TTCS Progress at Sun Yat-sen University - CERN Documents/Presentations and... · TTCS Progress at Sun Yat-sen University October 25, 2005, CERN Geneva ... CH13 CH14 TSET ... HW(accessible)

Tracker Thermal Control System

TTCS Progress TTCS Progress at Sun at Sun YatYat--sensen UniversityUniversity

October 25, 2005, CERN Geneva

Modeling: SS Lu, ZC Huang, DQ Mo EM test: ZH He, TX Li, KH Guo, WJ Xiao, NQ Pei, XH Sun,

ZW Pan, JF Ding, KL YuElectronics: JQ Ni, XH Jiang, D Zhang, ZX Wang, CP Tang,

GC Feng, YH Huang, Mechanics: XM Qi, XH Diao, GY Chen, SS Zheng

2


TTCS Thermal ModelingTTCS Thermal Modeling

TMM: Thermal mathematic model

TMM1 TMM1

TTCB TMM1:Pump/valve to radiator: 0.2w/kPump/valve to base plate: 0.1w/k

Size for cold finger: S_finger=25*25mm2，L_finger=140mm, h_cont=1000w/m2k

3


Cases run for TTCS loop Model with TMM1Cases run for TTCS loop Model with TMM1

Hot cold Finished To be simulated

GUSS G_COMPONENT T_IF Grad75 -15-20-15 P+50%, G=1.5*G0 P+5k P-50%75 -15+15-1530 +00-20-15 startup heater=0W0 -15+15-15 HX.5000=150W P-50%0 +00+00+00 HX.5000=150W

-75 -15+25+15 S+50% S+50%

60 +15-20+00 HX.5000=150W S-50%30 -15-20-15 S+5k S-50%

75 +15+15+15Tset=263, 10025 =150W

P-5K Tset=263,10025 =150W P+50%

-75 -15+25-1530 +15+25-15 S+5k S-50%

-30 -15+25+15 Tset=273K60 +15+25-15 S+5k S-50%

75 -15+15+15Tset = 263, 10025 =

150W

75 -15+00+15S-5K

HX.5000=150W S+50%

-75 +00+00-15Tset=263

10025 =150WS-5K

HX.5000=150W P+50%-75 +15+00-15 startup heater=50W

Beta Angle Attituderun cases status

TTCB-P TTCB-Ssensitivity

FR=2g/s

4

Tracker Thermal Control SystemTemperature of fluid line in failed cases Temperature of fluid line in failed cases

without Radiator Heaterswithout Radiator HeatersTemperature of the fluid

210

220

230

240

250

260

270

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

hr

Temperature/

TL101

TL106

TL112

TL116

TL124

TL130

TL136

TL141

TL201

TL206

TL212

TL216

TL224

TL230

TL236

TL241

Cases: B+75+15+15+15 cold cases

• Radiator health heaters (150W) can help to avoid freezing• Estimation of the cold case probability is called for

SS Lu16:00 26 Oct.


PREPARATION PREPARATION ofof

TTCSTTCS（（EMEM））TestTest

6


.

Clean room with climate chamber Clean room with climate chamber and thermal control chamberand thermal control chamber

Main Facilities is ReadyMain Facilities is Ready

7


Fluke 2680A Fluke 2680A Data Acquisition Data Acquisition and Control Systemand Control System

LeyboldLeybold Helium Leak DetectorHelium Leak Detector

Temperature Temperature Standard and Standard and CalibrationCalibration

Pressure Pressure Standard and Standard and CalibrationCalibration

MAIN FACILITIES READY

8

Tracker Thermal Control SystemVacuum Chamber with Cold Plates insideVacuum Chamber with Cold Plates inside

9

Tracker Thermal Control SystemCold Plate (old version) with programming temperature control

10


Static Control: 1oC; Dynamic Control: 3oC

-55.00-50.00-45.00

-40.00-35.00-30.00-25.00-20.00

-15.00-10.00-5.000.005.00

10.0015.0020.0025.00

1 61 121 181 241 301 361 421 481

Bottom:Tleft

Bottom:Tright

Bottom:Tset

Top:Tleft

Top:Tright

Top:Tset

Temperature Control Stability of Cold Plates

From Pt100 that is From Pt100 that is used for T controlused for T control

11


0 50 100 150 200 250 300 350

-50

-40

-30

-20

-10

0

10

20

30

40

Tem

pera

ture

(o C)

Time(min)

CH10 CH11 CH12 CH13 CH14 TSET Tleft Tright

Tset=25oC

Power offPower off

∆T=10oC

min90,5.12)2cos(5.37 =−−= CtC

Tset π

Temperature Uniformity of the Bottom Plates

From thermal couples on the cold platesFrom thermal couples on the cold plates

12


CONSTRUCTION OF THE TTCS CONSTRUCTION OF THE TTCS TEST BEDTEST BED

to provide a test system, including hardware and software, for the functional tests of TTCS EM

based on the test results, to determine the feasibility of present TTCS design, and if feasible, to finalize the control scenario

Design configuration of the TTCS test bed

13


Data acquisition & control System for Data acquisition & control System for TTCS Test BedTTCS Test Bed

PC & Labview

14

Tracker Thermal Control System系统总图系统总图1.System configuration and monitoring point（in green）

2.Control panel

3.Functional buttoms

4.System status5.Reserved

6.status

15


1. For online-monitoring data at certain channel

2. Results (charts) of selected Model and Channel will be shown on the screen

SpySpy InterfaceInterface

16


Preliminary Test for Temperature controlPreliminary Test for Temperature control

• PID control (tested)– with heater and Peltier element on

bottom and top side of a copper plate respectively

33 50 67 83 100 117 133

59.50

59.75

60.00

60.25

60.50

Tem

pret

ureo C

Time(Min)

Setpoint Process Tempreture

Set point temperature: 60°C, Room temperature: 27 °C

17


PC

SW(FLUKE) HW(accessible)

90% 75% 90% 90% 50% 20% 90% 90% 20%

Alarm

Rem

ote

User m

anager

Data record

Control

Data acquisition

Power supply

Cold plate

Fluke driver

18


To be done for GSE To be done for GSE

• Cold plates updated with dimension matched to the updated condenser

• CO2 Filling system (under manufactured)


TTCS EM INTEGRATION TTCS EM INTEGRATION

waiting for waiting for

TTCS EM COMPONENTSTTCS EM COMPONENTS

20

Tracker Thermal Control Systemondenser v1 has been manufactured in SYSU.

21


From B. Verlaat at NIKHEF

evaporators

22


Accumulator EMHeat ExchangerHeat Exchanger EMEM

Accumulator EM

NLR CAST

CAST

23


Pipe outside cleaning

Packaging storage

冷板安装

Pipe inside cleaning

24


Leak test proposal at different levelsLeak test proposal at different levels

• Leak test for all components before delivered• Leak test for TTCB components (box level) in the

vacuum chamber with Leybold Helium Leak Detector

• Leak test for TTCS loop EM measuring the pressure drop after 24 hours

25


TTCE ProgressTTCE Progress

TTEC and TTEP (EM) made with some modification;TTCE QM design will be delivered

TTEC board TTEP board

26


Low level Control Tests based on TTCE prototypeLow level Control Tests based on TTCE prototype

Cooling control

Heating control

Temperature control with precision of 0.2°C

27


1. AMS protocol communication functions have been implemented and tested at CERN

Echo.Reboot.Dallas temperature read.Status read.

2. Private AMS protocol communication debug system has been established

3. Software for high level control is under development

MCU program progress

28


Private development tools (hardware) with software

ZZ Wang16:30 25 Oct.

29


Preliminary Structure Analysis of the Preliminary Structure Analysis of the Latest TTCB LayoutLatest TTCB Layout

XM Qi16:30 26 Oct.

30


Positive Margin of Safety AchievedPositive Margin of Safety AchievedStructure and Bolts Analysis

Load Displacement

Case x y z Von Mises Max Principal (mm) Yield Ultimate

1 22 5.5 5.5 73.1 75.4 0.38 3.8 2.4

2 5.5 22 5.5 133 147 0.39 1.7 0.8

3 5.5 5.5 22 155 173 0.21 1.3 0.5

4 -22 -5.5 -5.5 73.1 75.4 0.38 3.8 2.4

5 -5.5 -22 -5.5 133 147 0.39 1.7 0.8

6 -5.5 -5.5 -22 155 163 0.21 1.3 0.6

7 -22 5.5 5.5 73.1 75.6 0.38 3.8 2.4

Loads Cases: BaseplateAcceleration (g) Limit Stress [N/mm2] Margin of Safety

Load Y Z Shear Tension Tension Shear Bending

Case (N) (N) (N) X (N) (lbf) (lbf) (in.lbf.)

1 81.7 -219 233.7432 609 136.8539 52.52656 0 0.0502 376 -170 412.6451 460 103.3708 92.72924 0 0.0533 -277 374 465.4084 -453 -101.798 104.5862 0 0.0534 -81.7 219 233.7432 -609 -136.854 52.52656 0 0.0505 -376 170 412.6451 -460 -103.371 92.72924 0 0.0536 277 -374 465.4084 453 101.7978 104.5862 0 0.0537 -6.61 275 275.0794 -373 -83.8202 61.8156 0 0.054

Bolt reaction force and MofSafety Calculation--BotlInsertConnection

MofS

31


The lab for TTCS development is located in Zhuhai campus, Sun Yat-sen University

Thank you!