Technology - MOS Electronic · 2018. 10. 15. · ia-filler (IPC 4761 type IV) 90 € Carbon printing 120 € Colour change for soldermask (all colours possi 10) 120 €* Miscellaneous

MOS Electronic GmbHHermann-Loens-Straße 40-46D-75389 Neuweiler

phone +49 (0) 70 55 - 92 99 -0 | fax +49 (0) 70 55 - 15 [email protected] | www.mos-electronic.de printed circuit board technology for the future

Technologyby MOS

13th

edi

tion,

07/

2018

Tech

nolo

gy b

y M

OS

Technology by MOS13th edition, Date of issue: July 2018

Table of contents

33

33 - 35

36 - 38

38

39 - 44

4041

45

46 - 56

48525354

57 - 59

60 - 80

6162 - 6768 - 80

82 - 83

84 - 85

86

87

90 - 93

Lacquers / Printing / Coatings

Final surfaces / Coatings

Via fi lling

Copper hole fi lling

Press-fi t technology

- Flexible or elastic press-fi t technology - Solid press-fi t technology

Backplanes

IMS

- Materials - Versions - The single-layer IMS board - Multiple-layer IMS versions

Thick-Copper Technology

Flex-rigid technology

- Applications - Base materials - Design information

References

Environmental protection

Contact

Agents

Notes

Prepreg

SBU-Kern

Prepreg

aufgesetztes Blind Via

gefü

llte

inne

nlie

gend

eD

K-Bo

hrun

g

gefü

llte

inne

nlie

gend

eD

K-Bo

hrun

g

aufgesetztes Blind Via

iii

6 - 7

8 - 9

11

11

12 - 13

14

15

15

16 - 19

20 - 21

22

22

23 - 24

25

26 - 31

262728293031

32

About MOS

The MOS Group

Express Service

PoolPlus

The MOS portfolio

Designs

Service and advice

Formats

Technology Roadmap

Base materials

Layer structures

Impedance test

Impedance models

Layer structure withimpedance-controlled conductors

Design rules

- External layers - Internal layers - Boreholes and microvias - HDI / SBU design - Coatings and screen printing - Mechanical

Soldermask

Table of contents

Qualityby MOS

PRINTED CIRCUIT BOARD TECHNOLOGY FOR THE FUTURE

ISO 9001:2015

About MOS

6

MOS Electronic has more than three decades of experience in the production of printed circuits. Cooperation with our partners in the Far East enables us to sup-ply all types of printed circuit boards in any quantity. From prototypes to mass production - All from a single source. The process of developing prototypes often results in requirements which do not actually apply until mass production starts a long time later. Our claim that we are “always one step ahead” ensures that your projects today feature the technology of tomorrow. After all, our slogan is:

» Printed circuit board technology for the future «

The quality standards of our products are an integral part of our corporate phi-losophy. Ever since the company was founded it has been our aim to maintain production at the highest possible technological standard. Continuous new in-vestments and product improvements are one of the main reasons behind our success. Our express service was fi rst launched at MOS in 1985. Express pro-duction jobs for prototypes but also for emergency production of large quantities and deliveries straight to the assembly belt have long been part of our everyday work - all in standard quality of course. Our wide range of references, for example from the motor industry, document our absolute reliability and professionalism, supported by our extremely fl exible team composed of around 70 employees, most of whom have been with us for years.

The MOS Group

9

Our manufacturers are at least certifi ed to ISO 9001, IATF 16949 and ISO 14001. In addition to products which are fully RoHS-compliant and lead-free processes, generally all products are also UL-licensed. In addition we have also been able to supply UL-licensed products for the Canadian market since 2009.

We use an extremely professional procedure for selecting our partners. We have at least one „second source“ for every technology. During our regular site audits, in addition to qualifi cation we also pay increased attention to the company‘s environ-mental policy.

The MOS Group

8

Precision

Flexibility

Quality

Speed

High Tech

We have been working with specifi c Asian mass manufacturers since 2005 which now enables us to supply printed circuit boards in all standard sizes. As a result of our experience and competence as a printed circuit board specialist we are also able to manufacture even complex products at our contract partners in the Far East. Our familiarity with their production systems and process enable us to cre-ate solutions for the cost-optimised mass production of critical products as early as the sample phase, working close with our partners.

Take advantage of our long term experience with mass manufacturers from the Far East. We will take care of all the organisation for you. Before we deliver any products to our customers all the consignments from our partners are subjected to extensive receiving inspection and testing procedures.

"Express services starts with a quotation."• Production within just one working day

- Lead time for HDI and fl ex-rigid by agreement• Production in standard quality

- Identical processes and machines- Identical IT and archiving- Transferability to mass production

• No restriction to PCB design• Our major strength: Emergency production even for large batches• Flexibility is a matter of course to us -

for important orders even at weekends...

Do you require low cost samples in standard quality as quickly as possible?Try our PoolPlus service.

Express Service

Pool Plus

Have we caught your interest? Why not request our PoolPlus fl yer today. Email: [email protected] or by phone from our Sales Team (see page 86).

iii11

* The

ext

ra c

harg

e fo

r mul

tiple

poo

l pan

els

does

not

app

ly to

thes

e ite

ms

LEGAL INFORMATIONThe products from the PoolPlus service are supplied by MOS Electronic GmbH. The offer is only valid after the data have undergone a final

review. We reserve the right to refuse unsuitable projects for this offer. Our terms of sale and delivery available at www.mos-electronic.de

are applicable. Prices are quoted exclusive of VAT. Terms of payment: (unless otherwise agreed) immediately and without any deduction.

Delivery ex-works. If you are interested or have any questions, please contact our Sales, phone +49 (0) 7055-9299-30, poolplus@mos-

electronic.de. Please send purchase orders / data to: [email protected]. We will also be delighted to provide you with a tailored

quotation.

Valid until 31st December 2017

OPTIONSLayout and final thicknessConductor width / Spacing 70 µm min. (for 18 µm base copper)

90 €

Final thickness > 1.00 mm to 2.00 mm +/- 10%

No extra charge

Final thickness > 2.00 mm to 3.20 mm +/- 10%

60 €

Final copper thicknessesExternal layers 70 µm (conductor width / spacing 150 µm min.)No extra charge

External layers 105 µm (min. conductor width 140 µm / min. spacing 210 µm) 35 €

Internal layers 70 µm (min. conductor width 140 µm / min. spacing 210 µm) 35 €

Internal layers 105 µm (min. conductor width 210 µm / min. spacing 340 µm) 50 €

IMS material (aluminium)Thickness 1.00 mm or 1.60 mm (special thickness available on request)No extra charge

Final copper thickness 35 µm or 70 µm

No extra charge

Thermal conductivity 1.6 W/m*K (VT4A1) or 2.2 W/m*K (VT4A2)No extra charge

Please note for IMS materials: min. milling diameter: 2.00 mm. Min. hole diameter 1.00 mm.

Extra charge may apply if you require complex milling programs or lots of parts on the pool panel.

MechanicsPanel design with v-cut only

40 €

Panel design with milling only

60 €

Panel design with v-cut and milling

80 €

Please note: Our standard mills are 2.0 and 2.4 mm in diameter.

Extra charge may apply to thinner mills and complex milling programs.

SurfacesEntek (OSP) / immersion tin (1.0 µm min.) / immersion silver

40 €

ENIG (3-5 µm Ni / 0.05-0.15 µm Au)

80 €

PrintingLegend ink (silkscreen) on each side (white)

60 €

Legend ink (silkscreen) on each side (not white)

90 €

Peelable mask, per side

90 €

Via-filler (IPC 4761 type IV)

90 €

Carbon printing

120 €

Colour change for soldermask (all colours possible, type: Carapace EMP110) 120 €*

MiscellaneousImpedance test

280 €*

Initial sample inspection report

180 €*

Production to IPC Class 3 (min. hole copper 25 µm)

plus 10% on the total price

Electrical testingElectrical testing for 2 layers and IMS

60 €

Electrical testing for 4 or more layers

included

Number of pool panelsOur offer relates to the size of a pool panel. However, we can also offer two or three pool panels within our PoolPlus

range. The extra charge on the total price for one pool panel which we charge for this are as follows:

For 2 pool panels

30%

For 3 pool panels

50%

Shipping flat rate (delivery only within germany)Service: Next Day 12.00 Uhr

12 €

Service: Next Day 9.00 Uhr

110 €

DescriptionOur offer is for a pool panel measuring 419 x 577 mm. For smaller layouts the printed circuit board is reproduced with the best possible capacity of the available panel. The reproduction is subject to technical restrictions (spacing from PCB to PCB generally 8 mm). We guarantee an error-free output volume of at least 60%. If only one PCB will fi t on the pool panel, at least two pool panels must be ordered (see optional price list). Different layouts per pool panel are not permitted as part of this offer. All products are UL-licensed (except IMS) and are RoHS-compliant. The production standard is IPC A600 Class 2 (min. hole copper 20 μm). Please see our extra charge system panel design uses and complex milling programs.

Pool panel419 x 577 mm

Not fast enough?Ask about our express service options.

We hope our quotation will fi nd your approval and are looking forward to receiving your order. Is your speci-fi cation not listed? We would be pleased to provide you an individual offer. Inquiries to: [email protected]

2 Layers 222 € » 4 WDS 4 Layers 444 € » 6 WDS 6 Layers 666 € » 8 WDS 8 Layers 888 € » 10 WDS

IMS material (aluminium)Basic price: 288 € » 6 WD(Subject to material availability)

DESIGN2-layer base material FR 4 TG 140 / TG 150Multilayer base material Ventec VT-481 or Isola IS400 (TG 150 fi lled, depending on availability)IMS material (aluminium) Ventec VT4A1 or VT4A2 (Dielectric 75 µm / 100 µm / more on request)Final thickness 1,60 mm +/- 10%Final copper thickness on external layers 35 µmFinal copper thickness on internal layers 18 µm or 35 µmSurface HAL lead-freeSoldermask Peters Elpemer 2467 (green matt)Standard prepegs 106 / 1080 / 2116 / 7628 (other types on request)Standard cores (mm) 0,1 – 1,46 (special stackups on request)

Please note: a symmetrical stackup is required.

LAYOUTConductor width/Spacing 0.10 mm (for 18 µm base copper)Min. residual root solder stop-off 0.10 mm (for 18 µm base copper)Final diameter tolerance• Plated drills < 6.00 mm +/- 0.10 mm• Non-plated drills < 6.00 mm +/- 0.05 mm• Routing (inner/outer) +/- 0.10 mm

Boreholes over 6.00 mm will be milled

plus

Basic price list

plus

10

MOS Electronic has been supplying soldermask in every conceivable colour for many years. ELPEMER SD 2431 HG (magenta colours) supplied by Peters is new at MOS. The initial colour samples caused a great deal of discussion when Peters appeared at the Productronica 2011 exhibition in Munich. „Like our other colours, this product features high colour stability. The special magenta colour was developed at the request of MOS Electronic. The aim of MOS is to highlight its corporate design to an even great extent in its product portfolio. Magenta - a colour than stands for quality.” (Source: LPinfos 3/2011, customer journal pub-lished by the PETERS Group)

The „Pink Circuit Board“

SE

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13

The MOS portfolio

From prototype to end of life

It is fundamental for the success of our company to fully meet our customer’s re-quirements of delivery and performance needs. Besides our in-house production, the cooperation for mass production with our partners in Europe as well as in Asia is a very important part of our company culture. Our delivery and performance matrix provides an overview of our services. Additionally the portfolio includes logistic solutions that will suit your project. It will be a pleasure for us to develop a customized concept that will meet your needs.

Do not hesitate to contact us.

Professionalism

expr

ess

serv

ice

emer

genc

y pr

oduc

tion

Pro

toty

ping

/ R

&D

smal

l & m

iddl

e si

zed

serie

s pr

oduc

tion

prod

uctio

n at

MO

S

mas

s pr

oduc

tion

euro

pean

and

asi

an

partn

ers

Service – Reliability – Responsibility – Quality

12

• Technological advice• Impedance calculations and layer structure suggestions• Support with the development of new products• Creation of alternative solutions and development to achieve product stability• Use of synergy effects• DFM (design for manufacturing)• Workshops and technology days with bespoke contents

Service and advice

• Standard format for one-sided and double-sided printed circuit boards:580 x 427 mm² (useful area)

• Standard format for multilayer boards:577 x 419 mm² (useful area)

• Standard format for SBU multilayer boards:577 x 419 mm² (useful area)

• Max. size in MOS Group:1200 x 700 mm² (useful area)

• Special sizes available on request

Formats

15

Designs

• One-sided with up to 50 layers(max. thickness 6 mm, when joined, up to 10 mm, max. 72 layers)

• HDI and SBU multilayers (4 + core + 4 max.)• Blind, buried and microvias• Stacked vias• High frequency and impedance-controlled printed circuit boards• Halogen-free printed circuit boards• Backplanes• Cu-Inlay Technology• Thick copper up to 400 µm• Press-fi t technology• IMS / Metal core PCB• Flex / Flex-rigid (also HDI)• Via hole plugging and copper hole fi lling• Soldermask in various colours• RoHS compliance and UL listing• Special materials (for example Rogers, Nelco, glass-reinforced polyimide, etc.)• Special applications if requested by customers

Our products are manufactured to IPC A600G Class 2 (alternatively Class 3).

14

17

Type Technology 2017 2019 2021 CommentStandard Special Standard Special Standard Special

Gen

eral

Layers 28 50 38 54 48 58

SequentialBuildup 4+Core+4 6+Core+6 5+Core+5 (7+Core+7) 6+Core+6 (8+Core+8)

Special materials are required for more than 4 pressing cycles. Insofar the development depends

on the material manufacturers.

Max. Cu innerlayer onefold and

outer layers400μm 500μm 500μm 600μm 600μm 800μm > 210μm only rolled copper possible

Max. Cu innerlayer to inner layer 210μm 400μm 400μm 600μm 600μm 800μm > 210μm only rolled copper possible

Min. Line/Space 70 50 60 50 50 40 Depend on base copper

Flex

ible

and

rigi

d-fl e

x P

CB

Layers 4 8 8 12 12 16

Easy symmetricand asymmetric

buildups

Horizontalasymmetric

buildups

Bookbindingtechnology 4 fl ex. layers 8 fl ex. layers 8 fl ex. layers 12 fl ex. layers 12 fl ex. layers 16 fl ex. layers

Multi-Flexlayer 4 fl ex. layers 6 fl ex. layers 6 fl ex. layers 8 fl ex. layers 8 fl ex. layers 8 fl ex. layers

Unilateralasymmetric

buildups 2 levels 2 levels 4 levels 4 levels 6 levels

Technology Roadmap

16

Technology Roadmap

Chip Build-up

Build-up

Soldermask Embedded Chips

19

FR 4 HF-Material

Cu-Inlay

Do you have any questions about technology roadmap?Our Technology Team will be delighted to help (see page 86).iii

Technology Roadmap

Type Technology 2017 2019 2021 CommentStandard Special Standard Special Standard Special

Spe

cial

confi

gur

atio

ns

Partial HDI (Mother-/

Daughterboard)

Developmentproject partlypossible onrequest

()

Partial IMSHybrid

Partial Hybrid


Em

bedd

ed

EmbeddedCapacitor/Resistor


EmbeddedComponents


Con

cept

High IntegrationPCB


() All-in-one: HF-Area, Power Supply

(Thick-copper, Cu-Inlay), HDI, rigid-fl ex …

18

Technology Roadmap

Bas

e m

ater

ial (

FR4)

Gra

ce M

TC-9

7Is

ola

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481

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ture

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10 m

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30 s

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ppm

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21

Different applications require different base materials.The following material types are used at MOS:

• Low, mid and high TG FR4• Materials for high frequency applications (for example Rogers, Nelco, etc.)• Halogen-free materials• Polyimide / Glass-reinforced polyimide• Tefl on• Ceramic-fi lled materials• IMS (aluminium, copper, brass, etc.)• Special materials if requested by customers

Base materials are classifi ed by their thermal, electrical and mechanical properties.

Thermal properties• Glass transition temperature (TG)• Delamination time

(at 260°C and 288°C)• Expansion properties

(CTE in x, y, and z)• Resistance in cycle tests• Heat conductivity in W/mK

Mechanical properties• Elasticity• Bending strength

On the following pages we would like to give you more details about the standard materials we use. All the standard materials we use are suitable for lead-free soldering processes. Thermally conductive materials are listed in the special IMS section starting on page 46.

Base materials

Do you have any questions about base materials?Our Technology Team will be delighted to help (see page 86).iii

Electrical properties• Dielectric constant (εr)• Comparative tracking index (CTI)• CAF resistance• Surface resistance• Loss angle• Voltage strength

20

Impedance models

In practice a range of impedance calculation models are used depending on the specifi c requirements. The following provides details of four commonly used models.

Coated microstripIndividual impedance-controlled conductors on the external layers.

Main factors:- Distance from reference surface (H1)- Printed conductor width (W1)- Dielectric constant (εr) of the

materials used

Edge coupled coated microstripImpedance-controlled conductors in pairs on the external layers.

Main factors:- Distance from reference surface (H1)- Printed conductor width (W1)- Printed conductor spacing (S1)- Dielectric constant (εr) of the

materials used

Offset striplineIndividual Impedance-controlled conductors on the internal layers with two reference surfaces.

Main factors:- Distance from reference surfaces

(H1 and H2)- Printed conductor widths (W1 and W2)- Dielectric constant (εr) of the

materials used23

The properties of a printed circuit board are determined not least by its layer structure. The layer structure influences the impedances, for example. The following contains a list of standard prepreg types used by MOS:

• 106• 1080• 2113• 2116• 7628

Other types possible on request. The min. core thickness is 50 µm. Total thick-nesses from 0.2 mm to 6.0 mm are possible (10.0 mm when joined).

Layer structures

Impedance test

The impedances on the printed circuit board are primarily determined by the PCB layout, the layer structure and the dielectric constant of the materials used. The customer's impedance defi -nitions are generally checked in terms of their feasibility depending on the oth-

er outline conditions using a calcula-tion system (POLAR) and solutions are suggested if necessary. The tolerances are generally checked with a tolerance of +/-10%. However, tolerances of up to +/-5% are also possible to order.

One factor which may result in undesirable differences in impedances is metallised copper layers (for example on the external layers) since they may feature irregularities in terms of their layer thickness. We recommend that impedance-controlled conductors are used on non-metallising internal layers.

We recommend that symmetrical layer structures are used to prevent pos-sible torsion and curvature.

22

Example

Layer structure with impedance-controlled conductors

25

Edge coupled offset striplineImpedance-controlled conductors in pairs on the internal layers with two reference surfaces.

Main factors:- Distance from reference surfaces

(H1 and H2)- Printed conductor widths (W1 and W2)- Printed conductor spacing (S1)- Dielectric constant (εr) of the materials used

Measuring an impedance signal

Impedance models

24

Do you have any questions about layer structures or impedance testing? Our Technology Team will be delighted to help (see page 86).We will be delighted to provide you with a tailored layer structure suggestion.

iii

Please note: These design rules are our standard min/max values (for 18 µm base copper). If the copper thickness is increased or special materials are used the feasibility of the specifi ed values becomes restricted. A review of the production documents is required for a fi nal feasibility assessment.

Printedconductor:

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pltdborehole

a

bc

l

i

f

hk j

d

e g

Design rules

Comments

Min. core thickness 50 μm

Min. copper lamination 9 μm

Max. copper lamination 400 μm

Conductor width tolerance +/-10%

a Min. conductor width 70 μm Sample up to 50 µm

b Min. conductor spacing 70 μm Sample up to 50 µm

c Conductor pitch 140 μm Sample up to 100 µm

d Conductor / Conductor spacing 70 μm Sample up to 50 µm

e Conductor / Via pad spacing 70 μm Sample up to 50 µm

f Conductor / Earth area spacing 70 μm Sample up to 50 µm

g Via pad / Via pad spacing 70 μm Sample up to 50 µm

h Via pad / Earth area spacing 70 μm Sample up to 50 µm

i Earth area / Earth area spacing 70 μm Sample up to 50 µm

j Distance between printed conductor and PCB edge

200 μm Special technology up to 50 µm

k Distance between pad and PCB edge 200 μm Special technology up to 50 µm

l Distance between earth area and PCB edge 200 μm Special technology up to 50 µm

Special parameters available on request

Internal layers

27

Printedconductor:

npltdborehole

pltdborehole

BGApad

a

bc

n

k

f

im l

d

e h

g

j

Design rules

Comments

Min. copper thickness (base + galv. copper) 32 μm

Max. copper thickness (base + galv. copper) 400 μm

Conductor width tolerance +/-10%

Min. hole copper20 μm / 25 μm

Others available on request

BGA pad (diameter) 0.3 mm

BGA pad pitch (one conductor between pad/pad) 0.5 mm

BGA pad pitch (two conductors between pad/pad) 0.65 mm

a Min. conductor width 70 μm Sample up to 50 µm

b Min. conductor spacing 70 μm Sample up to 50 µm

c Conductor pitch 140 μm Sample up to 100 µm

d Conductor / Conductor spacing 70 μm Sample up to 50 µm

e Conductor / Via pad spacing 70 μm Sample up to 50 µm

f Conductor / Earth area spacing 70 μm Sample up to 50 µm

g Conductor / BGA pad spacing 70 μm Sample up to 50 µm

h Via pad / Via pad spacing 70 μm Sample up to 50 µm

i Via pad / Earth area spacing 70 μm Sample up to 50 µm

j Via pad / BGA pad spacing 70 μm Sample up to 50 µm

k Earth area / Earth area spacing 70 μm

l Distance between printed conductor and PCB edge

200 μm Special technology up to 50 µm

m Distance between pad and PCB edge 200 μm Special technology up to 50 µm

n Distance between earth area and PCB edge 200 μm Special technology up to 50 µm


External layers

26

eg

f

d c b

a

Design rules

HDI / SBU Design Feasibility

Max. sequential structures 4 + core + 4

Min. prepreg thickness for sequential structure PP106 (approx. 50 μm)

Min. diameter microvia Drilling Ø 0.1 mm / Final Ø 0.05 mm

Max. aspect ratio microvia 1:1

a Internal microvias Yes

b Stacked via on through borehole Yes

c Stacked via on microvia Yes

d Copper hole fi lling for microvias Yes

d Via hole plugging for microvias Yes

e PID Yes

f Microvia layer 1-2(PP2116 / ~100 μm max.) Yes

g Microvia layer 1-3(PP1080 / ~75 μm max.) Yes

View of a section

HDI / SBU Design

Do you have any questions about our design rules?Our CAM Team will be delighted to help (see page 86).iii

29

a

b

eh

g

c

i f

d j

Design rules

Boreholes(Laser and mechanical) Feasibility

a Min. hole diameter (pltd) Drilling Ø 0.2 mm / Final Ø 0.15 mm

b Min. Via pad (pltd) Final Ø +0.25 mm

c Min. hole diameter buried via (pltd) Drilling Ø 0.2 mm / Final Ø 0.15 mm

d Min. Via pad for buried vias (pltd) Final Ø +0.25 mm

e Min. via / via spacing (pltd) 0.30 mm

f Min. hole / hole spacing (npltd) 0.15 mm

g Min. via spacing (pltd) / conductor pattern 0.20 mm

h Min. via spacing (pltd) / PCB edge 0.30 mm

h Min. hole spacing (npltd) / PCB edge 0.30 mm

i Min. diameter microvia (layer 1-2) Drilling Ø 0.1 mm / Final Ø 0.05 mm

j Min. via-pad microvia (layer 1-2) Final Ø +0.2 mm


View of a section

Boreholes and microvias

28

Design rules

Mechanical machining Feasibility

Min. tolerance borehole diameter +/-25 μm

Min. tolerance end hole diameter +/-50 μm

Min. tolerance milling +/-50 μm

a Notch angle (V-cut) 30°

V-cut / Conductor pattern registration tolerance +/-100 μm

b Max. pos. tolerance top / bottom notch +/-50 μm

c Min. tol. residual root for PCB thickness up to 1.2 mm +0.10 / -0.05 mm

c Min. tol. residual root for PCB thickness over 1.2 mm +0.15 / -0.05 mm

d Min. spacing skip notches (with chisel) 0.3 mm

d Min. spacing skip notches (with notch cutter) 15 mm

Notch cutter outlet (depending on notch depth) ~7 mm

e Tolerance PCB thickness Generally +/-10%

ec

a

b Notch / V-cut

V-Cutd

Skip notches

Mechanics

Do you have any questions about our design rules?Our CAM Team will be delighted to help (see page 86).iii

31

Design rules

Soldermask / Layout printing Feasibility

Soldermask thickness ≥ 16 μm

Min. Edge coverage soldermask ≥ 6 μm

a Min. opening soldermask / BGA pad 50 μm

b Min. opening soldermask / SMD pad 50 μm

c Min. residual root soldermask 75 μm

d Min. opening soldermask Pad + 100 μm

e Min. line thickness for text in soldermask 100 μm

g Min. line thickness for layout printing 100 μm

h Min. registration tolerance for layout printing / conductor pattern 100 μm

i Min. registration tolerance for layout printing / NDK borehole ≤ 3.0 mm 100 μm

Min. registration tolerance for layout printing / NDK borehole ≥ 3.0 mm 150 μm

Registration tolerances Standard Limit values

Pltd borehole to conductor pattern +/-100 μm +/-50 μm

Npltd borehole to conductor pattern +/-150 μm +/-100 μm

Milling for conductor pattern +/-150 μm +/-100 μm

Soldermask to conductor pattern +/-100 μm +/-50 μm

Layout printing to conductor pattern +/-100 μm +/-100 μm

Screen printing to conductor pattern +/-200 μm +/-150 μm

d

Pad

aSpacing

Sol

derm

ask

Soldermask

b

c

BSoldermask

e

R100SoldermaskNDK borehole

ig h

Registration

Residual rootsoldermask

Text style in soldermask

Layoutprinting


Coatings and screen printing

30

• Soldermask in various colours(Standard: Peters Elpemer 2467 / Carapace Electra EMP110)

• Component printing• Service printing• Soldermask• Carbon printing• Via fi ller printing• Flux stop coating• Silver conductive coating• Heatsink coating

HAL lead-free (hot air tinning)• Solder bath: HAL-Sn99Ag+• Coating thickness 1-30µm• Good soldering properties• Lengthy storage life (>12 months)• Not suitable for very fi ne textures• No bonding capacity• Poor planarity• Storage life: 12 months

HAL leaded• Coating thickness 1-30µm• Good soldering properties• Low process temperatures• Good storage properties• Not suitable for very fi ne textures• Non-bondable• No RoHS compliance• Poor planarity• Storage life: 12 months

Lacquers / Printing / Coatings

33

Final surfaces / Finishes

We use Peters Elpemer 2467 and Carapace Electra EMP110 soldermask as standard. These coatings are applied by spray. Various colours are possible and it is also possible to produce multi-coloured PCBs. The coatings can be characterised as follows:

• Photodefi nable• Maximum resolution (up to 50 µm)• Aqueous-alkaline developable• TWT cycle resistance (temperature cycle test)• Very good resistance in galvanic and chemical baths• Compatible with lead-free soldering processes• Excellent edge coverage• RoHS compliance and UL listing• Complies with IPC-SM-840 C, Classes H and T

Soldermask

Soldermask Elpemer 2467 EMP110Temperature shock Classes H and T Class H

Disruptive strength 160 - 190 kV/mm 134 kV/mm

Dielectric constant (εr) at 1MHz 3.7 4

Do you have any questions about soldermask?Our Technology Team will be delighted to help (see page 86).iii

32

Chemical Ni/Pd/Au (ENEPIG)• Coating thickness 4-7μm Ni, >0,05μm Pd, >0,02μm Au (soldering and US Al wire bonding)• Coating thickness 4-7μm Ni, 0,15μm Pd, 0,05μm Au (soldering and TS Au wire bonding)• Good soldering and bonding properties• TS / US wire bondability• High process window• Planar surface• Storage life: 12 months

Chemical Pd / Immersion Au (EPIG)• Coating thickness 0.1-0.2μm Pd, 0.1-0.2μm Au • Nickel free coating• Thin and very uniform electroless deposition• Suitable for (ultra) fi ne pitch layouts• Ductile fi lm compatible for fl ex PCB applications• Excellent Al and Au wire bondability• Planar surface• Storage life: 12 months

Immersion Ag / Immersion Au (ISIG)• Coating thickness 0.1-0.4µm Ag, 0.05-0.2µm Au (soldering)• Coating thickness 0.1-0.4µm Ag, 0.1-0.2µm Au (TS / US wire bonding)• Nickel free coating• High conductivity• Thin and very uniform electroless deposition• Suitable for (ultra) fi ne pitch layouts• Ductile fi nal fi nish compatible for fl ex PCB• Excellent Al and Au wire bondability• Storage life: 12 months

Other surfaces• Galvanic gold (for example plug gold)• Galvanic nickel• Soldering paints• Reductive gold• Other surfaces to order


Do you have any questions about surfaces or fi nishes?Our Technology Team will be delighted to help (see page 86).iii

35

Immersion tin• Process: Atotech (standard) and Ormecon possible• Min. coating thickness 1.0µm• Good soldering properties• Planar surface• Narrow process window for soldering processes• Restricted storage life• Storage life: 6 months

Immersion silver• Coating thickness 0.15-0.3µm• Good soldering properties• Bondable• Planar surface• Low processing temperature (approx. 50°C)• Airtight storage required• Storage life: 6 months

Organic copper passivation (OSP / Entek)• High planarity• Good storage properties• Low cost• High process temperatures• Non-bondable• Storage life: 6 months

Chemical Ni/Au (ENIG)• Coating thickness 3-5μm Ni, 0.05-0.2μm Au (soldering and US Al wire bonding)• Coating thickness 3-5μm Ni, 0.3-0.7μm Au (soldering and US Au wire bonding)• Good soldering and bonding properties• High process temperatures• Storage life: 12 months

Chemical Ni/Pd/Au (ENIPIG)• Coating thickness 4-8μm Ni, 0.01-0.04μm Pd, 0.03-0.08μm Au • Good soldering and bonding properties• TS / US wire bondability• High process temperatures• Storage life: 12 months


34

Via fi lling

Applications

Plugging and metallising external through-contacts(Via in pad technology)This applications allows vias to be placed directly on a pad. The plugging proc-ess prevents air inclusions, for example. Can also be used for blind boreholes. Copper thickness in the sleeve: 15 μm min. (standard). Copper cover: 10μm min. (standard, the base copper thickness may have to be reduced).

Plugging internal boreholes (buried vias)Unfi lled internal vias can cause sinks on the external layers of air inclusions, for example. This can be prevented by plugging the buried vias.

Plugging and metallising internal boreholes (buried vias)The metallising process enables blind vias to be stacked (stacked vias).

Fille

dpl

td b

oreh

ole

Basematerial

Non

-fille

dpl

td b

oreh

ole

Prepreg

SBUcoreFi

lled

inte

rnal

pltd

bor

ehol

e

Prepreg

Fille

din

tern

alpl

td b

oreh

ole

Prepreg

SBUcore

Prepreg

Stacked blind via

Fille

din

tern

alpl

td b

oreh

ole

Fille

din

tern

alpl

td b

oreh

ole

Stacked blind via

37

The via is sealed on one side (Type IV a) or on both sides (Type IV b) with a via fi ller print using the screen printing method before the soldermask process. The via fi ller print consists of the same

contents (predominantly resin) as the soldermask. Vias fi lled using Type IV are gas-tight, their surfaces are not 100% planar.

Via fi lling to IPC 4761

If there is noting in the PCB specifi ca-tion, the residual rings of the vias, as long as they are not exposed for data purposes, are covered with soldermask without fi lling the vias, MOS Electronic can provide several via fi ller types to comply with IPC 4761.

Please note: Types III, V and VI are not used as standard by MOS. Depending on the manufacturer, however, other via fi ller types may be preferred by oth-er companies in the MOS Group.

Via fi lling

Single-sided via filler print

Basematerial

Double-sided via filler print

Basematerial

As a result of the ever increasing den-sity of connections, so-called via hole plugging has become a key process in SBU technology. Both blind boreholes and through boreholes can be sealed with no air bubbles (also sequentially /

partially). The sealed boreholes can be metallised as an option. Hole diam-eters of 0.15 - 3.5 mm with an aspect ratio of max. 1:8 are possible (special sizes to order).

IPC 4761 Type VII: Filled and capped via

36

IPC 4761 Type IV: Plugged and covered via


Press-fi t technology is a technology for solder-free electrical connections be-tween components and printed circuit boards. The press-fi t pin is pressed into an interlayer connection borehole. There are two types of press-fi t tech-nology which differ by the way in which the press-fi t forces are absorbed.

In fl exible or elastic press-fi t technology the forces are absorbed by the press-fi t pin. If solid press-fi t pins are used, the retaining force is created by the deformation of the copper sleeve. Both methods produce a gas-tight, electrical connection.

Parameters for the printed circuit board• Drilling or milling tolerances• Tolerance of the fi nal hole diameter• Copper sleeve• Final surface• Thickness of the PCB and copper

thickness

Benefi ts of press-fi t technology• No thermal stress on the printed

circuit board or modules which have already been fi tted

• Gas-tight connection• Can be repaired• No solder bridges• No fl ux residues and therefore

no cleaning required• No additional fastening of the

components required39

A white plugging paste is used for the via hole plugging process.Its properties are as follows:

• Good adhesion between copper and paste even when affected by temperature• Good adhesion of copper, dielectrics and photoresist• No air inclusions in the paste• TG > 140°C• CTE < 50 ppm (below TG)• No shrinkage during curing• Solder bath resistance to IPC-SM-840 C• UL listing, RoHS compliance

We can provide copper-fi lled blind vias in addition to via fi lling to IPC 4761. Copper hole fi lling is possible for hole diameters from 70 μm to 150 μm (microvias, aspect ratio 1:1 max.). The benefi ts over to via hole plugging are as follows:

• Greater stability• No mechanical stress on the surface (no grinding process)• Copper layer in the sleeve > 25 μm since only one metallising process

is required• Higher TG (TG depends on the base material used)

Via fi lling

Copper hole fi lling

Do you have any questions about via fi lling or copper hole fi lling?Our Technology Team will be delighted to help (see page 86).iii

38


In contrast to fl exible press-fi t tech-nology the pin is solid (generally with a rectangular or square design). The press-fi t pin has a larger circumferen-tial diameter than the interlayer con-

nection borehole. During the pressing in process the copper sleeve in the PCB is deformed which creates the press contact and the gas-tight elec-trical connection.

Properties• High requirements on the PCB in terms of drilling diameter

(+0.025 / -0.025 mm) and hole copper (min. 30 µm / max. 60 µm)• High current capacity (>300 A)• High resistance to vibrations and dirt• Mechanically more stable compared to solder connections, high

mechanical stresses possible (torques, etc.)

Solid press-fi t technology

Würth Elektronikpower elements

Requirements for the printedcircuit board (hole parameters)

Section

Ø 1.60-0,03 min. 0.10

min. 30µm copper max. 60µm

Ø 1.475 ±0.05

The main criterion for a good press contact for the printed circuit board is primarily the tolerance of the borehole diameter before plating and compli-ance with the specifi ed copper thick-ness in the sleeve. Immersion tin is recommended as the final surface. A single press-fi t pin typically has a retaining force of > 100 N.

Example of solid press-fi t technology – Würth Elektronik power elements

41


Pins with a recess in the press-in zone are used for fl exible press-fi t technol-ogy. The pin has a larger diameter at this point than the interlayer connection borehole. The recess creates a spring effect which in turn produces the retain-ing force of the press-in connection.

The main criterion for a good press contact for the printed circuit board is primarily the tolerance of the fi nal hole diameter (typically +0.09 / -0.06 de-pending on manufacturer).

The copper sleeve should have a thick-ness of at least 25 µm (possibly plus the fi nal surface, see data sheet from the component manufacturer). Immersion tin is recommended as the fi nal surface.

ApplicationsFor example plug connectors for signal distribution, not for high current applica-tions.

Diameter of the metallised hole Ø 1.60 +0.09/-0.06 mm

min. 25 μm Cu

Flexible or elastic press-fi t technology

40


43

MOS Electronic GmbH printed circuit boards have been successfully qualifi ed by Würth Elektronik for processing Würth Elektronik power elements. The satisfy the required printed circuit board specifi cations and have passed the current capacity tests.

Printed circuit boards must satisfy the following specifi cations for processing power elements from Würth Elektronik: The current capacity of the power ele-ments must always be regarded in the context of the system as a whole since it depends on the design and pin layout

of the power elements and the layout of the printed circuit board. The tests conducted on them showed that, for example, the combination of "2-layer 70 µm fi nal copper PCB" and "Power One, 20 pins, all-round" can withstand currents of up to 300 A.

Specifi c requirements for the printed circuit boards


Würth Elektronik is an all-round spe-cialist in press-fi t technology. This is backed by more than 25 years of ex-pertise, lots of in-house developments, patents and experience in processing all conventional press-in zones from fl exible and knurled to square or rec-tangular.

Würth Elektronik supplies a wide range of power elements with press-fi t tech-nology. They are used for the supply and distribution of high currents in sys-tems based on printed circuit boards. They are also ideal for use as connec-tion elements for fuses, IGBTs, switch-es and cables on the printed circuit board or as connection elements from PCB to PCB or PCB to housing.

Power elements are available in vari-ous designs whose design and dimen-sions can be confi gured to suit specifi c needs. The solid power elements are available in the form of single-piece (PowerOne), two-piece (PowerTwo) or plug-in (PowerRadsok, PowerLamella or PowerBasket) power elements.

The punches PowerPlus and Power-Plus SMD power elements and the flexible PowerFlex power elements round off the range.

Würth Elektronik ICS GmbH & Co. KGIntelligent connecting systems

42

Backplanes

45

Do you have any questions about backplanes?Our Technology Team will be delighted to help (see page 86).iii

Press-fi t elements are often used for applications relating to signal distribu-tion, power consumption and high cur-rent applications. MOS Electronic has a wide range of productions and mas-

sive experienced in the production of high compatibility printed circuit boards. The MOS Group (Far East) can also provide all technologies.

Application and capabilities

Product features• Printed circuit board thickness up to 6 mm, up to 10 m within the MOS Group• Copper thicknesses of up to 400 µm are possible• Max. PCB size: 580 x 427 mm (1 and 2 layers) or 577 x 419 mm (multilayer),

1200 x 700 mm within the MOS Group, special sizes available on request.


Properties• Durable, breakable connection using high current contact elements• High current applications for 100 to 600 A using connection plates allows

current of well over 1000 A to be transferred to the printed circuit board.• High requirements on the PCB in terms of drilling and milling diameter

(+/-0.025 mm) and hole copper (min. 25 µm / max. 45 µm)

The press-fi t pins have a round, serrat-ed shape so that the entire contact sur-face area of the copper sleeve is avail-able for contacting purposes. Broxing power clamps for press-fi t technology are available in a range of versions. The press-fi t boreholes for the B, N and L series can be fully drilled. How-ever, the H and D series require press-fi t boreholes with a diameter of up to

22.15 mm which means that they can-not be drilled any further. MOS Elec-tronic has developed a special, reliable process for these requirements which allows compliance with the tolerance and coating thickness requirements to be guaranteed. Immersion tin (recom-mended), HAL or chemical Ni/Au may be used as the fi nal surface.

Do you have any questions about press-fi t technology?Our Technology Team will be delighted to help (see page 86).iii

Example of solid press-fi t technology - Broxing power clamps

44

IMS

A solid aluminium or copper plate is generally used as the metal substrate.

The surface and hole walls (if neces-sary) of the metal are coated with a lay-er of insulation. Thermally conductive prepregs (which contain ceramic) are generally used as the dielectric. This gives the product high thermal conduc-

tivity (or fast temperature spread) com-bined with good electrical insulation.

The classic version is a single-sided base material with a metal substrate on the underside. However, 2 or multiple-layer versions with interlayer connec-tions are also possible (metal substrate on the inside or outside.

Properties• High thermal conductivity• Low z-axis expansion• High mechanical strength• Low moisture absorption

Benefi ts of copper over aluminium• The physical properties of copper are better suited to mixed structures

in terms of its coeffi cient of expansion and elasticity.• Higher thermal and electrical conductivity• Higher voltage strength• Surfaces suitable for soldering can be applied

47

IMS

Printed circuit boards with a metal core are enjoying increasing popular-ity wherever high temperatures must be dissipated through the PCB, for example for LED and high power ap-plications.

The following rule of thumb applies for LED applications: A rise in operating temperature by 10°C means 50% short-er service life. However a metal core can also be extremely benefi cial for high mechanical stresses or high require-ments relating to dimensional stability.

46

Bending angle 30° Bending angle 60°

Bending angle 90° Bending angle 180°

IMS

The dielectrics without glass fabric (VT-4B3 and VT-4B5) are suitable for bending applications. Possible bending parameters for the VT-4B3 dielectric are shown in the following:

Consideration of possible bending radii using the VT-4B3 as an example

Bending tool

Bending diameter Error pattern

The bending process must always be carried out in controlled conditions using a bending tool so that the copper is not damaged (layout side).

49

IMS

All IMS materials are pressed in-house by MOS, no prefi nished materials are used as standard. This ensure maxi-mum fl exibility in the material confi gu-ration. The dielectrics used have heat conductivity values between 1.6 and 4.2 W/mK (for comparison: 0.2-0.4 W/mK on the standard FR 4). Aluminium or copper in thicknesses between 0.4 mm and 3.0 mm (> 3.0 mm on request) is

generally used as the metal substrate, but other substrates such as brass as also possible. Copper is recommended for multiple-layer applications as a result of the "proximity" of the physical proper-ties to the PCB. As a result of high raw material prices and high weight, how-ever, aluminium is typically used.

Materials

Dielectric Ventec VT-4A1 Ventec VT-4A2

Thickness of thedieletric in μm

75 100 125 150 75 100 125 150

Therm. conductivity 1.6 W/mK 2.2 W/mK

Therm. impedance(in °C*in²/W)

0.074 0.099 0.123 0.148 0.054 0.072 0.089 0.107

Glass fabric Yes Yes

Dielectric Ventec VT-4B3 Ventec VT-4B5

Thickness of thedieletric in μm

50 75 100 50 75 100

Therm. conductivity 3.0 W/mK 4.2 W/mK

Therm. impedance(in °C*in²/W)

0.026 0.04 0.053 0.018 0.029 0.038

Glass fabric No No

48

IMS

37

1.0 mm75 μm35 μm

1.0 mm100 μm

35 μm

1.5 mm75 μm35 μm

1.5 mm100 μm

35 μm

0.4 mm75 μm35 μm

0.5 mm75 μm35 μm

1.0 mm75 μm35 μm

1.5 mm75 μm35 μm

1.0 mm75 μm35 μm

HTE Super HTE

Bending diameter (mm)

25

20

15

10

5

0

AluminiumDielectric

Copper

90°

1.0 mm75 μm35 μm

1.0 mm100 μm

35 μm

1.5 mm75 μm35 μm

1.5 mm100 μm

35 μm

0.4 mm75 μm35 μm

0.5 mm75 μm35 μm

1.0 mm75 μm35 μm

1.5 mm75 μm35 μm

1.0 mm75 μm35 μm

HTE Super HTE


25

20

15

10

5

0

AluminiumDielectric

Copper

180°

51

IMS

1.0 mm75 μm35 μm

1.0 mm100 μm

35 μm

1.5 mm75 μm35 μm

1.5 mm100 μm35 μm

0.4 mm75 μm35 μm

0.5 mm75 μm35 μm

1.0 mm75 μm35 μm

1.5 mm75 μm35 μm

1.0 mm75 μm35 μm

HTE Super HTE


9

8

7

6

5

4

3

2

1

0

AluminiumDielectric

Copper

30°

1.0 mm75 μm35 μm

1.0 mm100 μm35 μm

1.5 mm75 μm35 μm

1.5 mm100 μm35 μm

0.4 mm75 μm35 μm

0.5 mm75 μm35 μm

1.0 mm75 μm35 μm

1.5 mm75 μm35 μm

1.0 mm75 μm35 μm

HTE Super HTE


25

20

15

10

5

0

AluminiumDielectric

Copper

60°

50

IMS

CopperCopper Metal substrateMetal substratePrepreg / Insulation layerPrepreg / Insulation layer

The single-layer IMS board

The single-sided IMS board is the classic version on which the metal substrate on the underside is exposed. A tool with 1.0 mm should be selected as the minimum borehole diameter. The smallest cutter which can be used as standard should not be smaller than 2.0 mm. Special parameters are possible subject to certain condi-tions on request.

1-layer IMS board with cavity

CavityvityCav

With single-layer IMS boards it should be ensured that the hole walls of boreholes through the metal substrate are exposed, or in other words are not insulated. Al-though insulation is feasible, it is also very expensive.

53

IMS

DesignsIn general all technologies which are familiar from conventional printed cir-cuit boards can be used. However, you should know that the metal substrate must initially be insulated for interlayer connections, for example, so as not to short circuit the entire system. There are restrictions for the mechanical ma-chining. Possible special techniques for IMS boards include blind and bur-ied vias, for example. To achieve even better heat dissipation, partial cavities

(cleared or copper and prepreg) may be inserted to connect components which develop high temperature direct to the metal substrate. The component may be connected to the higher cop-per for this technology, for example, using a bonding process. In the event of space problems, deep cuts into the metal substrate may be made and then insulated. Combination with flexible materials is also possible.

Final surfaces• OSP / Entek (recommended)• HAL lead-free / leaded

(do not use HAL for multiple-layer structures)• Immersion tin• Immersion silver

• Chem. Ni/Au

Other surfaces available on request

52

IMS

Examples of multiple-layer structures

2-layer structure with metal core

2-layer structure with external metal substrate acting as heat conduction plate

1-layer fl exible printed circuit board with metal reinforcement

4-layer structure with metal core

Copper PolyimidPolyimidCopper Adhesive Metal substrateMetal substrate FR4FR4Prepreg / Insulation layerPrepreg / Insulation layer

Legend

55

CopperCopper Metal substrateMetal substratePrepreg / Insulation layerPrepreg / Insulation layer

IMS

Multiple-layer IMS versions

ParameterRecom-mended

Limit value

a 1.20 mm 1.00 mmAspect Ratio a Max. 1:1 Max. 1:1

b 0.40 mm 0.30 mmc 0.50 mm 0.30 mmd 1.40 mm 1.20 mmMin. Ø NDK borehole 1.00 mm 1.00 mm

Smallest cutter 2.00 mm 2.00 mm


Section of a metallised borehole with an insulation layer

Prepreg

Cu sleeve

Insulationlayer

Aluminium

a b

c

d

To enable multiple-layer IMS versions to have interlayer connections without con-necting the metal substrate, a layer of insulation should be applied to the hole walls after the preceding drilling process. The actual interlayer connection can be made after the layer of insulation has been applied. The following parameters must be used for the printed circuit board design:

54

57


Design rules for thick copper

LAMINATIONBASE COPPER

MIN. CONDUCTOR WIDTH

MIN. DISTANCE

MIN. RESIDUAL RINGperipherally

70 µm 100 µm 210 µm 100 µm

105 µm 140 µm 340 µm 140 µm

140 µm 160 µm 400 µm 160 µm

210 µm 210 µm 500 µm 210 µm

400 µm 400 µm 700 µm 400 µm


Thick-Copper technologies become more and more important for power electro-nics. Technology drivers are for example topics such as electric mobility and wind power. Besides high voltage uses, thick-copper technology can also be used for heat dissipation. MOS Electronic GmbH has many years of experience with engineering, prototypes and series manufacturing of thick-copper boards up to 400µm copper thickness.

You must keep an eye on heat dissipation when processing further (through heating problems). The allowed thickness of soldermask on the copper must be increased, if thick-copper is used on outer layer, in order to provide enough edge coverage. When using thick-copper, layer construction and copper distribution play a major role regarding dimensional stability and prevention of delamination. We will be happy to consult you personally about product design.

Characteristics:

• Very robust Design• Well shielding of signal installations• High currents possible (several 100 Amperes at a copper thickness of 400µm)• Good heat splay• Standard components usable• Replaces stamped grids

IMS

Other heat dissipation methodsIn addition to using IMS materials, there are other methods of dissipating heat.• Radiation• Convection• Heat conduction (external coolers, heatsinks, copper inlays, heat dissipation

through thick copper or thermal vias)

The range of versions can also be combined.

Do you have any questions about IMS boards?Our Technology Team will be delighted to help (see page 86).iii

Copper and aluminium cores can also be placed in direct contact for excellent heat dissipation or an electrical connection to the metal substrate.

Dielectric

Copper

CopperAluminium

Aluminium

Cu sleeve

56

59

Do you have any questions about thick-copper technology?Our Technology Team will be delighted to help (see page 86).iii

CoreCore

Prepreg

Cu - InlayCoreCore Cu - Inlay

Prepreg

Blind Vias

CoreCore Cu - Inlay CoreCore Cu - Inlay

Prepreg

Continuous inlay with a fl at connection to the outer layer:

Inlay inside, electrical connection through copper fi lled blind vias:

Inner inlay with a fl at connection to the inner layer:


Possibilities of construction:

One-sided inlay outside, fl at connection to the outer layer:

Legend:

= Cu - outer layer

Heat distribution can be affected by the use of thermo optimized prepregs. We will be happy to advise you personally about the different possibilities of construction.

Please, do not hesitate to speak to us.

KernKern Cu - Inlay

Prepreg

Blind Vias

58

Micro sections

400µm copper on inner layers

210μm copper on inner layers

Outer Inlay, electrical connection from the top-side with copper

fi lled blind vias.

Copper-Inlay Technology

Copper-Inlays can alternatively be used for partial temperature problems on the PCB. The use of Copper-Inlays together with e.g. high power LED’s, has become an established and widespread technology.

Technology:

Massive Copper-Inlays are embedded into a PCB as a conductor rail or to provide ideal partial heat dissipation. The inlays can be placed directly underneath the com-ponent. Inlays are usually designed round or squared with round edges. Though any other shape is possible.


61


Benefi ts over cable solutions- Great long term reliability- Lower weight and less space- High fl exibility- Lower costs for assembly work and handling- Quality improvements and integration of special electrical properties (for example controlled impedance)

Flexible printed circuit boards are now widely regarded as established. The main customers for fl exible circuits are industries such as automotive, telecommunica-tions, computer & peripherals, sensor technology, mechanical engineering, medi-cal electronics and aerospace.

Flex-rigid

Flexibility for all applications

Applications

60


Flexibilityin every layer


Base foil

Dielectric constant

Disruptive strengthin V/μm

Max. operating temperature

in °C

TGin °C

waterabsorption

in %

Expansionin ppm

PET 3.20 240 105 78 < 0.08 120

PEN 3.16 275 160 120 0.60 65

PI 3.50 204 200 410 > 3.00 70

Properties of the main fl exible base foils

Base foil Adhesionin N/cm2

Shrinkage afteretching in %

Water absorptionin %

Flexible base material (PI) > 7 0 - 0.20 < 3

Rigid base material (FR4) 14 0 - 0.02 0.50

Differences between rigid and fl exible materials

Comparison of selected properties of the main fl exible base foils

- Standard foil thicknesses- Copper thicknesses and types- Adhesives and coatings

Technical data / Differences of fl exible materials

63


PET: Low price, very restricted soldering capacity, operating temperature approx. -70°C to +70°CPEN: Low price, very restricted soldering capacity, operating temperature approx. -70°C to +90°C PI: High temperature stability, unrestricted soldering capacity, operating temperature approx. -70°C to +110°C, up to 200°C briefl y

The following materials are mainly used as base foils:

PET (polyethylene teraphthalate)PEN (polyethylene naphtalate)PI (polyimide)*

Selection of materials relative to:- Flexible material- Adhesion- Type of adhesion

(no-fl ow prepreg, epoxy or acrylic adhesive)

- Temperature stress- Cleaning before interlayer

connection (plasma)- Chemicals for the interlayer

connection process- Design of the layer structure

Quality criteria for fl ex-rigid printed circuit boards

To ensure that a fl ex-rigid PCB can become a high quality product, atten-tion must be given to the main quality criteria as early as the design phase (for example selection of base materi-als, information about layout. etc.).

Selection criteria

* preferred

Base materials

62


Flexible base material without adhesive*- AP 9121 (DuPont)- A2010RD (Thinfl ex) - preferred

Sections

Flexible base material with adhesive- LF 9121 (DuPont)

Polyimide with acrylic adhesive is ideal for dynamic stresses for up to 40 mil-lion bending cycles with the appropri-ate layout and bending radius.

Polyimide with fl ame-inhibiting adhesive (FR4) is UL 94 VTM -0 listed and certi-fi ed to IPC Class 2 but only has limited dynamic fl exibility. Polyimide without ad-hesive is also UL 94 VTM -0 listed and certifi ed to IPC Class 3. Its temperature resistance is specifi ed at 1,000 hours at 150°C and it also has good chemical re-sistance and low gassing.

* preferred

65


Material Thickness in mm

Copper 0.018 0.035 0.070 0.105

Adhesive 0.015 0.025 0.025 0.025

Polyimide 0.025 0.050 0.075 0.125

Copper on one side


Copper 0.018 0.035 0.070 0.105

Adhesive 0.015 0.025 0.025 0.025

Polyimide 0.025 0.050 0.075 0.125

Adhesive 0.015 0.025 0.025 0.025

Copper 0.018 0.035 0.070 0.105

Copper on two sides


Copper 0.018 0.035 0.070

Polyimide 0.025 0.050 -

Copper 0.018 0.035 0.070

Copper on two sides, no adhesiveAP material

Standard foils

CopperED: Elongation at rupture 8 – 10% (HTE Cu approx. 16%)RA: Elongation at rupture > 10% (IPC-CF-150 approx. 16%)

AdhesiveEpoxy, acrylic

64

Parameters- Temper for 2 hours at 120°C in a convection furnace

(store printed circuit boards with gaps between them)- The max. holding time between tempering and the

soldering process is 8 hours. If the holding time exceeds 8 hours a fresh tempering processing is required before the soldering process.

- For refl ow soldering processes the max. temperature is 270°C


?!What does this mean for processing fl exible circuits?

Since this property has been known for at least 20 years, all processing business have adjusted to it.Polyimide is hydroscopic and there-fore absorbs moisture (water). When this water is heated to over 100°C it turns to water vapour and therefore requires a considerably large volume. If it is heated very quickly (soldering process) this may result in the vapour pressure destroying the adhesion be-tween the various layers (polyimide, adhesive and copper) - in other words delamination.This means that the product must be dried (tempering process) before the soldering process. After drying the PCBs must be processed within 2 - 6 hours or placed in temporary storage in a dry place.

As a result of the high moisture ab-sorption of polyimide the PCBs must be dried (using a tempering process) before the soldering process.

Processing instructions (tempering process)

Drying fl exible PCBs made of poly-imide As the diagram shows, polyimide ab-sorbs up to 3% water from the sur-rounding atmosphere.

Coating thickness (µm)

Insulation voltages

At max.water content

Polyimide foil 2 x 102 V/cm

Polyimide foil 1,5 - 2,5 x 102 V/cmPolyester foil 3 x 102 V/cm

Glass fibre epoxy foil 2,5 x 102 V/cm

100,2

0,5

1,0

2,0

5,0

10

20

20 50 75 100 200

Pun

ctur

e vo

ltage

(kV

)

67



Polyimide 0.025 0.050 0.075 0.125

Adhesive from 25 – 75 µm

Backing foil Removed after mechanical machining

Cover foil

MOS prefers Coverlay from DuPont

So-called flexible coatings (flexible soldermask, for example Peters type 2463) are also used.

Low cost PET material can be used in cases where a fl exible PCB is used as a pure connecting element between two connectors and not soldered with normal standard soldering systems. PEN or polyimide must be used as soon as SMD components must be fi tted and soldered automatically. The decisive criterion in this respect is the machine equipment and the solder you plan to use. PEN can be used with suit-able machines and automatic solder-ing. Polyimide has a clear advantage in this case. This material is suitable for all standard leaded and unleaded

soldering processes (wave soldering, manual soldering and vapour phase soldering).

It is often the adhesive system in the fl exible base materials which deter-mines with fl exible PCBs (made of PEN or polyimide) are suitable for use in the fi eld in high temperatures.

The stresses to which fl exible PCBs are exposed in the fi eld and during processing determine the choice of the base material.

Selection of materials relative to:- Temperature stress- Requirement for UL listing- Bending stress- Puncture resistance

Flexible coating

Do you have any questions about fl exible coatings?Our Technology Team will be delighted to help (see page 86).iii

66


If the layout is designed correctly the soldering eye areas should be as large as possible to ensure that the cover foil or coating covers the soldering eye. This is particularly necessary on 1-lay-er fl exible PCBs. On 2-layer interlayer connectors PCBs the soldering eyes are connected from the top to the bot-tom by the interlayer connection sleeve like a rivet and thus well secured.

Soft transitions from narrow to wide conductors are the best way of ensur-ing conductor structures which are no sensitive to fracturing.

Sharp corners in the etched conductor act like a notch in metal. If a compo-nent of this type is bent, the should in the conductor could become an obvi-ous place to fracture.

The transition from narrow to wider conductors at a 90° angle should al-ways be achieved using adequately large radii.

69


Design information

Layout design (conductive pattern)

Flexible PCBs are used for a wide range of purposes and in many ap-plications they are stressed dynami-cally with up to several million bending cycles. In many other cases fl exible PCBs are installed in miniature hous-ings with minimal bending radii. The conductor layout is expected to be able to withstand all these stresses without suffering damage.

If certain basic rules are observed dur-ing the creation of a layout, this sets in place an important foundation for the successful use of fl exible PCBs.

Examples

Conductor connectors at soldering eyes should always be droplet shaped and rounded. As large a soldering eye area as possible will help to anchor the soldering eyes on the fl exible base ma-terials better.

Soldering eyes which are too small have a poor connection to the fl exible base material. This may result in the solder-ing eyes peeling off the base material. A conductor fracture at the transition be-tween the soldering eye and conductor is possible if the conductor connection is very narrow and subjected to stress.

68


Minimum web width between the gaps: 0.08 mm

Soldermask gap

PadBorehole

Coating web width0.08 mm

Layout parameters

x

Soldermask gap

PadBorehole

x + 0.1Soldermask to conductor pattern:0.15 mm

Parameters for fl exible soldermask

Cover foil gap(borehole)

Flow up to 25 µm at 50 µmadhesive thickness(Standard)

Adhesive flowafter lamination

Cover foil

Borehole

Soldering eye

Parameters for cover foils (Coverlay)

71


Here, too, the sharp edges in the 90° angle act like notches in metal. There is a risk of fractures at these point if the component is bent.

If SMD components are fi tted to fl exible PCBs it is advisable to reinforce these zones with 0.125 mm polyimide foil or 0.5 mm FR4. This prevents the compo-nent zone being bent which may dam-age the soldering points.

Conductor connections to SMD pads must be as far removed from the bend-ing zone as possible. SMD pads are extended under the cover foil to pro-vide better anchoring. 90° conductor kinks are allowed in this zone since they are reinforced with polyimide or FR4. SMD pads are only designed in nominal form in this layout which means that no additional anchoring is achieved. The bending zone (yellow) is too close to the SMD pads which means that there is a very great risk of fractures at the conductor connection to the two right-hand SMD pads.

If fl exible PCBs are slit, for example to bend two fl exible arms in different directions, an additional copper track must be fi tted both for a zero cut (left picture) and for a slit (right picture) to prevent tearing. The zero cut should also end in a borehole. The internal corners of the slit must be as large as possible in the form of a radius. These precautions prevent the fl exible PCBs tearing at the points described when subjected to mechanical stresses.

70


Cover foil webmin. 0.2 mm

RecessCover foil

Solderingeye

Borehole inthe circuit

The cover foil has a backing foil to-wards the adhesive side. When this backing foil is removed and during lam-ination, this web may break and settled on the soldering eye.

Cover foil web width, borehole to borehole

Rigid zone { Rigid zone {Flexiblezone{ {

Sol

derm

ask

Sol

derm

ask

{

Partial cover foil0.8 mm

0.4 mm 0.4 mm

0.8 mm

Flexiblezone

Sol

derm

ask

{FlexibleFlexiblezonezone

Flexiblezone

{{{

0.8 mm

0.4 mm

FlexibleFlexiblezonezone

Flexiblezone

Sol

derm

ask

{{{

0.8 mm

Partial cover foil and partial solder-mask

The partial cover foil overlaps the sol-dermask applied previously. Set back the soldermask by at least 0.4 mm from the transition edge.

There must be no interlayer connectedboreholes or soldering eyes in the over-lap zone. Overcoating or coverage is not permitted.

Cover foil overlap in the rigid zone

Flexible zone{Flexible zone{{Flexible zone{{Flexible zone{{Flexible zone{{Flexible zone{{

Cover foilAdhesive

Polyimide

FR 4

No-flowPrepreg

0.8 mm min. overlap

We recommend a web width of at least 0.2 mm to prevent this. If this is not possible the entire zone must be left open (alternatively a flexible solder-mask may be used).

73


{

Flexible zone Cover foil

Rigid zone Rigid zone

{ {Offset for tacking the cover foil

Tolerance ± 0.25 mm




An adhesive fl ow occurs during the lamination of cover foils. The adhesive fl ow is transparent and therefore not al-ways visible.

It is not possible to provide a cover with a fi nal surface in this zone and it must therefore be included in the resid-ual ring design. See diagram entitled "Parameters for cover foils (Coverlay)"

Cover foil

Partial cover foilWhen tacking the cover foil on to fl ex-ible materials marks for registration are placed outside the PCB contour. This must also be given due consideration in the usage design.

72


{Flexible zone

1st pressing(flexible layer)

{

{{Flexible zone {{{ FR4

Example of a layer structure with internal fl exible layer

75


Cover foil tocustomer’s

drawing

{Rigid zone{

{ {

Rigid zone {Flexible zone

0.8 mm min. overlap

No-flowprepreg

Partialcover foil

No-fl ow prepreg to level partial cover foil

The cover foil is only partially applied to internal fl exibly layers. The other area must be fi lled with a partial no-fl ow prepreg to prevent delamination.

Levelling internal cover foil

{Flexible zone withpartial cover foil

No-flow prepreg type 1080(~ 65 μm after pressing)

25 µmcover foil

50 µmadhesive

Zero cut

Pressing(flexible layer)Pressing(flexible layer)

Flexible zone withpartial cover foilpartial cover foil

(flexible layer)(flexible layer)(flexible layer)

Flexible zone withpartial cover foilpartial cover foil

Flexible zone withpartial cover foil

{Flexible zone with{Flexible zone with{Flexible zone with

25 µm 50 µm25 µm Zero cut

PressingPressingPressing

50 µm Zero cut25 µmcover foil

50 µmadhesive

25 µmcover foil

50 µmadhesive

Zero cut {

74


Polyimide

Surface (gold)

Cu base (possibly galv. Cu)

PolyimidePolyimidePolyimidePolyimidePolyimidePolyimide

Cu base (possibly galv. Cu)Cu base (possibly galv. Cu)Cu base (possibly galv. Cu)

Stiffener

ZIF-connector zone

Thickness 0.3 ± 0.03 mm (overall)

ZIF-connector

Consideration in terms of:- Surface- Reinforcement

77

flow

flow

FR4

PolyimideNo-flowPrepreg

max. 0.3 mm


Max. fl ow of the no-fl ow prepreg

Max. undercut(withdrawal of the no-fl ow prepregs)

undercut

undercut

FR4

PolyimideNo-flowPrepreg

max. 0.2 mm

Forward / Counter grooves

Why forward and counter grooves?

Adhesive, no-fl ow prepreg or transparent adhesive such as LF0100 / LF0200 or composite adhesive LF0111 / LF0212 only have one fl ow which can only be stopped by the forward groove.

?!

Do you have any questions about forward and counter grooves?Our Technology Team will be delighted to help (see page 86).iii

76


Danger of fracture

The copper must be set back since burr can be created during mechanical machining process.

Conductors should exit the pins in a droplet shape.

Not like this!

min. 0.1 mm

Pins

Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in Conductors should exit the pins in

Design of the connector zone when using fl exible soldermask or cover foil

The pins must be covered with solder-mask or cover foil to avoid the risk of fracture. At least 0.35 mm of the pins should be covered as a result of pos-sible offset when tacking the cover foil or positioning the fl exible soldermask.

Pins min. 0,35 mm

Dimension to customer’sdrawing or layout

Cover foil orflexible soldermask

Do you have any questions about ZIF-connectors?Our Technology Team will be delighted to help (see page 86).iii

79


Cold adhesionWarm adhesion

FR4

Scotch 467 /3M foil

FR4

No-flowPrepreg

Dimensions X and Y are taken from the customer's drawing or customer's layout.

Flexible zone

Pin

X

Y

X

Y X

+ +

Z

XFiducials

Mechanical dimensions

Dimension X is the main criterion for contact registration between the con-nector and connector housing. Incor-rect layouts result in a loss of contact or even a short-circuit.

It must be noted in the design of the external contour and layout that addi-tional fi ducials are required for the pro-duction process to allow compliance with the required tolerances.

78

81

With snap-out technology the rigid ma-terial under the fl exible zone initially re-mains connected to the rigid section of the PCB and is not removed until the customer receives it. This achieves greater stability during the fi tting proc-ess.

The forward grooves are inserted as standard. Retaining webs are left when the counter grooves are cut. These must not be positioned in the conduc-tor zone.

Snap-out technology


Snap-out zone

OK Not OK

Do you have any questions about snap-out technology?Our Technology Team will be delighted to help (see page 86).iii

80

83

References

More references at www.mos-electronic.de

82

References

Short extract from our long duration customers:

85

The subject of protecting the environment and preserving resources has been an integral part of our thoughts and actions since the company was founded. Located at the edge of a conservation area in the Northern Black Forest nature reserve, we pay very close attention to saving material, water and energy and to improving our consumption levels.

These factors also play a major role when we are selecting new production equip-ment. The recycling of materials and media has long been a matter of course for us. The subject of the environment is also a signifi cant criterion when we select our group partners.

Our partners are certifi ed to ISO 14001 without exception.

Environmental protection

84

Agents

Staub Industrievertretungen GmbHMr Rainer StaubObere Torstrasse 6D-72108 Rottenburg

phone: +49 (0) 74 57 - 69 72 52fax: +49 (0) 74 57 - 32 92mobile: +49 (0) 160 - 36 55 056mail: [email protected]

Willuweit IndustrievertretungenMr Jürgen WilluweitKesselbergweg 30D-52385 Nideggen

phone: +49 (0) 2427 - 909 59-20fax: +49 (0) 2427 - 909 59-21mobile: +49 (0) 1573 - 566 48 41mail: [email protected]

Karl-Friedrich KempfIndustry AgentsWaldstrasse 56D-77933 Lahr

phone: +49 (0) 78 21 - 98 33 26fax: +49 (0) 78 21- 98 33 27mobile: +49 (0) 175 - 16 39 464mail: [email protected]

Horst Seifert Industrie-VertretungenMr Sascha SeifertMucheweg 6D-14532 Stahnsdorf

phone: +49 (0) 33 29 - 63 48 90fax: +49 (0) 33 29 - 63 48 51mobile: +49 (0) 172 - 593 01 01

87

Contact

86

We look forward to receiving your inquiries either by phone or to [email protected]

Mrs Sibylle Klingler +49 (0) 70 55 - 92 99 -13 [email protected]

Mr Andreas Klittich +49 (0) 70 55 - 92 99 -43 [email protected]

Quality Assurance

Mrs Gabi Walz +49 (0) 70 55 - 92 99 -35 [email protected]

Work Preparation

Mr Jürgen Bauer Authorised Signatory +49 (0) 70 55 - 92 99 [email protected]

Mrs Margrit Schmalstieg Managing Director +49 (0) 70 55 - 92 99 [email protected]

Management

Central Offi ce+49 (0) 70 55 - 92 99 [email protected]

Service & Support

Mr Roland Drexler Sales +49 (0) 70 55 - 92 99 [email protected]

Mr Jens Rosen Sales Manager +49 (0) 70 55 - 92 99 -33mobile: +49 (0) 160 - 989 750 [email protected]

Sales

Mrs Sabrina Hammann Support & Logistics +49 (0) 70 55 - 92 99 [email protected]

Mr Stefan Reule Sales +49 (0) 70 55 - 92 99 [email protected]

Mr Michael Klingler +49 (0) 70 55 - 92 99 -66 [email protected]

Technical Sales

Mr Matthias Klingler +49 (0) 70 55 - 92 99 -55 [email protected]

Production Management

CAM, Data Mr Jürgen Holdermann Department Manager +49 (0) 70 55 - 92 99 [email protected]

Mrs Elke Lörcher +49 (0) 70 55 - 92 99 -12 [email protected]

Mrs Carolin Schmalstieg +49 (0) 70 55 - 92 99 - 47

[email protected]

Accounts, Purchasing

91

Notes

90

93

Notes

92

We are pink.

the pink circuit board

PRINTED CIRCUIT BOARD TECHNOLOGY FOR THE FUTURE

Legal Information

© 2014 MOS Electronic GmbHHermann-Loens-Strasse 40-46D-75389 NeuweilerProject Manager: Jens Rosen

Layout and designKing DesignAgentur für Werbung und MarketingD-72229 Rohrdorfwww.kingdesign-online.de

All rights reserved.This work and all its components are protected by copyright.They must not be used or may only be used with the prior consent of MOS Electronic GmbH.

MOS Electronic GmbHHermann-Loens-Straße 40-46D-75389 Neuweiler

phone +49 (0) 70 55 - 92 99 -0 | fax +49 (0) 70 55 - 15 [email protected] | www.mos-electronic.de printed circuit board technology for the future

Technologyby MOS

13th

edi

tion,

07/

2018

Tech

nolo

gy b

y M

OS

Documents

Technology - MOS Electronic · 2018. 10. 15. · ia-filler (IPC 4761 type IV) 90 € Carbon printing 120 € Colour change for soldermask (all colours possi 10) 120 €* Miscellaneous