TJN-FM to KES-TJN Burn-In Transfer Correlation Report · 2013. 10. 23. · Thermocouple # Thermocouple Location TJN-FM (C) KES-TJN (C) % Delta 6 Open Area in Chamber 126.80 126.90

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TJN-FM to KES-TJN Burn-In Transfer Correlation Report – Monet AW60 (G9FA8AW6)

1. Introduction:

This report details the burn-in correlation plan and result of Monet AW60 (Device: S9S08AW48E5CFGER; Production Line: G9FA8AW6; Package code: 8256; Mask set: 5M75B) device so that the KES-TJN site can burn-in the same production line as in the TJN-FM site. These correlation units were first processed at the TJN-FM test site and then processed in KES-TJN, with the ambient burn-in temperature at 125°C.

Product lines ride on this correlation report:

G9FA8AW6 G9JA8AW6 G9ZA8AW6 G9GA8AW6

TJN-FM • Hardware:

Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC3 Burn-in Board : LQ44MONET Burn-in Board Header : LQ44MONET Socket : LQFP44LD

• Burn-in Program Software: Environment Plan : MBI Burn-in Program(s) : AW_44LQFP_R1.5

KES-TJN • Hardware:

Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC3 Burn-in Board : LQ44MONET Burn-in Board Header : LQ44MONET Socket : LQFP44LD Burn-in Program Software: Environment Plan : MBI Burn-in Program(s) : AW_44LQFP_R1.5 Conclusion: Same hardware and software environment were used in both TJN-FM and KES-TJN.

• Correlation Lot Information: Correlation Site Final Test Lot # Wafer Lot # Device Part ID Mask/Rev Qty.

TJN-FM YZME0027Q700 QBTP106301 S9S08AW48E5CFGE 5M75B 500 TJN-FM YZME0027Q800 QBTP106301 S9S08AW48E5CFGE 5M75B 500 TJN-FM YZME0027Q900 QBTP106301 S9S08AW48E5CFGE 5M75B 500 KES-TJN YZME0027Q701 QBTP106301 S9S08AW48E5CFGE 5M75B 500 KES-TJN YZME0027Q801 QBTP106301 S9S08AW48E5CFGE 5M75B 500 KES-TJN YZME0027Q901 QBTP106301 S9S08AW48E5CFGE 5M75B 500

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: Alpeca family products.

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2. Engineering Qualification Plan:

2.1. Requirements

The requirements and acceptance criteria were based off of agreements between MCD Reliability and MCD Product Engineering. If a specification exists for this transfer/change, then the specification overrides these requirements.

Name Detail Description

Req’d per Correlation

Plan, (Y / N?)

Acceptance Criteria Comment

Pattern Verify

Goal: Correlate and verify correct functionality of burn-in patterns, cycling, etc Lot quantity: 1 Units per lot: 5 Temperature: 25C, or as possible BI Duration: N/A Type of units: good Site: Compare Sites

Y

Correct pattern written to array or other product module(s)

This capability may be dependent upon type of product.

Equipment Release

Goal: Calibration and verification of entire system according to site standard equipment release procedure (May include performing voltage calibration on all drivers including debug station, meet GR&R requirements, etc.) Lot quantity / Units per lot: 0 Temperature: BI Ta BI Duration: N/A Type of units: N/A Site: New Site

Y Approval by manufacturing CAB

NA

Burn-in Board Voltages

Goal: Verify that the parts on the burn-in board are receiving the correct voltage Lot quantity: 1 Units per lot: Empty and Full Board Temperature: BI Ta BI Duration: N/A Type of units: good Site: Compare Sites

Y

Voltage within range of target to be agreed by PE/TE and R&QA

Measure at front & back of empty and full burn-in board.

Package Case Tempera-ture

Goal: Compare temperature at surface of mold compound or on-chip temperature monitor Lot quantity: 1 Units per lot: Full Board Temperature: BI Ta BI Duration: N/A Type of units: good

Y

Less than 15% variation or to be agreed by PE/TE and R&QA

Thermocouples on five units with full burn-in board running stress pattern. For high power devices, also verify with single part on


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Site: Compare Sites board to ensure no overheating.

Ambient Tempera-ture (Ta)

Goal: Compare temperate of air inside chamber Lot quantity: 1 Units per lot: Full Board Temperature: BI Ta Type of units: good BI Duration: N/A Site: Compare Sites

Optional

Less than 10% variation or to be agreed by PE/TE and R&QA.

One thermocouple. Can be performed along with Package Case Temperature.

Burn-in Board Current

Goal: Compare burn-in board current Lot quantity: 1 Units per lot: Full board Temperature: BI Ta BI Duration: N/A Type of units: good Site: Compare Sites

Y


Best measured on individual devices. Or measure entire full board current minus empty board current divided by # of devices on full board.

Three Lot Burn-in Check

Goal: Verify that burn-in system does not cause abnormal non-burn-in failures Lot quantity: 3 Units per lot: 1000 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: New Site

Y

Address manufacturability / over-stress issues.

Run through standard test flow.

Burn-in Yield

Goal: Verify that burn-in system does not cause unusually low yield Lot quantity: 1 Units per lot: 500 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: New Site or Comparison

Y

Post BI yield within PDA limit or agreed up by PE/TE and R&QA.

May set a target here based on typical yields.

Parameter Shift Analysis

Goal: Check for parametric shifts Lot quantity: 3 Units per lot: 10 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: New Site or Comparison

Y

Less than 10% variation or agreed upon by PE/TE and R&QA.

Use same units from parametric analysis in test correlation.

Visual Inspection

Goal: Check for visual mechanical Lot quantity: 3 Units per lot: 500 Temperature: 25C BI Duration: N/A

Y


Use same units from parametric analysis in test correlation. (For SOIC54 parts, the


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Type of units: good Site: New Site or Comparison

microscope 30x is utilized for manually inspection)

3. Correlation/Qualification Results:

3.1. Pattern Verify Table 1 summarizes the pattern comparison results.

Table 1 Memory Comparison

Lot Number BI Program BI Pattern Description TJN-FM KES-TJN YZME0027Q700 AW_44LQFP_R1.5 Bin2 Check Pass Pass YZME0027Q800 AW_44LQFP_R1.5 Bin2 Check Pass Pass YZME0027Q900 AW_44LQFP_R1.5 Bin2 Check Pass Pass Conclusion: All correlation lots passed Bin2 check in TJN-FM and KES-TJN

3.2. Equipment Release: (KES-TJN equipment Buy-off and release stuff)

(Click the attached zip file) Cc3.zip

3.3. Burn-in Board Voltage Measurements Tables 2 summarize the voltage measurements taken from an empty and full burn-in board. The full board was BIB #01-0950.01-01.0026 and the empty board was BIB #01-0950.01-01.0049. Measurements were taken with the burn-in board in zone #A07, slot #57&#71.

Table 2 Burn-in Board Voltage Measurements at 25C

BIB Condition BIB Location Target (V)

TJN-FM (V)

Delta from Target (mV)

KES-TJN (V)


VDD(V1) 6.00 5.97 30 5.99 10 Empty VPP(V2) 6.00 5.99 10 6.00 0 VDD(V1) 6.00 5.96 40 5.98 20 Full VPP(V2) 6.00 5.98 20 6.00 0

Conclusion: The Burn-in board voltage delta from target between TJN-FM and KES-TJN are less than 50mV that meet the spec.

3.4. Package Case Temperature Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and the AW_44LQFP_R1.5 pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were epoxied to the top of the device. Used zone #A07, slot #57.


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Figure 1 Location of Thermocouples

Table 3 Case Temperatures

Thermocouple # Thermocouple Location TJN-FM (C)

KES-TJN (C)

% Delta

1 Upper Left Corner 127.10 127.10 0.00% 2 Lower Left Corner 127.80 127.00 0.60% 3 Center of BIB 127.90 127.10 0.60% 4 Lower Right Corner 127.10 126.90 0.20% 5 Upper Right Corner 127.50 127.30 0.20%

Conclusion: The case temperature delta between TJN-FM and KES-TJN are less than 15% that meet spec.

3.5. Ambient Temperature Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta. Used zone #A07, slot #57.

Table 4 Chamber Air Temperature

Thermocouple # Thermocouple Location TJN-FM (C) KES-TJN (C) % Delta 6 Open Area in Chamber 126.80 126.90 0.10%

Conclusion: The chamber air temperature delta between TJN-FM and KES-TJN are less than 10% that meet spec.

3.6. Burn-in Board Current: Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta. Used zone #A07, slot #57.

Table 5 Burn-in Board Current

BI Program BI Pattern # Units on BIB TJN-FM (A) KES-TJN (A) % Delta Program Name Pattern Name Full 1.41 1.35 4.30% Conclusion: The Burn-in board current delta between TJN-FM and KES-TJN are less than 15% that meet spec.

3.7. 3-Lot Burn-in Check: Conclusion: No abnormal non-Burn-in failures found.

3.8. Burn-in Yield: Conclusion: All correlation lots yield variation is less than 10% that meet spec.

1 1

52

3 Feedthrough Connector (Driver-side)

6


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3.9. Shift Analysis: Tables 6-8 summarize the parametric data on golden units.

Table 6 SIDD3 Parametric Comparison for KES-TJN part (Hot Temp.) Hot 95C

Part #

Pre-BI (uA)

Post-BI(uA) % Delta

1 7.2852 7.3161 0.42%2 7.3474 7.3539 0.09%3 7.3952 7.4025 0.10%4 7.6956 7.7191 0.30%5 7.9071 7.9302 0.29%6 7.5744 7.5701 -0.06%7 7.9358 8.0156 1.00%8 8.1016 8.1582 0.69%9 8.0837 8.0735 -0.13%

10 8.1263 8.1328 0.08%11 5.8477 5.8018 -0.79%12 5.9837 6.0204 0.61%13 6.3087 6.3263 0.28%14 6.5369 6.5837 0.71%15 6.6469 6.6961 0.73%16 6.8266 6.8175 -0.13%17 7.3944 7.4650 0.95%18 7.5936 7.6356 0.55%19 7.5691 7.6007 0.42%20 7.6416 7.6593 0.23%21 8.9787 9.0017 0.26%22 10.0616 9.9780 -0.84%23 10.9346 11.0219 0.79%24 11.8633 11.9688 0.88%25 11.8878 11.9613 0.61%26 9.9503 10.0451 0.94%27 10.7010 10.7103 0.09%28 9.6046 9.5902 -0.15%29 9.7735 9.6980 -0.78%30 9.9889 10.0710 0.82%

Table 7 SIDD3 Parametric Comparison for KES-TJN part (Room Temp)

Room 25C Part #

Pre-BI (uA)

Post-BI (uA) % Delta


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1 1.0790 1.0898 0.99%2 1.0837 1.0857 0.18%3 1.0979 1.1061 0.74%4 1.1211 1.1238 0.24%5 1.1272 1.1270 -0.02%6 1.1278 1.1235 -0.38%7 1.1325 1.1554 1.98%8 1.1476 1.1424 -0.46%9 1.1797 1.1738 -0.50%

10 1.1838 1.1794 -0.37%11 1.1078 1.1143 0.58%12 1.1242 1.1323 0.72%13 1.1604 1.1631 0.23%14 1.1696 1.1693 -0.03%15 1.1768 1.1710 -0.50%16 1.1792 1.1723 -0.59%17 1.1816 1.1812 -0.03%18 1.1836 1.1931 0.80%19 1.1892 1.1964 0.60%20 1.1984 1.2065 0.67%21 1.1378 1.1390 0.11%22 1.1546 1.1582 0.31%23 1.1589 1.1564 -0.22%24 1.1655 1.1669 0.12%25 1.1875 1.1821 -0.46%26 1.1961 1.1959 -0.02%27 1.2009 1.2075 0.55%28 1.2063 1.2038 -0.21%29 1.2105 1.2127 0.18%30 1.2215 1.2237 0.18%

Table 8 SIDD3 Parametric Comparison for KES-TJN part (Cold Temp)

Cold -40C Part #

Pre-BI (nA )

Post-BI(nA) % Delta

1 664.0403 666.7936 0.41% 2 667.6349 669.9164 0.34% 3 692.0579 695.5505 0.50% 4 708.2464 708.5649 0.04% 5 726.0181 723.6636 -0.33% 6 738.5330 735.4227 -0.42% 7 739.6802 745.7802 0.82% 8 741.2169 746.2900 0.68% 9 753.7339 751.2101 -0.34%

10 782.2861 775.3520 -0.89%


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11 636.6855 634.1703 -0.40% 12 665.4679 670.4263 0.74% 13 679.2090 684.1484 0.72% 14 705.3146 703.1732 -0.30% 15 711.7980 705.2891 -0.92% 16 741.4463 738.9348 -0.34% 17 742.0001 735.0731 -0.94% 18 753.8037 754.5565 0.10% 19 767.5511 751.0249 -2.20% 20 774.9978 773.9566 -0.13% 21 658.6482 653.0837 -0.85% 22 694.1803 701.1082 0.99% 23 696.7807 701.4191 0.66% 24 693.9263 700.0245 0.87% 25 719.1387 725.5387 0.88% 26 729.5757 732.5674 0.41% 27 735.2188 737.6917 0.34% 28 741.3444 745.2703 0.53% 29 777.0855 775.6526 -0.18% 30 763.8453 762.1976 -0.22%

Conclusion: The shift variation between pre-BI and post-BI are less than 10% that meet spec.

3.10 Visual inspection Table9 summarize the Visual inspection data.

Table 9 Visual Inspection comparison data Lot No. Lot Size VM Yield (TJN-FM) VM Yield (KES-TJN)

YZME0027Q700/YZME0027Q701 500 Pass Pass YZME0027Q800/YZME0027Q801 500 Pass Pass YZME0027Q900/YZME0027Q801 500 Pass Pass Conclusion: The VM reject rate for all correlation lots are less than 2%, meet spec requirement.

3.11 Summary: The B/I result is correlated between TJN-FM and KES-TJN. 4. Conclusion:

KES-TJN is capable to implement B/I for product Monet AW60 (Device: S9S08AW48E5CFGER; Package code: 8256; Production Line: G9FA8AW6; Mask set: 5M75B), and it represented the combination – IBE oven and CC-3 driver.

5. Responsible Engineers:

Name: Jessica HAN Title: Test Product Engineer E-mail: R63560


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Phone: 86 (22) 8568 6058 Name: Alex WANG Title: B/I Engineer E-mail: B03806 Phone: 86 (22) 8568 6472

~ End of Report ~


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TJN-FM to KES-TJN Burn-In Transfer Correlation Report – Nitron Auto (G9IA8QY4)

2. Introduction: This report details the burn-in correlation plan and result of Nitron Auto (Device: MC510308QY4MDTER; Production Line: G9IA8QY4; Package code: 6117; Mask set: 7L69J) device so that the KES-TJN site can burn-in the same production line as in the TJN-FM site. These correlation units were first processed at the TJN-FM test site and then processed in KES-TJN, with the ambient burn-in temperature at 125°C.

The product lines ride on this correlation:

S9IA8QY4 G9IA8QB8 G9IA8QY4 G9IA8Y4A G9Z86QC6 GRIA8QY1 G9Z88QC6 G9Z80QC6 S9IA8QL4 G9IA8QL4 S9DA8QY4 G9DA8QB8 G9DA8QY4 G9DA8Y4A GRDA8QY4

TJN-FM: • Hardware:

Burn-in System : IBE System Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC1 Burn-in Board : TS16NITRON Burn-in Board Header : TS16NITRON Socket : TSSOP16LD

• Burn-in Program Software: Environment Plan : MBI Burn-in Program(s) : 9QY4_T125

KES-TJN: • Hardware:

Burn-in System : IBE System Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC1 Burn-in Board : TS16NITRON Burn-in Board Header : TS16NITRON Socket : TSSOP16LD


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• Burn-in Program Software: Environment Plan : MBI Burn-in Program(s) : 9QY4_T125 Conclusion: Same hardware and software environment were used in both TJN-FM and KESC.


TJN-FM WE73626W00 TD783221 MC510308QY4MDTER 7L69J 500 TJN-FM WE73626V00 TD792191 MC510308QY4MDTER 7L69J 500 TJN-FM WE73626X00 TD799531 MC510308QY4MDTER 7L69J 500 KES-TJN WE73626W01 TD783221 MC510308QY4MDTER 7L69J 500 KES-TJN WE73626V01 TD792191 MC510308QY4MDTER 7L69J 500 KES-TJN WE73626X01 TD799531 MC510308QY4MDTER 7L69J 500


2.2. Requirements:



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Req’d per

Correlation

Plan, (Y / N?)


Pattern Verify


Y

Correct pattern written

to array or other product

module(s)

This capability may be dependent upon type of

product.

Equipment Release

Goal: Calibration and verification of entire system according to site standard equipment release procedure (May include performing voltage calibration on all drivers including debug station, meet GR&R requirements, etc.) Lot quantity / Units per lot: 0 Temperature: BI Ta BI Duration: N/A Type of units: N/A Site: KES-TJN

Y Approval by

manufacturing CAB.

NA

Burn-in Board

Voltages


Y

Voltage within range of target to be agreed by

PE/TE and R&QA.

Measure at front & back of empty and full burn-in

board.

Package Case

Temperature

Goal: Compare temperature at surface of mold compound or on-chip temperature monitor Lot quantity: 1 Units per lot: Full Board Temperature: BI Ta BI Duration: N/A Type of units: good Site: Compare Sites

Y

Less than 15% variation or to be agreed by PE/TE and

R&QA.

Thermocouples on five units with full burn-in board running stress

pattern. For high power devices, also verify with single part on board to ensure no overheating.

Ambient Temperature (Ta)

Goal: Compare temperate of air inside chamber Lot quantity: 1 Units per lot: Full Board Temperature: BI Ta

Y


R&QA.

One thermocouple. Can be performed along with

Package Case Temperature.


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Type of units: good BI Duration: N/A Site: Compare Sites

Burn-in Board

Current


Y


R&QA.

Best measured on individual devices. Or

measure entire full board current minus empty board

current divided by # of devices on full board.


Goal: Verify that burn-in system does not cause abnormal non-burn-in failures Lot quantity: 3 Units per lot: 1000 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: KES-TJN

Y

Address manufactur-ability / over-stress issues.


Burn-in Yield

Goal: Verify that burn-in system does not cause unusually low yield Lot quantity: 1 Units per lot: 500 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: KES-TJN or Comparison

Y

Post BI yield within PDA

limit or agreed up by PE/TE and R&QA.


Shift Analysis

Goal: Check for parametric shifts Lot quantity: 3 Units per lot: 10 Temperature: BI Ta BI Duration: Typical BI Duration Type of units: good Site: KES-TJN or Comparison

Y

Less than 10% variation or agreed upon

by PE/TE and R&QA.

Use same units from parametric analysis in test

correlation.

Visual Inspection

Goal: Check for visual mechanical Lot quantity: 3 Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: good Site: KES-TJN or Comparison

Y


Use same units from parametric analysis in test correlation. (For SOIC54 parts, the microscope 30x is utilized for manually inspection)


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3.10. Pattern Verify:


Lot Number BI Program BI Pattern Description TJN-FM KES-TJN WE73626W00 9QY4_T125 Bin2 check Pass Pass WE73626V00 9QY4_T125 Bin2 check Pass Pass WE73626X00 9QY4_T125 Bin2 check Pass Pass

Conclusion: All correlation lots passed Bin2 check in TJN-FM and KES-TJN.

3.11. Equipment Release: (KES-TJN equipment buy off and release stuff)

(Pls. click attached zip file) Cc1.zip

3.12. Burn-in Board Voltage Measurements: Tables 2 summarize the voltage measurements taken from an empty and full burn-in board. The full board was BIB #01.0895.01-01.0117rd was BIB #01.0895.01-01.0164re taken with the burn-in board in zone #C15, slot#81&#87.


BIB Condition

BIB Location Target (V)

TJN-FM (V) Delta from Target (mV)

KES-TJN(V) Delta from Target (mV)

VDD(V1) 5.50 5.53 30 5.51 10 Empty VPP(V2) 10.00 9.97 30 9.98 20

VDD(V1) 5.50 5.51 10 5.51 10 Full VPP(V2) 10.00 9.99 10 9.97 30

Conclusion: The Burn-in board voltage delta from target between TJN-FM and KES-TJN are less than 50mV, meet the spec


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3.13. Package Case Temperature: Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and the 9QY4_T125 pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were located to the top of the device. Used zone #C15, slot #81.

Figure 2 Locations of Thermocouples


Thermocouple # Thermocouple Location TJN-FM (C)

KES-TJN (C)

% Delta

1 Upper Left Corner 126.50 127.10 0.50% 2 Lower Left Corner 126.70 127.10 0.30% 3 Center of BIB 126.50 127.40 0.70% 4 Lower Right Corner 126.90 126.90 0.00% 5 Upper Right Corner 127.30 127.00 0.20%

Conclusion: The case temperature delta between TJN-FM and KES-TJN are less than 15% that meet Spec.

3.14. Ambient Temperature: Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.

Table 4 Chamber Air Temperature

Thermocouple # Thermocouple Location TJN-FM (C) KES-TJN (C) % Delta 6 Open Area in Chamber 127.80 127.50 0.20

Conclusion: The chamber air temperature delta between TJN-FM and KES-TJN are less than 10% that meet spec.

3.15. Burn-in Board Current: Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.


BI Program BI Pattern # Units on BIB TJN-FM (A) KES-TJN (A) % Delta Program Name Pattern Name Full 0.35 0.35 0.00%

Conclusion: The Burn-in board current delta between TJN-FM and KES-TJN are less than 15% that meet spec.

3.16. 3-Lot Burn-in Check: Conclusion: No abnormal non-Burn-in failures found.

1 1

52


6


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3.18. Shift Analysis: Tables 6-11 summarize the parametric data on golden units.

Table 6 ridd_3v Parametric Comparison for KES-TJN part (Hot Temp) Hot C

Part # Pre BI (mA)

Post BI (mA) % Delta

1 2.0028 2.0339 1.03% 2 2.0115 2.0171 -0.56% 3 2.0018 2.0089 1.40% 4 2.0457 2.0043 -1.68% 5 1.9860 2.0089 -0.81% 6 1.9957 2.0210 0.73% 7 2.0181 2.0069 0.23% 8 1.9870 2.0426 1.50% 9 2.0217 2.0201 -0.89%

10 1.9794 2.0339 2.64% 11 2.0115 2.0262 0.83% 12 1.9972 2.0420 0.60% 13 2.0253 2.0329 0.88% 14 2.0237 2.0211 1.18% 15 2.0406 2.0125 -0.48% 16 1.9636 2.0063 -1.35% 17 2.0319 2.0461 0.95% 18 2.0059 1.9992 -1.05% 19 1.9982 2.0002 -0.28% 20 1.9967 2.0283 1.21% 21 1.9998 1.9936 -0.77% 22 2.0146 2.0308 1.46% 23 1.9304 1.9982 -0.15% 24 1.9962 2.0216 1.74% 25 2.0375 1.9987 0.36% 26 2.0084 2.0318 2.28% 27 2.0293 2.0329 1.48% 28 2.0023 2.0344 1.25% 29 2.0237 1.9824 0.08% 30 2.0125 2.0109 0.08%


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Table 7 ridd_3v Parametric Comparison for KES-TJN part (Room Temp) Room 25C

Part # Pre BI (mA)


1 2.0044 2.0028 -0.08% 2 2.0207 2.0115 -0.46% 3 2.0192 2.0018 -0.87% 4 2.0197 2.0457 1.27% 5 2.0018 1.986 -0.80% 6 2.0084 1.9957 -0.64% 7 2.0176 2.0181 0.03% 8 1.9962 1.987 -0.46% 9 2.01 2.0217 0.58%

10 1.9921 1.9794 -0.64% 11 1.988 2.0115 1.17% 12 1.985 1.9972 0.61% 13 2.0039 2.0253 1.06% 14 2.0115 2.0237 0.60% 15 1.9911 2.0406 2.43% 16 1.9952 1.9636 -1.61% 17 2.0074 2.0319 1.21% 18 2.0215 2.0059 -0.78% 19 1.977 1.9982 1.06% 20 2.0301 1.9967 -1.67% 21 2.0092 1.9998 -0.47% 22 1.998 2.0146 0.82% 23 1.9985 1.9304 -3.53% 24 2.0148 1.9962 -0.93% 25 2.0301 2.0375 0.36% 26 1.9826 2.0084 1.29% 27 2.0056 2.0293 1.17% 28 2.0245 2.0023 -1.11% 29 2.0127 2.0237 0.54% 30 2.0441 2.0086 1.74%

Table 8 ridd_3v Parametric Comparison for KES-TJN part (Cold Temp)

Cold -40C

Part # Pre BI (mA)


1 2.0321 2.0250 -0.35% 2 2.0010 2.0265 1.26% 3 2.0209 2.0286 0.38% 4 2.0082 2.0117 0.17% 5 2.0444 2.0056 -1.94% 6 1.9918 2.0224 1.51% 7 2.0076 2.0010 -0.33% 8 2.0286 2.0133 -0.76% 9 1.9959 1.9944 -0.08%

10 2.0276 1.9974 -1.51%


Page 18 of 37

11 1.9913 1.9954 0.21% 12 2.0240 2.0143 -0.48% 13 2.0010 2.0219 1.03% 14 2.0306 1.9944 -1.82% 15 2.0388 1.9974 -2.07% 16 2.0449 2.0122 -1.63% 17 1.9719 2.0036 1.58% 18 2.0327 2.0005 -1.61% 19 2.0010 1.9831 -0.90% 20 2.0097 2.0219 0.60% 21 2.0031 1.9699 -1.69% 22 2.0010 2.0194 0.91% 23 2.0168 2.0102 -0.33% 24 1.9265 1.9806 2.73% 25 1.9934 2.0046 0.56% 26 2.0337 2.0168 -0.84% 27 2.0219 2.0235 0.08% 28 2.0367 1.9750 -3.12% 29 2.0163 2.0056 -0.53% 30 2.0321 2.0367 0.23%

Table 9 osc_5v_trim Parametric Comparison for KES-TJN part (Hot Temp)

Hot C

Part # Pre BI

(M) Post BI

(M) % Delta 1 3.0500 3.0400 -0.33% 2 3.0560 3.0380 -0.59% 3 3.0480 3.0440 -0.13% 4 3.0560 3.0520 -0.13% 5 3.0600 3.0500 -0.33% 6 3.0460 3.0440 -0.07% 7 3.0400 3.0520 0.39% 8 3.0400 3.0500 0.33% 9 3.0460 3.0580 0.39%

10 3.0540 3.0420 -0.39% 11 3.0460 3.0540 0.26% 12 3.0500 3.0420 -0.26% 13 3.0560 3.0480 -0.26% 14 3.0500 3.0460 -0.13% 15 3.0420 3.0380 -0.13% 16 3.0500 3.0460 -0.13% 17 3.0520 3.0440 -0.26% 18 3.0520 3.0460 -0.20% 19 3.0500 3.0400 -0.33% 20 3.0420 3.0500 0.26% 21 3.0500 3.0520 0.07% 22 3.0580 3.0520 -0.20% 23 3.0440 3.0500 0.20% 24 3.0440 3.0440 0.00%


Page 19 of 37

25 3.0500 3.0420 -0.26% 26 3.0440 3.0480 0.13% 27 3.0560 3.0580 0.07% 28 3.0400 3.0420 0.07% 29 3.0380 3.0520 0.46% 30 3.0540 3.0460 0.26%

Table 10 osc_5v_trim Parametric Comparison for KES-TJN part (Room Temp)

Room 25C

Part # Pre BI

(M) Post BI

(M) % Delta 1 3.1820 3.1880 0.19% 2 3.1840 3.1840 0.00% 3 3.1900 3.1980 0.25% 4 3.1880 3.1900 0.06% 5 3.1860 3.1900 0.13% 6 3.1860 3.1900 0.13% 7 3.1940 3.1860 -0.25% 8 3.1940 3.1900 -0.13% 9 3.1900 3.1880 -0.06%

10 3.1880 3.1920 0.13% 11 3.1900 3.1800 -0.31% 12 3.1860 3.1880 0.06% 13 3.1960 3.1860 -0.31% 14 3.1800 3.1920 0.38% 15 3.1880 3.1880 0.00% 16 3.1900 3.1900 0.00% 17 3.1880 3.1820 -0.19% 18 3.1880 3.1920 0.13% 19 3.1820 3.1820 0.00% 20 3.1960 3.1940 -0.06% 21 3.1820 3.1800 -0.06% 22 3.1940 3.1940 0.00% 23 3.1880 3.1860 -0.06% 24 3.1920 3.1820 -0.31% 25 3.1820 3.1860 0.13% 26 3.1920 3.1940 0.06% 27 3.1800 3.1860 0.19% 28 3.1800 3.1820 0.06% 29 3.1920 3.1800 -0.38% 30 3.1840 3.1920 -0.25%

Table 11 osc_5v_trim Parametric Comparison for KES-TJN part (Cold Temp)

Cold -40C

Part # Pre BI

(M) Post BI

(M) % Delta 1 3.2640 3.2740 0.31% 2 3.2520 3.2660 0.43% 3 3.2680 3.2720 0.12%


Page 20 of 37

4 3.2560 3.2740 0.55% 5 3.2660 3.2680 0.06% 6 3.2640 3.2840 0.61% 7 3.2580 3.2600 0.06% 8 3.2680 3.2640 -0.12% 9 3.2620 3.2600 -0.06%

10 3.2480 3.2560 0.25% 11 3.2540 3.2600 0.18% 12 3.2560 3.2620 0.18% 13 3.2680 3.2720 0.12% 14 3.2580 3.2600 0.06% 15 3.2720 3.2660 -0.18% 16 3.2620 3.2540 -0.25% 17 3.2580 3.2620 0.12% 18 3.2620 3.2660 0.12% 19 3.2640 3.2420 -0.68% 20 3.2700 3.2440 -0.80% 21 3.2600 3.2460 -0.43% 22 3.2600 3.2700 0.31% 23 3.2560 3.2600 0.12% 24 3.2400 3.2520 0.37% 25 3.2620 3.2700 0.25% 26 3.2740 3.2580 -0.49% 27 3.2760 3.2640 -0.37% 28 3.2660 3.2660 0.00% 29 3.2560 3.2600 0.12% 30 3.2700 3.2680 -0.06%

Conclusion: All shift variation between pre-BI and post-BI are less than 10% that meet spec.

3.10 Visual inspection

Table12 summarize the Visual inspection data.

Table12 Visual Inspection Comparison Lot No. Lot Size VM Yield

( TJN-FM) VM Yield

(KES-TJN) WE73626W00/ WE73626W01 500 Pass Pass WE73626V00/ WE73626V01 500 Pass Pass

WE73626X00/ WE73626X001 500 Pass Pass Conclusion: The V/M reject rate for all correlation lots are less than 2%, meet spec requirement.

3.11. Summary:

The B/I result is correlated between TJN and KES-TJN. 4. Conclusion:

KES-TJN is capable to implement B/I for product of Nitron Auto (Device: MC510308QY4MDTER; Production Line: G9IA8QY4; Package code: 6117; Mask set: 7L69J), and it represented the combination – IBE oven and CC-1 driver.


Page 21 of 37

5. Responsible Engineers:

Name: Andy MU Title: Test product engineer E-mail: R65077 Phone: 86 (22) 8568 6586

Name: Alex WANG Title: B/I engineer E-mail: B03806 Phone: 86 (22) 8568 6472

~ End of Report ~


Page 22 of 37

TJN-FM to KESCHN Burn-In Transfer Correlation Report – Jumper Tssop16

3. Introduction:

This report details the burn-in correlation plan and result of Jumper (Device: S9S08SG8E2CTG; Production Line: G9TZSG8A; Package code 6117; Mask set: 2M84G) device so that the KESTJN can burn-in the same production line as in the TJN-FM site. These correlation units were first processed at the TJN-FM test site and then processed in KESTJN, with the ambient burn-in temperature at 125°C.

TJN-FM

• Hardware: Burn-in System: IBE Burn-in Pattern Generator: Flash Part Burn-in Driver: CC3 Burn-in Board: TS16 JUMPER Burn-in Board Header: Socket: 100

• Burn-in Program Software: SG8_T125 Environment Plan: 125C Burn-in Program(s): sg8tib12ru50v3.s19

KESTJN • Hardware:

Burn-in System: IBE Burn-in Pattern Generator: Burn-in Driver: CC3 Burn-in Board: TS16 JUMPER Burn-in Board Header: Socket: Burn-in Program Software: SG8_T125 Environment Plan: 125C Burn-in Program(s): sg8tib12ru50v3.s19 Conclusion: Same hardware and software environment were used in both KESTJN and TJN-FM.


KESTJN WEXE83222Z00 TP136441 S9S08SG8E2CTG 2M84G 1000 TJN-FM WEXE83222Z00 TP136441 S9S08SG8E2CTG 2M84G 1000


2.3. Requirements:



Page 23 of 37



Plan, (Y / N?)


Pattern Verify


Y



Equipment Release



N/A



Y





Y


Thermocouples on five units with full burn-in board running stress pattern. For high power devices, also verify with single part on board to ensure no overheating.



Optional




Page 24 of 37



Y





Y



Burn-in Yield


Y





Y



Visual Inspection

Goal: Check for visual mechanical Lot quantity: 3 Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: good Site: New Site or Comparison

Y




3.19. Pattern Verify:\ Table 1 summarizes the pattern comparison results.


Lot Number BI Program BI Pattern Description KESTJN TJN-FM WEXE83222Z00 sg8tib12ru50v3.s19 Bin2 Check Pass Pass

Conclusion: Pass

3.20. Equipment Release: (TJN-FM equipment Buy-off and release stuff)


Page 25 of 37

3.21. Burn-in Board Voltage Measurements

Tables 2 summarize the voltage measurements taken from an empty and full burn-in board. The full board was BIB #01021201010004 and the empty board was BIB #01021201010018. Measurements were taken with the burn-in board in #226, slot #1 & #2



KESTJN (V)


TJN-FM (V)


Empty VDD(V1) 5 5.02 20 5.01 10

Full VDD(V1) 5 5.02 20 5.02 20

Conclusion: Pass

3.22. Package Case Temperature: Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and the sg8tib12ru50v3.s19 pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were epoxied to the top of the device. Used Oven#226, slot #25.



Thermocouple # Thermocouple Location KESTJN (C)

TJN-FM (C)

% Delta

1 Upper Left Corner 126.2 126 0.16% 2 Lower Left Corner 126.0 125 0.80% 3 Center of BIB 126.3 126 0.23% 4 Lower Right Corner 126.1 125 0.88% 5 Upper Right Corner 126.1 126 0.08%

Conclusion: Pass

3.23. Burn-in Board Current: Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta. Used oven #226, slot #1.


BI Program BI Pattern # Units on BIB KESTJN (A) TJN-FM % Delta

1 1

52


6


Page 26 of 37

Program Name Pattern Name Full 1.0 0.95 5% Conclusion: Pass


3.7 Visual inspection Lot No. Lot Size VM Yield (KESTJN) VM Yield (TJN-FM) %Delta

WEXE83222Z00 1000 100% 100% 0% Conclusion: Pass

3.8 Summary: Pass 8. Conclusion: Pass, all the criteria are met. KESTJN is qualified for burn-in operation of product Jumper Tssop16.

~ End of Report ~


Page 27 of 37

TJNFM to KESTJN Burn-In Transfer Correlation Report

– Jumper Tssop20

4. Introduction:

This report details the burn-in correlation plan and result of Jumper (Device: S9S08SG4E2CTJ & S9S08SG8E2MTJ; Production Line: G9TZSG8B; Package code: 6118; Mask set: 2M84G) device so that the KESTJN can burn-in the same production line as in the TJNFM site. These correlation units were first processed at the TJNFM test site and then processed in KESTJN, with the ambient burn-in temperature at 125°C.

KESTJN • Hardware:

Burn-in System: IBE Burn-in Pattern Generator: Flash Memory Burn-in Driver: CC3 Burn-in Board: TS20JUMPER Burn-in Board Header: Socket: 100

• Burn-in Program Software: SG8_T125 Environment Plan: 125C Burn-in Program(s): sg8tib12ru50v3.s19

TJNFM • Hardware:

Burn-in System: IBE Burn-in Pattern Generator: Flash Memory Burn-in Driver: CC3 Burn-in Board: Burn-in Board Header: Socket: Burn-in Program Software:: Environment Plan: Burn-in Program(s): Conclusion: Same hardware and software environment were used in both KESTJN and TJNFM.


KESTJN LJXE83629S00 TP249901 S9S08SG4E2CTJ 2M84G 1000 KESTJN LJXE85127G00 TP200671 S9S08SG8E2MTJ 2M84G 1000 TJNFM LJXE83629S00 TP249901 S9S08SG4E2CTJ 2M84G 1000 TJNFM LJXE85127G00 TP200671 S9S08SG8E2MTJ 2M84G 1000


2.4. Requirements:



Page 28 of 37



Plan, (Y / N?)


Pattern Verify


Y



Equipment Release



N/A



Y





Y





Optional




Page 29 of 37



Y





Y



Burn-in Yield


Y





Y



Visual Inspection


Y




3.25. Pattern Verify Table 1 summarizes the pattern comparison results.


Lot Number BI Program BI Pattern Description KESTJN TJNFM LJXE83629S00 sg8tib12ru50v3.s19 Bin2 Check Pass Pass LJXE85127G00 sg8tib12ru50v3.s19 Bin2 Check Pass Pass

Conclusion: Pass


Page 30 of 37

3.26. Equipment Release: (TJNFM equipment Buy-off and release stuff)

3.27. Burn-in Board Voltage Measurements Tables 2 summarize the voltage measurements taken from an empty and full burn-in board. The full board was BIB #01021301010022 and the empty board was BIB #01021301010023. Measurements were taken with the burn-in board in Oven #226, slot #28&#3.


BIB Condition BIB Location

Target (V)

KESTJN (V)


TJNFM (V)


Full VDD(V1) 5 4.98 20 4.99 10 Empty VDD(V1) 5 4.98 20 5.01 10

Conclusion: Pass

3.28. Package Case Temperature: Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were epoxied to the top of the device. Used Oven #226, slot #46.



Thermocouple # Thermocouple Location KESTJN (C)

TJNFM (C)

% Delta

1 Upper Left Corner 126.0 125 0.8% 2 Lower Left Corner 126.2 126 0.16% 3 Center of BIB 126.6 125.8 0.64% 4 Lower Right Corner 126.1 125.4 0.4% 5 Upper Right Corner 126.3 126.3 0%

Conclusion: Pass

3.29. Burn-in Board Current: Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta. Used oven #226, slot #43.


BI Program BI Pattern # Units on BIB KESTJN (A) TJNFM % Delta

1 1

52


6


Page 31 of 37

Program Name Pattern Name Full 0.9 0.91 1.1% Conclusion: Pass


3.7 Visual inspection Lot No. Lot Size VM Yield (KESTJN) VM Yield (TJNFM) %Delta

LJXE83629S00 1000 100.00% 100% 0% LJXE85127G00 1000 100.00% 100% 0% Conclusion: Pass

3.8 Summary: Pass 10. Conclusion: Pass, all the criteria are met. KESTJN is qualified for burn-in operation of product Jumper Tssop20.

~ End of Report ~


Page 32 of 37

TrioTech to KESC Burn-In Transfer Correlation Report – ALPECA (SC560002MVF92) & ALPECA LITE (SC560006MVF92)

5. Introduction:

This report details the burn-in correlation plan and result of ALPECA (Device: SC560002MVF92R2; Production Line: S9VM3411, G9VM3411, S9VM3412, G9VM3412; Package code: 5253; Mask set: M98A) and ALPECA LITE (Device: SC560006MVF92; Production Line: S9VM3414, G9VM3414; Package code: 5253; Mask set: M03H) devices so that the KESC can burn-in the same production line as in the TRIOTECH site. These correlation units for ALPECA (from 3 different wafer lot) were first split up into 6 smaller lots where 3 of it processed at the TRIOTECH test site and the other 3 of it processed in KESC, with the ambient burn-in temperature at 125°C. While the correlation units for ALPECA LITE were 2 lots where 1 lot processed at the TRIOTECH test site and another 1 lot processed in KESC, with the ambient burn-in temperature at 125°C.

TRIOTECH

• Hardware: Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC3 Socket : 44

• Burn-in Program Software : ALPECA-T125 Environment Plan : 125C Burn-in Program(s) : APEC1_drv_v026.s19

KESC • Hardware:

Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC3 Socket : 44 Burn-in Program Software : ALPECA-T125 Environment Plan : 125C Burn-in Program(s) : APEC1_drv_v026.s19 Conclusion: Same hardware and software environment were used in both TRIOTECH and KESC.


TRIOTECH WEME003DTT00 M1DD525761 SC560002MVF92 3M98A 271 TRIOTECH WEME003DTU00 M1DD525771 SC560002MVF92 3M98A 273 TRIOTECH WEME003DTV00 M1DD525791 SC560002MVF92 3M98A 275

KESC WEMH203YR000 M1DD525761 SC560002MVF92 3M98A 270 KESC WEMH203YR100 M1DD525771 SC560002MVF92 3M98A 273 KESC WEMH203YR200 M1DD525791 SC560002MVF92 3M98A 275

TRIOTECH KLMHA0V9C401 MXDD5351198 SC560006MVF92 0M03H 334 KESC WEMHA0V9C400 MXDD5351198 SC560006MVF92 0M03H 350



Page 33 of 37

2.5. Requirements: The requirements and acceptance criteria were based off of agreements between MCD Reliability and MCD Product Engineering. If a specification exists for this transfer/change, then the specification overrides these requirements.



Plan, (Y / N?)


Pattern Verify


Y



Equipment Release



N/A

Burn-in Board Voltages**


Y


Measure at front & back of empty and full burn-in board. **Measured at voltage test point on board per CAB approval



Y




Goal: Compare temperate of air inside chamber Lot quantity: 1 Units per lot: Full Board Temperature: BI Ta Type of units: good

Optional




Page 34 of 37

BI Duration: N/A Site: Compare Sites

Burn-in Board Current*


Y


Best measured on individual devices. Or measure entire full board current minus empty board current divided by # of devices on full board. * Alternative measurement method (compare full BI board current) approved by quality and CAB.



Y



Burn-in Yield


Y



Visual Inspection


Y





Page 35 of 37

3.31. Pattern Verify: Table 1 summarizes the pattern comparison results.

Table 5.

Lot Number BI Program BI Pattern Description TRIOTECH

KESC

WEMH203YR000/WEME003DTT00 ALPECA-T125 Bin2 Check Pass Pass WEMH203YR100/WEME003DTU00 ALPECA-T125 Bin2 Check Pass Pass WEMH203YR200/WEME003DTV00 ALPECA-T125 Bin2 Check Pass Pass

Conclusion: Passed requirement.

3.32. Equipment Release: (KESC equipment Buy-off and release stuff)

3.33. Burn-in Board Voltage Measurements: Tables 2 summarize the voltage measurements taken from an empty and full burn-in board at the 1st hour of BI time where TIB was being performed, which before the operating life stress cycle begin. Voltages chosen for comparison were the low voltage 1.5V supply and the high voltage 5.0V supply. The 3.3V supply used in burn-in was not externally measured, but is monitored in software. The successful execution of the software without error confirms proper voltage values were set.

Table 2. Burn-in Board Voltage Measurements at 125C


TRIOTECH (V)


KESC (V) Delta from Target (mV)

VDD(V1) 1.5 1.51 10 1.50 0 Empty VPP(V2) 5.0 5.00 0 5.00 0 VDD(V1) 1.5 1.51 10 1.50 0 Full VPP(V2) 5.0 5.00 0 5.00 0

Conclusion: Passed requirement. Notes: - The purpose of this test is to ensure that the burn-in voltage measurement can be set correctly at both sites. The voltage being evaluated in this test were taken during the 1st hour of burn-in

- FSL requirement does not explicitly specify the voltage supply for the measurements. FSL Change Approval Board approved measurements on

1.5 and 5.0V supplies with the 3.3V supply monitored by the BI software. - Supply voltages were monitored by BI SW. If voltages are not being set correctly, an error will occur and BI

will halt. - No error or halt was reported during this qualification. - For new BI program releases, waveforms for voltage supplies are being checked to ensure no spike and

voltages are set correctly.

3.34. Package Case Temperature:

Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were epoxied to the top of the device.


Page 36 of 37

Figure 1. Location of Thermocouples

Table 3. Case Temperatures

Thermocouple # Thermocouple Location TRIOTECH (C)

KESC (C) % Delta

1 Upper Left Corner 126.5 127 0.5% 2 Lower Left Corner 126.9 126 - 0.9% 3 Center of BIB 127.1 126 -1.1% 4 Lower Right Corner 127.3 126 -1.3% 5 Upper Right Corner 126.8 126 - 0.8%


3.35. Ambient Temperature:

Table 4 shows the ambient air temperature in the chamber during BI communication check, before heating up the oven to 125C for BI operation.

Table 4. Chamber Air Temperature

Thermocouple # Thermocouple Location TRIOTECH (C) KESC (C) % Delta 6 Open Area in Chamber 33.5 31 - 2.5%


3.36. Burn-in Board Current: Table 5 shows the current readings measured on a full board of units running patterns at BI Ta. The same set of BI boards was used at both sites.

Table 5. Burn-in Board Current

BI Program BI Pattern # Units on BIB TRIOTECH (A)

KESC (A) % Delta

Program Name Pattern Name Full 5.6 5.5 1.79% Conclusion: Passed requirement.

Notes: - FSL Change Approval Board (CAB) agreed to the deviation of measurement method from the specification. The comparison of the full board current using the same units and boards provided an acceptable correlation between the burn-in sites and enabled faster data collection. With typical empty BIB currents about .1A at KESC and TRIOTECH, subtracting this current from full board value would have no significant impact on the %Delta criteria.

3.37. 3-Lot Burn-in Check: Table 6 shows the result of the 3-lot burn-in using the Bin-to-Bin correlation lots.

1 1

52

3 Feed through Connector (Driver-side)

6


Page 37 of 37

Table 6. 3-Lot Burn-in Check

Lot Lot Size Burn-in WEMH203YR000 270 270 WEMH203YR100 273 273 WEMH203YR200 275 275 WEME003DTT00 271 271 WEME003DTU00 273 273 WEME003DTV00 275 275 KLMHA0V9C401 334 334 WEMHA0V9C400 350 350 Conclusion:

3.38. Burn-in Yield: Table 7 shows the result of the post burn-in yield on one lot.

Table 7. Burn-in Yield

Lot Burn-in

WEMH203YR000 PASS WEME003DTT00 PASS WEMH203YR100 PASS WEME003DTU00 PASS WEMH203YR200 PASS WEME003DTV00 PASS KLMHA0V9C401 PASS WEMHA0V9C400 PASS Conclusion: Passed requirement.

3.11 Visual inspection Lot No. Lot

Size VM Yield (TRIOTECH) VM Yield (KESC) %Delta

WEMH203YR000/WEME003DTT00 270 100% 100% 0 WEMH203YR100/WEME003DTU00 273 100% 100% 0 WEMH203YR200/WEME003DTV00 275 100% 100% 0

KLMHA0V9C401/ WEMHA0V9C400 334 100% 100% 0 Conclusion: Passed requirement.

12. Conclusion: All result showed passed

~ End of Report ~


Documents

TJN-FM to KES-TJN Burn-In Transfer Correlation Report · 2013. 10. 23. · Thermocouple # Thermocouple Location TJN-FM (C) KES-TJN (C) % Delta 6 Open Area in Chamber 126.80 126.90