Ultrasound Sensing Technologies 2020

From Technologies to Markets

© 2020

Ultrasound Sensing

Technologies 2020

Market & Technology

Report 2020

Sample

2Ultrasound Sensing Technologies 2020 | Sample | www.yole.fr | ©2020

GLOSSARIES

• ADAS Advanced Driver Assistance System

• AGRS Automotive Gesture RecognitionSystem

• AlN Aluminum Nitride

• AR/VR Augmented Reality/Virtual Reality

• ASIC Application Specific IntegratedCircuit

• CAGR Compound Average Growth Rate

• CMOS Complementary Metal OxideSemiconductor

• CMUT Capacitive Micromachined UltrasonicTransducer

• CSD Chemical Solution Deposition

• DC Direct Current voltage

• DOF Degree of Freedom

• DRIE Deep-Reactive Ion Etching

• HIFU High Intensity Focused Ultrasound

• IR Infrared

• IVUS Intravascular Ultrasound

• LiDAR Light Detection and Ranging

• LZT Lead Zirconate Titanate

• OEM Original Equipment Manufacturer

• MEMS MicroElectroMechanical System

• NED Nano e-Drive

• NDT Non Destructive Testing

• PCB Printed Circuit Board

• POC Point of Care

• PMUT Piezoelectric MicromachinedUltrasonic Transducer

• PVD PhysicalVapor Deposition

• PZT Lead Zirconate Titanate

• RoHS Restriction of HazardousSubstances

• SEM Scanning Electron Microscope

• TFT Thin Film Transistor

• ToF Time of Flight

• TSV Through Silicon Via

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Some definitions on terms we are using in this report:

Ultrasound transducers (or sensors): Devices that generate or sense ultrasound energy. They can be divided in 3main catogories – Transmitters, receivers and transceivers.

• Transmitters:convert electrical signal into ultrasound

• Receivers; convert ultrasound into electrical signal

• Transceivers:both transmit and receive ultrasound

Bulk piezoelectric transducer: a piece of crystal or ceramic with piezoelectric properties. The piezo element ismechanically processed or micromachined to get the desired frequencies

MUT (micromachined ultrasound transducers): MEMS based ultrasonic transducers based on silicon substrate and usingsemiconductor processes for manufacturing.These transducers could be divided in two main principles: CMUT & PMUT.

CMUT (capacitive micromachined ultrasound transducer): MEMS-based ultrasonic transducers using siliconmicromachining techniques. The deposition of a membrane suspended on the top of a cavity forms the top electrode andthe silicon substrate serves as the bottom electrodes. The principle is based on the changed of capacitance creating theenergy transduction.

PMUT (piezoelectric micromachined ultrasound transducer): MEMS-based ultrasonic transducer using piezoelectricthin-film deposition to create a moving membrane on top of a cavity. The principle is based on the piezoelectric effectcreating the energy transduction.

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DEFINITION

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The main technology used for ultrasound sensing is the bulk piezoelectric transducer, but there is atrend to move to semiconductor technologies such as CMUT and PMUT.

ULTRASOUND TRANSDUCER TECHNOLOGIES

Bulk piezoelectric transducers CMUT transducers PMUT transducers

Image: Yongqiang Qiu et al., Sensors 2015, 15(4), 8020-8041

Main technology

todayApplications in medical imaging

Applications in medical monitoring,

fingerprinting and gesture recognition

• MEMS process (sacrificial layer)

• Materials: Silicon, SOI…

• MEMS process (PZT deposition by Sol-Gel or

Sputtering)

• Materials: PZT, AlN…

• Bulk ceramic processing

• Materials: Piezoelectric ceramics

(PZT, LiNbO3, PT, PMN,…)


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• Glossary and definition 2

• Definitions 3

• Table of contents 5

• Report objectives 7

• Report scope 8

• Report methodology 10

• About the authors 11

• Companies cited in this report 12

• What we got right, what we got wrong 13

• 3-page summary 14

• Yole Group related reports 17

• Executive summary 19

o Why this report

o Summary of report information

• Context 58

o Ultrasound technologies, applications, and history

o Yole Développement’s segmentation of the ultrasound market

o Introduction to ultrasound transducer technologies:

✓ Bulk piezoelectric, CMUT and PMUT

✓ Report scope

o COVID-19 pandemic impact


TABLE OF CONTENTS

Part 1/2

• Market forecasts 70

o End system market forecast 2019-2025 (in million units)

✓ Smartphones

✓ Automotive

✓ Medical

o Economical and technical segmentation

o Ultrasound modules forecast 2019-2025, by applications, (in $M, million units)

o Market data comparison with 2018 report

o Ultrasound modules forecast 2019-2025, by technologies (in $M, million units)

o MUT penetration over bulk piezoelectric technologies

o Drivers for ultrasonic sensing

• Market trends 89

o Market drivers, technical requirements, economic requirements / application

✓ Medical

✓ Automotive

✓ Industrial

✓ Consumer

• Market shares and supply chain 150

o Medical player landscape and market shares

o Automotive player landscape and top players

o Industrial player landscape

o Consumer landscape and top players

o Medical supply chain

o PMUT & CMUT players

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TABLE OF CONTENTS

Part 2/2

• Technology trends 165

o Introduction on ultrasound technologies

o Bulk devices focus

o CMUT devices focus

o PMUT devices focus

o Integration and assembly

o Technology trend analysis and roadmaps

• Reverse Costing® - Structure, Process and Cost analyses 226

o Butterfly IQ probe CMUT – Butterfly Network

o Time-of-flight sensor PMUT – TDK Chirp

• Outlooks 229

o Conclusions

o What is coming next? What could happen?

• How to use our data? 232

• About Yole Développemet 233

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This is Yole Développement’s updated report on ultrasound sensing technologies formedical, industrial, automotive and consumer applications.

Report objectives:

• Provide forecast metrics for each ultrasound sensing module:

o Ultrasound market revenue and volume shipment forecasts at the system level for various industries(consumer,medical, industrial, automotive)

o Ultrasound modules revenue forecast,volume shipments forecast

o Technology penetration rates:CMUT and PMUT technologies vs.bulk piezo

• Deliver an in-depth understanding of the ecosystem and players:o The key players from the various areas: foundry,transducer, packaging,system level integrator, etc.

o The key suppliers,and the technologies they provide

• Share key technical insights and analyses on expected technology trends and challenges

o The industry’s state-of-the-art technologies

o Dynamics of key technologies

o Emerging technologies and roadmaps

REPORT OBJECTIVES


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ULTRASOUND TECHNOLOGIES

Scope of the report (1/2)

Are your needs

beyond this

report’s scope?

Contact us for a custom:

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ULTRASOUND TECHNOLOGIES

Scope of the report (2/2)

User interface

Consumer

Automotive

Industrial

Medical

Ultrasonography

Fingerprint

sensing Nondestructive testing

Automation

Gesture

recognition

ADAS

Endoscopic ultrasound

Intravascular ultrasound


Ultrasound is used in a variety of applications ranging from consumer markets to medical markets as well as automotive and industrial. We are covering all these applications in this report with a special focus on the penetration of semiconductor technologies in transducers: CMUT (capacitive micromachined ultrasonic transducers), and PMUT (piezoelectric micromachined ultrasonic transducers).

WearablesVR headset

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METHODOLOGIES & DEFINITIONS

Market

Volume (in Munits)

ASP (in $)

Revenue (in $M)

Yole’s market forecast model is based on the matching of several sources:

Information

Aggregation

Preexisting

information

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Alexis Debray, PhD

Dr. Alexis Debray is a Technology & Market Analyst, Optoelectronics at Yole Développement (Yole). As a member of the Photonics, Sensing & Display

division, Alexis is currently engaged in the development of technology & market reports as well as custom consulting projects dedicated to the imaging

industry. After spending 2 years at the University of Tokyo to develop an expertise focused on MEMS technologies, Alexis served as a research

engineer at Canon Inc. Over 15 years he contributed to numerous developmental projects, focused on MEMS devices, lingual prehension, and

terahertz imaging devices. Alexis is the author of various scientific publications and patents. He graduated from ENSICAEN and holds a PhD in applied

acoustics.

Email: [email protected]

Jérôme Mouly

Jérôme Mouly is Team Lead Analyst in the Sensing & Actuating team within the Photonic & Sensing Division at Yole Développement (Yole). Jérôme

manages the expansion of the technical expertise and market know-how of the team. He actively supports and assists in the development of a

dedicated collection of market & technology reports as well as custom consulting projects. He has conducted more than 100 marketing and

technological analyses for industrial groups, start-ups, and institutes in the field of MEMS and sensing technologies. Jérôme has been also deeply

engaged in Yole's finance activities with a dedicated focus on the commercial exploitation of smart system technologies and access to funding

opportunities. Jérôme is regularly involved in international conferences, with presentations and keynotes. Jérôme Mouly earned a Master of Physics

degree from the University of Lyon (FR).



Biographies & contacts

ABOUT THE AUTHORS

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ABB, Anden, Apple, ASTI, BenQ, Baumer, Blatek, Bosch, Boston Scientific, Butterfly Network, Canon, Caresono, Carestream, Carewell, CEA Léti, Ceramtec,, TDK Chirp Microsystems,

Chison, CK Electronic, Clarius Mobile Health, Continental, Cortex Technology, Denso, DTU, Dwyer, Egistec, Endress Hauser, Esaote, Exact Imaging, Exo Imaging, Fraunhofer, Fuji Ceramics corp., Fujifilm Dimatix, Fujitsu, Fukuda Denshi, GE Healthcare, GlobalFoundries, GlobalMed,

Goodix, Healcerion, Hitachi, Holitech, Hologic, Huawei, Hyundai, Idex, Imasonic, Infineon, Infraredx, Kaixin, Kejian, Keyence, Kistler, Kolo Medical, Konica Minolta, Kyocera, Meggitt, Micralyne, Microsoft, Mindray, Mistras, Mitsubishi Electric, MobiSante, Muramoto Group,

Murata, Neato, Next Biometrics, NGK-NTK, NIT, Novosound, Oldelft Ultrasound, Olympus, Omron, OxiTechnology, Pentax Hoya, Pepperl Fuchs, PI, Philips, Philips Innovation Services, Prometheus, Qualcomm, Rohm Semiconductor, Samsung, Schneider Electric, Senix, Sentons,

Sick, Siemens, Silead, Silex, Silicon Sensing, Silterra, Sintef, SIUI, Smartisan, Sonatest, Sonavation, Sonic Concepts, SonoScape, Sonosite, SonoStar, Sonotron NDT, SPTS, STMicroelectronics,

Supersonic, Synaptics, TDK Epcos, TDK Invensense, Tong Hsing Electronic Industries, Toposens, Ultrasense Systems, Ulvac, Valeo, Validity, Vega, Verasonics, Vermon, Vision, VTT,

Waymo, Whetron, Xiaomi, Zetec and many more!


COMPANIES CITED IN THIS REPORT

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What is ultrasound?

• Ultrasound is a form of energy generated by sound waves of frequencies that are inaudible for humanears, typically above 20kHz.

• Ultrasound waves can propagate into gases, liquids and solids.

• Ultrasound has a number of applications from detecting to imaging through acting / processibg:• Therapeutics and destruction (e.g.: lithotripsy, dentistry…) in the lowest ultrasound frequencies - typically

20kHz to 500kHz.

• Processing and acting (e.g.: obstacle detection, gesture recognition…) in the medium ultrasound frequencies -typical from 500kHz to 2MHz.

• Diagnostics (e.g.: medical imaging, non-destructive testing…) in the highest ultrasound frequencies - typically2MHz to 20MHz.


ULTRASOUND - INTRODUCTION

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CONVENTIONAL ULTRASOUND TECHNOLOGY

Ultrasonic device used in reflection

Ultrasonic device used in transmission

The reversible use of a piezoelectric element as an actuator

and a sensor

• Ultrasound refers to sound waves above 20KHz, the limit for detection by human ears.

• The most common materials used in ultrasound applications are piezoelectric ceramics. Among a diversity of piezo crystals, PZT is commonly used as its properties enable a broad range of applications from imaging to non-destructive testing (NDT) to destructive applications.

• Piezoelectric crystals offer a reversible technique and could be used as:

• An actuator: a voltage is applied to the crystal which moves, generating an acoustic wave

• A sensor: an acoustic wave distorts the crystal generating a voltage

• The same crystal could be used both as an actuator and sensor. Different uses are possible:

• In reflection: same transducer is used to generate and collect an acoustic signal

• In transmission: one device is used as an actuator and one as a sensor on opposing sides

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HISTORY OF ULTRASOUNDS

1794

Discovery of

ultrasounds

1917 1947 1958 1960 1980 1994 2009 2016 2017


Langevin triplet

for Sonar

Quartz ultrasound

generator

Ultrasound for

obstetrics

Metal flaw

detectors

1st generation

PMUT

1st generation

CMUT

Hitachi – Mappie

probe based on

CMUT

Fingerprint sensor

based on PMUT

PMUT based

moduleButterfly probe

based on CMUT

Discover of PZT

material

Hyperphonography,

first medical imaging system for diagnosis

Inventor: Karl Theodore Dussik,

Austria

Classical Langevin

transducer

2018

US ToF sensors

based on PMUT

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GLOBAL ULTRASOUND MARKET ANALYSIS

Market segmentation: economic and technical requirements

Bulk CMUT PMUT

less than 1

MHz1-20 MHz 20-50 MHz

less than 1


less than 1


Miniaturization

/ Low cost /

Integration

$0-$5 Fingerprint (now)

User interface

+ VR headset

(consumer)

Fingerprint (future)

$5-$100

Medical

intravascular

and

endoscopic

ultrasound

Medical

handheld

High Quality /

Reliability

ADAS

Medical cart-

based and

portable

systems

Gesture

recognition

(automotive)

$100-

$1000

AutomationNon

destructive

testing

Main

driver Target

price of

the US

module

Main technology

Frequency

For more visibility in the global market analysis the medical segment is not separated (cart-based, portable, handheld,

IVUS/endoscopy) but you can find the market analysis of this segment in the Medical Ultrasound part of the report.


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• This market analysis quantifies the ultrasound modulesmarket, hence the bulk piezoelectric, CMUT and PMUTelements.

• In this part of the report we are focusing on comparingthe ultrasound market between segments:

• Medical ultrasound (ultrasonography,IVUS, Endoscopy)

• Medical wearables

• Fingerprint sensing

• User interface (consumer)

• ADAS (automotive)

• Gesture recognition (automotive)

• Automation

• Nondestructive testing

• And between technologies:

• Bulk piezo

• CMUT

• PMUT

GLOBAL ULTRASOUND MARKET ANALYSIS

Market data and forecasts (2019-2025): Hypothesis

Systems

Probe

Ultrasound module


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2019-2025 ULTRASOUND SENSING MODULES MARKET FORECASTS BY APPLICATIONS

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MARKET TRENDS

Market trends in consumer medical, automotive, and

industrial sectors to highlight the main facts for adoption of

ultrasound technologies

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20| Ultrasound Sensing Technologies | www.yole.fr | ©2018

MEDICAL IMAGING ULTRASOUND FOCUS - ECOSYSTEM

Portable

devices

Cart-based

devices

Handheld

devices

Intravascular ultrasound

Ultrasound transducer

providers or manufacturers

Endoscopic ultrasound

Ultrasound player ecosystem from sensors to OEM system

manufacturers, supply chain and collaborations

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MUT TECHNOLOGY SUPPLY CHAIN

?

CMUT

PMUT

R&D players Design MEMS fab / foundries

Assembly and test Module / sub-system

Non exhaustive list of companies

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• A typical CMUT is made of a membrane above an aircavity or vacuum. Made using MEMS technology with asacrificial layer, the device is processed on siliconsubstrate. Electrodes are put on the top and bottom ofthe device.

• Small capacitors, organized in arrays, are mostly madeusing Silicon Nitride.

• As opposed to the conventional piezoelectrictransducers, CMUTs rely on electrostatic principles forultrasound wave generation and reception when asuperimposed DC bias and AC signal of desiredfrequency is applied

• The device is also able to receive an ultrasound signalwhich is translated into a voltage through the capacitor.

• 2 majors processing techniques are used:• Surface micromachining

• Wafer bonding

CMUT DEVICES

Introduction on CMUT

CMUT Schematic cross-section; Source: Stanford University

CMUT detail; Source: Philips Innovation Services


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23Ultrasound 2020 | Report | www.yole.fr | ©2020

PMUT TECHNOLOGIES

Piezoelectric materials for ultrasound applications

Manufacturing process

Piezoelectric material

Material type

Piezoelectric materials

Bulk piezo material

PZT

Dicing

Quartz

Dicing

Thin film piezo

deposition

PZT

SputteringPulsed laser deposition

Sol-gel

AlN

SputteringPulsed laser deposition

ALD

Polymer film

PVDF

Chemical

Mechanical process Semiconductor processChemical process

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ULTRASOUND TRANSDUCER TECHNOLOGIES

Comparison

Bulk piezoelectric

transducersCMUT PMUT

Advantages

• Well controlled technology -

experience

• No requirement for

semiconductor technologies

• MEMS technology with good

control of the production

process

• Electromechanical coupling

typically 50%

• No DC bias required

• Relatively low range of

frequency (>1kHz)

Drawbacks

• Huge complexity for high

frequency range

• Miniaturization limitations

• Power required to move the

piezo element

• High DC bias (~100V)

• High frequency range

(>200kHZ)

• Electromechanical coupling <<

50%

• Piezo material deposition

relatively complex (depending

on piezo substrate)


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ULTRASOUND TECHNOLOGIES ROADMAP - CMUT & PMUT FOCUS


2025 2030

CMUT-on-CMOSR&D

Production

CMUT on flex

Monolithic integration

(PMUT on CMOS)Fingerprint

(PMUT and CMOS)

CMUT with high-

efficiency output

CMUT

(SiN

membrane)

CMUT

2018 20202015

PMUT

(PZT)

PMUT

(AlN)

PMUT

(AlN)

PMUT

(PZT)

Courtesy of eXo Imaging

Courtesy of SilTerraCourtesy of System Plus Consulting

Courtesy of System Plus ConsultingCourtesy of Stanford UniversityCourtesy of Philips Innovation Services

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Contact our

Sales Team

for more

information

BioMEMS Market and Technology 2020

Piezoelectric Devices: from Bulk to Thin-Film 2019

Status of the MEMS Industry 2020

Consumer Biometrics: Market and Technologies Trends 2018


YOLE GROUP OF COMPANIES RELATED ANALYSES

Yole Développement

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https://www.i-micronews.com/products/biomems-market-and-technology-2020/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/piezoelectric-devices-from-bulk-to-thin-film-2019/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample


i-micronews.com/products/consumer-biometrics-market-and-technologies-trends-2018/?pk_campaign=r_ultrasound Nov2020&pk_medium=relatedreports_Sample


https://www.i-micronews.com/products/status-of-the-mems-industry-2020/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

i-micronews.com/products/consumer-biometrics-market-and-technologies-trends-2018/?pk_campaign=r_ultrasound Nov2020&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/biomems-market-and-technology-2020/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

27

Contact our

Sales Team

for more

information

Qualcomm 3D Sonic Sensor Fingerprint

Bosch Ultrasonic Sensor Teardown

Valeo Ultrasonic Sensors Teardown

Piezoelectric Material From Bulk to Thin Film – Comparison 2019

Butterfly Network iQ CMUT Ultrasonic Sensor


YOLE GROUP OF COMPANIES RELATED ANALYSES

System Plus Consulting

http://www.yole.fr/

https://www.reverse-costing.com/teardowns/valeo_ultrasonic_sensor/

https://www.i-micronews.com/products/qualcomm-3d-sonic-sensor-fingerprint/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

https://www.reverse-costing.com/teardowns/bosch_ultrasonic_sensor/

https://www.systemplus.fr/reverse-costing-reports/qualcomm-3d-sonic-sensor-fingerprint/

https://www.systemplus.fr/reverse-costing-reports/piezoelectric-material-from-bulk-to-thin-film-comparison-2019/

https://www.reverse-costing.com/teardowns/valeo_ultrasonic_sensor/

https://www.systemplus.fr/reverse-costing-reports/piezoelectric-material-from-bulk-to-thin-film-comparison-2019/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

https://www.reverse-costing.com/teardowns/bosch_ultrasonic_sensor/

hthttps://www.i-micronews.com/products/butterfly-network-iq-cmut-sensor/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

hthttps://www.i-micronews.com/products/butterfly-network-iq-cmut-sensor/?pk_campaign=r_ultrasound%20Nov2020&pk_medium=relatedreports_Sample

28

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Ultrasound Sensing Technologies 2020