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2021 Consumer Product Guide TEAMGROUP T-FORCE T-CREATE

T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

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Page 1: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

2021 ConsumerProduct Guide

● TEAMGROUP

● T-FORCE● T-CREATE

Page 2: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

● Established Datacell Technology Ltd, Hong Kong subsidiary

Hong Kong

Milestone

1997

1998

2004

2006

2008

2009

2011

2012

2014

2015

2016

2017

2018

2019

2020

2021

● Founded SMT factory in Brazil. Launched the new Team USB series● Exhibited at the CebIT for the first time● Exhibited at CES for the first time● Established Team Japan in Tokyo, Japan

● Damond(D603), USB drive, won the COMPUTEX d&i awards 2009

● Established flash product lines.

● Relocated to a newly acquired office due to rapid growth● Exhibited at Computex Taipei for the first time

● “Commonwealth Magazine’s Top 1000 Enterprises in Taiwan” ranked 419th. Ranked NO.395 of Deloitte Technology Fast 500 Asia Pacific.

● The establishment of Industrial Applications

● Exhibited at the ESEC for the first time.

● Established headquarter in Taiwan.

● Ranked 377 in the Technology Fast 500 Asia Pacific by Deloitte Hong Kong.● Developed the mobile application product line● Exhibited at the Embedded World for the first time

● XCALIBUR ARGB & Cardea Liquid won Taiwan excellent award.

● XTREEM ARGB won the Red Dot Design Award 2020.

● T-CREATE CLASSIC DDR4 Memory won the GOOD DESIGN AWARD 2020.

● NIGHT HAWK & GAMING BUNDLES PACK won the Taiwan Excellence Award 2017.

● NIGHT HAWK, XTREEM, T162 & T171 won the COMPUTEX d&i awards 2017.

● XTREEM won the GOOD DESIGN AWARD 2017.

● TEAMGROUP also listed company at stock exchange market in January,2019.

● XCALIBUR won the IF DESIGN AWARD 2019.

● XACALIBUR & NIGHT HAWK RGB won the Red Dot Design Award.

● T-FORCE XTREEM ARGB WHITE MEMORY SERIES won prestigious IF DESIGN AWARD 2021.

● T-FORCE TREASURE TOUCH EXTERNAL RGB SSD AND T-CREATE MEMORY won RED DOT DESIGN AWARD 2021.

● T-FORCE NIGHT HAWK RGB DDR4 & SPARK RGB UFD & T193 Flash Drive won 2021 Taiwan Excellence Award.

● XTREEM & NIGHT HAWK RGB won the IF DESIGN AWARD 2018.

● 2018 XCALIBUR won the Golden Pin Award 2018.

● T183 won the COMPUTEX d&i awards 2018.

● Sustained expansion of brand management and has a strong foothold as one of the top10 global memory product suppliers.

● USB 3.1 SSD -PD700 won the Taiwan Excellence Award 2016.

● MoStash won the COMPUTEX d&i awards 2016.

● T162 & NIGHTHAWK won the Golden Pin Award 2016.

● M152 won the Computex Best Choice Award 2015 with features of flash drive, file sharing and mobile phone screen mirroring.

● MoStash won Golden Pin Award 2015.

● Twinbo, mobile product, was awarded the Taiwan Excellence Award 2015.

Page 3: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

1 2

About TEAMGROUP Contents

MEMORY OF A LIFETIME

Team Group Inc. was founded in 1997 in Taiwan. To aim at the global layout of R&D technology and manufacturing in memory

products, the chairman of the board, Mr. Danny Hsia established the headquarter in 1997 in Taipei. Team Group Inc. possesses

professional research and development capabilities, high quality products, rapid productivity, a tightly-knit global sales network

and complete customer services. In addition to ranking among CommonWealth Magazine’s top 1000 enterprises, it has also

become one of the fastest growing 3C product manufacturer and a world’s leading brand in recent years. Team Group Inc. has

been publicly listed on the Emerging Stock Market since October 2010.Team Group Inc. also listed company at stock exchange

market in January 2019. (Stock code: 4967)

TEAMGROUP’S SERIES OF PRODUCTS ARE YOUR PERFECT CHOICE.

TEAMGROUP mainly produces its own brand of memory modules, memory cards, USB flash drives, solid state disks, peripheral

series, mobile accessories and industrial applications. Gaming competitions have drawn worldwide attention in the recent years,

so TEAMGROUP integrated its gaming memory modules into “T-FORCE” product line which is specifically designed for people

who pursuit extreme high speed and excellent performance. These products have been well received by the technology media

around the globe and have won honors such as Computex Design & Innovation Awards, Best Choice Award, Good Design

Product Award, Golden Pin design, TAIWAN EXCELLENCE, GOOD DESIGN AWARD 2017, iF Design Award 2018, iF Design

Award 2019 and RED DOT Design Award 2019.

GLOBALIZATION

With over 20 years of computer peripherals production and sales experience, Team Group Inc. has built up a strong center in

Taiwan for production, R&D, sales and customer service. It has subsidiary companies in Hong Kong and Japan and also has

over 300 global sales agents with more than 400 employees around the world. Through the real-time market information, and

based on each market’s characteristics, TEAMGROUP uses differentiating sales strategies with a global vision and a localized

channel management to establish a closed distribution network.

QUALITY GUARANTEED WITH COMPLETE WARRANTY SERVICE

TEAMGROUP is well praised by the industry and customers by adhering to the corporate philosophy of “Integrity, Innovation,

Professionalism, Efficiency, Discipline, and Simplicity.” Every series of TEAMGROUP’s memory product is covered with full

warranty services. We offer faster repair and exchange services than other brands and we guarantee to send RMA products

back into the hands of every global customer with a minimum of delivery time.

SOLID R&D CAPABILITIES

By building the best technical team, laboratories, and manufacturing equipment, TEAMGROUP’s products are made with spirits

of innovation and a strict quality control system. Our memory technology has passed the ISO9001 and ISO14001 certifications

and is equipped with strong vertical integration ability of product design, material acquisition, manufacturing process, and quality

testing. The result we have is that our latest over-clocking memory module is leading the industry. Recently, we have also

devoted into industrial products to adapt to the rapidly changing industry environment. By introducing the concept of smart living

and the use of cloud computing, we have shown our strength in R&D capabilities and we will further carry out the idea of One

Stop Service to enhance customer services. TEAMGROUP P48-P69

T-FORCE Gaming P03-P22

T-CREATE P23-P27

TEAMGROUP P28-P47

Page 4: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

3 4

XTREEM ARGB / XTREEM ARGB WHITE

NIGHT HAWK RGB

DDR4 4000 DDR4 3600 DDR4 3200 DDR4 3000Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2

32,000MB/s

(PC4-32000)

18-22-22-42

1.35V

8GBx2 / 16GBx2

28,800MB/s

(PC4-28800)

25,600MB/s

(PC4-25600)

16-18-18-38

24,000MB/s

PC4-24000)

GAMING MEMORY

T-FORCE Gaming

Taiwan Invention Patent / I703920China Utility Patent / CN 210039639 U

DDR4 4000 DDR4 3600 DDR4 3200Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx2

32,000MB/s

(PC4-32000)

18-22-22-42 / 18-24-24-46

1.35V / 1.4V

28,800MB/s

(PC4-28800)

18-22-22-42 / 14-15-15-35

1.35V / 1.45V

25,600MB/s

PC4-25600)

16-18-18-38 / 14-14-14-34

1.35V

Page 5: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

5 6

NIGHT HAWK Legend RGB

DELTA RGB

DELTA TUF Gaming Alliance RGB

XTREEM

DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx2

28,800MB/s

(PC4-28800)

18-22-22-42

1.35V

8GB / 8GBx2 / 16GB /16GBx2 / 32GB / 32GBx2

25,600MB/s

(PC4-25600)

16-18-18-38 / 16-20-20-40

24,000MB/s

(PC4-24000)

16-18-18-38

21,300MB/s

(PC4-213000)

16-18-18-38 / 16-18-18-43

1.2V

DDR4 3466 DDR4 3200Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2

27,700MB/s

(PC4-27700)

16-18-18-38

1.35V

25,600MB/s

(PC4-25600)

14-14-14-31

DDR4 3200 DDR4 2933 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8G / 8GBx2 / 16G / 16GBx2

32G /32Gx2

28,800MB/s

(PC4-28800)

16-18-18-38 / 16-20-20-40

1.35V

8GBx2 / 16GBx2

25,600MB/s

(PC4-25600)

16-18-18-38

24,000MB/s

(PC4-24000)

18-18-18-43

1.2V

DDR4 3866 DDR4 3733 DDR4 3600Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 8GBx4

30,900MB/s

(PC4-30900)

18-20-20-44

1.35V

8GBx2

29,800MB/s

(PC4-29800)

18-20-20-39

28,800 MB/s

(PC4 28800)

18-20-20-39

DDR4 4500 DDR4 4300 DDR4 4133 DDR4 4000Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2

36,000MB/s

(PC4-36000)

18-20-20-44

1.45V

34,400MB/s

(PC4-34400)

33,600MB/s

(PC4-33000)

18-18-18-38

1.4V

8GBx2 / 8GBx4

32,000MB/s

(PC4-32000)

18-20-20-44

1.35V

GAMING MEMORY GAMING MEMORY

Page 6: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

7 8

DARK Z

DARK Z FPS

DARK Zα

DARK PRO

DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx2

28,800MB/s

(PC4-28800)

18-22-22-42

1.35V

8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2

25,600MB/s

(PC4-25600)

16-18-18-38 / 16-20-20-40

24,000MB/s

(PC4-24000)

16-18-18-38

8GB/8GBx2/16GB/16GBx2

21,300MB/s

(PC4-213000)

16-18-18-38

1.2V

DDR4 4000Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2

32,000MB/s

(PC4-32000)

16-18-18-38

1.45V

DDR4 4000 DDR4 3600 DDR4 3200Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx2

32,000MB/s

(PC4-32000)

18-22-22-42 / 18-24-24-46

1.35V / 1.4V

28,800MB/s

(PC4-28800)

18-22-22-42

25,600MB/s

(PC4-25600)

16-18-18-38 / 16-20-20-40

1.35V

GAMING MEMORYGAMING MEMORY

DDR4 3466 DDR4 3200Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2

27,700MB/s

(PC4-27700)

16-18-18-38

1.35V

25,600MB/s

(PC4-25600)

14-14-14-31

Taiwan Utility Patent / M585419China Utility Patent / CN 210038691 U

Page 7: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

VULCAN Z

VULCAN TUF Gaming Alliance ZEUS SO-DIMM

ZEUS

9 10

GAMING MEMORYGAMING MEMORY

DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2

28,800MB/s

(PC4-28800)

18-22-22-42

1.35V

25,600MB/s

(PC4-25600)

16-18-18-38 / 16-20-20-40

24,000MB/s

(PC4-24000)

16-18-18-38

21,300MB/s

(PC4-213000)

18-18-18-43

1.2V

DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GB / 8GBx2 / 16GB / 16GBx2

28,800MB/s

(PC4-28800)

19-19-19-39

1.35V

25,600MB/s

(PC4-25600)

16-18-18-38 / 16-20-20-40

24,000MB/s

(PC4-24000)

16-18-18-38

21,300MB/s

(PC4-213000)

18-18-18-43

1.2V

DDR4 3200 DDR4 3000 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 Pin Non-ECC Unbuffered DIMM

8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2

25,600MB/s

(PC4-25600)

16-20-20-40 / 20-22-22-46

1.35V / 1.2V

24,000MB/s

(PC4-24000)

16-18-18-38

1.35V

21,300MB/s

(PC4-21300)

19-19-19-43

1.2 V

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Laptop

260Pin SO-DIMM Non ECC

8GB / 16GB / 32GB / 8GBx2 / 16GBx2 / 32GBx2

25,600MB/s

(PC4-25600)

16-20-20-40 / 22-22-22-52

1.35V / 1.2V

21,300MB/s

(PC4-21300)

19-19-19-43

1.2V

Page 8: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

DELTA MAX / DELTA MAX WHITE RGB SSD

DELTA / DELTA S / DELTA R RGB SSD

DELTA S TUF Gaming Alliance RGB SSD (12V)

DELTA TUF Gaming Alliance RGB SSD (5V)

11 12

GAMING SSDGAMING MEMORY

Interface

NAND Flash

Performance

Capacity

RGB Signal

RGB Header

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB

USB Micro B type

5pin 12V RGB Header● RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).

100 x 69.85 x 9.5 mm

DC 5V

● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction.

Interface

NAND Flash

Performance

Capacity

RGB Signal

RGB Header

Features

Dimensions

Voltage

SATA III 6Gb/s

3D TLC

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB

USB Micro B type

3 or 4 pin 5V add Header● ASUS TUF Gaming Alliance certified RGB solid state drive.● TUF Gaming Alliance design elements.● Fully upgraded, extreme performance.

100 x 69.85 x 9.5 mm

DC 5V

● Tough protection, durable and reliable.● 3 pin connector makes lighting effects synchronization so easy.

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB● The largest visual proportion designed, bringing the most colorful lighting effects.● The mirror surface is simply designed to present a mirror reflection effect.● Lighting effects can be synchronized with the motherboard.● To understand the status of the system by Illuminated lighting effects.

100.0 x 69.9 x 9.5 mm

DC 5V

● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction

Taiwan Utility Patent / M583110China Utility Patent / CN 209766039 UTaiwan Invention Patent / I697761United States Patent / US10,803,713 B1

Interface

NAND Flash

Performance

Capacity

RGB Signal

RGB Header

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB

USB Micro B type

3 or 4 pin 5V add Header (DELTA) / 5pin 12V RGB Header (DELTA S) / 9 pin USB Header (DELTA R)● RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).

100 x 69.85 x 9.5 mm

DC 5V

● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction.

China Utility Patent / CN 207676655 U

Page 9: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

DELTA Phantom Gaming RGB SSD

VULCAN G SATA SSD

VULCAN SSD

CARDEA Liquid M.2 PCIe SSD

13 14

GAMING SSDGAMING SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D TLC

Read: 550MB/s ; Write: 500MB/s Max

512GB / 1TB● 4 times faster than a HDD.● Optimized SLC caching algorithm.● S.M.A.R.T. monitoring technology.● TRIM optimization command.

100 x 69.9 x 7 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB● 3D NAND technology-the capacity has been expanded more than ever, which is capable of storing more games and data.● High speed transfer: the excellent experience in terms of booting, data adding, and gaming reaction requirement bring all

incredible read write speed.● Extremely lightweight and thin. 2.5-inch drive with 7mm in height.● Support S.M.A.R.T. technology monitoring hard drive status efficiently.● Support TRIM bring out its best performance on the compatible operating system.● Product warranty three years product warranty with free technical support service.

100 x 69.9 x 7 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

RGB Signal

RGB Header

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: 560MB/s ; Write: 510MB/s Max

500GB / 1TB

USB Micro B type

3 or 4 pin 5V add Header / RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).● Support S.M.A.R.T. technology.

100 x 69.85 x 9.5 mm

DC 5V

● Support TRIM.● Configurable Error Correction.

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D NAND

Read: 3400MB/s ; Write: 3000MB/s Max

512GB / 1TB● The world's exclusive water-cooling module solid-state hard drive especially designed for gaming/high-performance computers.● High-speed transferring interface PCI-e with the latest NVMe1.3 protocol.● Life-friendly design, allow user to add on solution anytime for DIY adjustment purpose.● Product warranty 3 years product warranty with free technical support service.

80.0 x 24.1 x 14.3 mm

DC +3.3V

Taiwan Utility Patent / M574264China Utility Patent / CN 209674880 UChina Invention Patent / CN 111276173 A

Page 10: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

CARDEA A440 M.2 PCIe SSD

CARDEA II M.2 PCIe SSD

CARDEA IOPS M.2 PCIe SSD

CARDEA II TUF Gaming Alliance M.2 PCIe SSD

15 16

GAMING SSDGAMING SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D TLC

Read: 3400MB/s ; Write: 3000MB/s Max

512GB / 1TB● First M.2 SSD with ASUS TUF Gaming Alliance certification.● Gaming style cooling fin for best temperature control.● Fully upgraded, extreme performance.● Smart algorithm for prolonging the service life.

80.1 x 23.4 x 12.9 mm

DC +3.3V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D NAND

Read: 3400MB/s ; Write: 3000MB/s Max

512GB / 1TB● Cooling module with gaming fin type design can provide effective cooling for continuous and high-intensity use.● High performance superconductivity - Thermally conductive adhesive offers averageheat radiating, instantaneously therma

energy transfer and accelerates the radiating process.● Extreme read/write speed - Over 3,400MB/s of reading speed can enhance the speed and performance of the overall system.● PCIe interface - Support latest NVMe specification.● Support S.M.A.R.T. technology - Monitoring hard drive status efficiently.● Support TRIM Bring out its best performance on the compatible operating system.Product warranty - 3 years product warranty.● Free technical support service.

80.1 x 23.4 x 12.9 mm

DC +3.3V

Taiwan Utility Patent / M541645

Interface

NAND Flash

Performance

Capacity

Features

IOPS

Dimensions

Voltage

PCIe Gen3 x4 with NVMe 1.3

3D TLC

Read: 3400MB/s ; Write: 3000MB/s Max

1TB● Winning every crucial game without lagging.● Enjoy two cooling patents at once.● Ultimate performance.● Smart algorithm enhances stability and durability.

1TB Read / Write: 680K/670K IOPS Max

80.0 x 22.0 x 3.7 mm (with Graphene heat sink)

80.0 x 23.4 x 12.9 mm (with Aluminum heat sink)

DC +3.3V

Taiwan Utility Patent / M541645

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen4.0 x4 with NVMe 1.4

3D NAND

Read: 3400MB/s ; Write: 3000MB/s Max

512GB / 1TB● Enjoy the lightning speed of the PCIe Gen4 x4.● Featuring two patented heat sinks.● Effective cooling—flexible installation.● Supports the latest NVMe 1.4 standard.

80.0 x 22.0 x 3.7 mm(with Graphene heat sink)

80.0 x 23.4 x 12.9 mm(with Aluminum heat sink)

DC +3.3V

Taiwan Utility Patent / M541645Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U

Page 11: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

CARDEA Ceramic C440 M.2 PCIe SSD

CARDEA ZERO Z440 M.2 PCIe SSD

CARDEA ZERO Z340 M.2 PCIe SSD

CARDEA ZERO Z330 M.2 PCIe SSD

17 18

GAMING SSDGAMING SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D NAND

Read: 2100MB/s ; Write: 1700MB/s Max

512GB / 1TB / 2TB● Unleash the full power.● Ultra-thin structure.● Patented graphene cooling structure.● Smart management technology.

80.0 x 22.0 x 3.7 mm

DC +3.3V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D TLC

Read: 3400MB/s ; Write: 3000MB/s Max

512GB / 1TB● High speed read/write performance.● Ultra-thin and lightweight structure.● Patented graphene cooling technology.● All-around smart management technology.

80.0 x 22.0 x 3.7 mm

DC +3.3V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen4 x4 with NVMe 1.4

3D NAND

Read: 5000MB/s ; Write: 4400MB/s Max

1TB / 2TB● M.2 NVMe PCIe Gen4 x4 solid state drive. Supports the latest platform AMD X 570.● Excellent performance - Read speed is up to 5,000 MB/s. Enhances the speed and performance of the overall system.● Three heat dissipation elements - the combination of graphene and copper can provide excellent heat dissipation. 0.2mm

ultra-thin and patented cooling module can avoid interference during installation.● Multiple protection, smart management technology - effectively monitors the status of solid state drive and maximizes its

performance.● Product warranty - five-year product warranty with free technical support service.

80.0 x 22.0 x 3.7 mm

DC +3.3V

Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.4

3D TLC

Read: 5000MB/s ; Write: 4400MB/s Max

1TB / 2TB● Unleash the ultimate power.● Beautiful and thin as a snowflak.● Top specification that breaks through the limit.● Aerospace ceramic material for better heat dissipation.● Trustworthy smart management technology.

80.0 x 22.0 x 4.75 mm

DC +3.3V

Taiwan Utlity Patent / M595313China Utility Patent / CN 210984280 U

Page 12: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

CARDEA ZERO M.2 PCIe SSD

TREASURE TOUCH External RGB SSD

SPARK RGB USB3.2 FLASH DRIVE

19 20

GAMING ACCESSORYGAMING SSD

GAMING A2 CARD SSD Adaptor

Applicable type

Applicable size

Features

Dimensions

Weight

2.5” SATA SSD

2.5” SSD 7mm / 9mm ● Magnetic attraction for easy placement.● Easy to lock and install.● Thoughtful angle design to avoid hands jamming.● Perfect with RGB SSD.● Tough, durable and reliable.

99.0 x 84.1 x 11.9 mm

74g

Capacity

Performance

Interface

Dimensions

Voltage

256GB / 512GB / 1TB

up to 100/90MB/s

Micro SDXC UHS-Ⅰ U3 V30 A2

15.0 x 11.0 x 1.0 mm

2.7V~3.6V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

USB 3.2 Gen2 Type C

3D TLC

Read: 400MB/s ; Write: 400MB/s Max

1TB● Magical RGB as new gaming element● Simple and stylish. Leading the trend● USB 3.2 Gen2 Type C● Wide compatibility with gaming consoles● Touch Me with endless usage possibilities

80.0 x 22.0 x 3.7 mm

DC 5V

Taiwan Utility Patent / M575552

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe 3.0 x4 with NVMe 1.2

3D NAND

Read: 2600MB/s ; Write: 1450MB/s Max

240GB / 480GB● The first super slim graphene SSD cooling module.● The combination of graphene and copper foil can efficiently speed up the heat transfer.● NVMe interface – Support latest NVMe specification.● Support S.M.A.R.T. technology – Monitoring hard drive status efficiently.● Support TRIM – Bring out its best performance on the compatible operating system.● Product warranty – 3-year product warranty. Free technical support service.

80.0 x 22.0 x 3.7 mm

DC +3.3V

Taiwan Utility Patent / M548287

● Smart capacity status indicator[1]

● Easy-Slide! Capless design

Interface

NAND Flash

Performance

Capacity

Feature

Dimensions

Voltage

USB 3.2 Gen 1

3D TLC

Read: 180MB/s ; Write: 90MB/s Max

128GB● RGB soft ambient lighting effect● Support multi-platform

60.9(L) x20.4 (W) x8.6 (H) mm

DC +3.3V[1] Smart capacity status indicator supports Windows system only. If connected to a game console or Mac OS, only normal RGB lighting effects will be displayed.

Taiwan Utility Patent / M583608Chian Utility Patent / CN 209674876 U

Page 13: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

CAPTAIN RGB Control Box & RGB Strip

21 22

GAMING ACCESSORYGAMING ACCESSORY

ARGB LED Uniform Strip

CK5

Melting point / freezing point

Initial boiling point and boiling range

Flash point

Features

Vapour pressure

Upper/lower flammability orexplosive limits

-60 °C

187 °C

103 °C - closed cup● Environmentally friendly anti-corrosion material● Natural biological decomposition● Low conductivity

0.11 hPa at 20 °C

Upper explosion limit: 12.5 %(V)

Lower explosion limit: 2.6 %(V)

Relative density: 1.036 g/mL at 25 °C

SABLE SABLE L SABLE XLSurface Material

Base Material

Dimensions

Weight

100% Polyester

Silicone

470.0 x 230.0 x 2.0 mm

205g

Robust CORDURAl® nylon

Nature Rubber

450.0 x 400.0 x 2.0 mm

380g

Robust CORDURAl® nylon

Nature Rubber

900.0 x 400.0 x 2.0 mm

680g

MOUSE PAD

Signal Output

Via 5V ARGB 3 pin header x 4port

Via 12V RGB 4 pin header x 1port

Switch bottom

Hardware light control by build in IC

solution, control by switch

Power

Interface

Color

Weight

Includes

Feature

Dimensions

Voltage

SATA power (5V)

Signal Input

Via 5V ARGB 3 pin header x 1port

Via 12V RGB 4 pin header x 1port

Black

75g

30cm ARGB Strip x2 pcs

94.4 x 78.0 x 16.0 mm

DC 5V

● Auto detection input signal sources, automatically switching output

● Support lighting effect control and software synchronization● Build in lighting effect by hardware control

● Support RGB x1 / ARGB x4 device lighting effect signal control● Product warranty – 1 year product warranty with free technical

support service

Voltage

Length

Features

DC +5V

450mm● ARGB addressable LED.● Intensive and even lighting effect.● Rollable material.● Magnetic light clip.● Compatible with all major motherboard's lighting control software.

Taiwan Utility Patent / M583184Chinese Utility Paten / CN 210042292 U

Page 14: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

23 24

T-CREATE

CLASSIC 10L

EXPERT OC10L

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx 2 / 32GBx2

25,600MB/s

(PC4-25600)

22-22-22-52

1.2V

21,328MB/s

(PC4-21300)

19-19-19-43

DDR4 3600Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

8GBx2 / 16GBx2 / 32GBx2

28,800MB/s

(PC4-28800)

18-22-22-42

1.35V

CREATE MEMORY

Page 15: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

CLASSIC 10L SO-DIMM EXPERT SATA SSD

CLASSIC SATA SSD

25 26

CREATE SSDCREATE MEMORY / SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen4.0 x4 with NVMe 1.4

3D TLC

Read: 5000MB/s ; Write: 4400MB/s Max

1TB / 2TB● Timeless classic.● Customized stable firmware for storage safety.● Specially chosen Flash IC for focusing creation.● Greatly shorten your waiting time.● Built-in high-rate LDPC ECC functionality.

80.0 x 22.0 x 3.7 mm

DC +3.3V

CLASSIC PCIe 4.0 SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D TLC

Read: 550MB/s ; Write: 520MB/s Max

1TB● Timeless classic.● Customized stable firmware for storage safety.● No need to wait while creating.

100.0 x 69.9 x 7.0 mm

DC 5V

● Large storage for creative work.● Built-in high-rate LDPC ECC functionality.

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D TLC

Read: 560MB/s ; Write: 520MB/s Max

1TB / 2TB● Out of this world , ridiculous durability.● The only SSD that can give the creator a peace of mind.● The world’s first 12-year ultra long term warranty.

100.0 x 69.9 x 7.0 mm

DC 5V

● High speed. Time-saving. Create without waiting.● TB level of storage that meets the needs for creativity.

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Laptop

260Pin SO-DIMM Non ECC

8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2

25,600MB/s

(PC4-25600)

22-22-22-52

1.2V

21,300MB/s

(PC4-21300)

19-19-19-43

Page 16: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

TEAMGROUP

27 28

CREATE SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D TLC

Read: 3400MB/s ; Write: 3000MB/s Max

1TB / 2TB● Out of this world , ridiculous durability.● The only SSD that can give the creator a peace of mind.● The industry’s first 12-year ultra long term warranty.● No more anxiety of waiting for files to be converted.● Meet the storage needs of creating large contents.

80.0 x 22.0 x 3.7 mm

DC +3.3V

EXPERT PCIe SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe Gen3.0 x4 with NVMe 1.3

3D TLC

Read: 2100MB/s ; Write: 1700MB/s Max

512GB / 1TB / 2TB● Timeless classic.● Customized stable firmware for storage safety.● Specially chosen Flash IC for focusing creation.● Greatly shorten your waiting time.● Built-in high-rate LDPC ECC functionality.

80.0 x 22.0 x 3.7 mm

DC +3.3V

CLASSIC PCIe SSD

Page 17: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

29 30

TEAMGROUP MEMORYTEAMGROUP MEMORY

ELITE + U-DIMM

ELITE U-DIMM

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

4GB / 4GBx2 / 8GB / 8GBx2 /16GB / 16GBx2

32GB / 32GBx2

25,600MB/s

(PC4-25600)

22-22-22-52

1.2V

21,300MB/s

(PC4-21300)

19-19-19-43

DDR4 2400

4GB / 4GBx2 / 4GBx4 / 8GB / 8GBx2 / 8GBx4

16GB / 16GBx2

19,200MB/s

(PC4-19200)

16-16-16-39

DDR4 2133

17,000MB/s

(PC4-17000)

15-15-15-36

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Desktop PC

288 pin Non-ECC Unbuffered DIMM

4GB / 4GBx2 / 8GB / 8GBx2 / 16GB / 16GBx2

32GB / 32GBx2

25,600MB/s

(PC4-25600)

22-22-22-52

1.2V

21,300MB/s

(PC4-21300)

19-19-19-43

DDR4 2400

4GB / 4GBx2 / 4GBx4 / 8GB / 8GBx2 / 8GBx4

16GB / 16GBx2

19,200MB/s

(PC4-19200)

16-16-16-39

DDR4 2133

17,000MB/s

(PC4-17000)

15-15-15-36

ELITE SO-DIMM

MAC SO-DIMM

DDR3 1866 DDR3 1600Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Laptop

204Pin SO-DIMM Non ECC

4GB / 4GBx2

8GB / 8GBx2

14,928MB/s

(PC3-14900)

13-13-13-32

1.5V

2GB / 2GBx2 / 4GB

4GBx2 / 8GB / 8GBx2

12,800MB/s

(PC3-12800)

11-11-11-28

1.35V / 1.5V

DDR3 1333

10,664MB/s

(PC3-10600)

9-9-9-24

DDR2 800 DDR2 667

1GB / 2GB

6,400MB/s

(PC2-6400)

6-6-6-18

1.8V

4GB / 4GBx2 / 8GB

8GBx2 / 16GB / 16GBx2

5,336MB/s

(PC2-5300)

5-5-5-15

DDR4 3200 DDR4 2666Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Laptop

260Pin SO-DIMM Non ECC

8GB / 8GBx2 /16GB

16GBx2 / 32GB / 32GBx2

25,600MB/s

(PC4-25600)

22-22-22-52

1.2V

4GB / 4GBx2 / 8GB / 8GBx2 /16GB / 16GBx2

32GB / 32GBx2

21,300MB/s

(PC4-21300)

19-19-19-43

DDR4 2400

19,200MB/s

(PC4-19200)

16-16-16-39

DDR4 2133

4GB / 4GBx2 / 8GB / 8GBx2

16GB / 16GBx2

17,000MB/s

(PC4-17000)

15-15-15-36

DDR3 1600 DDR3 1333Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Laptop

204Pin SO-DIMM Non ECC

4GB / 8GB

12,800MB/s

(PC3-12800)

11-11-11-26

1.35V / 1.5V

10,664MB/s

(PC3-10600)

9-9-9-24

Page 18: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

31 32

TEAMGROUP SSDTEAMGROUP MEMORY

ECC U-DIMM

ECC R-DIMM

DDR4 2666 DDR4 2133DDR4 2400 DDR4 1600Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Server / Workstation

288Pin Registered-DIMM

4GB / 8GB /16GB

21,300MB/s

(PC4-21300)

22-22-22-52

1.2V

17,064MB/s

(PC4-17000)

19-19-19-43

19,200MB/s

(PC4-19200)

19-19-19-43

240Pin Registered-DIMM

4GB / 8GB

12,800MB/s

(PC3-12800)

19-19-19-43

1.35V / 1.5V

DDR4 2666 DDR4 2133DDR4 2400 DDR4 1600Suitable For

TYPE

Capacity

Data Transfer

Bandwidth

Latency

Voltage

Server / Workstation

288Pin Registered-DIMM

4GB / 8GB /16GB

21,300MB/s

(PC4-21300)

22-22-22-52

1.2V

17,064MB/s

(PC4-17000)

19-19-19-43

19,200MB/s

(PC4-19200)

19-19-19-43

240Pin Registered-DIMM

4GB / 8GB

12,800MB/s

(PC3-12800)

19-19-19-43

1.35V / 1.5V

QX SSD

CX1 SSD CX2 SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 560MB/s ; Write: Up to 480MB/s

15.3TB (15.3TB, the industry’s largest consumer-grade 2.5” SATA SSD)● 15.3TB, the industry’s largest consumer-grade 2.5” SATA SSD.● Smart Dual Cache and powerful performance.● A monster that can defeat mechanical hard drives.● Ultra-high durability. Stable and reliable.

100.0 x 69.9 x 7.0 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 540MB/s ; Write: Up to 490MB/s

240GB / 480GB / 960GB● A must-have for beginners who want to replace

their traditional mechanical hard drive● Advanced SLC Caching technology● Shock and drop resistant. Quiet and lightweight● ECC (Error Correction Code) function enhances

efficiency

100.0 X 69.9 X 7.0 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 540MB/s ; Write: Up to 490MB/s

256GB / 512GB / 1TB / 2TB● A must-have for beginners who want to replace

their traditional mechanical hard drive● Advanced SLC Caching technology● Shock and drop resistant for safe use● ECC (Error Correction Code) function enhances

efficiency

100.0 X 69.9 X 7.0 mm

DC 5V

Page 19: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

33 34

TEAMGROUP SSDTEAMGROUP SSD

MP34 M.2 PCIe SSD

MP33 PRO M.2 PCIe SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe 3.0 x4 with NVMe 1.3

3D NAND

Read: Up to 3500MB/s ; Write: Up to 2900MB/s

256GB / 512GB / 1TB / 2TB / 4TB● With DRAM Cache buffer.● Extreme read/write speed – Over 3000MB/s of read speed can enhance the speed and performance of the overall system.● NVMe interface – Support latest NVMe specification.● Support S.M.A.R.T. technology – Monitoring hard drive status efficiently.● Support TRIM – Bring out its best performance on the compatible operating system.● Product warranty – 3 years product warranty. Free technical support service.

80.1 x 22.0 x 3.1 mm

DC +3.3V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe 3.0 x4 with NVMe 1.3

3D NAND

Read: Up to 2100MB/s ; Write: Up to 1700MB/s

512GB / 1TB / 2TB● High-speed reading and writing for more efficiency.● Stable and durable- Not only fast, but reliable● Up to 2TB of storage capacity● Five year warranty providing customers with peace of mind.

80.1 x 22.0 x 3.1 mm

DC +3.3V

● Optimized performance.● Complete lineup of capacities.● Trustworthy reliability.

EX2 SSD

GX1 SSD GX2 SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 550MB/s ; Write: Up to 520MB/s

512GB / 1TB / 2TB● Blazing read/write speed● Optimized performance● Complete lineup of capacities● Trustworthy reliability

100.0 X 69.9 X 7.0 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 530MB/s ; Write: Up to 480MB/s

120GB / 240GB / 480GB / 960GB● 4x faster than a HDD ● Read speeds up to 530 MB/s to boost overall

system responsiveness and performance● Supports S.M.A.R.T. ● Supports TRIM 

100.0 X 69.9 X 7.0 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

SATA III 6Gb/s

3D NAND

Read: Up to 550MB/s ; Write: Up to 500MB/s

128GB / 256GB / 512GB / 1TB / 2TB● 4x faster than a HDD ● Read speeds up to 550 MB/s to boost overall

system responsiveness and performance● Supports S.M.A.R.T. ● Supports TRIM 

100.0 X 69.9 X 7.0 mm

DC 5V

Page 20: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

35 36

TEAMGROUP SSDTEAMGROUP SSD

PD1000 Portable SSD

PD400 Portable SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

USB 3.2 Gen1 5Gb/s

3D NAND

Read: Up to 430MB/s ; Write: Up to 420MB/s

240GB / 480GB / 960GB● USB 3.2 Gen1 Super high-speed transmission.● 3D NAND SSD.● Extreme Metal Craft , Easy to carry lightweight size.● Dustproof & Water Repellent (IP66) , Crushproof.

83.1 x 65.5 x 13.2 mm

DC 5V

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

USB 3.2 Gen2 10Gb/s

3D NAND

Read: Up to 1000MB/s ; Write: Up to 900MB/s

512GB / 1TB / 2TB● USB 3.2 Gen2 Super high-speed transmission.● Dustproof & Water Repellent (IP68,under water 1m,1hr).● 3D NAND SSD.● Us Military Grade Shock Proof(MIL-STD 810G 516.6).

107.0 x 40.0 x 10.9 mm

DC 5V

MP33 M.2 PCIe SSD

MS30 M.2 PCIe SSD

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

PCIe 3.0 x4 with NVMe 1.3

3D NAND

Read: Up to 1800MB/s ; Write: Up to 1500MB/s

512GB / 1TB / 2TB● High-speed reading and writing for more efficiency.● Stable and durable- Not only fast, but reliable.● Up to 2TB of storage capacity.● Five year warranty providing customers with peace of mind.

80.1 x 22.0 x 3.1 mm

DC +3.3V

● Optimized performance.● Complete lineup of capacities.● Trustworthy reliability.

Interface

NAND Flash

Performance

Capacity

Features

Dimensions

Voltage

M.2 2280 SATA III

M.2 2242 SATA III

3D NAND

Read: Up to 550MB/s ; Write: Up to 500MB/s

M.2 2242 : 128GB / 256GB / 512GB

M.2 2280 : 128GB / 256GB / 512GB / 1TB● Read/write speed: up to 530/430 MB/s*(512GB).● Mainstream M.2 interface.● Supports Intel's SRT.

M.2 2242:42.0 x 22.0 x 3.5 mm

M.2 2280:80.0 x 22.0 x 3.5 mm

DC +3.3V

● Supports S.M.A.R.T.● Supports TRIM.● DRAM-less.

Page 21: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

37 38

TEAMGROUP CARDTEAMGROUP CARD

ELITE SDXCMEMORY CARD

CLASSIC SDXC / SDHCMEMORY CARD

PRO SDXCMEMORY CARD

XTREEM SDXCMEMORY CARD

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

SDXC:128GB / 256GB

up to 100/90 MB/s

Yes

SDXC UHS-I U3 V30

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

SDXC:64GB / 128GB / 256GB

up to 250/120 MB/s

Yes

SDXC UHS-II U3 V60

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

SDXC:64GB / 128GB / 256GB

up to 90/45 MB/s

Yes

SDXC UHS-I U3 V30

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

SDXC:64GB / 128GB / 256GB

SDHC:16GB / 32GB

up to 80/15 MB/s

Yes

SDHC/SDXC UHS-I U1 C10

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

SDXC / SDHCUHS-I U1

SDHCClass 10 / Class 4

CF233X / 133X

Capacity

Write Protection

Interface

Dimensions

Voltage

133X:4GB / 8GB / 16GB

233X:4GB / 8GB / 16GB / 32GBB

Yes

CF 6.0 Type I

32.0 x 24.0 x 2.1 mm

3.3V ~ 5V

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

4GB / 8GB / 16GB / 32GB

up to 10/4 MB/s

Yes

SDHC C4/C10

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Write Protection

Interface

Dimensions

Voltage

SDXC:64GB / 128GB / 256GB

SDHC:16GB / 32GB

up to 60/20 MB/s

Yes

SDHC/SDXC UHS-I U1 C10

32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Page 22: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

39 40

TEAMGROUP CARDTEAMGROUP CARD

COLOR CARDMicro SDHC / SDXCUHS-I U1

COLOR CARD IIMicro SDXC / SDHCUHS-I U3

Capacity

Performance

Interface

Dimensions

Voltage

16GB / 32GB / 64GB / 128GB / 256GB / 512GB

up to 80/20 MB/s

Micro SDHC/SDXC UHS-I U1 C10

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Interface

Dimensions

Voltage

16GB / 32GB / 64GB / 128GB

up to 90/45 MB/s

Micro SDHC/SDXC UHS-I U3 C10

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Micro SDXC / SDHCUHS-I U1

Micro SDHCClass 10 / Class 4

Capacity

Performance

Interface

Dimensions

Voltage

4GB / 8GB / 16GB / 32GB

up to 10~13/4~5 MB/s

Micro SD/SDHC

15.0 x 11.0 x 1.0 mm

2.7V~3.6V

Capacity

Performance

Interface

Dimensions

Voltage

Micro SDXC:64GB / 128GB

Micro SDHC:16GB / 32GB

up to 80/15 MB/s

Micro SDHC/SDXC UHS-I U1 C10

15.0 x 11.0 x 1.0 mm

2.7V~3.6V

PRO A1 U3 V30MicroSD CARD

ELITE A1 U3 V30MicroSD CARD

Dash CardMicro SDHC / SDXCUHS-I U1

GO CARD (for action cameras)

Micro SDHC / SDXCUHS-I U3

Capacity

Performance

Interface

Dimensions

Voltage

128GB / 256GB

up to 100/90 MB/s

Micro SDXC UHS-I U3 V30 A1

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Interface

Dimensions

Voltage

64GB / 128GB / 256GB / 512GB / 1TB

up to 90/45 MB/s

Micro SDXC UHS-I U3 V30 A1

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Interface

Dimensions

Voltage

32GB / 64GB / 128GB / 256GB / 512GB / 1TB

up to 90/45 MB/s

Micro SDHC/SDXC UHS-I U3 V30

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Capacity

Performance

Interface

Dimensions

Voltage

8GB / 16GB / 32GB / 64GB / 128GB

up to 80/20 MB/s

Micro SD/SDHC/SDXC UHS-I U1 C10

Micro SD:15.0 x 11.0 x 1.0 mm

Adapter:32.0 x 24.0 x 2.1 mm

2.7V~3.6V

Page 23: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

41 42

TEAMGROUP UFDTEAMGROUP UFD

T193 USB3.2FLASH DRIVE

T183 USB3.2FLASH DRIVE

C212 USB3.2FLASH DRIVE

C211 USB3.2FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

32GB / 64GB / 128GB

Nickel Black

USB 3.2 Gen 1

72 x 24 x 4.6 mm

19g

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB / 128GB

Nickel Black

USB 3.2 Gen 1

60.3 x 18.0 x 4.6 mm

19g

Taiwan Utility Patent / M581756Taiwan Design Paten / D199855China Utility Model Patent / ZL 2019 2 0808175.3

C201 USB3.2FLASH DRIVE

C188 USB3.2FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

32GB / 64GB / 128GB

Grown-up Pink / Matcha Green / Monday Blue

USB 3.2 Gen 1

41.0 x 17.5 x 7.5 mm

3g

Capacity

Color

Interface

Dimensions

Weight

32GB / 64GB / 128GB / 256GB

Blue

USB 3.2 Gen 1

78.2 x 20.5 x 12.2 mm

9g

Taiwan Invention Patent / I672986

C186 USB3.2FLASH DRIVE

C183 USB3.2FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB /128GB

Black

USB 3.2 Gen 1

78.2 x 20.5 x 12.2 mm

9g

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB / 128GB / 256GB

Black

USB 3.2 Gen 1

58.0 x 17.6 x 7.0 mm

7g

Taiwan Invention Patent / I672986

Capacity

Color

Interface

Performance

Dimensions

Weight

256GB / 512GB / 1TB

Black

USB 3.2 Gen 1

256GB: 590/290MB/s, 512GB/1TB: 600/500MB/s

78.2 x 20.5 x 12.2 mm

9g

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB / 128GB / 256GB

Blue

USB 3.2 Gen 1

56.0 x 17.2 x 7.6 mm

8g

Page 24: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

43 44

TEAMGROUP UFDTEAMGROUP UFD

C182 USB2.0FLASH DRIVE

C173 USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB

Black / White

USB 2.0

54.9 x 20.5 x 9.5 mm

15g

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB / 64GB

Black / White

USB 2.0

58.0 x 17.6 x 7.0 mm

7g

C175 USB3.2FLASH DRIVE

C162 USB3.2FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB / 128GB / 256GB

Black

USB 3.2 Gen 1

54.9 x 20.5 x 9.5 mm

15g

Capacity

Color

Interface

Dimensions

Weight

16GB / 32GB / 64GB / 128GB

Black

USB 3.2 Gen 1

24.0 x 12.2 x 7.0 mm

3.4g

C155 USB3.2FLASH DRIVE

C145 USB3.2FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB / 128GB / 256GB

Gold

USB 3.2 Gen 1

54.4 x 19.3 x 7.3 mm

12g

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB / 128GB

Red / Blue / Yellow / Green

USB 3.2 Gen 1

56.7 x 20.0 x 8.4 mm

10g

T181 USB2.0FLASH DRIVE

C185 USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB

Blue / Gray

USB 2.0

44.5 x 17 x 11.6 mm

10g

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB / 64GB

Black

USB 2.0

78.2 x 20.5 x 12.2 mm

9g

Taiwan Invention Patent / I672986

Page 25: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

45 46

TEAMGROUP UFD TEAMGROUP UFD

C171 USB2.0FLASH DRIVE

C161 USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB / 64GB

Black / White

USB 2.0

34.1 x 14.5 x 6.1 mm

3.4g

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB

White / Blue

USB 2.0

24.0 x 12.2 x 7.0 mm

3.4g

C156 USB2.0FLASH DRIVE

C153 USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB

Silver

USB 2.0

19.5 x 12.2 x 4.6 mm

3g

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB / 64GB

Black / Silver / Blue / Pink

USB 2.0

54.4 x 19.3 x 7.3 mm

12g

C151 USB2.0FLASH DRIVE

C141 USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB / 64GB

Purple / Red / Blue / Black / Silver

USB 2.0

19.5 x 17.2 x 9.7 mm

3g

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB / 64GB

Red / Blue / Yellow / Green

USB 2.0

56.7 x 20.0 x 8.4 mm

10g

C12G USB2.0FLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

4GB / 8GB / 16GB / 32GB

Black / White

USB 2.0

18.0 x 15.0 x 7.0 mm

2.5g

Page 26: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

47 48

TEAMGROUP OTG

M141 USB OTGFLASH DRIVE / READER

Capacity

Color

Interface

Dimensions

Weight

-

Black

USB 2.0 & Micro USB

43.8 x 14.7 x 7.2 mm

2.97g

Capacity

Color

Interface

Dimensions

Weight

8GB / 16GB / 32GB

Gray

USB 2.0 & Micro USB

31.0 x 12.0 x 4.5 mm

2.1g

M151 USB OTGFLASH DRIVE

M211 USB3.2 OTGFLASH DRIVE

Capacity

Color

Interface

Dimensions

Weight

32GB / 64GB / 128GB / 256GB

Black

USB3.2 Gen1 type-C & type-A

40.0 x 17.7 x 8.4 mm

5g

TEAMGROUPIndustrial

Page 27: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

Embedded DDR4 U-DIMM

Embedded DDR4 SO-DIMM

Embedded DDR3 U-DIMM

Embedded DDR3 SO-DIMM

49 50

INDUSTRIAL MEMORYINDUSTRIAL MEMORY

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

288pin

64Bits

1.2V

1.23 Inches

0~70°C

0~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

260pin

64Bits

1.2V

1.18 Inches

0~70°C

0~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

240pin

64Bits

1.5V / 1.35V

1.18 Inches

0~70°C

0~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

204pin

64Bits

1.5V / 1.35V

1.18 Inches

0~70°C

0~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating / Graphene heatsink

Page 28: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

51 52

INDUSTRIAL MEMORYINDUSTRIAL MEMORY

Server DDR4 R-DIMM

Server DDR4 ECC SO-DIMM

Server DDR4 ECC U-DIMM

Server DDR3 R-DIMM

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s,

2GB / 4GB / 8GB / 16GB

240pin

72Bits

1.5V/1.35V

1.18 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

260pin

72Bits

1.2V

1.18 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

288pin

72Bits

1.2V

1.23 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz/random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine(compliant with MIL-STD-810G General)

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

288pin

72Bits

1.2V

1.23 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating / Graphene heatsink

Page 29: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

53 54

INDUSTRIAL MEMORYINDUSTRIAL MEMORY

Server DDR3 ECC SO-DIMM

Server DDR3 ECC U-DIMM

DDR4 WT ECC U-DIMM

DDR4 WT ECC SO-DIMM

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

204pin

72Bits

1.5V / 1.35V

1.18 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s,

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

240pin

72Bits

1.5V / 1.35V

1.18 Inches

0~85°C

-40~85°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating / Graphene heatsink

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

288pin

72Bits

1.2V

1.23 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

260pin

72Bits

1.2V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Page 30: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

55 56

INDUSTRIAL MEMORYINDUSTRIAL MEMORY

DDR3 WT ECC U-DIMM

DDR3 WT ECC SO-DIMM

DDR4 WT U-DIMM

DDR4 WT SO-DIMM

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

240pin

72Bits

1.5V/1.35V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s,

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

240pin

72Bits

1.5V/1.35V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

288pin

64Bits

1.2V

1.23 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

2133MT/s, 2400MT/s

2666MT/s, 3200MT/s

4GB / 8GB / 16GB / 32GB

260pin

64Bits

1.2V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

Conformal Coating

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Page 31: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

57 58

INDUSTRIAL SSDINDUSTRIAL MEMORY

DDR3 WT U-DIMM

DDR3 WT SO-DIMM

S540M SSD

S530K SSD

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

240pin

64Bits

1.5V / 1.35V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating

Data RATE

Capacity

Pin Count

Width

Voltage

PCB Height

Standard Operating Temperature ( °C )

Extended Operating Temperature ( °C )

Shock

Vibration

Anti-Sulfuration

Value-Added Service

1066MT/s, 1333MT/s

1600MT/s, 1866MT/s

2GB / 4GB / 8GB

204pin

64Bits

1.5V / 1.35V

1.18 Inches

-40~85°C

-40~95°C

Operation: 50G/11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

-

Conformal Coating

SATA III 6.0Gb/s

3D TLC

128GB~512GB

550 / 510

5V x 325mA

69.85(W) x 100(L) x 6.9(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

10K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

64GB~512GB

550/490

5V x 345mA

69.85(W) x 100(L) x 6.9(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

N

Y

Y

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951

Page 32: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

59 60

INDUSTRIAL SSDINDUSTRIAL SSD

S522K SSD

S520M-W SSD

S520M-W M.2 SATA SSD

S540M M.2 SATA SSD

SATA III 6.0Gb/s

3D TLC

128GB~256GB

550 / 510

3.3V x 495mA

22.0(W) x 80.0(L) x 3.5(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Wide Temp. -40°C (-40°F) ~ 85°C (185°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

128GB~256GB

560 / 520

3.3V x 590mA

22.0(W) x 80.0(L) x 3.5(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

10K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

64GB~512GB

560 / 510

5V x 280mA

69.85(W) x 100(L) x 6.9(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

128GB~512GB

550 / 510

5V x 390mA

69.85(W) x 100(L) x 6.9(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Wide Temp. -40°C (-40°F) ~ 85°C (185°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

Page 33: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

61 62

INDUSTRIAL SSDINDUSTRIAL SSD

S530K M.2 SATA SSD

S522K M.2 SATA SSD

S750-3A mSATA SSD

S540 mSATA SSD

SATA III 6.0Gb/s

3D TLC

512GB~1TB

560 / 510

3.3V x 495mA

29.85(W) x 50.80(L) x 3.86(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F) / Wide Temp. -40°C (-40°F) ~ 85°C (185°F)

3K for W.T / 10K for S.T

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

128GB~256GB

560 / 500

3.3V x 460mA

29.85(W) x 50.80(L) x 3.86(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

10K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

SATA III 6.0Gb/s

3D TLC

64GB~256GB

550 / 500

3.3V x 355mA

22.0(W) x 80.0(L) x 3.5(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

N

Y

Y

SATA III 6.0Gb/s

3D TLC

64GB~256GB

560 / 500

3.3V x 450mA

22.0(W) x 42.0(L) x 3.5(H) mm / 22.0(W) x 80.0(L) x 3.5(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -50°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U

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63 64

INDUSTRIAL SSDINDUSTRIAL SSD

S520 mSATA SSD

N540M M.2 PCIe SSD

N522K M.2 PCIe SSD

N430K M.2 PCIe SSD

SATA III 6.0Gb/s

3D TLC

128GB~256GB

560 / 500

3.3V x490mA

29.85(W) x 50.80(L) x 3.86(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Wide Temp. -40°C (-40°F) ~ 85°C (185°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

PCIe Gen3 x4

3D TLC

256GB~512GB

3500 / 3200

3.3V x 1290mA

22.0(W) x 80.0(L) x 3.8(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

10K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

PCIe Gen3 x4

3D TLC

128GB~512GB

3300 / 2500

3.3V x 1210mA

22.0(W) x 80.0(L) x 3.8(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

Y

Y

Y

PCIe Gen3 x4

3D TLC

128GB~512GB

2100 / 1700

3.3V x 1250mA

22.0(W) x 80.0(L) x 3.8(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

> 3 million hours

Storage Temperature: -55°C ~ +95°C

Standard Temp. 0°C (32°F) ~ 70°C (158°F)

3K

3 years

Interface

Flash Type

Capacity

Sequential R/W (MB/sec, max.)

Max. Power consumption(operation)

Dimension (WxLxH/mm)

Shock

Vibration

MTBF

Environment

Operating Temperature

P/E Cycle

Warranty

Thermal Sensor

External DRAM Buffer

TRIM

S.M.A.R.T

Y

N

Y

Y

Page 35: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

65 66

INDUSTRIAL CARDINDUSTRIAL CARD

D900-W ISD

D700 ISD

D500 ISD

D900-W MSD

‧Compliant SD Card Specification 2.0 / 3.0

‧SLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD2.0 / SD3.0

SD 2.0:512MB~2GB / SD3.0:4GB~32GB

90 / 70 MB/s

3.3V x 300uA

24.0(W) x 32.0(L) x 2.1(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-

-50°C ~ +95°C

TEAMGROUP industrial-grade memory cards built with top-quality SLC NAND Flash chips, can endure

operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even in

the harshest conditions.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

SLC

Y

‧Compliant SD Card Specification 3.0

‧MLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD 3.0

8GB~256GB

90 / 70 MB/s

3.3V x 465uA

24.0(W) x 32.0(L) x 2.1(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-25°C ~ +85°C

TEAMGROUP industrial-grade memory cards built with high-quality MLC NAND Flash chips, can endure

operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even

in the harshest conditions.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

MLC

Y

Optional

‧Compliant SD Card Specification 3.0

‧3D TLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD3.0

16GB~256GB

90 / 30 MB/s

3.3V x 400mA

24.0(W) x 32.0(L) x 2.1(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-50°C ~ +95°C

TEAMGROUP industrial-grade memory cards built with high-quality 3D TLC NAND Flash chips, can endure

operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even

in the harshest conditions.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

3D TLC

Y

Optional

‧Compliant SD Card Specification 2.0 / 3.0

‧SLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD2.0 / SD3.0

SD2.0:512MB~2GB / SD3.0:4GB~8GB

30 / 25MB/s

3.3V x 250uA

11.0(W) x 15.0(H) x 1.0(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-

-50°C ~ +95°C

TEAMGROUP industrial-grade memory cards built with top-quality SLC NAND Flash chips, can endure

operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even

in the harshest conditions. These cards are the ideal solution for small form factor applications.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

SLC

Y

Page 36: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

67 68

INDUSTRIAL CARD INDUSTRIAL CARD

D700 MSD

D500 MSD

‧Compliant SD Card Specification 3.0

‧MLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD3.0

8GB~128GB

90 / 70 MB/s

3.3V x 500uA

24.0(W) x 32.0(L) x 2.1(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-40°C ~ +85°C

Team Group industrial-grade memory cards built with top-quality MLC NAND Flash chips, can endure

operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even

in the harshest conditions. These cards are the ideal solution for small form factor applications.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

MLC

Y

Optional

‧Compliant SD Card Specification 3.0

‧3D TLC NAND Flash

‧Power fail management

‧Advance wear leveling

SD3.0

16GB~256GB

90 / 30 MB/s

3.3V x 400mA

24.0(W) x 32.0(L) x 2.1(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

3 million hours

-40°C ~ +85°C

TEAMGROUP industrial-grade memory cards built with top-quality 3D TLC NAND Flash chips, can endure

operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even

in the harshest conditions. These cards are the ideal solution for small form factor applications.

Key Features

Interface

Capacity

Sequential R/W(MB/sec, max.)

Max. Power Consumption

Dimension(WxLxH/mm)

Vibration

Shock

MTBF

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Bad block mangement

‧Support Auto-Reflash

‧Support SMART health monitoring

Flash Type

S.M.A.R.T.

Wide Temp. OP (-40°C~+85°C)

3D TLC

Y

NA

F900

‧S.M.A.R.T. disk health monitoring

‧Intelligent error recovery system

PATA(50-pin)

512MB / 1GB / 2GB / 4GB

2

30 / 20 MB/s

42.8(W) x 36.4(L) x 3.3(H) mm

Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)

Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)

Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)

Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)

0-95%

-55°C ~ +95°C

TEAMGROUP's industrial-standard CF card is designed for industrial and major mission applications to

meet the stringent requirements of high-end equipment operating under extreme temperatures. In

addition, it has anti-shock and anti-vibration functions, low power consumption, and greater error detection

and correction functions, providing industrial users with durability and reliability.

Key Features

Interface

Capacity

Max. Channel

Sequential R/W(MB/sec, max.)

Dimension(WxLxH/mm)

Vibration

Shock

Relative Humidity

Standard Temp. OP (-25°C~+85°C)

Storage Temperature

General Description

‧Excellent data transfer speed

‧Mechanical design for anti-vibrationFlash Type

Max. Power Consumption

ATA Security

S.M.A.R.T.

MTBF

Wide Temp. OP (-40°C~+85°C)

SLC

3.3V x 62mA

Y

Y

> 2 million hours

Optional

Page 37: T-FORCE T-CREATE TEAMGROUP 2021Product Guide Consumer

www.teamgroupinc.com

Japan株式会社TeamジャパンAddress : 〒101-0032東京都千代田区岩本町三丁目10番9号 秋葉原花岡ビル5階Tel : 03 (6240) 9961E-mail : [email protected]

Hong KongDatacell Technology Ltd.Address : Room 909, 9/F, Nan Fung Commercial Centre, 19 Lam Lok Street, Kowloon Bay, Hong Kong.Tel : +852-2972-2578Fax : +852-2972-2655E-mail : [email protected]

China十铨恒泰科技(深圳)有限公司地址:广东省深圳市福田区车公庙天安创新科技广场一期B座1609电话:400-069-0188 总代理售后专线 (服务时间:周一到周五9:30-17:30)信箱:[email protected] [email protected]

TaiwanTeam Group Inc.Address : 3F., No.166, Jian 1st Rd., Zhonghe Dist., New Taipei City 235, Taiwan (R.O.C.)Tel : +886-2-8226-5000 (Taiwan's Customer Service Line: 0800-821-688)Fax : +886-2-8226-5011Service E-mail : [email protected] E-mai : [email protected]