The SALTRO16 system

From ALTRO to SALTRO16A decrease in size by a factor 40

190 mm 32.5 mm

FEC

MCM

8.9 mm

25 m

m

170 m

m

PadPadModule

19 cm

17cm

32.5 mm

25mm

8.9 mm

12mm

Sideviewsof anMCM

FEC with 8 ALTRO MCM with 8 SALTRO Carrier Board

With mounted chip CPLD

The Carrier BoardCarrier Board with SALTRO chipmounted

Bottom side of the Carrier Boardwith tin balls

Bonding machine Test Socket

The MCM-development board (stand alone board)

The MCM-development board has been sent to Brussels together with an SALTRO-chip in CQFP208 packaging. An SRU has also been sent to Brussels. Purpose: Develop firmware for communication between the CPLD (Yifan

Yang)on the MCM-board and the SRU (Fan Zang).

Fan Zang has arrived in Brussels on the 6.1 and will stay until the 25.1

Work program:1) Program the CPLD2) Communicate with the SRU3) Mount the SALTRO-chip4) Communicate with the SALTRO

20.6 cm

14.5 cmCPLD

Place forSALTRO

ConnectorsThe problem with the male connectors on the upper side of the MCM-board isthat the female partner can not be mounted on a vertical LV-board. This has forced us to introduce an adaptor board and a pair of additional connectors, which are suited for such mounting. The MCM-board plus the adaptor board can be regarded as a unit, which will not be separated.

Item Status Plans/purpose

Carrier Board (CB) 1st SALTRO-chip succesfully Bonding ongoingmounted

Test Socket (TS) Delivered Setup of test system

Test Socket Board (TSB) Design ready; mounting of components,PCB order week 3 tests of 1st CBs

MCM development board Ready, has been sent to Functionality tests; (dMCM) Brussels Develpment of firmware for

communication CPLD-SRUSRU Sent to Brussels

MCM Final Board (fMCM) Design essentially ready Finalize after tests with pMCM and delivery ofconnectors

LV Prototype Board (pLV) Ready Functionality tests; LV to TSBtest I2C communication

LV Final Board (fLV) Design essentially ready Finalize after tests with pLV

Detector Control SystemMaster Board Ready tests ongoing5to1 Board Ready tests ongoing

Present status and future plans