TC Chapter of Automation Technology Global Technical Committee

C: Christian Hoffman - PEER Group

Japan TC Chapter of Automation Technology Global Technical Committee

C: Makoto Ishikawa - Nisshinbo MechatronicsC: Naoki Ito - Mitsubishi ElectricC: Terry Asakawa - TEL

Global Equipment Interface Specification (EIS) TF

L: Carsten Born - VITRONIC GmbH

PV Wafer Traceability TF

L: TBD

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Automated Test Equipment Global Technical Committee

NA TC Chapter of Automated Test Equipment Technical Committee

C: Ajay Khoche - Khoche Consulting

Standard Test Data Format (STDF) TF

L: Ajay Khoche - Khoche Consulting

Test Cell Communcations TF

L: Len Van Eck - LTX- CredenceL: Mark Roos - Roos Instruments

Japan TC Chapter of Test Technical Committee

C: Hirofumi Kaga - Renesas SynapticsC: Takashi Umenaga -Teradyne

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Compound Semiconductor Materials (CSM) Global Technical Committee

Europe TC Chapter of CSM Global Technical Committee

C: Arnd Weber - SiCrystal

Contactless Resistivity and Mobility Mapping TF

L: Wolfgang Jantz - Semimap

SiC TF

L: Arnd Weber - SiCrystal

Japan TC Chapter of CSM Global Technical Committee

C: Masayoshi Obara - Shin-Etsu HandotaiC: open

5 Year Review TF

L: TBD

Global 200 mm GaAs Wafer Specification TF

L: TBD

Sapphire Substrate TF

L: Toshiro Kotaki - Namiki Precision Jewel

International SiC TF

L: Taizo Hoshino - Nippon Steel & Sumikin Materials

NA TC Chapter of CSM Global Technical Committee

C: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman

Electrical Properties TF

L: Austin Blew - LEI

SEMI M55 5-Yr Review TF

L: Judy Kronwasser - NOVASiC

Silicon Carbide TF

L: Open

GaN TF

L: Judy Kronwasser - NOVASiC

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Japan TC Chapter of EHS Global Technical Committee

C: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho

Global S23 Revision TF

L: George Hoshi - TEL

Environmental, Health & Safety (EHS) Global Technical Committee

GHG Emission Characterization TF

L: George Hoshi - TELL: Tetsuya Kitagawa - Sony

Seismic Protection TF

L: Eiji Nakatani - SCREEN Semiconductor Solutions

FPD System Safety TF

L: Naokatsu Nishiguchi- SCREEN Business Support Solutions

Taiwan TC Chapter of EHS Global Technical Committee

C: S. W. Yu - SAHTECHC: F. M. Hsu - TSMC

IC Equipment Safety TF

L: Colin Shen - MXICL: C. C. Huang - SAHTECH

Gas and Chemical Safety TF

L: Benny Chen - AUOL: Heng-Li Sue - SAHTECHL: Moony Lee - UMC

Seismic TF

L: K. C. Tsai - NCREEL: J. S. Hwang - NCREEL: D. W. Sun - TSMC

FPD Safety Subcommittee

L: C. C. Huang - SAHTECH

Equipment Safety TF

L: Benny Chen - AUOL: Juo Cho - AUOL: Alice Lin - CMO

Environmental Sustainability TF

L: Tony C. H. Lu - ITRIL: C Y Huang - TSMC

PV Safety TF

L: Eddie Wu - Nexpower

LED Safety TF

L: Eric Lin - Epistar

EHS TC ChapterAdvisor

Roger Wu - UMC

STEP Planning WG

L: Kenji Sugihara - Panasonic

SDRCM (S Documents REG-PG-SM Conformance Maintenance) TF

L: Supika Mashiro - TEL

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S2 Interlock Reliability TF

L: Bert Planting - ASMLL: Tom Pilz - Pilz GmbH

Ergonomics TF

L: Ron Macklin - Macklin & AssociatesL: Paul Schwab - Texas Instruments

NA TC Chapter of EHS Global Technical Committee

C: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML

Environmental, Health & Safety Global Technical Committee

S2 Ladders & Steps TF

L: Ron Macklin - Macklin & Associates L: Carl Wong - AKTL: Lindy Austin - Salus Engineering

Fire Protection TF

L: Eric Sklar - Safety GuruL: Matt Wyman - Koetter Fire

Lifting Equipment TF

L: Ron Macklin - Macklin & Associates

S2 Chemical Exposure TF

L: John Visty - Salus Engineering

S22 Revision TF

L: Chris Evanston - Salus EngineeringL: Sean Larsen - Lam Research

S6 Revision TF

L: John Visty - Salus EngineeringL: Glenn Holbrook - TUV SUD

S2 Non-Ionizing RadiationTF

L: Sean Larsen - Lam Research L: John Visty - Salus Engineering

S10 Revision TF

L: Eric Sklar - Safety GuruL: Mark Fessler - Tokyo Electron

Manufacturing Equipment Safety Subcommittee

C: Cliff Greenberg - Nikon PrecisionC: Andrew Giles - ESTECC: Lauren Crane - KLA-Tencor

Seismic Liaison TF

L: Lauren Crane - KLA-Tencor

S27 Revision TF

L: Chris Evanston - Salus Engineering

Energetic Materials EHS TF

L: Steve Trammell - EORML: Andy McIntyre - EORM

Hazardous Energy Control Isolation Devices TF

L: Andrew Giles - ESTEC L: Sean Larsen - Lam Research L: Mark Fessler - Tokyo Electron

Global S23 TF

L: Lauren Crane - KLA-Tencor

Device Removal Shipment TF

L: Eric Sklar - Safety Guru

Flow Limitation TF

L: Eric Sklar - Safety Guru

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Facilities Global Technical Committee

Japan TC Chapter of Facilities Global Technical Committee

C: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan

F1 Revision TF

L: Shuji Moriya - TEL YamanashiL: Yoshifumi Machii - Fujikin

Korea TC Chapter of Facilities Global Technical Committee

C: Kwang Sun Kim - KUT

Equipment Cleanness TF

L: TBD

NA TC Chapter of Facilities Global Technical Committee

C: Steve Lewis - DPS Engineering

F51 Revision TF

L: Dalia Vernikovsky - Applied Seals North America

Building Information Modeling (BIM) for Semiconductor Capital Equipment TF

L: Ben Bruce - Applied Materials

D31 Revision TF

L: Kose Tanahashi - Samsung ElectronicsL: Masao Kochi - HighlandL: Keizo Ochi - Konica Minolta

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FPD Metrology Global Technical Committee

Transparent Display TF

L:JongSeo Lee - Samsung Display

Perceptual Image Quality TF

L: Jongho Chong - Samsung Display

Perceptual Viewing Angle TF

L: Myongyoung Lee - LG Electronics

Liaison TF

L: YP Lan - ITRIL:DA Chang - KingbirdL:RJ Chuang - TDMDAL:Tony Chiu - CIPO

Flexible Display TF

L: WangWen - Tung - ITRI

LCD Subcommittee

L: Kerson Wang - AUO

E-Paper Display TF

L: Fang Hui - MeiL: Bor-Jiunn Wen - CMS/ITRI

Touch Screen Panel TF

L: Yen-Wen Fang - AUOL: S.Y. Chou - CMS/ITRI

Korea TC Chapter of FPD Metrology Global Technical Committee


Japan TC Chapter of FPD Metrology Global Technical Committee

C: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics

Taiwan TC Chapter of FPD Metrology Global Technical Committee

C: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA

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FPD Materials & Components Global Technical Committee

Polarizing Film TF

L: Toshihito Otsuka - SanritzL: Yoshihiko Shibahara - FujifilmL: Shigeo Kobayashi - Nitto Denko

Flexible Display TF

L: Haruhiko Itoh - Teijin L: Tadahiro Furukawa - Yamagata University

FPD Color Filter TF

L: Tadahiro Furukawa -Yamagata University

FPD Mask TF

L: Kaname Nitobe - HOYAL: Kazuya Shiojiri - SK Electronics

PDP Subcommittee

L: SeKwang Park - Kyungpook Univ.

LCD Subcommittee

L: JongSeo Lee - Samsung Display

OLED Subcommittee

L: Choonghoon Yi - MODISTECH

NA TC Chapter of FPD Technical Committee

C:Bill Colbran - Engenuity Systems

Japan TC Chapter of FPD Materials & Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - Fujifilm

Korea TC Chapter of FPD Technical Committee


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NA TC Chapter of Gases Global Technical Committee

C: Tim Volin - Parker HannifinC: Mohamed Saleem - Fujikin

Mass Flow TF

L: Mohamed Saleem - Fujikin

Pressure Measurement TF

L: Joyce Chen - UCTL: Jeff Christian - WIKA

Filters & Purifiers TF

L: Mohamed Saleem - Fujikin

Materials of Construction Gas Delivery Systems TF

L: Tim Volin - Parker HannifinL: Bill Kiikvee - AP TECH

Gases Global Technical Committee

Heater Jacket TF

L: David Colquhoun - BriskHeat

Gas Specifications TF

L: Mark Ripkowski - CONSCI

Surface Mount Sandwich Component Dimensions TF

L: Matt Milburn - UCT

Europe TC Chapter of Gases Global Technical Committee

C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Gordon F Consulting

Korea Gas & Liquid Chemicals CFG

L: TBD

Japan TC Chapter of Gases Global Technical Committee

C: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan

Gas Panel Test Method TF

L: Yoshifumi Machii - Fujikin L: Shuji Moriya - TEL Yamanashi

Live Gas Flow Rate TF

L: Shuji Moriya - TEL YamanashiL: Shimizu Tetsuo - Horiba STECL: Ishihara Seiji - Flow Techno Service

5 Year Review TF

L: Yoshifumi Machii - Fujikin

Standardization Live Gas Flow Rate SG

L: Shuji Moriya - TEL Yamanashi

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HB-LED Global Technical Committee

China TC Chapter of HB-LED Global Technical Committee

C: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San’an Optoelectronic

Single Crystal Sapphire TF

L: Yong Ji - Guizhou Haotian Optoelectronics Technology L: Xinhong Yang - AURORA

NA TC Chapter of HB-LED Global Technical Committee

C: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco

HB-LED Equipment Automation Interfaces TF

L: Daniel Babbs - Brooks AutomationL: Jeff Felipe - Entegris

HB-LED Assembly TF

L: Paul Reid - Kulicke & Soffa

HB-LED Wafer TF

L: Win Bayles - BayTech-Resor

HB-LED Impurities and Defects in Sapphire Wafers TF

L: Luke Glinski - GT Advanced Technologies

HB-LED Equipment Communication Interfaces TF

L: Brian Rubow - Cimetrix

Patterned Sapphire Substrate (PSS) TF

L: Win Bayles - BayTech-Resor

Korea HB-LED CFG

L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI

Test Methods TF

L: Peter Wagner - Self

GaN based LED Epitaxial Wafer TF

L: Fa Dong - THTF L: Xinhong Yang - AURORA

Sapphire Single Crystal Ingot TF

L: Hongo Zuo – AURORAL: Songbin Zhao - DDXDF

Process Control Systems TF

L: Martin Schellenberger - FhG IISB

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Information & Control Global Technical Committee

TA

Hiroshi Kondo - Murata MachineryTadashi Mochizuki - TEL

GEM300 TF

L: Yoshihisa Takasaki - SCREEN Semiconductor SolutionsL: Yuko Toyoshima - Hitachi High-Technologies

Equipment Information System Security TF

L: Mitch Sakamoto - Freelance

Sensor Bus TF

L: Hideaki Ogihara - Reno Sub- Systems

Japan I&CC Maintenance TF

L: Hideaki Ogihara - Reno Sub- SystemsL: Mitsuhiro Matsuda - Hitachi Kokusai Electric

GEM300 TF

L: Jong Sub Shim - ASM L: Chang Yul Cho - SEMESL: Byoung Min Im - TEL Korea

DDA TF

L: Hyungsu Kim - Doople

Europe TC Chapter of Information & Control Global Technical Committee


Japan TC Chapter of Information & Control Global Technical Committee

C: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai ElectricAdviser: Mitch Sakamoto - Freelance

Korea TC Chapter of Information & Control Global Technical Committee

C: Hyungsu Kim - DoopleC: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research


L: Mitsuhiro Matsuda - Hitachi Kokusai Electric

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Information & Control Global Technical Committee

GEM300 TF

L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant

Diagnostic Data Acquisition (DDA) TF

L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant

Process Control System Architecture (PCS) TF

L: James Moyne - University of MichiganL: Chris Maloney - Intel

Energy Saving Equipment Communication TF

L: Gino Crispieri - ConsultantL: Mike Czerniak - Edwards Vacuum

Equipment Information TF

L : Liao Robin - TSMC

GEM 300 TF

L : Liao Robin - TSMC

Liaison - TSIA

Celia Shih - TSIA

Information & Control TC Chapter Advisor

Thomas W.Y Chen - TSMC

NA TC Chapter of Information & Control Global Technical Committee

C: Brian Rubow - CimetrixC: Jack Ghiselli - Ghiselli ConsultingC: Lance Rist - RistTex

Taiwan TC Chapter of Information & Control Global Technical Committee

C: Robert Chien - TSMC

Sensor Bus TF

C: James Moyne - University of Michigan

Backend Factory Integration TF

L :Ivan Chen - TSMCL: C.Y. Chiu - TSMC

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Precursor Specifications TF

L: Paul Williams - SAFC Hitech

Liquid Chemicals Global Technical Committee

Solvents in Advanced Processes TF

L: TBD

Analytical Methods TF

L: Frank Flowers - PeroxyChem

SEMI F57 Rewrite TF

L: James Henry - Arkema GroupL: Ian Francisco - Lam Research

Determining Roughness of Polymer Surfaces TF

L: Gunter Moeller - Arkema Group

SEMI IX Resin TF

L: Slava Libman - Air Liquide

UPW Filter Performance TF


SEMI F63 Rewrite TF


SEMI F31, F39 & F41 Rewrite TF

L: David Kandiyeli - Mega Fluid SystemsL: Koh Murai - Mega Fluid Systems

SEMI F40 Rewrite TF

L: Don Hadder Jr. - Intel

Liquid Chemicals Subcommittee


Liquid Chemical Distribution Subcommittee

C: open

Diaphragm Valve TF

L: Shigeru Ohsugi - CKDL: Kimihito Sasao - Advance Electric

Welding Fitting TF

L: Kimihito Sasao - Advance ElectricL: Takashi Hasegawa - KITZ SCT

Liquid Filter TF

L: Takuya Nagafuchi - Nihon EntegrisL: Takehito Mizuno - Nihon Pall

Liquid-Borne Particle Counter TF

L: Kaoru Kondo - RIONL: Kazutoshi Kato - PMS

Europe TC Chapter of Liquid Chemicals Global Technical Committee

C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics

Japan TC Chapter of Liquid Chemicals Global Technical Committee

C: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions

NA TC Chapter of Liquid Chemicals Global Technical Committee


Permeation Tubes for Trace Moisture Calibration TF

L: Jean-Marie Collard - Solvay ChemicalsL: Jim Mc Kinley - KIN-TEK

Ultrapure Liquid Evaluation Study Group

L: Kaoru Kondo - Rion L: Hiroshi Sugawara - Organo

Korea Gas & Liquids Chemicals CFG

L: TBD

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MEMS/NEMS Global Technical Committee

Packaging TF

L: Steve Martell - Sonoscan

Wafer Bond TF

L: Win Baylies - BayTech-ResorL: Richard Allen - NIST

Material Characterization TF

L: Kevin Turner - University of Pennsylvania

International MEMS Terminology TF

L: Steven Martell - Sonoscan

Reliability TF

L: Open

Microfluidics TF

L: Mark Tondra - Diagnostic Biosensors

NA TC Chapter of MEMS/NEMS Global Technical Committee

C: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan

Europe TC Chapter of Metrics Global Technical Committee

C: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB

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Metrics Global Technical Committee

Japan TC Chapter of Metrics Global Technical Committee

C: Toshio Murakami - Murakami Corporation

Int'l Environmental Contamination Control TFL: Mikio Furukawa - Shin-Etsu Polymer

ESD/ESC TF

L: Toshio Murakami - Murakumi Corporation

EMC Study Group

L: Koji Ochi - Noise Laboratory

Cycle Time Metrics TF

L: Kenichiro Mukai - Applied Materials JapanL: Supika Mashiro - TEL

Metrics Education & Adoption (MEA) Subc (inactive)

C: TBD

EMC TF

L: Vladimir Kraz - BestESD Technical ServicesL: Mark Frankfurth - Cymer

ESD/ESC TF (inactive)

L: Arnold Steinman - Electronics WorkshopL: open

Factory Level Productivity Metrics TF (inactive)

L: Ron Billings - Georgia Tech/ FABQL: Jim Irwin - I/C Irwin Consulting

Equipment Training & Documentation TF

L: Mark Cohran - IntelL: Malthi Venkat - Nikon Precision

Wait Time Waste Metrics and Methods TF

L: Lance Rist - RistTex

Equipment RAMP Metrics TF

L: David Busing - ConsultantL: Steven Meyer - Intel

Equipment Cost of Ownership TF (inactive)

L: Daren Dance - WWKL: David Bouldin - Fab Consulting

NA TC Chapter of Metrics Global Technical Committee

C: David Bouldin - Fab ConsultingC: Mark Frankfurth - CymerTE: Carolyn Busing - Self TE: Chona Shumate - CymerTA: Greg Francis - Cymer

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Micropatterning Global Technical Committee

5 Year Review TF

L: Morihisa Hoga - Dainippon Printing

Mask Data Format for Mask Tools TF

L: Toshio Suzuki - Dainippon Printing

Terminology of Metrology TF

L: Jim Potzick - NIST

Extreme Ultraviolet (EUV) Mask TF

L: David Chan - SEMATECH

Mask Orders (P10) TF

L: Wes Erck - Wes Erck & Associates

Data Path TF

L: Thomas Grebinski - OASIS ToolingL: Kurt Wampler - ASML

Standards for Scatterometry TF

L: Thomas Germer - NIST

Extreme Ultraviolet (EUV) Fiducial Mark TF

L: Long He - SEMATECH

NA TC Chapter of Microlithography Global Technical Committee

C: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST

Japan TC Chapter of Micropatterning Global Technical Committee

C: Morihisa Hoga - Dainippon Printing

32 / 37

Photovoltaic Global Technical Committee

China TC Chapter of PV Global Technical Committee

C: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute

PV Silicon Wafer TF

L: Yuepeng Wan - LDKL: Xiaoyong Wang - JAsolarL: Jingang Lu - Suntech

Thin Film PV TF

L: Yaohua Mai - Baoding Tianwei SolarfilmsL: Xinwei Niu - Chint SolarL: Jian Ding - Hanergy

PV Silicon Raw Materials TF

L: Xiaoxia Liu - GCLL: Dongxu Chu - SINOSICOL: He Li - CPVT

Taiwan TC Chapter of PV Global Technical Committee

C : B. N. Chuang - CMS/ITRIC : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan

Organic & Dye Sensitized Solar Cell TF

L : Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRI

PV Wafer Measurement Method TF

L : Samunine Chen - Chunson

PV Package Performance TF

L: C.C.Lin - PV GuiderL: Bor -Tsuen Wang - National Pingtung UnviersityL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King Design

Building Integrated Photovoltaic (BIPV) TF

L: C.C.Lin - PV GuiderL: Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King DesignL: K. Han Ke - Gran System

NA TC Chapter of Global PV Technical Committee

C: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan

Japan TC Chapter of Global PV Technical Committee

C: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - GlobalWafers JapanC: Masaaki Yamamichi - AIST

Multi-Wire Saws TF

L: Jingying Jia - National Engineering Research Center for Photovoltaic EquipmentL: Xianwu Cai - CETC 48th InstituteL: Zhixin Li - LCT

Crystalline Silicon Solar Cell TF

L: Dengyuan Song - YingLi EnergyL: Ruling Chen - Suntech L: Xianwu Cai - 48th Institute

PV Diffusion Furnace Test Methods TF

L: Liangyu Liu - CETC-48thL: Xianwu Cai - CETC-48th

PV Module TF

L: Wei Zhou - Trina SolarL: Liang Luo - Hunan Red SolarL: Ton Schless - SibcoL: Jingbing Zhu - Suntech

PV Reliability Test Method TF

L: H.S. Wu – CMS/ITRI

EU TC Chapter of PV Materials Global Technical Committee

C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley

PV Silicon Materials TF

L: Peter Wagner - Consultant

33 / 37

PV Materials Global Technical Committee

NA TC Chapter of PV Materials Global Technical Committee

C: Lori Nye - Brewer ScienceC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide Electronics US

JA TC Chapter of PV Materials Global Technical Committee

C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima - GlobalWafers JapanC: Tetsuo Fukuda - AIST

Japan PV Materials TF

L: Tetsuo Fukuda - AISTL: Takashi Ishihara - Mitsubishi Electronic

Int’l PV Analytical Test Methods, Metrology, and Inspection TF

L: Hugh Gotts - Air Liquide Electronics USL: Ron Sinton - Sinton InstrumentsL: Chris Moore - BayTech-Resor

Int’l PV Analytical Test Methods, Metrology, and Inspection TF


International Reticle SMIF Pod & Loadport Interoperability TF

L: Jan Rothe - GLOBALFOUNDRIES

34 / 37

Physical Interfaces & Carriers Global Technical Committee

Global PIC Maintenance TF

L: Shoji Komatsu - Acteon

International 450 mm PIC TF



L: Koji Oyama - Freelance

450 mm AMHS TF

L: Yoichi Motoori - Murata MachineryL: Kenji Yamagata - DAIFUKU

International Process Module Physical Interface (IPPI) TF




Glboal PIC Maintenance TF

L: Larry Hartsough - UA Associates

EUV Reticle Handling TF

L: Long He - SEMATECHL: David Chan - SEMATECHL: John Zimmerman - ASMLL: Kazuya Ota - Nikon

International 450 mm PIC TF

L: Melvin Jung - IntelL: Shoji Komatsu - Acteon

NA 450mm Shipping Box TF

L: Tom Quinn - Intel

International 450 mm Shipping Box TF

L: Tom Quinn - Intel

450mm ATDP TF

L: Stefan Radloff - Intel


L: Jan Rothe - GLOBALFOUNDRIES

International Process Module Physical Interface (IPPI) TF

L: Richard Oechsner - Fraunhofer

NA TC Chapter of Physical Interfaces & Carriers Global Technical Committee

C: Matt Fuller - EntegrisC: Stefan Radloff - Intel

Japan TC Chapter of Physical Interfaces & Carriers Global Technical Committee

C: Tsuyoshi Nagashima - Miraial C: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKUTA: Shoji Komatsu - Acteon

Europe TC Chapter of Physical Interfaces & Carriers Global Technical Committee


E84 Revision TF

L: Alfred Honold - InReCon

(PIC-Si) Int’l 450 mm Shipping Box TF


Japan Shipping Box TF

L: Shoji Komatsu – ActeonL: Tsuyoshi Nagashima - Miraial

Europe TC Chapter of Si Wafer Global Technical Committee

C: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic

International Terminology TF


International Advanced Wafer Geometry TF

L: Fritz Passek - SiltronicL: Frank Riedel - Siltronic

International Test Methods TF


International Advanced Surface Inspection TF

L: Frank Riedel - Siltronic

International Polished Wafers TF

L: Frank Riedel - Siltronic

35 / 37

Silicon Wafer Global Technical Committee

International Annealed Wafers TF

L: Dinesh Gupta - STA

International Epitaxial Wafers TF



L: John Valley - SunEdison SemiconductorL: Mike Goldstein

International SOI Wafers TF

L: Bich-Yen Nguyen - SOITEC


L: Noel Poduje - SMSL: Jaydeep Sinha


L: TBD

NA TC Chapter of Si Wafer Global Technical Committee

C: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein TE: Murray Bullis - Materials & Metrology

International Test Methods TF


International Automated Advance Surface Inspection TFL: Kurt Haller - KLA Tencor

36 / 37

Japan TC Chapter of Si Wafer Global Technical Committee

C: Naoyuki Kawai - The University of TokyoC: Tetsuya Nakai - SUMCO

International Annealed Wafers TF

L: Koji Araki - GlobalWafers Japan

Silicon Wafer Global Technical Committee


L: Tetsuya Nakai - SUMCO


L: Satoshi Akiyama - Raytex

Japan JWG TF

L: Masanori Yoshise - FreelanceL: Satoshi Akiyama - Raytex

International Test Method TF

L: Ryuji Takeda - GlobalWafers Japan

International SOI Wafers TF

L: Atsushi Ogura - Meiji University

International Advanced Surface Inspection TF

L: Masami Ikota - Hitachi High Technologies

JA Shipping Box TF

L: Shoji Komatsu - ActeonL: Tsuyoshi Nagashima - Mirial

International 450 mm Shipping Box TF


GOI WG

L: Tsuyoshi Otsuki - Shin-Etsu Handotai

Surface Organic Contaminant Analysis WGL: Mikako Omata - Sumika Chemical Analysis Service

Surface Metal Chemical Analysis WG

L: Ryuji Takeda - GlobalWafers JapanL: Ryo Machida - Sumika Chemical Analysis Service

BMD DZ WG

L: Satoshi Akiyama - RaytexL: Kazuo Moriya - Raytex

Bulk Heavy Metal Analysis by Electrical Measurement WG

L: Shingo Sumie - KOBELCOL: Masaru Akamatsu - KOBELCO

International Epitaxial Wafers TF

L: Naohisa Toda - Shin-Etsu Handotai

Japan Test Method TF

L: Ryuji Takeda - GlobalWafers JapanL: Tsuyoshi Otsuki Shin-Etsu HandotaiL: Mikako Omata - SCAS


L: Koji Izunome - GlobalWafers Japan


L: Tetsuya Nakai - SUMCO

37 / 37

Traceability Global Technical Committee

5 Year ReviewTF

L: Hirokazu Tsunobuchi - Keyence

Japan PV Traceability TF

L: Yoichi Iga - FreelanceL: Hirokazu Tsunobuchi - Keyence

NA TC Chapter of Traceability Global Technical Committee

C: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST

5 Year Review TF

L: Win Baylies - BayTech-Resor

Japan TC Chapter of Traceability Global Technical Committee

C: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence


L: Hirokazu Tsunobuchi - Keyence