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Tin whisker Test ReportJESD22A121:May 2005
NEC Electronics CorporationCompound Semiconductor Devices Division
Approved by: :yb edaM:yb deweiveR
GQR-12857Issue date : April 28, 2006
Kiyoshi Fukushima
Manager
Yoichi Emura
Assistant Manager
Kenichi Hosaka
Reliability & Quality Control Department
Kiyoshi Fukushima Yoichi Emura Kenichi Hosaka
Stress type Preconditioning Test Condision Test time
Ta=-40 deg.C to85 deg.C
Ta=60 deg.C,90%RH
Ta=30 deg.C,60%RH
0, 500cy, 1000cy
0, 1000hrs,2000hrs, 3000hrs
0, 1000hrs,2000hrs, 3000hrs
Temperaturecycling
HighTemperature /
HumidityAmbient
Temperature /Humidity
Room temperaturestorage for 4weeks or more
Table 1 Test condition
Table 2 Test samples and result
*Criterion of axial whisker length : Less than 40 microns
Lot Product type Package Lead framematerial
Number ofsamples
inspected(per each test)
Number ofterminalsinspected
(per each test)
Test result
1 PS2805-4-F3 10 1602 PS2805-4-F3 10 1603 PS2815-4-F3 10 1604 PS9617-V 12 965 PS9617-V 12 966 PS9613 12 967 PS7113-1A 6pin DIP 16 968 PS7142-2A 12 969 PS7141-1C 12 96
No whisker* was observed at theall test conditions(Temperature cycling, High Temperature/Humidity Storage and AmbientTemperature/ Humidity Storage )
16pin SSOP
8pin DIP
8pin DIP
Alloy 42
Fe
Cu
Table 3 General information of test samples for Temperatuer cycling
Lot.116pin SSOP
Lot.216pin SSOP
Lot.316pin SSOP
Lot.48pin DIP
Lot.58pin DIP
Lot.68pin DIP
Lot.76pin DIP
Lot.88pin DIP
Lot.98pin DIP
Product nameBasic Information:Date of inspectionTest ConditionCumulative exposure time (hours) or # of cycles at read point
Observations:Type of whisker (Kinked, straight, branched)Axial length of lomgest whisker (microns)Whisker density (Low, Medium, High per inspected area)Additional Comments / Exceptions
Substrate:Type (e.g., package, coupon, ship) 16pin SSOP 16pin SSOP 16pin SSOP 8pin DIP 8pin DIP 8pin DIP 6pin DIP 8pin DIP 8pin DIPSubstrate material (e.g., Cu, CuFe2, Alloy 42) Alloy 42 Alloy 42 Alloy 42 Fe Fe Fe Cu Cu CuForming operation (e.g., etched, stamped)Post finish treatment (none, reflow @ C, Anneal @ time & temp, Time between pre and post-finish treatment (anneal, reflow, etc.)Time between finish application and initiation of environmental a 4 weeks 4 weeks 4 weeks 22 weeks 4 weeks 4 weeks 4 weeks 4 weeks 4 weeks
Underplating:Underplate date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006Underplate material (e.g., Ni, Ag, etc.)Bath type (e.g., sulfamate) KCNUnderplate type (bright, matte, satin)Underplate thickness (microns) 0.5(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ)
Tin Finish:Finish application date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006Alloy Type (e,g., tin, tin-bismurth)If an alloy of tin is used, alloy content range (e.g., 1-3%)Bath type (Methane sulfonic acid, mixed acid, etc)Finish type (bright, matte, satin)Finish thickness (microns)Finish grain size (microns)Current density (Amps/dm)Carbon content in the deposit -
Test samples
Photocoupler OC-MOSFET
-
Tin-bismuth
-
matte10 microns(typ)
--
--
sulfonic acid2.2%(typ)
* Criterion of axial whisker length : Less than 40 microns
-None
-Cu
NaCN KCN
stampednone
Temperatuer cycling (Ta=-40 deg.C to 85 deg.C)1000cycles
-No whisker was observed.*
matte
We show you visual inspection results(SEM images) of representative sample per each Lot in APPENDIX 1-3
18-Jan-06
Table 4 General information of test samples for High Temperature / Humidity Storage
Lot.116pin SSOP
Lot.216pin SSOP
Lot.316pin SSOP
Lot.48pin DIP
Lot.58pin DIP
Lot.68pin DIP
Lot.76pin DIP
Lot.88pin DIP
Lot.98pin DIP
Product nameBasic Information:Date of inspectionTest ConditionCumulative exposure time (hours) or # of cycles at read point
Observations:Type of whisker (Kinked, straight, branched)Axial length of lomgest whisker (microns)Whisker density (Low, Medium, High per inspected area)Additional Comments / Exceptions
Substrate:Type (e.g., package, coupon, ship) 16pin SSOP 16pin SSOP 16pin SSOP 8pin DIP 8pin DIP 8pin DIP 6pin DIP 8pin DIP 8pin DIPSubstrate material (e.g., Cu, CuFe2, Alloy 42) Alloy 42 Alloy 42 Alloy 42 Fe Fe Fe Cu Cu CuForming operation (e.g., etched, stamped)Post finish treatment (none, reflow @ C, Anneal @ time & temp, Time between pre and post-finish treatment (anneal, reflow, etc.)Time between finish application and initiation of environmental a 4 weeks 4 weeks 4 weeks 22 weeks 4 weeks 4 weeks 4 weeks 4 weeks 4 weeks
Underplating:Underplate date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006Underplate material (e.g., Ni, Ag, etc.)Bath type (e.g., sulfamate) KCNUnderplate type (bright, matte, satin)Underplate thickness (microns) 0.5(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ)
Tin Finish:Finish application date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006Alloy Type (e,g., tin, tin-bismurth)If an alloy of tin is used, alloy content range (e.g., 1-3%)Bath type (Methane sulfonic acid, mixed acid, etc)Finish type (bright, matte, satin)Finish thickness (microns)Finish grain size (microns)Current density (Amps/dm)Carbon content in the deposit
---
Test samples
Photocoupler OC-MOSFET
-
We show you visual inspection results(SEM images) of representative sample per each Lot in APPENDIX 4-6
CuNaCN KCN
matte
20-Apr-06High Temperature / Humidity Storage (Ta=60 deg.C, 90%RH)
3000hrs
-No whisker was observed.*
Tin-bismuth
-
stampednone
--
* Criterion of axial whisker length : Less than 40 microns
-None
-
sulfonic acid2.2%(typ)
matte10 microns(typ)
Table 5 General information of test samples for Ambient Temperature / Humidity Storage
Lot.116pin SSOP
Lot.216pin SSOP
Lot.316pin SSOP
Lot.48pin DIP
Lot.58pin DIP
Lot.68pin DIP
Lot.76pin DIP
Lot.88pin DIP
Lot.98pin DIP
Product nameBasic Information:Date of inspectionTest ConditionCumulative exposure time (hours) or # of cycles at read point
Observations:Type of whisker (Kinked, straight, branched)Axial length of lomgest whisker (microns)Whisker density (Low, Medium, High per inspected area)Additional Comments / Exceptions
Substrate:Type (e.g., package, coupon, ship) 16pin SSOP 16pin SSOP 16pin SSOP 8pin DIP 8pin DIP 8pin DIP 6pin DIP 8pin DIP 8pin DIPSubstrate material (e.g., Cu, CuFe2, Alloy 42) Alloy 42 Alloy 42 Alloy 42 Fe Fe Fe Cu Cu CuForming operation (e.g., etched, stamped)Post finish treatment (none, reflow @ C, Anneal @ time & temp, Time between pre and post-finish treatment (anneal, reflow, etc.)Time between finish application and initiation of environmental a 4 weeks 4 weeks 4 weeks 22 weeks 4 weeks 4 weeks 4 weeks 4 weeks 4 weeks
Underplating:Underplate date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006Underplate material (e.g., Ni, Ag, etc.)Bath type (e.g., sulfamate) KCNUnderplate type (bright, matte, satin)Underplate thickness (microns) 0.5(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ) 0.9(typ)
Tin Finish:Finish application date Oct, 2006 Oct, 2006 Oct, 2006 Jun, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006 Oct, 2006Alloy Type (e,g., tin, tin-bismurth)If an alloy of tin is used, alloy content range (e.g., 1-3%)Bath type (Methane sulfonic acid, mixed acid, etc)Finish type (bright, matte, satin)Finish thickness (microns)Finish grain size (microns)Current density (Amps/dm)Carbon content in the deposit
Test samples
10 microns(typ)
No whisker was observed.*
Tin-bismuth
-
stamped
Photocoupler OC-MOSFET
-
sulfonic acid2.2%(typ)
matte
-
--
none
--
* Criterion of axial whisker length : Less than 40 microns
-Cu
NaCN KCNmatte
None-
We show you visual inspection results(SEM images) of representative sample per each Lot in APPENDIX 7-9
20-Apr-06Ambient Temperature / Humidity Storage (Ta=30 deg.C, 60%RH)
3000hrs
-
APPENDIX 1 SEM images(1)
S/N1
Package : 16pin SSOP
= After Temperature cycling(1000cycles) =
S/N1 S/N1
Lead frame material : Alloy 42
Sample size : 10p per each Lot
Sample
Lot.1 Lot.2 Lot.3
1pin
8pin
Result : No whisker was observed
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
×250
×250
×250
×250
×250
×250
Test Condition : Ta=-40 deg.C to 85 deg.C
Criterion of axial whisker length : Less than 40 microns
APPENDIX 2
S/N1
Package : 8pin DIP
S/N1 S/N1
Lead frame material : Fe
Sample size : 12p per each Lot
Sample
Lot.4 Lot.5 Lot.6
1pin
4pin
Result : No whisker was observed
= After Temperature cycling(1000cycles) =
×250 ×250 ×250
×250 ×250 ×250
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=-40 deg.C to 85 deg.C
Criterion of axial whisker length : Less than 40 microns
SEM images(2)
APPENDIX 3
S/N1
Package : Lot.7 6pin DIP
S/N1 S/N1
Lead frame material : Cu
Sample size : Lot.7 16p per each Lot
Sample
Lot.7 Lot.8 Lot.9
1pin
4pin
Result : No whisker was observed
Criterion of axial whisker length : Less than 40 microns
= After Temperature cycling(1000cycles) =
Lot.8,9 12p per each Lot
Lot.8,9 8pin DIP
×250 ×250 ×250
×250 ×250 ×250
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=-40 deg.C to 85 deg.C
SEM images(3)
APPENDIX 4
S/N1
Package : 16pin SSOP
= After High Temperature / Humidity Storage(3000hours) =
S/N1 S/N1
Lead frame material : Alloy 42
Sample size : 10p per each Lot
Sample
Lot.1 Lot.2 Lot.3
1pin
8pin
Result : No whisker was observed
×250 ×250 ×250
×250 ×250 ×250
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=60 deg.C, 90%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(4)
APPENDIX 5
S/N1
Package : 8pin DIP
S/N1 S/N1
Lead frame material : Fe
Sample size : 12p per each Lot
Sample
Lot.4 Lot.5 Lot.6
1pin
4pin
Result : No whisker was observed
×250 ×250 ×250
×250 ×250 ×250
= After High Temperature / Humidity Storage(3000hours) =
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=60 deg.C, 90%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(5)
APPENDIX 6
S/N1 S/N1 S/N1 Lot.7 Lot.8 Lot.9
1pin
4pin
Result : No whisker was observed
×250 ×250 ×250
×250 ×250 ×250
Package : Lot.7 6pin DIPLead frame material : Cu
Sample size : Lot.7 16p per each Lot
Sample
Lot.8,9 12p per each Lot
Lot.8,9 8pin DIP
= After High Temperature / Humidity Storage(3000hours) =
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=60 deg.C, 90%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(6)
APPENDIX 7
S/N1
Package : 16pin SSOP
S/N1 S/N1
Lead frame material : Alloy 42
Sample size : 10p per each Lot
Sample
Lot.1 Lot.2 Lot.3
1pin
8pin
Result : No whisker was observed
= After Ambient Temperature / Humidity Storage(3000hours) =
×250 ×250 ×250
×250 ×250 ×250
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=30 deg.C, 60%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(7)
APPENDIX 8
S/N1
Package : 8pin DIP
S/N1 S/N1
Lead frame material : Fe
Sample size : 12p per each Lot
Sample
Lot.4 Lot.5 Lot.6
1pin
4pin
Result : No whisker was observed
×250 ×250 ×250
×250 ×250 ×250
= After Ambient Temperature / Humidity Storage(3000hours) =
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=30 deg.C, 60%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(8)
APPENDIX 9
S/N1 S/N1 S/N1 Lot.7 Lot.8 Lot.9
1pin
4pin
Result : No whisker was observed
×250 ×250 ×250
×250 ×250 ×250
Package : Lot.7 6pin DIPLead frame material : Cu
Sample size : Lot.7 16p per each Lot
Sample
Lot.8,9 12p per each Lot
Lot.8,9 8pin DIP
= After Ambient Temperature / Humidity Storage(3000hours) =
Equipment : Scanning Electron Microscope(The following images are lead bending portion of each samples of terminals)
Test Condition : Ta=30 deg.C, 60%RH
Criterion of axial whisker length : Less than 40 microns
SEM images(9)
