US stavelet update

12th April 2013

PPB2s on serial power side

12 Apr 2013 2

YX

BC

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G N D 11

IO2

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P IO B4

G N D 25

P IO A6

FG

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R 210 0 k

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C O N N S O C K E T 1 9 x 2

24681 01 21 41 61 82 02 22 42 62 83 03 23 43 63 8

13579

1 11 31 51 71 92 12 32 52 72 93 13 33 53 7

J24

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J25

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TL2

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IRRADIATED

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J22SP In Hybrid B

1

J21

SP Out Hybrid B

1

J 2 6 Litz Pad1

SP-H1SP+H1

SP-BSP+B

SP+H2SP-H2

D a ta V p l

R100

R 80

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SAMTEC connector (floating)

Bond pad (connected to EoS through WB + bus tape conductor)

SAMTEC U2-U2B (irradiated FETs)D1 zenerTrace + WB

PPB2s issue In addition to that connection (present in all modules), W-shunt was enabled (missing

wire bond) in one of the hybrids of module 2, and the voltages on the 1-wire circuit were not correct the very first time the stavelet was powered

The FETs on the PPB2 of module 2 fried, and the PCB itself was damaged (probably acted as a fuse…) Removed undesired wirebonds on all modules, so that the connection was really floating Loaded a new PPB2 and replaced it

Everything works fine after that:

ΔV = 90-120 mV across disabled modules

12 Apr 2013 3

ΔV = 117mV

All enabled M2 disabled

ENC noise @ 1fC (after trimrange)

12 Apr 2013 4

Hybrid 56

Hybrid 55

Hybrid 58

Hybrid 57

Hybrid 60

Hybrid 59

Hybrid 62

Hybrid 61

M3 M2 M1 M0

Comparable (or even better) to CoM with PI filter boards

Double trigger noise

Even hybrids always worse (also true for ENC), but results still quite good, except an ugly hybrid 58

What’s new: Extra 10 μF caps between BCC (hybrid) GND and data

shield (total = 10.1 μF) Al shielded module: Reference between hybrids made

through metal pieces in between hybrids rather than Al shield and Cu square

Pretty fresh result, I still have to look further into this

12 Apr 2013 5

Thr. value Module 3 Module 2 Module 1, Al shielded Module 0

Hybrid 55 56 57 58 59 60 61 62

1 fC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

0.75 fC 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

0.5 fC 6 3 32 38 10 7 355 647 19 17 82 43 1 5 46 26

Sensor on module 1 (Al shield) Strange behavior (at least for me) on sensor of module 1 of SP side (FZ1, module SC-02,

Al shielded module) Leakage current at 200 V (and chips power ON) stays < 0.26 μA for a couple of minutes, then

starts rising slowly, until it stabilizes at around 4-6 μA After some time (~50 min) it starts going down again very slowly

Cooling is ON all the time It doesn’t happen at all when the chips power is OFF → “thermal runaway”? (although nothing

evident from thermal images) It doesn’t happen while keeping V < 180V Started right after having the PPB2 boards working, before then I ~ 0.25 μA at 200 V (stable)

12 Apr 2013 6

Cur

rent

(μA

)

Time (s)

V=200 VMeasurement taken during strobedelay + 3pointgain + trimrange

New firmware versions Checked Matt’s new firmware versions with top and bottom streams of HSIO-IB

enabled: v4192 (no streams on IDC connector)

• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK

v4194 (no streams on IDC connector)• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK

v419e (no streams on IDC connector)• Streams 0-15 (top) → OK• Streams 64-79 (bottom) → OK

Firmware is ready for double sided stavelet tests with a single HSIO!

12 Apr 2013 7

Next

HV power with root/sctdaq Get rid of Labview HV controller: requires too many PC resources, slows down

sctdaq significantly

Simultaneous readout of both stavelet sides First with 2 HSIO + 2 PCs + 2 sctdaq, later with single HSIO and PC

Noise injection on pulsing lines (JP14 differential data lines on EoS, Noise-P-M streams on 50 pin SAMTEC, next to BCO lines) An extra macro on sctdaq will do, or do I also need to modified firmware? Also asynchronous noise injection? Shielded vs. shieldless modules: “final” test

12 Apr 2013 8