TRD Status Report

Octagon Integration T. Siedenburg 20min

DAQ Electronics F. Hauler 10min

Gas System & Electronics B. Borgia 20min

AMS TIM

CERN, 24-Apr-2006

Aachen TRD Status Report

Th. Siedenburg

AMS TIM

CERN, 24-Apr-2006

TRD Octagon Integration (Th.Kirn)

I. Özen

21-APR-2006

TRD Octagon Integration21-APR-2006

TRD Octagon Integration• All DALLAS temperature sensors tested• All 82 flight frontend boards installed (UFE)• HV ground connections installed• UFE function tests in progress• Gas-tower interconnection tubes installed

Tower to tower finished next week• Gas-group cosmic tests in preparation

• TRD upper plate: Installation of inserts• STA M-Structure machined within specs.

Test mounting in preparation • TRD Rosengitter in preparation

Gastubing / Dallas & UFE cabeling

TRD Longterm Test

J. Hattenbach

2 Years

Gastightnessunchanged

Gasgainstable

Final Report on TRD Front End Electronics

UFE (Flight Modules)

Ch.H. Chung

Production of UFE (FM)

358 VA Chips TestsSelect 202 Chips

101 Production of 4 Types PCB

+

Functional Tests Integration

Series ofSpace Qualification

Tests

TVT 3D Vibration Coating TVT

Space Qualification Tests

1st TVTTemperature : -40oC … +80oC

Pressure : 110-5 mbarFunctional test without failure

Random VibrationX,Y and Z-DirectionaRMS = 6.8g, 20-2000 Hz for 120 secFunctional test without failure

Conformal Coating2nd TVTSame as 1st TVT condition

Operating Temperature (-20 ~ +50 oC)

: Gain Calibration Points

Thermal Profile in TVT

Noise after SQT

Common mode noise correctedNoise = 1.5 ADC == ENC = 4000 e-

Pedestal RMS

Gain Calibration

+50 oC -20 oC

All 6464 channels arecalibrated over full Temperature range

Gain vs. Temperature

Flight UFE Selection

ALL 101 produced UFEs within specificationsSelect “better“ UFEs as flight modules

TRD-UFE (FM)Pedestal Distribution :

~ 10% of full range

TRD-UFE (FM)Noise RMS Spread :

~ 4%

TRD-UFE (FM)Gain RMS Spread :

~ 3%25oC

UFE(FM) Production : Finished (Jul. 2005) Total = 101 UFEs (FM = 82, FS = 19)

UFE Space Qualification Tests (Mar.05 ~ Mar. 06) 1st Thermal Vacuum Test= 101 (Done w/o failure) Random Vibration Test = 101 (Done w/o failure) Conformal Coating = 101 (Done w/o failure) 2nd Thermal Vacuum Test = 101 (Done w/o failure) Best 82 FM selected (Mar. 2006)

Functional Tests : Finished (20.07.05)

UFE Integration : Finished (Apr. 2006)

TRD UFE Summary

TRD Gas Manifolds

• Distribute TRD gasflow into 41 segments

• Measure gastightness of individual segments

• Allow isolation of a segment when leaky

• Introduce no additional risk of gas leakage

Manifolds mounted on Octagon

OctagonTemperature

Swing

R,P,Y coldest

R,P,Y hottest

+30

0

-20

OHB TRD Thermal Report

240 days (4 periods)

MLI = 0.03

Average TRD Temperaturebetween +35oC and -20oC

Depending on ISS R, P, Y

Manifold / Flipper Valve Schematics

FVa FVb

Improve Manifold Leaktightness

FVa FVb

New Manifold Prototype ● Dry mounting of all components

● Full function test● Potting when ok

Alu. Body Viton Seal Alu. Cover

New Manifold Design

New Manifold DesignFits inside existing magnetic shielding

Gas connectionswith double-o-ringfront access

Cold Case Flipper-Valve Operation

Buerkert 6124

Viton Bag

No switching below -15oC Leakage to outsideif switched below -8oC

Flipper-Valve Temperature

TVT Tank Vacuum

Manifold operation: heated switching

SMD 100

Switching in TVT at -25oC ok if valve heated to 0oC

Heating of fully potted 2FV manifold: 2 x 2W x 30 min.

Gastightness through valves and to outside ok

Heater powerline control (8H+8C 40W each) TBD

FVa FVa+b FVb

3.4×10-5 l mbar/s 3.0×10-5 18×10-5

Helium Leakrate (1 Gasgroup 50×10-5 )

TRD Integration Schedule

Octagon Integration finished in May 06Rosengitter tubing & cabeling Jun - Sep 06Manifold design & production Apr - Oct 06Box-S/C EM -> QM upgrade Apr - Jul 06UG QM Electronics Prod. & Test Apr - Oct 06Box-S/C FM Prod. & Test Apr - Dec 06TRD Cosmics EM UGcrate @ RWTH Nov - Dec 06TRD Cosmics QM UGcrate TBD Jan - Mar 07UG FM Electronics Prod. & Test Oct 06 - May 07

TRD Integration Schedule INr. Vorgangsname Dauer Anfang Ende VorgängerRessourcennamen

1 TRD Gas System 359 Tage? Feb 6 '06 Jun 21 '072 1) Thermal Model 16 Tage Apr 4 '06 Apr 25 '06 U.Becker,K.Luebelsmeyer,C.Clark8

9 2a) UG Electronics EM (Rome) 0 Tage Mrz 27 '06 Mrz 27 '0618

19 2b) UG Electronics QM (Rome) 149 Tage Feb 6 '06 Sep 1 '06 B. Borgia,A. Bartoloni20 UG Electronic Boards 115 Tage Feb 6 '06 Jul 14 '06

31 UG Backplane 0 Tage Sep 1 '06 Sep 1 '0632 UG Crate 0 Tage Sep 1 '06 Sep 1 '0633 UGPD 0 Tage Sep 1 '06 Sep 1 '0634

35 3) EM / QM Box S & C 138 Tage Apr 18 '06 Okt 26 '0636 Prepare Clean Room at CERN 4 Wochen Apr 18 '06 Mai 15 '06 J. Burger / R. Becker37 Transport (Rome to CERN with EM UG-Crate) 5 Tage Mai 15 '06 Mai 22 '06 36EE38 Installation of missing Hardware Components Box-S35 Tage Mai 23 '06 Jul 10 '06 3744 Installation of missing Hardware Components Box-C40 Tage Apr 18 '06 Jun 12 '06 P. Fisher,R.Becker58 Tests with EM Electronics and Software 50 Tage Mai 23 '06 Jul 31 '06 A.Lebedev / F.Spada / A.Bartoloni61 Tests with QM Electronics and Software 35 Tage Sep 1 '06 Okt 19 '06 A.Lebedev / F.Spada / A.Bartoloni66 Space Quali. (QM Box S&C, EM Electronics) 30 Tage Sep 15 '06 Okt 26 '06 Aachen69

70 4) Cosmic Test AC 90 Tage Okt 27 '06 Mrz 1 '07 AC / KA / MIT / Rome71 Octagon Installation QM-Gas-System & EM-UG-Crate 10 Tage Okt 27 '06 Nov 9 '06 66 Th.Kirn/U.Becker/F.Zhou/ F.Bucci72 QM-Gas-System 2xQM-Ucrate EM-UG-Crate 8 Wochen Nov 10 '06 Jan 4 '07 71 AC / KA / MIT / Rome73 QM-Gas-System 2xFM-Ucrate QM-UG-Crate 8 Wochen Jan 5 '07 Mrz 1 '07 72 AC / KA / MIT / Rome74

3/27

J. Burger / R. Becker

4/4

Feb Mrz Apr Mai2006

TRD Integration Schedule IINr. Vorgangsname Dauer Anfang Ende Vorgänger Ressourcennamen

75 5) FM Box S 132 Tage Apr 4 '06 Okt 4 '0676 Plate with Vessels 0 Tage Apr 4 '06 Apr 4 '0677 MIT Transport Box 0 Tage Apr 4 '06 Apr 4 '0678 Fill ports 50 Tage Apr 18 '06 Jun 26 '0680 Sub-Assemblies (5 pieces ARDE) 62 Tage Apr 4 '06 Jun 28 '0691 Integration & Leak Test ( ARDE ) 2 Wochen Jun 29 '06 Jul 12 '06 80 M.Green / Arde92 Wire Harness 6 Wochen Jul 13 '06 Aug 23 '06 91 MIT / Miller93 Test (Clean Room MIT) 4 Wochen Aug 24 '06 Sep 20 '06 92 F.Zhou / M.Green94 Transport to CERN 2 Wochen Sep 21 '06 Okt 4 '06 93 MIT95

96 6) FM Box C 120 Tage Apr 4 '06 Sep 18 '0697 Components at CERN 40 Tage Apr 18 '06 Jun 12 '06

103 Clean Room at CERN 15 Tage Apr 4 '06 Apr 24 '06 J. Burger / R.Becker104 Welding 10 Tage Jun 13 '06 Jun 26 '06 102,103 R.Becker105 Functional Testing with EM UG Electronics 20 Tage Aug 1 '06 Aug 28 '06 58,104 G.Rybka / P.Fisher106 Vibration Jig 80 Tage Mai 2 '06 Aug 21 '06 R. Becker / M. Wlochal107 Vibration Test (Aachen) 10 Tage Aug 29 '06 Sep 11 '06 106,105 K.Luebelsmeyer108 Shipment from Aachen to CERN 5 Tage Sep 12 '06 Sep 18 '06 107109

110 7) FM Gas System 66 Tage Okt 5 '06 Jan 4 '07111 Integration Box S & C 2 Wochen Okt 5 '06 Okt 18 '06 75,96112 Functional Test ( CERN, QM Electronics )8 Wochen Okt 20 '06 Dez 14 '06 111,61113 Gas Supply (TBD) 5 Tage Dez 15 '06 Dez 21 '06 112114 TVT (Aachen,TBD) 2 Wochen Dez 22 '06 Jan 4 '07 113115

4/4

4/4

M.Green / Arde

MIT / Miller

F.Zhou / M.Green

MIT

J. Burger / R.Becker

R.Becker

G.Rybka / P.Fisher

R. Becker / M. Wlochal

K.Luebelsmeyer

Apr Mai Jun Jul Aug2006

TRD Integration Schedule IIINr. Vorgangsname Dauer Anfang Ende Vorgänger Ressourcennamen

116 8) UG Electronics FM Components 165 Tage Okt 6 '06 Mai 24 '07128

129 9) FM Software 20 Tage Mai 25 '07 Jun 21 '07130 Functional Test 1 Monat Mai 25 '07 Jun 21 '07 127131

132 10) Supply Vessel Filling 1 Tag? Apr 4 '06 Apr 4 '06133 Procedure Definition 1 Tag? Apr 4 '06 Apr 4 '06134 Procedure Approval 1 Tag? Apr 4 '06 Apr 4 '06135 Filling 1 Tag? Apr 4 '06 Apr 4 '06 Linde US136 Transportation to KSC 1 Tag? Apr 4 '06 Apr 4 '06137

Linde US

Apr Mai Jun2006