Embed Size (px)
Citation preview
COMPLETE TEARDOWN
WITH:
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with AT&S Embedded Component Technology (ECP)
TDK SESUB Bluetooth Module
Title: TDK SESUB Bluetooth Module
Pages: 94
Date: June 2017
Format: PDF & Excel file
Price: Full report: EUR 3,490
Latest Release of TDK Embedded Die Package Technology
Although the embedded die market is still in an early phase, by 2021 itsrevenues will reach $50 million. It will have a compound annual growthrate for consumer applications in the range of 45% according to YoleDéveloppement.
Against this backdrop, TDK has released the world's smallest Bluetooth 4.1 lowenergy (LE) module, the SESUB-PAN-D14580. With dimensions of 3.5mm x3.5mm, it offers a footprint reduction of 60% compared to modules withdiscrete components. Thanks to its miniature size, light weight and low powerconsumption, the module is ideal for use in battery-powered wearable devices.
The module is packaged with TDK's SESUB (semiconductor embedded insubstrate) technology. It embeds a Dialog Semiconductor DA14580 Bluetoothchip into a 4-layer printed circuit board substrate and features an integratedDC-DC converter. This technology extends the package size beyond theintegrated circuit surface area and allows additional passive components to bemounted on top of the laminated module.
SESUB is a Chip-First Face-Up process. Initially, all the packaging steps wererealized internally at the panel-scale level by TDK, but more recently itannounced a joint venture with ASE to support Embedded Die SESUBtechnology. With this packaging approach, TDK considerably changed theconventional supply chain model, where the chip maker sells directly to thesystem maker. Here the module maker takes a larger role by addingconsiderable value.
The report includes an in-depth physical analysis of the Bluetooth module, anda complete description of the manufacturing process flow. For the first time,
the cost estimation of the module has beenrealized in partnership with SavanSys Solutions toprovide even more detail.
Also, we compare TDK’s SESUB with AT&S’Embedded Component Packaging (ECP) tounderstand the technology choices made by eachcompany.
TABLE OF CONTENTS
Overview / Introduction
Company Profile
• Embedded Die Market
• TDK Company Profile
• SESUB Presentation, Supply Chain and Roadmap
• SESUB Production Location and Capacity
Physical Analysis
• Physical Analysis Methodology
• Module Module views and dimensions Module opening Module delayering
• IC Die
View, dimensions and markings
Delayering and main block identification
Process Cross-section
• Module Cross-Section
Complete PCB Vias Die edges RDL Copper reveal
Manufacturing Process Flow
• IC Process and IC Fab Unit
Description
• SESUB Process Flow
• SESUB Fab Unit Description
• Module Assembly Process
• Module Assembly Unit
Description
Cost Analysis
• Yield Explanations and
Hypotheses
• IC Die IC front-end and wafer cost IC die cost and price
• SESUB Packaging SESUB panel cost SESUB panel cost by process
step SESUB cost per module
• Module Passives components cost Final assembly cost Final assembly cost per
process step and per module
Module cost
Estimated Price Analysis
Performed byPerformed by
AUTHORS:
Consulting in 2011 to setup itslaboratory. He previouslyworked for 25 years at AtmelNantes Technological AnalysisLaboratory as fab support inphysical analysis, and for threeyears at Hirex Engineering inToulouse, in a destructivephysical analysis lab.
YvonLe Goff (Lab)
Yvon has joinedS y s t e m P l u s
analyses for Advanced Packa-ging, MEMS and IntegratedCircuits. He has published morethan 50 Reverse Costing reportson various MEMS devicesincluding inertial, pressure,microphones or RF sensors.
Romain Fraux
R o m a i n i s i ncharge of costing
RELATED REPORTS
NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level
System-in-Package
TSMC Integrated Fan-Out (inFO) Package in Apple’s A10 Application Processor
Embedded Die Packaging: Technology and Market
Trends 2017
The first ultra-small multi-die lowpower module with boot memoryand power management integrated ina package-on-package compatibledevice for the Internet of Things.
Reverse engineering and costing ofthe new inFO packaging technologyfrom TSMC used for Apple’s latestA10 application processor, found inthe iPhone 7 and 7 Plus.
Embedded Die is finally passing thethreshold from incubation tovolume. Which markets are startingfirst, with which technology andsupply chain?
Pages: 132Date: June 2017Full report: EUR 3,490*
Pages: 100Date: October 2016Full report: EUR 3,490*
Pages: 150+Date: January 2017Full report: EUR 6,490*
Cost analysis performed in partnership with SavanSys Solutions
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
• MEMS & Sensors:
Accelerometer - Compass - Display /Optics - Environment - Fingerprint -Gyroscope - IMU/Combo - Light -Microphone - Oscillator - Pressure sensor
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Systems:
Automotive - Consumer - Energy -Medical - Telecom
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &costing analyses in various domains.
• Imaging:
Infrared - Visible
• Integrated Circuits & RF:
Integrated Circuit (IC) - RF IC
• LEDs:
LED Lamp - UV LED - White/blue LED
• Packaging:
3D Packaging - Embedded - SIP - WLP
More than 60 reports released each year on the following topics (considered for 2017):
SYSTEM PLUS CONSULTING EXISTING COSTING TOOLS
All System Plus Consultingservices and analyses arebuilt on the foundation ofcosting tools developedinternally.These proprietary tools canbe purchased under license.
There are two types ofcosting tools:- Process-based costing
tools: a specific process isdescribed using librariesof equipment andconsumables
- Parametric costing tools:costs are calculated froma set of parameters, asolution best suited tostandardizedtechnologies.
Performed by
ORDER FORM
Performed by
DELIVERY on receipt of payment:
By credit card:Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__|
Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP
In EURBank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING
21 rue La Nouë Bras de Fer44200 Nantes – France
Contact: EMAIL: [email protected]: +33 2 40 18 09 16
BILLING CONTACT
ABOUT SYSTEM PLUS CONSULTING
Name (Mr/Ms/Dr/Pr):......................................................................................Job Title:......................................................................................Company:......................................................................................Address:......................................................................................City: State:......................................................................................Postcode/Zip:......................................................................................Country:......................................................................................VAT ID Number for EU members: ......................................................................................Tel:......................................................................................Email:.....................................................................................
Date:.......................................................................................Signature:......................................................................................
First Name: ..................................................................Last Name: ...................................................................Email:............................................................................Phone:...........................................................................
SHIP TO PAYMENT
Please process my order for “TDK SESUB Bluetooth Module” Reverse Costing Report
Full Reverse Costing report: EUR 3,490*
Annual Subscription (including this report as the first of the year):
System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available.
Our services:
TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS
www.systemplus.fr - [email protected]
o 3 reports EUR 8 400*o 5 reports EUR 12 500*
o 7 reports EUR 16 000*o 10 reports EUR 21 000*o 15 reports EUR 27 500*
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: June 2017
Ref.: SP17306
TERMS AND CONDITIONS OF SALES
1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consultingexcept in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and workedout without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged onthese initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commitsitself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to thenumber of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.
4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of aparticular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penaltyfor late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on thedelivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty issent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total
invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequentlyany reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takesplace. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones(reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described inthe current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes allexternal event unpredictable and irresistible as defined by the article 1148 of the French Code Civil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costingtools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
Performed by
