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THE UNIVERSAL SERIAL BUS 3.0 SEMINAR REPORT Submitted by ARJUN C C in partial fulfillment for the award of the degree of BACHELOR OF TECHNOLOGY in COMPUTER SCIENCE AND ENGINEERING SREE NARAYANA GURUKULAM COLLEGE OF ENGINEERING KADAYIRUPPU, KOLENCHERY 682311 MAHATMA GANDHI UNIVERSITY: KOTTAYAM 686580 OCTOBER 2009

The Universal Serial Bus 3.0

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THE UNIVERSAL SERIAL BUS 3.0SEMINAR REPORT

Submitted by

ARJUN C C

in partial fulfillment for the award of the degree

of

BACHELOR OF TECHNOLOGY

in

COMPUTER SCIENCE AND ENGINEERING

SREE NARAYANA GURUKULAM COLLEGE OF ENGINEERING

KADAYIRUPPU, KOLENCHERY 682311

MAHATMA GANDHI UNIVERSITY: KOTTAYAM 686580

OCTOBER 2009

SREE NARAYANA GURUKULAM COLLEGE OF ENGINEERING,

KOLENCHERYDEPARTMENT OF COMPUTER SCIENCE AND ENGINEERING

CERTIFICATE

Certified that the seminar report “THE UNIVERSAL SERIAL BUS 3.0” is

the bonafide work done by “ARJUN C C” in partial fulfillment of award of

B.Tech Degree in “COMPUTER SCIENCE AND ENGINEERING”.

Mr. Prof. K. Girija Sankar Mrs.Silpa Kamalan ,Lecturer,CSE

HEAD OF THE DEPARTMENT GUIDE

Submitted for the Viva-Voce examination on …………………………………….

Name and Signature of Name and signature of Internal Examiner External Examiner

ACKNOWLEDGEMENT

Dedicating this seminar to the Almighty God whose abundant grace and mercies enabled its

successful completion, I would like to express my profound gratitude to all the people who had inspired and

motivated me to undertake this seminar.

I wish to express our sincere thanks to our Head of the Department, Mr. Prof. K. Girija Sankar, for

providing an opportunity to undertake this seminar. I am deeply indebted to my seminar guide Mrs.Silpa

Kamalan, lecturer in the Department of Computer Science and Engineering for providing me with valuable

advice and guidance during the course of the seminar.

Finally I would like to express my gratitude to Sree Narayana Gurukulam College of Engineering for

providing me with all the required facilities without which the seminar would not have been possible.

TABLE OF CONTENTS

TITLE PAGE NO

ABSTRACT

ACKNOWLEDGEMENTS

CHAPTER 1: INTRODUCTION 6

CHAPTER 2: HISTORY 7

CHAPTER 3: ARCHITECTURE 9

CHAPTER 4: PHYSICAL STRUCTURE 12

CHAPTER 5: FEATURES 16

CHAPTER 6: COMPARISON 19

CHAPTER 7: APPLICATION 22

CHAPTER 8: CONCLUSION 24

CHAPTER 9: REFERENCE 25

UNIVERSAL SERIAL BUS 3.0

ABSTRACT

In information technology, Universal Serial Bus (USB) is a serial bus standard to connect devices to

a host computer. USB was designed to allow many peripherals to be connected using a single standardized

interface socket and to improve plug and play capabilities by allowing hot swapping; that is, by allowing

devices to be connected and disconnected without rebooting the computer or turning off the device. Other

convenient features include providing power to low-consumption devices, eliminating the need for an

external power supply; and allowing many devices to be used without requiring manufacturer-specific device

drivers to be installed.

The U S B 3.0 is the upcoming version of the Universal Serial Bus (USB). The specification of the

new standard had been announced by USB Implementers Forum (USB-IF). The main feature of the new USB

is the raw throughput is 500 MByte/s. The new USB is also capable to provide more power to drive the

devices. USB 3.0 is highly backward compatible that is, it is capable of operating with the current USBs

which is USB 2.0

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CHAPTER 1

INTRODUCTION

Universal Serial Bus (USB) is a serial bus standard to connect devices to a host computer. The USB

3.0 is the upcoming version of the USB. The USB 3.0 is also called super speed USB. Because the USB 3.0

support a raw throughput of 500MByte/s. As its previous versions it also support the plug and play capability,

hot swapping etc. USB was designed to allow many peripherals to be connected using a single standardized

interface socket. . Other convenient features include providing power to low-consumption devices, eliminat­

ing the need for an external power supply; and allowing many devices to be used without requiring manufac­

turer-specific device drivers to be installed.

There are many new features included in the new Universal Serial Bus Specification. The most im­

portant one is the supers speed data transfer itself. Then the USB 3.0 can support more devices than the cur­

rently using specification which is USB 2.0. The bus power spec has been increased so that a unit load is

150mA (+50% over minimum using USB 2.0). An unconfigured device can still draw only 1 unit load, but a

configured device can draw up to 6 unit loads (900mA, an 80% increase over USB 2.0 at a registered maxim­

um of 500mA). Minimum device operating voltage is dropped from 4.4V to 4V. When operating in Super­

Speed mode, full-duplex signaling occurs over 2 differential pairs separate from the non-SuperSpeed differ­

ential pair. This result in USB 3.0 cables containing 2 wires for power and ground, 2 wires for non-Super­

Speed data, and 4 wires for SuperSpeed data, and a shield (not required in previous specifications).

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CHAPTER 2

HISTORY

Prereleases

• USB 0.7: Released in November 1994.

• USB 0.8: Released in December 1994.

• USB 0.9: Released in April 1995.

• USB 0.99: Released in August 1995.

• USB 1.0: Release Candidate: Released in November 1995.

USB 1.0

• USB 1.0: Released in January 1996.

Specified data rates of 1.5 Mbit/s (Low-Speed) and 12 Mbit/s (Full-Speed). Does not allow for ex­

tension cables or pass-through monitors (due to timing and power limitations). Few such devices actu­

ally made it to market.

• USB 1.1: Released in September 1998.

Fixed problems identified in 1.0, mostly relating to hubs. Earliest revision to be widely adopted.

USB 2.0

USB 2.0: Released in April 2000.Added higher maximum speed of 480 Mbit/s (now called Hi-Speed). Further modifications to the USB spe­cification have been done via Engineering Change Notices (ECN). The most important of these ECNs are in­cluded into the USB 2.0 specification package available from USB.org:

• Mini-B Connector ECN: Released in October 2000.Specifications for Mini-B plug and receptacle. These should not be confused with Micro-B plug and receptacle.

• Pull-up/Pull-down Resistors ECN: Released in May 2002.

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• Interface Associations ECN: Released in May 2003.New standard descriptor was added that allows multiple interfaces to be associated with a single device function.

• Rounded Chamfer ECN: Released in October 2003.A recommended, compatible change to Mini-B plugs that results in longer lasting connectors.

• Inter-Chip USB Supplement: Released in March 2006.• On-The-Go Supplement 1.3: Released in December 2006.

USB On-The-Go makes it possible for two USB devices to communicate with each other without re­quiring a separate USB host. In practice, one of the USB devices acts as a host for the other device.

• Battery Charging Specification 1.0: Released in March 2007.Adds support for dedicated chargers (power supplies with USB connectors), host chargers (USB hosts that can act as chargers) and the No Dead Battery provision which allows devices to temporarily draw 100 mA current after they have been attached. If a USB device is connected to dedicated charger, maximum current drawn by the device may be as high as 1.8A. (Note that this document is not distrib­uted with USB 2.0 specification package.)

• Micro-USB Cables and Connectors Specification 1.01: Released in April 2007.• Link Power Management Addendum ECN: Released in July 2007.

This adds a new power state between enabled and suspended states. Device in this state is not required to reduce its power consumption. However, switching between enabled and sleep states is much faster than switching between enabled and suspended states, which allows devices to sleep while idle.

• High-Speed Inter-Chip USB Electrical Specification Revision 1.0: Released in September 2007.

USB 3.0• On September 18, 2007, Pat Gelsinger demonstrated USB 3.0 at the Intel Developer Forum. The USB

3.0 Promoter Group announced on November 17, 2008, that version 1.0 of the specification has been

completed and is transitioned to the USB Implementers Forum (USB-IF), the managing body of USB

specifications. This move effectively opens the spec to hardware developers for implementation in

future products.

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CHAPTER 3

ARCHITECTURE

ARCHITECTURAL COMPONENTS

HUB

The hub provide electrical interface between the USB devices and the host. Hubs are directly

responsible for supporting many of the attributes that make USB user friendly and hide its complexity from

the user. Listed below the major aspects of USB functionality that hub support:

• Connectivity behavior

• Power management

• Device connect/disconnect detection

• Bus fault detection

• Superspeed and USB2.0 (high-speed, full-speed, an low-speed) support

A USB 3.0 hub incorporates a USB 2.0 hub and a SuperSpeed hub consisting of two principal

components: the SuperSpeed Hub Repeater/Forwarder and the SuperSpeed Hub controller. The hub

repeater/forwarder is responsible for connectivity and setup and tear-down. It also support fault detection and

recovery. The Hub controller provides the mechanism for host-hub communication. Hub-specific status and

control commands permit the host to configure hub and to monitor and control its individual downstream

port.

HOST

There are two hosts are incorporated in a USB 3.0 host. One is SuperSpeed host and the second one is

Non-SuperSpeed host. This incorporation ensures the backward compatibility of the USB 3.0 hub. Here the

SuperSpeed hub will be supporting the 500MB/sec data transfer rate with full duplex mode. Then the Non-

SuperSpeed host will be supporting the old data rates such as High-Speed, Full-Speed, Low-Speed. The host

here interacts with the devices by the help of a host controller. When the host is powered off, the hub does not

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provide power to is downstream unless the hub support the charging application. When the host is powered

on with SuperSpeed support enabled on its downstream port by default the following is the typical sequence

of events.

• Hub detects VBUS SuperSpeed support and powers its downstream ports with SuperSpeed enabled.

• Hub connects both as s SuperSpeed and as a High-Speed device.

• Device detects VBUS and SuperSpeed support and connects as a SuperSpeed device.

• Host system begins hub enumeration at high-speed and SuperSpeed.

• Host system begins device enumeration at SuperSpeed.

A SuperSpeed host is a source or sink of information. It implements the required host-end,

SuperSpeed. Communications layer to accomplish information exchanges over the bus. It owns the

SuperSpeed data activity schedule and management of the SuperSpeed bus and all devices connected to it.

The host includes an implementation number of the root downstream ports for SuperSpeed and USB 2.0.

Through these ports the host:

• Detect the attachment and removal of USB device

• Manages control flow between the host and the USB device

• Manages data flow between the host and the USB device

• Collect the status activity statistics

• Provide power to the attached USB device

DEVICE

SuperSpeed devices are sources or sink of information exchanges. They implement the required

device-end, SuperSpeed communication layers to accomplish information exchanges between a driver on the

host and a logical function on the device. All SuperSpeed devices share their base architecture with USB 2.0.

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They are required to carry information for self-identification and generic configuration. They are also

required to demonstrate behavior consistent with the defined SuperSpeed Device States.

All devices are assigned a USB address when enumerated by the host. Each device supports one or

more pipes though which the host may communicate with the device. All devices must be support a designed

pipe at endpoint zero to which the device’s Default Control Pipe is attached. All devises support a common

access mechanism for accessing information through this control pipe. SuperSpeed inherit the the categories

of information that are supported on the default pipe from the USB 2.0. The USB 3.0 connection model

allows for the discovery and configuration of the USB device at the highest signaling speed supported by the

device. The USB 3.0 supports an increased power supply for the devices operating at the SuperSpeed. USB

3.0 devices within a single physical package (ie, a single peripheral) can consist of a number of functional

topologies including single function , multiple functions on a single peripheral device (composite device), and

permanently attached peripheral devices behind an integrated hub.

Figure 1.0 Architecture of USB 3.0

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CHAPTER 4

PHYSICAL STRUCTURE

CABLE STRUCTURE

USB 3.0 cables have eight primary conductors: three twisted signal pairs for USB data paths and a

power pair. In addition to the twisted signal pair for the USB 2.0 data path, two twisted signal pairs are used

to provide the SuperSpeed data path, one for the transmit path and one for the receive path. USB 3.0

receptacles (both upstream and down stream) are backward compatible with USB 2.0 connector plug. USB

3.0 cables and plugs are not intended to be compatible with USB 2.0 upstream receptacles. As an aid to the

user, USB 3.0 mandates standard coloring for plastic portions of USB 3.0 plugs and receptacles. Electrical

(insertion loss, return loss, cross talk etc) performance for USB 3.0 is defined with regard to raw cables, mate

connectors, and mated cable assemblies, with compliance requirements using industry test specification

established for the later two catagories.

Figure 2.0 the architectural view of the USB 3.0 bus provided by USB-IF. VBUS : this cable is used to carry power.

GND : it’s the ground of the power cable.

D+ : it’s the ‘+’ data bus for the USB 3.0, which support backward compatibility with 2.0

D- : it’s the ‘-’ data bus for the USB 3.0, which support backward compatibility with 2.0

SSTX+ : it’s the ‘+’ data transmission bus of USB 3.0, which support SuperSpeed

SSTX- : it’s the ‘-’ data transmission bus of USB 3.0, which support SuperSpeed

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SSRX+ : it’s the ‘+’ data reception bus of USB 3.0, which support SuperSpeed

SSRX- : it’s the ‘-’ data reception bus of USB 3.0, which support SuperSpeed

Here the USB is using a differential pair data cables. The differential pair data cables are used to d

reduce the transmission error. The data to be transmitted is passed through an opamp and the inverse of the

data is produced. And then these two data are passed through the +, - lines provided. In USB 3.0 both

shielded and unshielded differential pair lines are used. Shielded for the SuperSpeed transmission and the

unshielded for the non-SuperSpeed.

CROSS SECTIONAL REVIEW

Figure 3.0 cross sectional view of USB 3.0 cables

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Table 4.0 color codes wires.

CONNECTORS

The USB 3.0 specification defines the following connectors:

• USB 3.0 standard-A plug and receptacle

• USB 3.0 standard-B plug and receptacle

• USB 3.0 powered-B plug and receptacle

• USB 3.0 micro-B plug and receptacle

• USB 3.0 micro-A plug

• USB 3.0 micro-AB receptacle

RECEPTACLE PLUG ACCEPTEDUSB 2.0 Standard-A USB 2.0 Standard-A or USB 3.0 Standard-AUSB 3.0 Standard-A USB 3.0 Standard-A or USB 2.0 Standard-AUSB 2.0 Standard-B USB 2.0 Standard-BUSB 3.0 Standard-B USB 3.0 Standard-B or USB 2.0 Standard-BUSB 3.0 Powered-B USB 3.0 Powered-B, USB 3.0 Standard B,

USB 2.0 Standard-BUSB 2.0 Micro-B USB 2.0 Micro-BUSB 3.0 Micro-B USB 3.0 Micro-B or USB 2.0 Micro-BUSB 2.0 Micro-AB USB 2.0 Micro-B or USB 2.0 Micro-AUSB 3.0 Micro-AB USB 3.0 Micro-B, USB 3.0 Micro-A

USB 2.0 Micro-B, or USB 2.0 Micro-Atable 5.0 plug accepted by Receptacles

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PINNO

COLOUR DESCRIPTION

1 RED POWER2 GREEN USB 3.0 DATA+3 WHITE USB 3.0 DATA-4 BLACK GROUND5 ORANGE SUPER SPEED RECEIVER-6 VIOLET SUPER SPEED RECEIVER+7 BLACK GROUND USB 3.08 GREEN SUPER SPEED TRANSMITTER-9 BLUE SUPER SPEED TRANSMITTER+

UNIVERSAL SERIAL BUS 3.0

STANDARD A TYPE CONNECTOR

USB3_RX : +/- data bus for reception USB 3.0

USB3_TX : +/- data bus for transmission USB 3.0

-D/+D : +/- data bus for USB 2.0

VBUS : Carry power

GND : Ground

Figure 6.0 diagram type A connector

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CHAPTER 5 FEATURES

TRANSFER RATES

A USB supports following data rates:

• A low speed rate of 1.5 Mbit/s (187.5 kB/s) is defined by USB 1.0. It is very similar to full speed

operation except each bit takes 8 times as long to transmit. It is intended primarily to save cost in low-

bandwidth human interface devices (HID) such as keyboards, mice, and joysticks.

• The full speed rate of 12 Mbit/s (1.5 MB/s) is the basic USB data rate defined by USB 1.1. All USB

hubs support full speed.

• A high-speed (USB 2.0) rate of 480 Mbit/s (60 MB/s) was introduced in 2001. All high-speed devices

are capable of falling back to full-speed operation if necessary.

• A SuperSpeed (USB 3.0) rate of 5.0 Gbit/s (625 MB/s). The USB 3.0 specification was released by

Intel and its partners in August 2008

BACKWARD COMPATIBILITY

To accommodate the additional pins for SuperSpeed mode, the physical form factors for USB 3.0

plugs and receptacles have been modified from those used in previous versions. Standard-A cables have

extended heads where the SuperSpeed connectors extend beyond and slightly above the legacy connectors.

Similarly, the Standard-A receptacle is deeper to accept these new connectors. A legacy Standard-A cable

will operate as intended and will never interact with the SuperSpeed connectors, ensuring backward

compatibility. The Standard-B modifications could not be made as elegantly; the SuperSpeed connectors had

to be placed on top of the existing form factor, making legacy Standard-B plugs workable on SuperSpeed

Standard-B receptacles, but not vice versa.

POWER SPECIFICATIONS

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The bus power spec has been increased so that a unit load is 150mA (+50% over minimum using USB

2.0). An unconfigured device can still draw only 1 unit load, but a configured device can draw up to 6 unit

loads (900mA, an 80% increase over USB 2.0 at a registered maximum of 500mA). Minimum device

operating voltage is dropped from 4.4V to 4V.

CABLE LENGTH

USB 3.0 does not define cable assembly lengths, except that it can be of any length as long as it meets

all the requirements defined in the specification. However, electronicdesign.com estimates cables will be

limited to 3 m at SuperSpeed.

TRANSFER MODE

When operating in SuperSpeed mode, full-duplex signaling occurs over 2 differential pairs separate

from the non-SuperSpeed differential pair. Full-duplex means that the data can be transferred in two

directions simultaneously.

OTHER FEATURES

• New power management features include support of idle, sleep and suspend states, as well as Link-,

Device-, and Function-level power management.

• Technology is similar to a single channel (1x) of PCI Express 2.0 (5-Gbit/s). It

uses 8B10B encoding, linear feedback shift register (LFSR) scrambling for data, spread spectrum. It

forces receivers to use low frequency periodic signaling (LFPS), dynamic equalization, and training

sequences to ensure fast signal locking.

• USB 3.0 extends the bulk transfer type in SuperSpeed with Streams. This extension allows a host and

device to create and transfer multiple streams of data through a single bulk pipe

• SuperSpeed establishes a communications pipe between the host and each device, in a host-directed

protocol. In contrast, USB 2.0 broadcasts packet traffic to all devices.

• As its ancestors USB 3.0 support hot swapping. That is the USB cables can be connected and operated

without rebooting the computer.

• As its ancestors USB 3.0 networks use a tiered-star topology

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• The USB standard specifies relatively loose tolerances for compliant USB connectors, intending to

minimize incompatibilities in connectors produced by different vendors (a goal that has been very

successfully achieved). Unlike most other connector standards, the USB specification also defines

limits to the size of a connecting device in the area around its plug. This was done to prevent a device

from blocking adjacent ports due to its size. Compliant devices must either fit within the size

restrictions or support a compliant extension cable which does.

• The connectors are designed to be robust. Many previous connector designs were fragile, with pins or

other delicate components prone to bending or breaking, even with the application of only very

modest force. The electrical contacts in a USB connector are protected by an adjacent plastic tongue,

and the entire connecting assembly is usually further protected by an enclosing metal sheath. As a

result USB connectors can safely be handled, inserted, and removed, even by a young child.

• It is difficult to attach a USB connector incorrectly. Connectors cannot be plugged in upside down,

and it is clear from the appearance and kinesthetic sensation of making a connection when the plug

and socket are correctly mated. However, it is not obvious at a glance to the inexperienced user (or to

a user without sight of the installation) which way around the connector goes, thus it is often

necessary to try both ways. More often than not, however, the side of the connector with the trident

logo should be on top or towards the user.

• USB communication takes the form of packets. Initially, all packets are sent from the host, via the

root hub and possibly more hubs, to devices. Some of those packets direct a device to send some

packets in reply.

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CHAPTER 6COMPARISONS

USB 3.0 WITH FIREWIRE

The firewire is the industrial name of the cable standard called IEEE 1394. S3200 is the upcoming

product in this series. Any common computer users might never see a FireWire cable; professionals and Mac

owners tend to be more familiar with the technology. Right now, there are two versions of FireWire in use;

FireWire 400 and 800. If you’re catching on to the number scheme by now, you might guess that FireWire

400 transfers at 400 Mbps and 800 transfers at 800 Mbps. The comparison between the USB 3.0 and the

FireWire is made below.

• USB 3.0 promises a data transfer rate of 4.8 Gbps, where FireWire 3200 promises to deliver 3.2 Gbps.

FireWire 3200 has a maximum capability of a 3.2Gbps transfer rate, which is 1.6Gbps slower than

USB 3.0

• FireWire 400 is easier to find than FireWire 800 (except on Macs), and the number of available ports

is typically limited to 1-2, even on a high-end motherboard. USB 2.0 ports, on the other hand, are

plentiful, with most boards offering 8-12 in some combination of included ports and onboard headers.

• The firewire is capable to deliver more power on a single cable than the USB 3.0.

• FireWire has always been the more technologically-advanced standard, with its faster transfer speeds,

lower CPU utilization, and the ability to provide more power to attached devices (devices that can run

off a single FireWire port could well require two USB ports). These advantages, however, have never

managed to overcome USB 2.0's general popularity, and FireWire remains a niche interface outside

certain peripheral markets (i.e., video cameras), where it has always done well, and Macintosh

computers.

• The wide popularity and simplicity of the USB series are capable of suppressing the S3200. The main

reason is that the Firewire is generally seen only in the Mac computers, so the Firewire is not much

popular among the normal users.

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• The new S1600/S3200 cables will be fully compatible with both older FireWire 800 cables and

FireWire 400/800 devices. Like wise the USB 3.0 cables will also be compatible with the old USB 2.0

versions.

• One of the other advantages of USB 3.0 over the Firewire is that the USB ports are available in all

standard motherboards in 6-12 numbers. They don’t need any add on cards for that. But when we take

the case of the Firewire they need add on card to support. And also they are not popular in the

ordinary motherboards.

• The USB 3.0 is supporting master-slave architecture while the Firewire is supporting a peer-to-peer

architecture.

• USB has two key things going for it though – it’s cheaper and more popular – which means it’s easier

to buy (for your wallet) and easier to use (for your mainstream devices). FireWire has long been

supported by Apple, whereas USB has been found in most Microsoft machines, and the difference

reminds me a lot of the difference between the two companies

USB 3.0 WITH USB 2.0

As we know the USB 3.0 is the next version of the USB series. So we cant expect anything other than

advantages from USB 3.0 over 2.0. Still we perform a comparison to find out what are advantages which we

can expect from the new SuperSpeed USB (USB 3.0).

• The new spec will support data transfers at 4.8 gigabits per second, or Gbps, nearly 10 times faster

than the current standard’s 480 megabits per second and six times faster than FireWire 800. It’s also

400 times faster than the 12 Mbps offered by the original spec, USB 1.0.To get a sense of the speed

increase, consider this: Under USB 2.0 it takes about 10 minutes to transfer a high-def video from a

Blu-ray disc. With USB 3.0, it will take just about a minute.

• USB 2.0 is also known as "Hi-Speed USB," while USB 3.0 will have the confusingly similar moniker

"SuperSpeed USB."

• The new USB 3.0 connectors and devices will be compatible with older USB ports (on devices using

USB 2.0 and 1.0) but they will be limited to the older ports’ slower speeds. The latest SuperSpeed

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USB-enabled devices connecting to older PCs running USB 2.0 or lower will experience data transfer

rates that are much slower.

• USB 2.0 uses a polling-based architecture, which means the host computer has to constantly check the

bus to see if any devices are attached and if so, whether they are doing anything. As a result, that

keeps the host computer busy, drawing power even when it’s not needed. It’s a problem when you

attach a USB device to a laptop running on battery. USB 3.0 offers better specifications for power

management. USB 3.0 will move to an interrupt-driven architecture where your PC can ignore the

connected device till the latter actually does something. That can really lower the power consumption.

• It also has better power output, 900 milliamps compared to 100 milliamps with USB 2.0. That means

up to four devices can be charged from a single USB port and charged faster.

• When we look to the architecture of the USB 3.0, unlike the USB 2.0, USB 3.0 support 9 pins instead

of 5 pins.

• The USB 3.0 support full-duplex data transfer. The full duplex means you can send data in either

direction (bi-directionally) simultaneously. But USB 2.0 was supporting half-duplex transmission that

you can transmit the data in either direction but not simultaneously.

• The main change the users can observe is coming in the inner side of the USB 3.0. The USB 2.0’s

inner side was appeared to be in gray or black, it appeared even white in some time. But the USB

3.0’s inner side will be in blue.

• Since the USB 3.0 is supporting more cables than USB 2.0 the cable will be appeared a little much

thick for the users.

• When we look at the length supported by each one USB 2.0 was supporting about 5 meters USB 3.0

will be supporting about 3 meters.

CHAPTER 7APPLICATIONS

The USB ports are used for a number of applications. The USB ports get the popularity because of its

simplicity as well the easiness in use. The main application of USB 3.0 is listed below.

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• USB implements connections to storage devices using a set of standards called the USB mass storage

device class (referred to as MSC or UMS). This was initially intended for traditional magnetic and

optical drives, but has been extended to support a wide variety of devices, particularly flash drives.

This generality is because many systems can be controlled with the familiar idiom of file manipulation

within directories (The process of making a novel device look like a familiar device is also known as

extension)

• USB 3.0 can also support portable hard disk drives. The earlier versions of USBs were not supporting

the 3.5 inch hard disk drives. Originally conceived and still used today for optical storage devices

(CD-RW drives, DVD drives, etc.), a number of manufacturers offer external portable USB hard

drives, or empty enclosures for drives, that offer performance comparable to internal drives[citation

needed]. These external drives usually contain a translating device that interfaces a drive of

conventional technology (IDE, ATA, SATA, ATAPI, or even SCSI) to a USB port. Functionally, the

drive appears to the user just like an internal drive.

• These are used to provide power for low power consuming devises. These can be used for charging

the mobile phones.

• Though most newer computers are capable of booting off USB Mass Storage devices, USB is not

intended to be a primary bus for a computer's internal storage: buses such as ATA (IDE), Serial ATA

(SATA), and SCSI fulfill that role. However, USB has one important advantage in that it is possible to

install and remove devices without opening the computer case, making it useful for external drives.

• Mice and keyboards are frequently fitted with USB connectors, but because most PC motherboards

still retain PS/2 connectors for the keyboard and mouse as of 2007, they are often supplied with a

small USB-to-PS/2 adaptor, allowing usage with either USB or PS/2 interface. There is no logic

inside these adaptors: they make use of the fact that such HID interfaces are equipped with controllers

that are capable of serving both the USB and the PS/2 protocol, and automatically detect which type

of port they are plugged into. Joysticks, keypads, tablets and other human-interface devices are also

progressively migrating from MIDI, PC game port, and PS/2 connectors to USB.

• It can also support Ethernet adapter, modem, serial port adapter etc

• It can support Full speed hub, hi-speed hub, and SuperSpeed hub.

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• It can support USB smart card reader, USB compliance testing devices, Wi-Fi adapter,

Bluetooth adapter, ActiveSync device, Force feedback joystick

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UNIVERSAL SERIAL BUS 3.0

CHAPTER 8CONCLUSION

The Universal serial bus 3.0 is supporting a speed of about 5 Gb/sec ie ten times faster than the 2.0

version. And it is also faster than the new Firewire product S3200. So hopefully by the help of this

SuperSpeed data transfer rate the USB 3.0 will be replacing many of the connecters in the future. The

prototype of the USB 3.0 was already implemented by ASUSE in their motherboard. The drivers for the

USB 3.0 are made available to the opensource Linux. The Linux kernel will support USB 3.0 with version

2.6.31, which will be released around August. Because of the backward compatibility of the USB 3.0 the

devises which we are using now and the ports we are using now(which is USB 2.0) will be working proper

with the new USB 3.0 devises and ports. Consumer products are expected to become available in 2010.

Commercial controllers are expected to enter into volume production no later than the first quarter of 2010.

REFERENCE

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USB 3.0 specifications released by USB consortium

Chip magazine 06/2009

http://www.reghardware.co.uk/2009/05/25/superspeed_usb_3_guide

http://en.wikipedia.org/wiki/Universal_Serial_bus

http://www.usb.org/developers/docs

http://www.wired.com/gadgetlab/2008/11/superspeed-us-1

http://tech.blorge.com

http://www.interfacebus.com

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