Embed Size (px)
Citation preview
User's GuideSBOU056–March 2008
USB DAQ Platform
This user's guide describes the characteristics, operation, and use of the USB DAQ Platform. It provides adetailed description of the hardware design. The USB DAQ Platform is used as part of several of TexasInstruments evaluation module kits; this document supplements the documentation of those evaluationmodule kits.
Contents1 Overview ...................................................................................................................... 22 System Setup ................................................................................................................ 43 Theory of Operation ......................................................................................................... 54 Detailed Description of Jumper Settings ................................................................................ 195 Bill of Materials ............................................................................................................. 25
List of Figures
1 Typical Hardware Included with the USB DAQ Platform ............................................................... 22 Hardware Setup for the USB DAQ Platform ............................................................................. 43 USB DAQ Platform Block Diagram........................................................................................ 54 Digital I/O Area—Microcontroller .......................................................................................... 65 Digital I/O Area—I2C and SPI .............................................................................................. 76 Digital I/O Area—Internal Control Signals ................................................................................ 87 Digital I/O Area—CTRL and MEAS ....................................................................................... 88 Digital I/O Area—Address Select .......................................................................................... 99 Microcontroller Power ....................................................................................................... 910 USB I/O...................................................................................................................... 1011 Firmware EEPROM ........................................................................................................ 1012 Power Indicators............................................................................................................ 1013 Reset......................................................................................................................... 1114 One-Wire Speed-Up Circuit............................................................................................... 1115 DUT Power Switching ..................................................................................................... 1216 Loop and INA Supplies .................................................................................................... 1317 I2C Isolation ................................................................................................................. 1418 Calibration EEPROM ...................................................................................................... 1419 TUSB UART to RS232 .................................................................................................... 1420 DAC, ADC, and INA—Reference ........................................................................................ 1521 DAC, ADC, and INA—ADS1100 a1 Connections...................................................................... 1522 DAC, ADC, and INA—ADS1100 a2 Connections...................................................................... 1623 DAC, ADC, and INA—DAC8574 ......................................................................................... 1624 5V Default Jumper Settings............................................................................................... 1725 3V Default Jumper Settings............................................................................................... 1826 Connector Definition ...................................................................................................... 22
Windows is a registered trademark of Microsoft Corporation.SPI is a trademark of Motorola, Inc.I2C is a trademark of NXP Semiconductors.All other trademarks are the property of their respective owners.
SBOU056–March 2008 USB DAQ Platform 1Submit Documentation Feedback
www.ti.com
1 Overview
1.1 Hardware Included with a Typical USB DAQ Platform
1.2 Related Documentation from Texas Instruments
Overview
The USB DAQ Platform is a data acquisition system that generates digital and analog signals. Specifically,the system generates I2C™, SPI™, One-Wire, and general-purpose digital I/O signals. The system alsocontains four 16-bit string digital-to-analog converters (DACs), and two 16-bit delta-sigma (ΔΣ)analog-to-digital converters (ADCs).
In general, the USB DAQ Platform is connected to a separate test board; these two components, alongwith the related cables and power supplies, form a complete evaluation module (EVM). An EVM facilitatesthe evaluation of a specific device. For example, the PGA308EVM contains the USB DAQ Platform, thePGA308 test board, a power supply, and a USB cable. This EVM allows customers to evaluate andunderstand all the features on the PGA308 integrated circuit.
Figure 1 illustrates the typical hardware included the USB DAQ Platform.
Figure 1. Typical Hardware Included with the USB DAQ Platform
Current versions of all documentation can be obtained from the TI website at http://www.ti.com/, or bycalling the Texas Instruments Literature Response Center at (800) 477-8924 or the Product InformationCenter (PIC) at (972) 644-5580. When ordering, identify the document by both title and literature number.
USB DAQ Platform2 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
1.3 If You Need Assistance
1.4 Information About Cautions and Warnings
1.5 FCC Warning
Overview
If you have questions about the INA209 evaluation module, contact the Linear Amplifiers ApplicationsTeam at [email protected]. Include USB DAQ Platform as the subject heading.
This document contains caution statements.
CAUTIONThis is an example of a caution statement. A caution statement describes asituation that could potentially damage your software or equipment.
The information in a caution or a warning is provided for your protection. Please read each caution andwarning carefully.
This equipment is intended for use in a laboratory test environment only. It generates, uses, and canradiate radio frequency energy and has not been tested for compliance with the limits of computingdevices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonableprotection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense is required totake whatever measures may be required to correct this interference.
SBOU056–March 2008 USB DAQ Platform 3Submit Documentation Feedback
www.ti.com
2 System Setup
USB
DAQ
Platrform
Test
Board
EVM
Power
External Connection
to Input and Output Signals
DUT
System Setup
Figure 2 shows the typical system setup for the USB DAQ Platform. The PC runs software thatcommunicates with the USB DAQ Platform, while the USB DAQ Platform generates the digital signalsused to communicate with the test board. Connectors on the test board are typically used to connectexternal signals to the device under test (DUT). Jumpers and other circuitry on the test board allow fordifferent configurations of the DUT.
Figure 2. Hardware Setup for the USB DAQ Platform
Minimim PC operating requirements:• Microsoft Windows® XP or higher• Available USB port
NOTE: Works with either US or European regional settings.
USB DAQ Platform4 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3 Theory of Operation
Adjustable
Regulator
TUSB3210
8052 Cm
with USB Interface
and UART
4mA to 20mA
Loop Receiver
2 x 16-Bit
Delta-Sigma ADC
Loop Switching
Circuit
Reference
Circuits
3.3V
Regulator
4 x 16-Bit
String DAC
8K byte
EEPROM
VCC
(2.7V to 5.5V)
V CS m
3.3VVUSB
5V
VDUT
(2.7V to 5.5V)
Reset Button and
Power-On Reset
Buffers and
Latches
Calibration
EEPROM
USB DAQ Platform
To Te
st B
oa
rd
To C
om
pu
ter a
nd
Po
we
r Su
pp
lies
Power
Switching
Switched
PowerExternal
Power
(6V dc)
External Power
V = 40V dcLOOP
Loop Measurement
Circuitry = 15V±
(6V dc)
USB Bus
from
Computer
I C/SPI2
Control and
Measure Bits
4mA to 20mA
Receiver
2 x 16-Bit
Delta-Sigma ADC
4 x 16-Bit
String DAC
Theory of Operation
The USB DAQ Platform is a general-purpose data acquisition system that is part of several different TexasInstruments EVMs. Figure 3 illustrates a block diagram of the platform.
The core of the USB DAQ Platform is the TUSB3210, an 8052 microcontroller (µC) that has a built-in USBinterface. The microcontroller receives information from the host computer that it translates into I2C, SPI,or other digital I/O patterns. During the digital I/O transaction, the microcontroller reads the response ofany device connected to the I/O interface. The response from the device is then sent back to the PCwhere it is interpreted by the host computer.
Figure 3. USB DAQ Platform Block Diagram
SBOU056–March 2008 USB DAQ Platform 5Submit Documentation Feedback
www.ti.com
3.1 Digital I/O Area
3.1.1 Microcontroller
P0.043
P0.144
P0.245
P0.346
P0.447
P0.548
P0.649
P0.750
P1.031
P1.132
P1.233
P1.334
P1.435
P1.536
P1.640
P1.741
P2.022
P2.123
P2.225
P2.326
P2.427
P2.528
P2.629
P2.730
P3.058
P3.157
P3.256
P3.355
P3.454
P3.553
P3.652
P3.751
S28
S39
X161
PUR17
SDA11
SCL12
SUSP16
X260
VCC110
VCC362
VCC239
GND15
GND342
GND224
GND459
DP018
DM019
VREN38
VDDOUT37
RST13
TEST014
TEST115
TEST220
SELF/~BUS21
U2
TUSB3210
R1
15k
R13
1.5k
R3
33
R4
33
XTL1
SE3409-ND
C2522pF
C2622pF
C50.1uF
R27
1M
3.3VP3.0 / RXDP3.1 / TXD
SDASCL
RST#
SUSP
R8100k
3 JUMP43.3V
3.3V
1
2
3 JUMP2
12MHz
C350.1uF
C340.1uF
1
2 3Q1MMBT4401
EXT
BUS
H
8052 Core USB uC
1.8V
These ports
are used to
generate I C,2
SPI, and other
control signals.
USB
Input
Signals
Theory of Operation
The following subsections discuss the digital I/O areas that surround the microcontroller. Refer toSBOR001 (avavilable for download from www.ti.com) for a detailed copy of the entire schematic.
Figure 4 shows the detailed area surrounding the microcontroller. U2 is a TUSB3210 microcontroller—an8052 core with a built-in USB interface. U2 converts information from the USB bus on the PC to I2C, SPI,and One-Wire digital transactions. U2 runs on 3.3V; the inputs are not 5V tolerant. As a result, all externalinput signals are level-translated. JUMP2 allows U2 to be powered from the USB bus or the externalsupply.
Figure 4. Digital I/O Area—Microcontroller
USB DAQ Platform6 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.1.2 I2C and SPI
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U3
SN74LV07ADBR
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U4
SN74LV07ADBR
3.3V
3.3V
3.3V
CLR1
VCC20U8
OE11
A12
A23
A34
A45
A56
A67
A78
A89
GND10
Y811
Y712
Y613
Y514
Y415
Y316
Y217
Y118
OE219
Vcc20U7
SN74LVTH541DBR
C3
0.1uF
C4
0.1uF
C60.1uF
C70.1uF
SPI_CLKSPI_DOUT1SPI_CS1SPI_DOUT2SPI_CS2I2C_SCKI2C_SDA1I2C_SDA2
Vdut
SPI_DIN1SPI_DIN2
ONE_WIRE
VdutVcc
Vcc14
U11
3.3V
C380.1uF
1234
5
6789
01
RN1
3.3V
DAC_ADAC_BDAC_CDAC_D
ads2_Vin+
ads1_Vin+
ads2_Vin-
I2C_SDA_ISO
ads1_Vin-
I2C_SCK_ISO
1234
5
6789
01
RN2
Vcc
XTR -LoopXTR +Loop
-15V+15V
I2C_SDA1
SPI_DIN2
SPI_DOUT2SPI_CS2
I2C_SCK
I2C_SDA2SPI_DIN1
SPI_DOUT1SPI_SCK
SPI_CS1
SPI_DOUT1
SPI_SCKSPI_CS1
I2C_SCK
SPI_DIN1
Digital I/O Area
I2C_SDA2
R46 10
R47 10
R48 10
R49 10
R50 10R55 10
R54 10
R53 10
R52 10
R51 10
INA_NEG_IN
Theory of Operation
Figure 5 shows the digital I/O area that manages I2C and SPI communications. U3 and U4 are opencollector drivers. These devices drive the I2C and SPI output signals. Note that the input is 3.3V and theoutput follows VDUT (that is, 3V or 5V). U7 is the input buffer. Note that the inputs are 5V tolerant. Theoutputs of U7 are compatible with the microcontroller (that is, 3.3V).
Figure 5. Digital I/O Area—I2C and SPI
SBOU056–March 2008 USB DAQ Platform 7Submit Documentation Feedback
www.ti.com
3.1.3 Internal Control Signals
CLR1
1Q2
1D3
2D4
2Q5
3Q6
3D7
4D8
4Q9
GND10
CLK11
5Q12
5D13
6D14
6Q15
7Q16
7D17
8D18
8Q19
VCC20U8
SN74HC273DBR
OE11
A2A3
4
A45
A56
A67
A78
A89
GND10
Y811
Y712
Y613
Y514
Y415
Y316
Y2
OE219
SN74LVTH541DBRC70.1uF
C110.1uF
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U11
SN74LV07ADBR
3.3V
C380.1uF
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U22
SN74LV07ADBR
3.3V
C480.1uF
1234
5
6789
01
RN3
50
1
3.3V
3.3V
1
2
3JUMP18Vdut
CLR1
1Q2
1D3
2D4
2Q5
VCC20
U35
3.3V
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U33
SN74LV07ADBR
3.3V
C490.1uF
1234
5
6789
01
RN2
Vcc
SW3SW4SW5SW6SW7SW8
SW1SW2
Vcc
C420.1uF
SPI_D
SPISP
SPI
CLR1
1Q2
1D3
2D4
2Q5
3Q6
3D7
4D8
4Q9
GND10
CLK11
5Q12
5D13
6D14
6Q15
7Q16
7D17
8D18
8Q19
VCC20
U25
SN74HC273DBR
Vcc Vdut
Vcc
3.1.4 CTRL and MEAS
Title
Number RevisionSize
C
Date: 11-Feb-2008 Sheet of
3.3VC10
0.1uF
OE11
A12
A23
A34
A45
A56
A67
A78
A89
GND10
Y811
Y712
Y613
Y514
Y415
Y316
Y217
Y118
OE219
Vcc20U5
SN74LVTH541DBR
12345678910111213141516171819202122232425
J4
CON25
1234
5
6789
01
RN4
1
2
3JUMP18Vdut
CLR1
1Q2
1D3
2D4
2Q5
3Q6
3D7
4D8
4Q9
GND10
CLK11
5Q12
5D13
6D14
6Q15
7Q16
7D17
8D18
8Q19
VCC20
U35
SN74HC273DBR
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
SN74LV07ADBR
1A1
1Y2
2A3
2Y4
3A5
3Y6
GND7
4Y8
4A9
5Y10
5A11
6Y12
6A13
Vcc14
U34
SN74LV07ADBR
SW8
Vcc
C420.1uF
C470.1uF
3.3V CTRL1CTRL2CTRL3CTRL4CTRL5CTRL6CTRL7CTRL8MEAS1MEAS2MEAS3MEAS4MEAS5MEAS6MEAS7MEAS8
SPI_DIN2SPI_DOUT2
SPI_CS2SPI_SCK
VdutVcc
Vcc Vdut
1 2
USB DAQ EVM
C
Theory of Operation
Figure 6 shows the digital I/O area used for internal control (for example, calibration mux control). U8 isused to latch the internal control signals. A latch is required because microcontroller port 2 is used formultiple purposes. U11 is an open collector buffer that converts the control signals to VDUT logic levels(that is, 3V or 5V). U25 and U22 perform the same function as U8 and U11, respectively.
Figure 6. Digital I/O Area—Internal Control Signals
Figure 7 shows the connection of the CTRL and MEAS circuitry. U34 is the latch for the general-purposeoutput (CTRL1 to CTRL8). U5 is the buffer for the general-purpose input (MEAS1 to MEAS8).
Figure 7. Digital I/O Area—CTRL and MEAS
USB DAQ Platform8 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.1.5 Address Select
P3.058
P3.157
P3.256
P3.355
P3.454
P3.553
P3.652
P3.751
S28
S39
VCC110
VCC362
VCC239
GND15
GND342
GND224
GND459
TUSB3210
C5
0.1uF
3.3VP3.0 / RXD
P3.1 / TXD
SDA
SCL
1
2
3 JUMP4
1
2
3 JUMP5
3.3V
3.3V
35
1uF
H
H
L
L
8052 Core USB uC
Address Set
3.2 Microcontroller Power
P0.043
P0.144
P0.245
PUR17
DP018
DM019
U2
GND4
+5V1
DM2
DP3
R5
100k
IN1
GND2
EN3
NC4
OUT5
U1
TPS76333DBV
R1
15k
R13
1.5k
C2
0.1uF
+ C23
4.7uF+ C22
4.7uFC1
0.1uF
R610k
R710k
1.8V
1
2
3
JUMP1
3.3V
1
2 3Q1
MMBT4401
5V USB
EXT
BUS
uC Power
F3
Vraw2
Theory of Operation
Figure 8 shows the jumper connections that set the USB address. JUMP4 and JUMP5 allow for differentUSB product IDs. The product IDs are called addresses because they effectively act as USB addresses.
Figure 8. Digital I/O Area—Address Select
Figure 9 shows the power connections to the microcontroller. U1 provides the 3.3V supply for theTUSB3210 microcontroller. JUMP1 selects the power source: EXT = External 9V dc power, BUS = 5Vpower from USB.
Figure 9. Microcontroller Power
SBOU056–March 2008 USB DAQ Platform 9Submit Documentation Feedback
www.ti.com
3.3 USB I/O
PUR17
SUSP16
DP018
DM019
VREN38
TEST014
TEST115
TEST220
U2
GND4
+5V1
DM2
DP3
GND6
GND5
J1
USB_CON
R1
15k
R13
1.5k
R3
33
R4
33
R710k
SUSP
1
2 3Q1MMBT4401
5V USB5V USBUSB I/O
F3
C710.01uF
R201M
C700.01uF
3.4 Firmware EEPROM
A01
A12
A23
VSS4
SDA5
SCL6
WP7
Vcc8
U10
24LC64
3.3V
SDA
SCL
C8
0.1uF
R28
2.4k
R29
1.2k
3.3V
SCL SDA
1
2
3
JUMP3
EE OFFEE ON
R9
2.4k
Firmware EEPROM
1
2
3
JUMP10
WP OFF
WP ON
D11
P6SMB6.8A
3.5 Power Indicators
R31
510
D1
LED
3.3V
SUSP
R10
510
D6
LED
R12
510
D7
LED
Vcc Vdut
R14
510
D8
LED
3.3V
uC OK
Vcc Vdut 3.3V
GND
Power Indicators
Theory of Operation
Figure 10 shows the USB port connection to the microcontroller. J1 connects the USB bus to theTUSB3210 microcontroller. The transistor and resistors are standard support circuitry for this device. Seethe TUSB3210 data sheet (SLLS466F), available from www.ti.com, for more information.
Figure 10. USB I/O
Figure 11 shows the firmware EEPROM area. U10 is the 8K-byte EEPROM that contains the firmwareprogram used to run the microcontroller. JUMP3 allows the EEPROM to be disconnected from themicrocontroller (EE OFF). The EE OFF feature is only used by the factory during EEPROM programming.This jumper must be in the EE ON position for normal operation.
Figure 11. Firmware EEPROM
Figure 12 shows the LED power indicators. The LEDs are used to indicate DUT power, 3V power, andmicrocontroller status. The LEDs labeled VCC, uC OK, and 3.3V should be on when the system is poweredup. VDUT is switched power and can be turned on and off with software.
Figure 12. Power Indicators
USB DAQ Platform10 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.6 Reset
R2
22k
R3010
C121uF
RST#
1 2
3 4
SW1PB_SW
3.3V
Reset
3.3VC46
0.1uF
2 4
53
U28
SN74LVC1G17DBV
13D14ZHCS500
RC gives 19mS reset pulse
3.7 One-Wire Speed-Up Circuit
12 3
4
5
U13
SN74LVC1G66
2
3
4
CN
1 5
U16
SN74LVC1G07
R40
18.2k
C31220pF
1
2
3
JUMP8
P3.1 / TXD
R224.7k
R35
200
Vdut
3.3V
Vcc
Pull_up
12 3
4
5
U14
SN74LVC1G66
Vcc
+ C2410uF
Vdut
1
2
34
5
U17
LMV331
VccVcc
R3310k
R244.7k
R234.7k
Vcc
R38
15.8k
R36200
Vcc
Vcc
C150.1uF
C140.1uF
C180.1uF
C160.1uF
C170.1uF
R34
10k
(1206)
R434.7k
Vcc
3.3V
TP24
TP26
TP25
C370.1uF
2
3
4
CN
15
U6
SN74LVC1G07
P3.0 / RXD
ONE_WIRE
12 3
4
5
U21
SN74LVC1G66
C90.1uF
Vcc
Disconnect One
13
D2MMBD4148
13
D3MMBD4148
D4MMBD4148
TP27
TP28
One-Wire Speed Up Circuit
SPD_UP
GND
1A1
1B2
1CLR3
1Q4
2Q5
2Cext6
2Rext/Cext7
DN
G8
2A9
2B10
2CLR11
2Q12
1Q13
1Cext14
1Rext/Cext15
Vcc
61
U18
SN74HC221PWR
Theory of Operation
Figure 13 shows the microcontroller reset circuitry. The reset circuit is connected to the RST pin on themicrocontroller and resets the microcontroller upon power-up. U28 is a Schmitt buffer that is used tocreate a clean logic high or low (that is, the RST pin is connected to 3.3V or 0V and not to intermediatevoltage levels).
Figure 13. Reset
Figure 14 shows the One-Wire speed-up circuit. This circuit allows the UART signals to be connected onlong lines (that is, lines with high capacitance). The key to the operation is capacitor C24 (10µF), which isused to speed up (boost) the rising edge of the UART signal. The one-shot component (U18) disconnectsthe boost capacitor shortly after the rising edge. JUMP8 can be used to enable or disable the speed-upcircuit: SPD_UP = speed-up is enabled; GND = speed-up is disabled.
Figure 14. One-Wire Speed-Up Circuit
SBOU056–March 2008 USB DAQ Platform 11Submit Documentation Feedback
www.ti.com
3.8 DUT Power Switching
Vout1
Vout2
ADJ3
GND4
EN5
NC6
Vin7
Vin8
U19
REG101UA-A
R4118.2k
R3915.8k
R4211.5k
1
2
3 JUMP9
C20
0.1uF
+ C3310uF
C210.1uF
3
6 4521 Q3
ZXMP3A17E6
+ C32150uF
R2610k
R25200
Du
t_P
ow
re
Vdut
123
4
5 U15
SN74LVC1G66
R37200
Vcc
Vdut_discharge
C190.1uF
Vcc
(1206) DCASE
Vreg_in Vreg_in
1
2
3
JUMP141
2
3JUMP13
5V USB5V USB
13D5
ZHCS500
9V
BUS
BUS REG
R15
200k
Vraw Vraw
Vraw
1
2
3JUMP17
TP29
DUT Power Switching
5V
3V
Vraw BUS
Vraw2
When the jumper is in this positionVraw must be between 3V and 5.5V
Note: The power supply input range is 6V to 10V.
F1
D16P6SMB6.8A
12
T3
T_STRIP2
9VGND
J5
CUI_PJ-102
Theory of Operation
Figure 15 shows the DUT power switching. U19 is an adjustable regulator. JUMP9 controls the output ofU19; the output of U19 can be set to either 5V or 3V. Q3 switches the power on or off. The supply beforethe switch is called VCC, and is a constant 3V or 5V. The supply after the switch is called VDUT and is aswitched 3V or 5V (that is, it can be disconnected). U15 is used to discharge any capacitance connectedto VDUT after it is disconnected.
Figure 15. DUT Power Switching
USB DAQ Platform12 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.9 Loop and INA Supplies
12
T1
T_STRIP2
1 3D10
ZHCS500
1234 5 6
U42AQV102A
1
23 4
5
6
U43AQV102A
XTR +Loop
R60200
(1206)
Vdut_discharge
R58
1k
R59
1k
Vcc
TP1
C270.1uF
5.4V
5.4V
Vcc
C130.1uF
123
4
5
U41
SN74LVC1G66
TP4
XTR -Loop
R17
24.9k 0.1%
C52
0.1uF
R16
20k 0.1%
R18
150 0.1%
+15V
12 3
4
5
U31
SN74LVC1G66
AVcc
C510.1uF
I to V from Loop
Vin-2
Vin+3
+V
7-
V4
Rfe
5
Vo6
Rg-1
Rg+8
U32
INA128
-15V
INA Connect
C53
0.1uF
R4510k 0.1% Gain = 1 + 50k/Rg
Gain =1 + 50k/24.9k = 3.008
C600.1uF
D9
P6SMB6.8A
To
25-pin
DSUB
Vo_in_ADS = (1/3)Vo_INA
123
T2
T_STRIP3
+15V
+ C55
4.7uF
-15V
L2
L3
+
C54
4.7uF C571uF
C561uF
1 3D12
ZHCS500
13D13
ZHCS500
Loop Supply and INA Supply
+15V-15VGND
F4
F5
+VL-VL
-VL+VL
GND-15V+15V
Cut pin3 and plug on
mating connector.
Connector allows
quick connection
during test.
12345678
CON2
2
3
4
CN
15
U12
SN74LVC1G07
2
3
4
CN
15
U44
SN74LVC1G07
Dut_Power
R614.7k
Vcc
C280.1uF
INA_NEG_IN
Theory of Operation
Figure 16 shows the loop and INA supplies, and current-loop receiver circuitry. This section provides theconnection for ±15V supplies and the loop supply. Diodes prevent reverse connections. Capacitors C55and C54 and inductors L2 and L3 provide filtering.
The instrumentation amplifier (U32) amplifies the current loop current across R18. The output of U32 is avoltage of 0V to 15V. The U32 output voltage is divided into 0V to 5V by R16 and R45. This voltage isconnected to ADS1100_2 via U11. U11 can connect or disconnect the current loop output to ADS1100_2.
Photo-MOS-Relay U42 is used to connect and disconnect the loop supply from the loop. U12 provides thecontrol signal to U42. Photo-MOS-Relay U43 is used to discharge any capacitance on the current loopafter it has been disconnected. U44 provide the control signal to U43. U41 inverts the control signal.
Figure 16. Loop and INA Supplies
SBOU056–March 2008 USB DAQ Platform 13Submit Documentation Feedback
www.ti.com
3.10 I2C Isolation
12
GND3 4
V+5
U27
MAX4596DBVR
I2C ISO
12
GND3 4
V+5
U23
MAX4596DBVR
I2C_SDA_ISO
I2C_SCKI2C_SCK_ISO
I2C ISO
Vcc
Vcc
C43
0.1uF
C45
0.1uF
I2C Isolation
I2C_SDA1
3.11 Calibration EEPROM
A01
A12
A23
VSS4
SDA5
SCL6
WP7
Vcc8
U9
24LC64
VccC50
0.1uF
I2C_SCKI2C_SDA2
Calibration EEPROM
1
2
3
JUMP11
WP OFF
WP ON
D15
P6
SM
BA
8.6
3.12 TUSB UART to RS232
Provisional TUSB UART to RS232
P3.0 / RXDP3.1 / TXD
3.3V
Note: Cut pin 4 and plug pin 4 on mate.
EN RS232
123456
CON1
CON6
Theory of Operation
Figure 17 shows the switches that isolate the I2C communication lines. U27 and U23 are used to connector disconnect the I2C bus.
Figure 17. I2C Isolation
Figure 18 shows the EEPROM that contains calibration information. U9 is a 8K-byte EEPROM. Calibrationinformation (that is, slopes and offsets) for the DACs and ADCs is stored in U9. The USB DAQ Platform iscalibrated at the factory. After calibration, JUMP11 is used to write-protect the EEPROM (that is, JUMP11= WP ON).
Figure 18. Calibration EEPROM
Figure 19 shows the firmware debug connector. This connector can be used to connect an RS232 port tothe TUSB3210 microcontroller. The RS232 port can be connected to a computer communication terminaland used to debug firmware.
Figure 19. TUSB UART to RS232
USB DAQ Platform14 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.13 DAC, ADC, and INA
3.13.1 Reference
Vcc
C401uF
C410.1uF
AVccAVcc
5.4V
Vraw2
1
2
3
JUMP6
1
2
3
JUMP7
C640.033uF
REG
REF
EN-
4
+3
1
25
U40OPA333AIDBV
R1124k .1%
R19
7.5k .1%
5.4V
GND_F1
GND_S2
ENABLE3
IN4
OUT_S5
OUT_F6
U39
REF3230
GND_F1
GND_S2
ENABLE3
IN4
OUT_S5
OUT_F6
U37
REF3220
5.4V
5.4V
E2
C3
B1
Q4MMBT4403
R444.99k
R21
1kR56
2k
R32
4.99k
C591uF
+ C6510uF
Vraw2
C580.1uF
C660.1uF
C670.1uF
R57
4.99kC68
0.1uF
Vout1
Vout2
ADJ3
GND4
EN5
NC6
Vin7
Vin8
U36
REG101UA-A
C690.1uF
1
23
Q2MMBT4401
3.13.2 ADS1100 a1 Connections
Vin+1
DN
G2
SCL3
SDA4V
cc5
Vin-6
U20
ADS1100A0IDBVT
I2C_SCK
I2C_SDA2
C36
0.1uF
a1_Vin+
a1_Vin-
Vcc
AVcc
C44
AVcc
1
2
3
4
5 6
GND7
8
9
10
11
1213
Vcc14
U29
SN74HC4066DBR
AVcc
SW3
SW4
SW1
SW2
DAC_A
DAC_B
1
2
3
JUMP7
REG
REF
1
2
3
4
5 6
GND7
8
9
10
11
1213
Vcc14
U38
SN74HC4066DBR
AVcc
ads1_Vin+
ads1_Vin-
ads2_Vin+
ads2_Vin-
EN_ADS EN_ADS
a1_Vin+
a1_Vin-
a2_Vin+
a2_Vin-
C610.1uF
C620.1uF
E2
C3
B
Q4MMBT4403
k
Theory of Operation
Figure 20 shows the circuitry that generates the voltage reference for the DACs and ADCs. U37 and U39are references connected in a stacked configuration to achieve a 3V or 5V reference. U36 generates a5.4V supply for the OPA333 buffer. U40 is used to buffer the reference signal. Q2 and Q4 boost thecurrent, but allow a close swing to the rail.
Figure 20. DAC, ADC, and INA—Reference
Figure 21 shows the ADS1100 a1 external connections and self-calibration circuitry. U20 is a 16-bitdelta-sigma ADC (ADS1100). U38 is a switch that allows the ADCs to be disconnected. U29 is aself-calibration/test switch that allows the ADC to be connected either to the DAC or to GND. Note that theUSB DAQ Platform communicates to U24 using I2C channel 2.
Figure 21. DAC, ADC, and INA—ADS1100 a1 Connections
SBOU056–March 2008 USB DAQ Platform 15Submit Documentation Feedback
www.ti.com
3.13.3 ADS1100 a2 Connections
Vin+1
DN
G2
SCL3
SDA4V
cc5
Vin-6
U24
ADS1100A1IDBVT
I2C_SCK
I2C_SDA2
C44
0.1uF
a2_Vin+
a2_Vin-
AVcc
SW5
SW6
SW7
SW8
DAC_C
DAC_D
1
2
3
4
5 6
GND7
8
9
10
11
1213
Vcc14
U30
SN74HC4066DBR
AVcc
C630.1uF
C620.1uF
I to V from LoopVo_in_ADS = (1/3)Vo_INA
3.13.4 DAC8574
I2C_SCKI2C_SDA2
C39
0.1uF
AVcc
VoutA1
VoutB2
VrefH3
Vd
d4
VrefL5
DN
G6
VoutC7
VoutD8
LDAC9
SCL10
SDA11I
VO
dd
21
A013
A114
A215
A316
U26
DAC8574
DAC, ADC, and INA
DAC_ADAC_BDAC_CDAC_D
Theory of Operation
Figure 22 shows the ADS1100 a2 external connections and self-calibration circuitry. U23 is a 16-bit,delta-sigma ADC. U30 is a self-calibration/test switch that allows the ADC to be connected either to theDAC or to GND. Note that the a2_Vin+ input is connected to U11 in the Loop and INA Supplies/4mA to20mA Switching section. Thus, U23 can be used to measure the 4mA to 20mA loop output.
Figure 22. DAC, ADC, and INA—ADS1100 a2 Connections
Figure 23 shows the DAC8574 external connections. U26 is a 16-bit DAC (DAC8574) with four outputchannels. The USB DAQ Platform communicates to U26 using I2C channel 2.
Figure 23. DAC, ADC, and INA—DAC8574
USB DAQ Platform16 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
3.14 Default Jumper Settings
3.14.1 5V
Theory of Operation
Figure 24 shows the jumper settings for the most common USB DAQ Platform configuration. This setup isthe jumper setting configuration that is shipped from the factory. In this configuration, the digital I/O, DACs,and ADCs are all referenced to 5V. This configuration also uses an external 6V dc supply to providepower for the digital I/O. It is possible to use the USB bus to power the USB DAQ Platform. However, it isnot recommended because the USB bus power is noisier than the external power supply, has limitedcurrent, and does not have the headroom required to run the 5V reference.
Figure 24. 5V Default Jumper Settings
SBOU056–March 2008 USB DAQ Platform 17Submit Documentation Feedback
www.ti.com
3.14.2 3V
Theory of Operation
Figure 25 shows the jumper settings for another typical USB DAQ Platform configuration. In thisconfiguration, the digital I/O has 3V levels and the DACs and ADCs are also referenced to 3V. Thisconfiguration uses an external 6V dc supply to provide power for the digital I/O. It is possible to use theUSB bus to power the USB DAQ Platform. However, it is not recommended because the USB bus poweris noisier than the external power supply, has limited current, and does not have the headroom required torun the 3V reference.
Figure 25. 3V Default Jumper Settings
USB DAQ Platform18 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
4 Detailed Description of Jumper SettingsDetailed Description of Jumper Settings
Table 1 to Table 7 show the detailed description of jumpers on the USB DAQ Platform. In most cases, it iseasiest to use the typical setting described in Figure 24 or Figure 25. However, for some specific cases itmay be useful to create a custom jumper setting using the information in Table 1 to Table 7.
Table 1. Power-Supply Jumper Configuration #1Mode Jumper Comment
External Power—5V JUMP17 = BUS (not used) In this mode, all power is supplied to the EVM via J5 or T3. The external(default jumper settings) JUMP13 = REG supply must be between 5.8V and 10.4V for proper operation. All digital
JUMP14 = 9V I/Os are regulated to 5V using U19 (REG101). The ADCs and DACsJUMP9 = 5V have a separate 5V reference that is derived from U37 (REF1004).JUMP1 = EXT This configuration is the default setup.JUMP2 = EXTJUMP6 = 5VJUMP7 = REF
External Power—3V JUMP17 = BUS (not used) In this mode, all power is supplied to the EVM via J5 or T3. The external(typical jumper settings) JUMP13 = REG supply must be between 5.8V and 10.4V for proper operation. All digital
JUMP14 = 9V I/Os are regulated to 3V using U19 (REG101). The ADCs and DACsJUMP9 = 3.3V have a separate 3V reference that is derived from U37 (REF1004).JUMP1 = EXT This configuration is very common. It is the same as the default, exceptJUMP2 = EXT that it uses a 3V supply and reference.JUMP6 = 3VJUMP7 = REF
External Power—Variable JUMP17 = Vraw In this mode, all the digital I/Os are referenced to the supply that isSupply JUMP13 = BUS attached to either J5 or T3.
JUMP14 = 9V (not used)JUMP9 = 5V (not used)JUMP1 = EXT CAUTIONJUMP2 = EXTJUMP6 = 5V (not used) It is absolutely critical that theJUMP7 = REG (ratiometric supply voltage does notmode) exceed 5.5V in this mode.
The supply is directly applied to devices with 5.5V absolute maximumratings. This mode of operation is useful when a device supply otherthen 3.0V or 5.0V is required. Note that the ADCs and DACs for thiscase are configured in ratiometric mode only.
Table 2. Power-Supply Jumper Configuration #2Mode Jumper Comment
Bus Power—5V JUMP17 = BUS In this mode, the USB bus completely powers the EVM. The USB bus isJUMP13 = BUS regulated by the master (computer) to be 5V. This mode relies uponJUMP14 = 9V (not used) external regulation. The ADCs and DACs also use 5V as the reference.JUMP9 = 5V (not used) This mode is recommended only when an external 9V supply is notJUMP1 = BUS available. If an external 9V supply is available, use either External PowerJUMP2 = BUS 5V mode or External Power 3V mode.JUMP6 = 5V (not used)JUMP7 = REG (ratiometricmode, 5V supply)
Bus Power—3V JUMP17 = BUS (not used) In this mode, the USB bus completely powers the EVM. The regulatorJUMP13 = REG (U19, REG101) is used to generate a 3V supply for all digital I/O. TheJUMP14 = BUS ADCs and DACs also use 3V as the reference.JUMP9 = 3.3VJUMP1 = BUSJUMP2 = BUSJUMP6 = 3VJUMP7 = REG (ratiometricmode, 5V supply)
SBOU056–March 2008 USB DAQ Platform 19Submit Documentation Feedback
www.ti.com
Detailed Description of Jumper Settings
Table 3. Address SelectAddress
(Product ID or PID) Jumper Setting CommentJUMP4 = L0x1234 This address is the default.JUMP5 = LJUMP4 = L0x1235 JUMP5 = LJUMP4 = L0x1236 JUMP5 = LJUMP4 = L0x1237 JUMP5 = L
Table 4. EEPROM JumpersJumper Setting Comment
This position is the default setup for USB DAQ Platform users. This position allows the TUSB3210JUMP3 = EE On microcontroller to load the USB DAQ Platform firmware upon power-up or reset. The other(default) position (EE Off) is used for development or firmware update.This position disconnects the EEPROM from the TUSB3210 microcontroller. This mode ofoperation allows new firmware to be loaded from the host computer to the USB DAQ PlatformJUMP3 = EE Off using the Texas Instruments Apploader driver (SLLC160). Note that this mode of operation is onlyused during firmware development.
JUMP10 = WP On Prevents accidental overwrite of the firmware (normal position).JUMP10 = WP Off Allows for writing new firmware (normally done at factory).
EE On is the default position. This jumper is typically only used in factory EEPROM programming. In orderto write new firmware into the EEPROM, the USB DAQ Platform must be connected to the host computerwith the jumper in the EE Off position. Once the USB device has been detected, the jumper position mustbe changed to the EE On position. After the jumper position is changed, the EEPROM Burner softwaremay be used to copy new firmware onto the USB DAQ Platform.
The following procedure describes the procedure for programming the EEPROM:1. JUMP3 = EE Off, JUMP10 = WP Off.
a. Connect power.b. Connect the USB cable.c. Press the reset button.
2. JUMP3 = EE On, JUMP10 = WP Off.a. Program the EEPROM.
3. JUMP3 = EE On, JUMP10 = WP On.a. Press the reset button.b. The programming procedure is complete. Test the module.
USB DAQ Platform20 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
Detailed Description of Jumper Settings
Table 5. One-Wire Speed-Up JumperJumper Setting CommentJUMP8 = GND One-Wire speed-up circuit disabled.
One-Wire speed-up circuit enabled. The speed-up circuit connects a 10µF capacitor via a 200ΩJUMP8 = SPD_UP pull-up resistor to the one-wire line when making a low-to-high transition. This connection helps
(default) shorten the rise time when talking across long communication lines. In general, this is therecommended operating mode and the default position.
Table 6. VCC/VDUT JumperJumper Setting Comment
The digital output (CTRL1 to CTRL8) pull-up resistor is connected to VDUT, a switched powersupply of 3V or 5V. This mode of operation is most useful when the digital outputs are connectedJUMP18 = VDUT directly to the device under test (DUT). Thus, if the DUT power supply is turned off, the digitalsignals connected to the DUT are also turned off.The digital output (CTRL1 to CTRL8) pull-up resistor is connected to VCC, a constant powersupply of 3V or 5V. This mode of operation is most useful when the digital outputs are connected
JUMP18 = VCC to control circuitry that must remain configured regardless of the DUT supply status. For example,this mode would be used when an analog multiplexer is connected to the DUT, and the DUTpower must be cycled without affecting the multiplexer configuration.
Table 7. Calibration EEPROM JumperJumper Setting Comment
JUMP11 = WP_On Prevents accidental overwrite of calibration constants (default position).JUMP11 = WP_Off Allows rewriting of calibration constants (recalibration).
SBOU056–March 2008 USB DAQ Platform 21Submit Documentation Feedback
www.ti.com
4.1 Connector Definition
Power
Connection
Hand-Wired
Power
Connection
±15V
Power
SupplyVLOOP
Supply
Reset
Button
I C, SPI,2
One-Wire, and
Analog Female
25-Pin DSUB
General-Purpose
I/O, SPI, and I C2
Detailed Description of Jumper Settings
Figure 26 gives a functional description of the different connectors on the USB DAQ Platform.
Figure 26. Connector Definition
USB DAQ Platform22 SBOU056–March 2008Submit Documentation Feedback
www.ti.com
4.2 Signal Definition of J3 (25-Pin Female DSUB)Detailed Description of Jumper Settings
Table 8 shows the different signals connected to J3 on the USB DAQ Platform, and gives a description ofeach signal.
Table 8. Signal Definition of J3 (25-Pin Female DSUB)Pin on J1 Signal Description
1 DAC A 16-bit string DAC output (1 of 4)2 DAC B 16-bit string DAC output (2 of 4)3 DAC C 16-bit string DAC output (3 of 4)4 DAC D 16-bit string DAC output (4 of 4)5 ADS1+ 16-bit delta-sigma converter positive input (1 of 2)6 ADS1– 16-bit delta-sigma converter negative input (1 of 2)7 ADS2+ 16-bit delta-sigma converter positive input (2 of 2)8 ADS2– 16-bit delta-sigma converter negative input (2 of 2)9 I2C_SCK I2C clock signal (SCL) channel 110 I2C_SDA2 I2C data signal (SDA) channel 111 ONE_WIRE One-Wire digital interface (UART-type interface)12 I2C_SCK_ISO I2C clock signal (SCL) channel 1 – can be disconnected using a switch13 I2C_SDA_ISO I2C data signal (SCL) channel 1 – can be disconnected using a switch14 XTR_LOOP+ Supplies power for a 4mA to 20mA loop15 XTR_LOOP– Return for power for a 4mA to 20mA loop. Current is measured using an INA128.16 INA– Connection to negative input of INA128 for future use.
Switched 3V or 5V power. Note that when power is switched off, the digital I/O is also17 VDUT switched off.This supply is the same voltage as VDUT, but is not switched. For example, if VDUT =18 VCC 3V, then VCC =3V; however, VCC does not change when VDUT is turned off.Supply for INA128. This device is only used to measure the 4mA to 20mA loop. If the19 +15V 4mA to 20mA loop is not used, this supply is not required.Supply for INA128. This device is only used to measure the 4mA to 20mA loop. If the20 –15V 4mA to 20mA loop is not used, this supply is not required.
21 GND Common or ground connection for power.22 SPI_SCK SPI clock signal for channel 123 SPI_CS1 SPI chip select for channel 124 SPI_DOUT SPI data output for channel 125 SPI_DIN1 SPI data input for channel 1
SBOU056–March 2008 USB DAQ Platform 23Submit Documentation Feedback
www.ti.com
4.3 Signal Definition of J4 (25-Pin Male DSUB)Detailed Description of Jumper Settings
Table 9 shows the different signals connected to J4 on the USB DAQ Platform and gives a description ofeach signal.
Table 9. Signal Definition of J4 (25-Pin Male DSUB)Pin on J1 Signal Description
1 NC No connection2 CTRL1 Digital output or control line (1 of 8)3 CTRL2 Digital output or control line (2 of 8)4 CTRL3 Digital output or control line (3 of 8)5 CTRL4 Digital output or control line (4 of 8)6 CTRL5 Digital output or control line (5 of 8)7 CTRL6 Digital output or control line (6 of 8)8 CTRL7 Digital output or control line (7 of 8)9 CTRL8 Digital output or control line (8 of 8)10 MEAS1 Digital input or measure line (1 of 8)11 MEAS2 Digital input or measure line (2 of 8)12 MEAS3 Digital input or measure line (3 of 8)13 MEAS4 Digital input or measure line (4 of 8)14 MEAS5 Digital input or measure line (5 of 8)15 MEAS6 Digital input or measure line (6 of 8)16 MEAS7 Digital input or measure line (7 of 8)17 MEAS8 Digital input or measure line (8 of 8)18 SPI_SCK SPI clock for channel 2 (note this signal is shared for both channels)19 SPI_CS2 SPI chip select for channel 220 SPI_DOUT2 SPI data output for channel 221 SPI_DIN2 SPI data input for channel 2
Switched 3V or 5V power. Note that when power is switched off, the digital I/O is also22 VDUT switched off.This supply is the same voltage as VDUT, but is not switched. For example, if VDUT = 3V,23 VCC then Vcc =3V; however, VCC does not change when VDUT is turned off.
24 GND Common or ground connection for power25 GND Common or ground connection for power
24 USB DAQ Platform SBOU056–March 2008Submit Documentation Feedback
www.ti.com
5 Bill of MaterialsBill of Materials
Table 10 shows the parts list.
Table 10. Bill of MaterialsQty Value Ref Des Description Vendor Part Number
Panasonic -1 15kΩ R1 RES 15.0K OHM 1/16W 1% 0603 SMD ERJ-3EKF1502VECG
1 22kΩ R2 RES 22.0K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-0722KL
Panasonic -2 100kΩ R5, R8 RES 100K OHM 1/16W 1% 0603 SMD ERJ-3EKF1003VECG
R6, R7, R26,5 10kΩ RES 10.0K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-0710KLR33, R34
2 33Ω R3, R4 RES 33.0 OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-0733RL
1 1MΩ R27 RES 1.00M OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-071ML
1 1.5kΩ R13 RES 1.50K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-071K5L
R30, R46, R47,R48, R49, R50,11 10Ω RES 10.0 OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-0710RLR51, R52, R53,
R54, R55
R10, R12, R14,4 510Ω RES 510 OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-07510RLR31
1 1.2kΩ R29 RES 1.20K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-071K2L
3 200Ω R36, R37, R60 RES 200 OHM 1/4W 1% 1206 SMD Yageo America RC1206FR-07200RL
2 200Ω R25, R35 RES 200 OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-07200RL
2 15.8kΩ R38, R39 RES 15.8K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-0715K8L
2 18.2kΩ R40, R41 RES 18.2K OHM 1/10W 1% 0603 SMD Vishay/Dale CRCW060318K2FKEA
Yageo1 11.5kΩ R42 RES 11.5K OHM 1/10W 1% 0603 SMD RC0603FR-0711K5LCorporation
1 200kΩ R15 RES 200K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-07200KL
2 2.4kΩ R9, R28 RES 2.40K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-072K4L
R22, R23, R24,5 4.7kΩ RES 4.70K OHM 1/10W 1% 0603 SMD Yageo America RC0603FR-074K7LR43, R61
Panasonic -1 24kΩ 0.1% R11 RES 24K OHM 1/16W .1% 0603 SMD ERA-3YEB243VECG
1 2kΩ R56 RES 2.00K OHM 1/10W 1% 0603 SMD Vishay/Dale CRCW06032K00FKEA
3 4.99kΩ R32, R44, R57 RES 4.99K OHM 1/10W 1% 0603 SMD Vishay/Dale CRCW06034K99FKEA
1 7.5kΩ 0.1% R19 RES 7.5K OHM 1/16W .1% 0603 SMD Vishay/Dale ERA-3YEB752V
1 24.9kΩ 0.1% R17 RES 24.9K OHM 1/10W .1% 0603 SMD Rohm RG1608P-2492-B-T5
1 150Ω 0.1% R18 RES 150 OHM 1/4W 0.1% 1206 Yageo America TNPW1206150RBEEA
Panasonic -1 20kΩ 0.1% R16 RES 20K OHM 1/16W .1% 0603 SMD ERA-3AEB203VECG
Panasonic -1 10kΩ 0.1% R45 RES 10K OHM 1/16W .1% 0603 SMD ERA-3AEB103VECG
3 1kΩ R21, R59, R58 RES 1.00K OHM 1/10W 1% 0603 SMD Vishay/Dale CRCW06031K00FKEA
1 1MΩ R20 RES 1.00M OHM 1/4W 1% 1206 SMD Yageo America RC1206FR-071ML
RN1, RN2, CTS4 4.7kΩ RES ARRAY 4.7KOHM 10TRM BUSS SMD 746X101472JPRN3, RN4 Corporation
C22, C23, C54, CAPACITOR TANT 4.7UF 25V 10% SMD AVX4 4.7µF T491C475K025ATC55 6032-28 (EIA) Corporation
SBOU056–March 2008 USB DAQ Platform 25Submit Documentation Feedback
www.ti.com
Bill of Materials
Table 10. Bill of Materials (continued)Qty Value Ref Des Description Vendor Part Number
C1, C2, C3, C4,C5, C6, C7, C8,C9, C10, C11,C14, C15, C16,C17, C18, C19,C20, C21, C34,C35, C36, C37,C38, C39, C41,50 0.1µF CAP .10UF 25V CERAMIC Y5V 0603 Kemet C0603C104M3VACTUC42, C43, C44,C45, C46, C47,C48, C49, C50,C51, C52, C53,C58, C60, C61,C66, C67, C68,C69, C27, C13,C28, C62, C63
1 220pF C31 CAP 220PF 50V CERAMIC X7R 0603 10% Yageo America CC0603KRX7R9BB221
C12, C40, C56, Panasonic -5 1µF CAP 1UF 25V CERAMIC 0603 X5S ECJ-1V41E105MC57, C59 ECG
3 10µF C24, C33, C65 CAP TANTALUM 10UF 25V 20% SMD EPCOS Inc B45196H5106M309
AVX1 150µF C32 CAP TANTALUM 150UF 10V 10% SMD TAJC157K010RCorporation
Panasonic -1 0.033µF C64 CAP 0.033uF 25V CERM X7R 0603 ECJ-1VB1E333KECG
2 22pF C25, C26 CAP CERAMIC 22PF 50V NP0 0603 Yageo America CC0603JRNPO9BN220
2 0.01µF C70, C71 CAP CERAMIC .01UF 500V X7R 1206 Kemet C1206C103KCRACTU
Texas1 U1 IC 3.3V 150MA LDO REG SOT-23-5 TPS76333DBVTInstruments
Texas1 U2 IC USB CNTRLR STORAGE 64-LQFP TUSB3210PMInstruments
U3, U4, U11, Texas6 IC HEX BUFF/DRV W/OD 14-SSOP SN74LV07ADBRU22, U33, U34 Instruments
Texas2 U9, U10 IC SERIAL EEPROM 64K 2.5V 8-SOIC 24LC64-I/SNInstruments
Texas2 U5, U7 IC OCT BUFF/DRVR TRI-ST 20-SSOP SN74LVTH541DBRInstruments
Texas3 U8, U25, U35 IC OCT D-TYPE F-F W/CLR 20-SSOP SN74HC273DBRInstruments
Texas1 U20 IC 16BIT SELF-CALIB ADC SOT23-6 ADS1100A0IDBVTInstruments
Texas1 U24 IC 16BIT SELF-CALIB ADC SOT23-6 ADS1100A1IDBVTInstruments
Texas2 U19, U36 IC LDO REG ADJ 100MA 8-SOIC REG101UA-AInstruments
Texas1 U18 IC DUAL MULTIVIBRATR MON 16TSSOP CD74HC221PWRInstruments
U13, U14, U15, Texas6 IC BILATERL ANALOG SWTCH SOT23-5 SN74LVC1G66DBVRU21, U31, U41 Instruments
U16, U6, U12, Texas4 IC BUFF/DRVR W/OD OUT SOT-23-5 SN74LVC1G07DBVRU44 Instruments
Texas1 U17 IC GP LV COMPARATOR SOT-23-5 LMV331IDBVRInstruments
Texas1 U26 IC DAC V-OUT QUAD LP 16-TSSOP DAC8574IPWInstruments
Texas2 U23, U27 IC ANALOG SWITCH 5V SOT23-5 MAX4596DBVRInstruments
Texas1 U37 IC LDO VOLT REF 2.048V SOT23-6 REF3220AIDBVTInstruments
Texas1 U39 IC LDO VOLT REF 3.0V SOT23-6 REF3230AIDBVTInstruments
Texas2 U40 IC OPAMP 1.8V 0-DRIFT SOT23-5 OPA333AIDBVTInstruments
26 USB DAQ Platform SBOU056–March 2008Submit Documentation Feedback
www.ti.com
Bill of Materials
Table 10. Bill of Materials (continued)Qty Value Ref Des Description Vendor Part Number
Texas3 U29, U30, U38 IC QUAD BI-LAT ANALOG SW 14-SSOP SN74HC4066DBRInstruments
Texas1 U28 IC SCHMITT-TRIG BUFF SOT-23-5 SN74LVC1G17DBVRInstruments
Texas1 U32 IC LP INSTRUMENTATION AMP 8 SOIC INA128UInstruments
Panasonic2 U42, U43 RELAY OPTO DC 60V 600MA 6-SMD AQV102AElectric Works
Epson MA-5051 12MHz XTL1 CRYSTAL 12.0000MHZ 18PF SMD Electronics 12.0000M-C0:ROHSAmerica Inc
Keystone1 J1 CONN SOCKET USB B-TYPE HORZ 924Electronics
3-Position Terminal Strip, Cage Clamp, 45°, On-Shore1 T2 ED300/315A, Dove-tailed Technology Inc
2-Position Terminal Strip, Cage Clamp, 45°, On-Shore2 T1, T3 ED300/215A, Dove-tailed Technology Inc
CONN D-SUB PLUG R/A 25POS 30GOLD AMP/Tyco1 J4 5747842-4(With Threaded Inserts and Board locks) Electronics
CONN D-SUB RCPT R/A 25POS 30GOLD AMP/Tyco1 J3 5747846-4(With Threaded Inserts and Board locks) Electronics
1 J5 CONN AUDIO JACK 3.5MM MONO CUI Inc MJ-3536NG
4 D1, D7, D6, D8 Ultra Bright Red Diffused LED, 0603 pkg Panasonic LNJ208R8ARA
Diodes3 D2, D3, D4 SOT-23 Switching Diode, 300mS, 75V MMBD4148-7-FIncorporated
D9, D11, D15, ON4 TVS ZENER UNIDIR 600W 6.8V SMB P6SMB6.8AT3GD16 Semiconductor
D5, D10, D12, Zetex5 SOT-23 Schottky Diode, 500mA, 40V ZHCS500D13, D14 Semiconductor
Fairchild2 Q1, Q2 TRANSISTOR GP NPN AMP SOT-23 MMBT4401Semiconductor
30V P-Channel Enhancement Mode MOSFET, Zetex1 Q3 ZXMP3A17E6SOT23-6 Semiconductor
1 Q4 TRANS PNP 40V 350MW SMD SOT-23 Diodes Inc MMBT4403-7-F
4 F1, F3, F4, F5 FERRITE 300MA 600 OHM 0603 SMD Steward HZ0603C601R-10
2 L2, L3 INDUCTOR MULTILAYER 150UH 1210, 85mA Panasonic NLCV32T-151K-PF
Alcoswitch/Tyco1 SW1 SWITCH TACT 6MM SMD GULL WING FSM2JSMAElectronics
TP1,TP4 TP24,TP25, TP26,TP27, TP28,TP29, Avcc, CONN HEADER .100 SNGL STR 36POS (cut19 3M/ESD 929647-09-36-IVraw, Vreg_in, into single position test points)
Vcc, Vdut, 3.3V,GND, 5V_USB,SDA, SCL, TP4
JUMP1,JUMP2,JUMP3,JUMP4,JUMP5,JUMP6,JUMP7, CONN HEADER .100 SNGL STR 36POS (cut15 JUMP8, 3M/ESD 929647-09-36-Iinto three position Jumpers)JUMP9,JUMP10,JUMP11,JUMP13,JUMP14,JUMP17,JUMP18
SBOU056–March 2008 USB DAQ Platform 27Submit Documentation Feedback
www.ti.com
Bill of Materials
Table 10. Bill of Materials (continued)Qty Value Ref Des Description Vendor Part Number
Jumpers forJUMP1,JUMP2,JUMP3,JUMP4,JUMP5,JUMP6,JUMP7, AMP/Tyco15 Jumper Shorting Units 881545-2JUMP8, ElectronicsJUMP9,JUMP10,JUMP11,JUMP13,JUMP14,JUMP17,JUMP18
Standoffs, Hex , 4-40 Threaded, 0.500" length, Keystone7 NA 2203K-ND0.250" OD, Aluminum Iridite Finish Electronics
Building7 NA SCREW MACHINE PHIL 4-40X1/4 SS PMSSS 440 0025 PHFasteners
2 NA PCB EXTRACTOR Bivar 1001-062
2 NA PIN FOR PCB EXTRACTOR Bivar RP-250
28 USB DAQ Platform SBOU056–March 2008Submit Documentation Feedback
EVALUATION BOARD/KIT IMPORTANT NOTICETexas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.
FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.
EVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of 5.7V (min) to 9V (max) and the output voltage range of 0V (min) to 5V(max). A ±15V supply for the loop measurement circuit and a 15V to 40V floating supply for the current loop power are required for thecurrent loop configuration only.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than +25°C. The EVM is designed to operateproperly with certain components above +25°C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2008, Texas Instruments Incorporated
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandClocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrolInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyRF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated
