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2021 ConsumerProduct Guide
● TEAMGROUP
● T-FORCE● T-CREATE
● Established Datacell Technology Ltd, Hong Kong subsidiary
Hong Kong
Milestone
1997
1998
2004
2006
2008
2009
2011
2012
2014
2015
2016
2017
2018
2019
2020
2021
● Founded SMT factory in Brazil. Launched the new Team USB series● Exhibited at the CebIT for the first time● Exhibited at CES for the first time● Established Team Japan in Tokyo, Japan
● Damond(D603), USB drive, won the COMPUTEX d&i awards 2009
● Established flash product lines.
● Relocated to a newly acquired office due to rapid growth● Exhibited at Computex Taipei for the first time
● “Commonwealth Magazine’s Top 1000 Enterprises in Taiwan” ranked 419th. Ranked NO.395 of Deloitte Technology Fast 500 Asia Pacific.
● The establishment of Industrial Applications
● Exhibited at the ESEC for the first time.
● Established headquarter in Taiwan.
● Ranked 377 in the Technology Fast 500 Asia Pacific by Deloitte Hong Kong.● Developed the mobile application product line● Exhibited at the Embedded World for the first time
● XCALIBUR ARGB & Cardea Liquid won Taiwan excellent award.
● XTREEM ARGB won the Red Dot Design Award 2020.
● T-CREATE CLASSIC DDR4 Memory won the GOOD DESIGN AWARD 2020.
● NIGHT HAWK & GAMING BUNDLES PACK won the Taiwan Excellence Award 2017.
● NIGHT HAWK, XTREEM, T162 & T171 won the COMPUTEX d&i awards 2017.
● XTREEM won the GOOD DESIGN AWARD 2017.
● TEAMGROUP also listed company at stock exchange market in January,2019.
● XCALIBUR won the IF DESIGN AWARD 2019.
● XACALIBUR & NIGHT HAWK RGB won the Red Dot Design Award.
● T-FORCE XTREEM ARGB WHITE MEMORY SERIES won prestigious IF DESIGN AWARD 2021.
● T-FORCE TREASURE TOUCH EXTERNAL RGB SSD AND T-CREATE MEMORY won RED DOT DESIGN AWARD 2021.
● T-FORCE NIGHT HAWK RGB DDR4 & SPARK RGB UFD & T193 Flash Drive won 2021 Taiwan Excellence Award.
● XTREEM & NIGHT HAWK RGB won the IF DESIGN AWARD 2018.
● 2018 XCALIBUR won the Golden Pin Award 2018.
● T183 won the COMPUTEX d&i awards 2018.
● Sustained expansion of brand management and has a strong foothold as one of the top10 global memory product suppliers.
● USB 3.1 SSD -PD700 won the Taiwan Excellence Award 2016.
● MoStash won the COMPUTEX d&i awards 2016.
● T162 & NIGHTHAWK won the Golden Pin Award 2016.
● M152 won the Computex Best Choice Award 2015 with features of flash drive, file sharing and mobile phone screen mirroring.
● MoStash won Golden Pin Award 2015.
● Twinbo, mobile product, was awarded the Taiwan Excellence Award 2015.
1 2
About TEAMGROUP Contents
MEMORY OF A LIFETIME
Team Group Inc. was founded in 1997 in Taiwan. To aim at the global layout of R&D technology and manufacturing in memory
products, the chairman of the board, Mr. Danny Hsia established the headquarter in 1997 in Taipei. Team Group Inc. possesses
professional research and development capabilities, high quality products, rapid productivity, a tightly-knit global sales network
and complete customer services. In addition to ranking among CommonWealth Magazine’s top 1000 enterprises, it has also
become one of the fastest growing 3C product manufacturer and a world’s leading brand in recent years. Team Group Inc. has
been publicly listed on the Emerging Stock Market since October 2010.Team Group Inc. also listed company at stock exchange
market in January 2019. (Stock code: 4967)
TEAMGROUP’S SERIES OF PRODUCTS ARE YOUR PERFECT CHOICE.
TEAMGROUP mainly produces its own brand of memory modules, memory cards, USB flash drives, solid state disks, peripheral
series, mobile accessories and industrial applications. Gaming competitions have drawn worldwide attention in the recent years,
so TEAMGROUP integrated its gaming memory modules into “T-FORCE” product line which is specifically designed for people
who pursuit extreme high speed and excellent performance. These products have been well received by the technology media
around the globe and have won honors such as Computex Design & Innovation Awards, Best Choice Award, Good Design
Product Award, Golden Pin design, TAIWAN EXCELLENCE, GOOD DESIGN AWARD 2017, iF Design Award 2018, iF Design
Award 2019 and RED DOT Design Award 2019.
GLOBALIZATION
With over 20 years of computer peripherals production and sales experience, Team Group Inc. has built up a strong center in
Taiwan for production, R&D, sales and customer service. It has subsidiary companies in Hong Kong and Japan and also has
over 300 global sales agents with more than 400 employees around the world. Through the real-time market information, and
based on each market’s characteristics, TEAMGROUP uses differentiating sales strategies with a global vision and a localized
channel management to establish a closed distribution network.
QUALITY GUARANTEED WITH COMPLETE WARRANTY SERVICE
TEAMGROUP is well praised by the industry and customers by adhering to the corporate philosophy of “Integrity, Innovation,
Professionalism, Efficiency, Discipline, and Simplicity.” Every series of TEAMGROUP’s memory product is covered with full
warranty services. We offer faster repair and exchange services than other brands and we guarantee to send RMA products
back into the hands of every global customer with a minimum of delivery time.
SOLID R&D CAPABILITIES
By building the best technical team, laboratories, and manufacturing equipment, TEAMGROUP’s products are made with spirits
of innovation and a strict quality control system. Our memory technology has passed the ISO9001 and ISO14001 certifications
and is equipped with strong vertical integration ability of product design, material acquisition, manufacturing process, and quality
testing. The result we have is that our latest over-clocking memory module is leading the industry. Recently, we have also
devoted into industrial products to adapt to the rapidly changing industry environment. By introducing the concept of smart living
and the use of cloud computing, we have shown our strength in R&D capabilities and we will further carry out the idea of One
Stop Service to enhance customer services. TEAMGROUP P48-P69
T-FORCE Gaming P03-P22
T-CREATE P23-P27
TEAMGROUP P28-P47
3 4
XTREEM ARGB / XTREEM ARGB WHITE
NIGHT HAWK RGB
DDR4 4000 DDR4 3600 DDR4 3200 DDR4 3000Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2
32,000MB/s
(PC4-32000)
18-22-22-42
1.35V
8GBx2 / 16GBx2
28,800MB/s
(PC4-28800)
25,600MB/s
(PC4-25600)
16-18-18-38
24,000MB/s
PC4-24000)
GAMING MEMORY
T-FORCE Gaming
Taiwan Invention Patent / I703920China Utility Patent / CN 210039639 U
DDR4 4000 DDR4 3600 DDR4 3200Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx2
32,000MB/s
(PC4-32000)
18-22-22-42 / 18-24-24-46
1.35V / 1.4V
28,800MB/s
(PC4-28800)
18-22-22-42 / 14-15-15-35
1.35V / 1.45V
25,600MB/s
PC4-25600)
16-18-18-38 / 14-14-14-34
1.35V
5 6
NIGHT HAWK Legend RGB
DELTA RGB
DELTA TUF Gaming Alliance RGB
XTREEM
DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx2
28,800MB/s
(PC4-28800)
18-22-22-42
1.35V
8GB / 8GBx2 / 16GB /16GBx2 / 32GB / 32GBx2
25,600MB/s
(PC4-25600)
16-18-18-38 / 16-20-20-40
24,000MB/s
(PC4-24000)
16-18-18-38
21,300MB/s
(PC4-213000)
16-18-18-38 / 16-18-18-43
1.2V
DDR4 3466 DDR4 3200Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2
27,700MB/s
(PC4-27700)
16-18-18-38
1.35V
25,600MB/s
(PC4-25600)
14-14-14-31
DDR4 3200 DDR4 2933 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8G / 8GBx2 / 16G / 16GBx2
32G /32Gx2
28,800MB/s
(PC4-28800)
16-18-18-38 / 16-20-20-40
1.35V
8GBx2 / 16GBx2
25,600MB/s
(PC4-25600)
16-18-18-38
24,000MB/s
(PC4-24000)
18-18-18-43
1.2V
DDR4 3866 DDR4 3733 DDR4 3600Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 8GBx4
30,900MB/s
(PC4-30900)
18-20-20-44
1.35V
8GBx2
29,800MB/s
(PC4-29800)
18-20-20-39
28,800 MB/s
(PC4 28800)
18-20-20-39
DDR4 4500 DDR4 4300 DDR4 4133 DDR4 4000Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2
36,000MB/s
(PC4-36000)
18-20-20-44
1.45V
34,400MB/s
(PC4-34400)
33,600MB/s
(PC4-33000)
18-18-18-38
1.4V
8GBx2 / 8GBx4
32,000MB/s
(PC4-32000)
18-20-20-44
1.35V
GAMING MEMORY GAMING MEMORY
7 8
DARK Z
DARK Z FPS
DARK Zα
DARK PRO
DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx2
28,800MB/s
(PC4-28800)
18-22-22-42
1.35V
8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2
25,600MB/s
(PC4-25600)
16-18-18-38 / 16-20-20-40
24,000MB/s
(PC4-24000)
16-18-18-38
8GB/8GBx2/16GB/16GBx2
21,300MB/s
(PC4-213000)
16-18-18-38
1.2V
DDR4 4000Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2
32,000MB/s
(PC4-32000)
16-18-18-38
1.45V
DDR4 4000 DDR4 3600 DDR4 3200Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx2
32,000MB/s
(PC4-32000)
18-22-22-42 / 18-24-24-46
1.35V / 1.4V
28,800MB/s
(PC4-28800)
18-22-22-42
25,600MB/s
(PC4-25600)
16-18-18-38 / 16-20-20-40
1.35V
GAMING MEMORYGAMING MEMORY
DDR4 3466 DDR4 3200Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2
27,700MB/s
(PC4-27700)
16-18-18-38
1.35V
25,600MB/s
(PC4-25600)
14-14-14-31
Taiwan Utility Patent / M585419China Utility Patent / CN 210038691 U
VULCAN Z
VULCAN TUF Gaming Alliance ZEUS SO-DIMM
ZEUS
9 10
GAMING MEMORYGAMING MEMORY
DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2
28,800MB/s
(PC4-28800)
18-22-22-42
1.35V
25,600MB/s
(PC4-25600)
16-18-18-38 / 16-20-20-40
24,000MB/s
(PC4-24000)
16-18-18-38
21,300MB/s
(PC4-213000)
18-18-18-43
1.2V
DDR4 3600 DDR4 3200 DDR4 3000 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GB / 8GBx2 / 16GB / 16GBx2
28,800MB/s
(PC4-28800)
19-19-19-39
1.35V
25,600MB/s
(PC4-25600)
16-18-18-38 / 16-20-20-40
24,000MB/s
(PC4-24000)
16-18-18-38
21,300MB/s
(PC4-213000)
18-18-18-43
1.2V
DDR4 3200 DDR4 3000 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 Pin Non-ECC Unbuffered DIMM
8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2
25,600MB/s
(PC4-25600)
16-20-20-40 / 20-22-22-46
1.35V / 1.2V
24,000MB/s
(PC4-24000)
16-18-18-38
1.35V
21,300MB/s
(PC4-21300)
19-19-19-43
1.2 V
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Laptop
260Pin SO-DIMM Non ECC
8GB / 16GB / 32GB / 8GBx2 / 16GBx2 / 32GBx2
25,600MB/s
(PC4-25600)
16-20-20-40 / 22-22-22-52
1.35V / 1.2V
21,300MB/s
(PC4-21300)
19-19-19-43
1.2V
DELTA MAX / DELTA MAX WHITE RGB SSD
DELTA / DELTA S / DELTA R RGB SSD
DELTA S TUF Gaming Alliance RGB SSD (12V)
DELTA TUF Gaming Alliance RGB SSD (5V)
11 12
GAMING SSDGAMING MEMORY
Interface
NAND Flash
Performance
Capacity
RGB Signal
RGB Header
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB
USB Micro B type
5pin 12V RGB Header● RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).
100 x 69.85 x 9.5 mm
DC 5V
● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction.
Interface
NAND Flash
Performance
Capacity
RGB Signal
RGB Header
Features
Dimensions
Voltage
SATA III 6Gb/s
3D TLC
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB
USB Micro B type
3 or 4 pin 5V add Header● ASUS TUF Gaming Alliance certified RGB solid state drive.● TUF Gaming Alliance design elements.● Fully upgraded, extreme performance.
100 x 69.85 x 9.5 mm
DC 5V
● Tough protection, durable and reliable.● 3 pin connector makes lighting effects synchronization so easy.
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB● The largest visual proportion designed, bringing the most colorful lighting effects.● The mirror surface is simply designed to present a mirror reflection effect.● Lighting effects can be synchronized with the motherboard.● To understand the status of the system by Illuminated lighting effects.
100.0 x 69.9 x 9.5 mm
DC 5V
● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction
Taiwan Utility Patent / M583110China Utility Patent / CN 209766039 UTaiwan Invention Patent / I697761United States Patent / US10,803,713 B1
Interface
NAND Flash
Performance
Capacity
RGB Signal
RGB Header
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB
USB Micro B type
3 or 4 pin 5V add Header (DELTA) / 5pin 12V RGB Header (DELTA S) / 9 pin USB Header (DELTA R)● RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).
100 x 69.85 x 9.5 mm
DC 5V
● Support S.M.A.R.T. technology.● Support TRIM.● Configurable Error Correction.
China Utility Patent / CN 207676655 U
DELTA Phantom Gaming RGB SSD
VULCAN G SATA SSD
VULCAN SSD
CARDEA Liquid M.2 PCIe SSD
13 14
GAMING SSDGAMING SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D TLC
Read: 550MB/s ; Write: 500MB/s Max
512GB / 1TB● 4 times faster than a HDD.● Optimized SLC caching algorithm.● S.M.A.R.T. monitoring technology.● TRIM optimization command.
100 x 69.9 x 7 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB● 3D NAND technology-the capacity has been expanded more than ever, which is capable of storing more games and data.● High speed transfer: the excellent experience in terms of booting, data adding, and gaming reaction requirement bring all
incredible read write speed.● Extremely lightweight and thin. 2.5-inch drive with 7mm in height.● Support S.M.A.R.T. technology monitoring hard drive status efficiently.● Support TRIM bring out its best performance on the compatible operating system.● Product warranty three years product warranty with free technical support service.
100 x 69.9 x 7 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
RGB Signal
RGB Header
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: 560MB/s ; Write: 510MB/s Max
500GB / 1TB
USB Micro B type
3 or 4 pin 5V add Header / RGB Multi-color Illuminated SSD.● 3D NAND● SATA Rev. 3.0(6Gb/s), backwards compatibility to SATA Rev.2.0(3Gb/s).● Support S.M.A.R.T. technology.
100 x 69.85 x 9.5 mm
DC 5V
● Support TRIM.● Configurable Error Correction.
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D NAND
Read: 3400MB/s ; Write: 3000MB/s Max
512GB / 1TB● The world's exclusive water-cooling module solid-state hard drive especially designed for gaming/high-performance computers.● High-speed transferring interface PCI-e with the latest NVMe1.3 protocol.● Life-friendly design, allow user to add on solution anytime for DIY adjustment purpose.● Product warranty 3 years product warranty with free technical support service.
80.0 x 24.1 x 14.3 mm
DC +3.3V
Taiwan Utility Patent / M574264China Utility Patent / CN 209674880 UChina Invention Patent / CN 111276173 A
CARDEA A440 M.2 PCIe SSD
CARDEA II M.2 PCIe SSD
CARDEA IOPS M.2 PCIe SSD
CARDEA II TUF Gaming Alliance M.2 PCIe SSD
15 16
GAMING SSDGAMING SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D TLC
Read: 3400MB/s ; Write: 3000MB/s Max
512GB / 1TB● First M.2 SSD with ASUS TUF Gaming Alliance certification.● Gaming style cooling fin for best temperature control.● Fully upgraded, extreme performance.● Smart algorithm for prolonging the service life.
80.1 x 23.4 x 12.9 mm
DC +3.3V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D NAND
Read: 3400MB/s ; Write: 3000MB/s Max
512GB / 1TB● Cooling module with gaming fin type design can provide effective cooling for continuous and high-intensity use.● High performance superconductivity - Thermally conductive adhesive offers averageheat radiating, instantaneously therma
energy transfer and accelerates the radiating process.● Extreme read/write speed - Over 3,400MB/s of reading speed can enhance the speed and performance of the overall system.● PCIe interface - Support latest NVMe specification.● Support S.M.A.R.T. technology - Monitoring hard drive status efficiently.● Support TRIM Bring out its best performance on the compatible operating system.Product warranty - 3 years product warranty.● Free technical support service.
80.1 x 23.4 x 12.9 mm
DC +3.3V
Taiwan Utility Patent / M541645
Interface
NAND Flash
Performance
Capacity
Features
IOPS
Dimensions
Voltage
PCIe Gen3 x4 with NVMe 1.3
3D TLC
Read: 3400MB/s ; Write: 3000MB/s Max
1TB● Winning every crucial game without lagging.● Enjoy two cooling patents at once.● Ultimate performance.● Smart algorithm enhances stability and durability.
1TB Read / Write: 680K/670K IOPS Max
80.0 x 22.0 x 3.7 mm (with Graphene heat sink)
80.0 x 23.4 x 12.9 mm (with Aluminum heat sink)
DC +3.3V
Taiwan Utility Patent / M541645
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen4.0 x4 with NVMe 1.4
3D NAND
Read: 3400MB/s ; Write: 3000MB/s Max
512GB / 1TB● Enjoy the lightning speed of the PCIe Gen4 x4.● Featuring two patented heat sinks.● Effective cooling—flexible installation.● Supports the latest NVMe 1.4 standard.
80.0 x 22.0 x 3.7 mm(with Graphene heat sink)
80.0 x 23.4 x 12.9 mm(with Aluminum heat sink)
DC +3.3V
Taiwan Utility Patent / M541645Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U
CARDEA Ceramic C440 M.2 PCIe SSD
CARDEA ZERO Z440 M.2 PCIe SSD
CARDEA ZERO Z340 M.2 PCIe SSD
CARDEA ZERO Z330 M.2 PCIe SSD
17 18
GAMING SSDGAMING SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D NAND
Read: 2100MB/s ; Write: 1700MB/s Max
512GB / 1TB / 2TB● Unleash the full power.● Ultra-thin structure.● Patented graphene cooling structure.● Smart management technology.
80.0 x 22.0 x 3.7 mm
DC +3.3V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D TLC
Read: 3400MB/s ; Write: 3000MB/s Max
512GB / 1TB● High speed read/write performance.● Ultra-thin and lightweight structure.● Patented graphene cooling technology.● All-around smart management technology.
80.0 x 22.0 x 3.7 mm
DC +3.3V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen4 x4 with NVMe 1.4
3D NAND
Read: 5000MB/s ; Write: 4400MB/s Max
1TB / 2TB● M.2 NVMe PCIe Gen4 x4 solid state drive. Supports the latest platform AMD X 570.● Excellent performance - Read speed is up to 5,000 MB/s. Enhances the speed and performance of the overall system.● Three heat dissipation elements - the combination of graphene and copper can provide excellent heat dissipation. 0.2mm
ultra-thin and patented cooling module can avoid interference during installation.● Multiple protection, smart management technology - effectively monitors the status of solid state drive and maximizes its
performance.● Product warranty - five-year product warranty with free technical support service.
80.0 x 22.0 x 3.7 mm
DC +3.3V
Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.4
3D TLC
Read: 5000MB/s ; Write: 4400MB/s Max
1TB / 2TB● Unleash the ultimate power.● Beautiful and thin as a snowflak.● Top specification that breaks through the limit.● Aerospace ceramic material for better heat dissipation.● Trustworthy smart management technology.
80.0 x 22.0 x 4.75 mm
DC +3.3V
Taiwan Utlity Patent / M595313China Utility Patent / CN 210984280 U
CARDEA ZERO M.2 PCIe SSD
TREASURE TOUCH External RGB SSD
SPARK RGB USB3.2 FLASH DRIVE
19 20
GAMING ACCESSORYGAMING SSD
GAMING A2 CARD SSD Adaptor
Applicable type
Applicable size
Features
Dimensions
Weight
2.5” SATA SSD
2.5” SSD 7mm / 9mm ● Magnetic attraction for easy placement.● Easy to lock and install.● Thoughtful angle design to avoid hands jamming.● Perfect with RGB SSD.● Tough, durable and reliable.
99.0 x 84.1 x 11.9 mm
74g
Capacity
Performance
Interface
Dimensions
Voltage
256GB / 512GB / 1TB
up to 100/90MB/s
Micro SDXC UHS-Ⅰ U3 V30 A2
15.0 x 11.0 x 1.0 mm
2.7V~3.6V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
USB 3.2 Gen2 Type C
3D TLC
Read: 400MB/s ; Write: 400MB/s Max
1TB● Magical RGB as new gaming element● Simple and stylish. Leading the trend● USB 3.2 Gen2 Type C● Wide compatibility with gaming consoles● Touch Me with endless usage possibilities
80.0 x 22.0 x 3.7 mm
DC 5V
Taiwan Utility Patent / M575552
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe 3.0 x4 with NVMe 1.2
3D NAND
Read: 2600MB/s ; Write: 1450MB/s Max
240GB / 480GB● The first super slim graphene SSD cooling module.● The combination of graphene and copper foil can efficiently speed up the heat transfer.● NVMe interface – Support latest NVMe specification.● Support S.M.A.R.T. technology – Monitoring hard drive status efficiently.● Support TRIM – Bring out its best performance on the compatible operating system.● Product warranty – 3-year product warranty. Free technical support service.
80.0 x 22.0 x 3.7 mm
DC +3.3V
Taiwan Utility Patent / M548287
● Smart capacity status indicator[1]
● Easy-Slide! Capless design
Interface
NAND Flash
Performance
Capacity
Feature
Dimensions
Voltage
USB 3.2 Gen 1
3D TLC
Read: 180MB/s ; Write: 90MB/s Max
128GB● RGB soft ambient lighting effect● Support multi-platform
60.9(L) x20.4 (W) x8.6 (H) mm
DC +3.3V[1] Smart capacity status indicator supports Windows system only. If connected to a game console or Mac OS, only normal RGB lighting effects will be displayed.
Taiwan Utility Patent / M583608Chian Utility Patent / CN 209674876 U
CAPTAIN RGB Control Box & RGB Strip
21 22
GAMING ACCESSORYGAMING ACCESSORY
ARGB LED Uniform Strip
CK5
Melting point / freezing point
Initial boiling point and boiling range
Flash point
Features
Vapour pressure
Upper/lower flammability orexplosive limits
-60 °C
187 °C
103 °C - closed cup● Environmentally friendly anti-corrosion material● Natural biological decomposition● Low conductivity
0.11 hPa at 20 °C
Upper explosion limit: 12.5 %(V)
Lower explosion limit: 2.6 %(V)
Relative density: 1.036 g/mL at 25 °C
SABLE SABLE L SABLE XLSurface Material
Base Material
Dimensions
Weight
100% Polyester
Silicone
470.0 x 230.0 x 2.0 mm
205g
Robust CORDURAl® nylon
Nature Rubber
450.0 x 400.0 x 2.0 mm
380g
Robust CORDURAl® nylon
Nature Rubber
900.0 x 400.0 x 2.0 mm
680g
MOUSE PAD
Signal Output
Via 5V ARGB 3 pin header x 4port
Via 12V RGB 4 pin header x 1port
Switch bottom
Hardware light control by build in IC
solution, control by switch
Power
Interface
Color
Weight
Includes
Feature
Dimensions
Voltage
SATA power (5V)
Signal Input
Via 5V ARGB 3 pin header x 1port
Via 12V RGB 4 pin header x 1port
Black
75g
30cm ARGB Strip x2 pcs
94.4 x 78.0 x 16.0 mm
DC 5V
● Auto detection input signal sources, automatically switching output
● Support lighting effect control and software synchronization● Build in lighting effect by hardware control
● Support RGB x1 / ARGB x4 device lighting effect signal control● Product warranty – 1 year product warranty with free technical
support service
Voltage
Length
Features
DC +5V
450mm● ARGB addressable LED.● Intensive and even lighting effect.● Rollable material.● Magnetic light clip.● Compatible with all major motherboard's lighting control software.
Taiwan Utility Patent / M583184Chinese Utility Paten / CN 210042292 U
23 24
T-CREATE
CLASSIC 10L
EXPERT OC10L
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx 2 / 32GBx2
25,600MB/s
(PC4-25600)
22-22-22-52
1.2V
21,328MB/s
(PC4-21300)
19-19-19-43
DDR4 3600Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
8GBx2 / 16GBx2 / 32GBx2
28,800MB/s
(PC4-28800)
18-22-22-42
1.35V
CREATE MEMORY
CLASSIC 10L SO-DIMM EXPERT SATA SSD
CLASSIC SATA SSD
25 26
CREATE SSDCREATE MEMORY / SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen4.0 x4 with NVMe 1.4
3D TLC
Read: 5000MB/s ; Write: 4400MB/s Max
1TB / 2TB● Timeless classic.● Customized stable firmware for storage safety.● Specially chosen Flash IC for focusing creation.● Greatly shorten your waiting time.● Built-in high-rate LDPC ECC functionality.
80.0 x 22.0 x 3.7 mm
DC +3.3V
CLASSIC PCIe 4.0 SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D TLC
Read: 550MB/s ; Write: 520MB/s Max
1TB● Timeless classic.● Customized stable firmware for storage safety.● No need to wait while creating.
100.0 x 69.9 x 7.0 mm
DC 5V
● Large storage for creative work.● Built-in high-rate LDPC ECC functionality.
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D TLC
Read: 560MB/s ; Write: 520MB/s Max
1TB / 2TB● Out of this world , ridiculous durability.● The only SSD that can give the creator a peace of mind.● The world’s first 12-year ultra long term warranty.
100.0 x 69.9 x 7.0 mm
DC 5V
● High speed. Time-saving. Create without waiting.● TB level of storage that meets the needs for creativity.
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Laptop
260Pin SO-DIMM Non ECC
8GB / 8GBx2 / 16GB / 16GBx2 / 32GB / 32GBx2
25,600MB/s
(PC4-25600)
22-22-22-52
1.2V
21,300MB/s
(PC4-21300)
19-19-19-43
TEAMGROUP
27 28
CREATE SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D TLC
Read: 3400MB/s ; Write: 3000MB/s Max
1TB / 2TB● Out of this world , ridiculous durability.● The only SSD that can give the creator a peace of mind.● The industry’s first 12-year ultra long term warranty.● No more anxiety of waiting for files to be converted.● Meet the storage needs of creating large contents.
80.0 x 22.0 x 3.7 mm
DC +3.3V
EXPERT PCIe SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe Gen3.0 x4 with NVMe 1.3
3D TLC
Read: 2100MB/s ; Write: 1700MB/s Max
512GB / 1TB / 2TB● Timeless classic.● Customized stable firmware for storage safety.● Specially chosen Flash IC for focusing creation.● Greatly shorten your waiting time.● Built-in high-rate LDPC ECC functionality.
80.0 x 22.0 x 3.7 mm
DC +3.3V
CLASSIC PCIe SSD
29 30
TEAMGROUP MEMORYTEAMGROUP MEMORY
ELITE + U-DIMM
ELITE U-DIMM
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
4GB / 4GBx2 / 8GB / 8GBx2 /16GB / 16GBx2
32GB / 32GBx2
25,600MB/s
(PC4-25600)
22-22-22-52
1.2V
21,300MB/s
(PC4-21300)
19-19-19-43
DDR4 2400
4GB / 4GBx2 / 4GBx4 / 8GB / 8GBx2 / 8GBx4
16GB / 16GBx2
19,200MB/s
(PC4-19200)
16-16-16-39
DDR4 2133
17,000MB/s
(PC4-17000)
15-15-15-36
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Desktop PC
288 pin Non-ECC Unbuffered DIMM
4GB / 4GBx2 / 8GB / 8GBx2 / 16GB / 16GBx2
32GB / 32GBx2
25,600MB/s
(PC4-25600)
22-22-22-52
1.2V
21,300MB/s
(PC4-21300)
19-19-19-43
DDR4 2400
4GB / 4GBx2 / 4GBx4 / 8GB / 8GBx2 / 8GBx4
16GB / 16GBx2
19,200MB/s
(PC4-19200)
16-16-16-39
DDR4 2133
17,000MB/s
(PC4-17000)
15-15-15-36
ELITE SO-DIMM
MAC SO-DIMM
DDR3 1866 DDR3 1600Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Laptop
204Pin SO-DIMM Non ECC
4GB / 4GBx2
8GB / 8GBx2
14,928MB/s
(PC3-14900)
13-13-13-32
1.5V
2GB / 2GBx2 / 4GB
4GBx2 / 8GB / 8GBx2
12,800MB/s
(PC3-12800)
11-11-11-28
1.35V / 1.5V
DDR3 1333
10,664MB/s
(PC3-10600)
9-9-9-24
DDR2 800 DDR2 667
1GB / 2GB
6,400MB/s
(PC2-6400)
6-6-6-18
1.8V
4GB / 4GBx2 / 8GB
8GBx2 / 16GB / 16GBx2
5,336MB/s
(PC2-5300)
5-5-5-15
DDR4 3200 DDR4 2666Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Laptop
260Pin SO-DIMM Non ECC
8GB / 8GBx2 /16GB
16GBx2 / 32GB / 32GBx2
25,600MB/s
(PC4-25600)
22-22-22-52
1.2V
4GB / 4GBx2 / 8GB / 8GBx2 /16GB / 16GBx2
32GB / 32GBx2
21,300MB/s
(PC4-21300)
19-19-19-43
DDR4 2400
19,200MB/s
(PC4-19200)
16-16-16-39
DDR4 2133
4GB / 4GBx2 / 8GB / 8GBx2
16GB / 16GBx2
17,000MB/s
(PC4-17000)
15-15-15-36
DDR3 1600 DDR3 1333Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Laptop
204Pin SO-DIMM Non ECC
4GB / 8GB
12,800MB/s
(PC3-12800)
11-11-11-26
1.35V / 1.5V
10,664MB/s
(PC3-10600)
9-9-9-24
31 32
TEAMGROUP SSDTEAMGROUP MEMORY
ECC U-DIMM
ECC R-DIMM
DDR4 2666 DDR4 2133DDR4 2400 DDR4 1600Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Server / Workstation
288Pin Registered-DIMM
4GB / 8GB /16GB
21,300MB/s
(PC4-21300)
22-22-22-52
1.2V
17,064MB/s
(PC4-17000)
19-19-19-43
19,200MB/s
(PC4-19200)
19-19-19-43
240Pin Registered-DIMM
4GB / 8GB
12,800MB/s
(PC3-12800)
19-19-19-43
1.35V / 1.5V
DDR4 2666 DDR4 2133DDR4 2400 DDR4 1600Suitable For
TYPE
Capacity
Data Transfer
Bandwidth
Latency
Voltage
Server / Workstation
288Pin Registered-DIMM
4GB / 8GB /16GB
21,300MB/s
(PC4-21300)
22-22-22-52
1.2V
17,064MB/s
(PC4-17000)
19-19-19-43
19,200MB/s
(PC4-19200)
19-19-19-43
240Pin Registered-DIMM
4GB / 8GB
12,800MB/s
(PC3-12800)
19-19-19-43
1.35V / 1.5V
QX SSD
CX1 SSD CX2 SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 560MB/s ; Write: Up to 480MB/s
15.3TB (15.3TB, the industry’s largest consumer-grade 2.5” SATA SSD)● 15.3TB, the industry’s largest consumer-grade 2.5” SATA SSD.● Smart Dual Cache and powerful performance.● A monster that can defeat mechanical hard drives.● Ultra-high durability. Stable and reliable.
100.0 x 69.9 x 7.0 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 540MB/s ; Write: Up to 490MB/s
240GB / 480GB / 960GB● A must-have for beginners who want to replace
their traditional mechanical hard drive● Advanced SLC Caching technology● Shock and drop resistant. Quiet and lightweight● ECC (Error Correction Code) function enhances
efficiency
100.0 X 69.9 X 7.0 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 540MB/s ; Write: Up to 490MB/s
256GB / 512GB / 1TB / 2TB● A must-have for beginners who want to replace
their traditional mechanical hard drive● Advanced SLC Caching technology● Shock and drop resistant for safe use● ECC (Error Correction Code) function enhances
efficiency
100.0 X 69.9 X 7.0 mm
DC 5V
33 34
TEAMGROUP SSDTEAMGROUP SSD
MP34 M.2 PCIe SSD
MP33 PRO M.2 PCIe SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe 3.0 x4 with NVMe 1.3
3D NAND
Read: Up to 3500MB/s ; Write: Up to 2900MB/s
256GB / 512GB / 1TB / 2TB / 4TB● With DRAM Cache buffer.● Extreme read/write speed – Over 3000MB/s of read speed can enhance the speed and performance of the overall system.● NVMe interface – Support latest NVMe specification.● Support S.M.A.R.T. technology – Monitoring hard drive status efficiently.● Support TRIM – Bring out its best performance on the compatible operating system.● Product warranty – 3 years product warranty. Free technical support service.
80.1 x 22.0 x 3.1 mm
DC +3.3V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe 3.0 x4 with NVMe 1.3
3D NAND
Read: Up to 2100MB/s ; Write: Up to 1700MB/s
512GB / 1TB / 2TB● High-speed reading and writing for more efficiency.● Stable and durable- Not only fast, but reliable● Up to 2TB of storage capacity● Five year warranty providing customers with peace of mind.
80.1 x 22.0 x 3.1 mm
DC +3.3V
● Optimized performance.● Complete lineup of capacities.● Trustworthy reliability.
EX2 SSD
GX1 SSD GX2 SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 550MB/s ; Write: Up to 520MB/s
512GB / 1TB / 2TB● Blazing read/write speed● Optimized performance● Complete lineup of capacities● Trustworthy reliability
100.0 X 69.9 X 7.0 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 530MB/s ; Write: Up to 480MB/s
120GB / 240GB / 480GB / 960GB● 4x faster than a HDD ● Read speeds up to 530 MB/s to boost overall
system responsiveness and performance● Supports S.M.A.R.T. ● Supports TRIM
100.0 X 69.9 X 7.0 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
SATA III 6Gb/s
3D NAND
Read: Up to 550MB/s ; Write: Up to 500MB/s
128GB / 256GB / 512GB / 1TB / 2TB● 4x faster than a HDD ● Read speeds up to 550 MB/s to boost overall
system responsiveness and performance● Supports S.M.A.R.T. ● Supports TRIM
100.0 X 69.9 X 7.0 mm
DC 5V
35 36
TEAMGROUP SSDTEAMGROUP SSD
PD1000 Portable SSD
PD400 Portable SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
USB 3.2 Gen1 5Gb/s
3D NAND
Read: Up to 430MB/s ; Write: Up to 420MB/s
240GB / 480GB / 960GB● USB 3.2 Gen1 Super high-speed transmission.● 3D NAND SSD.● Extreme Metal Craft , Easy to carry lightweight size.● Dustproof & Water Repellent (IP66) , Crushproof.
83.1 x 65.5 x 13.2 mm
DC 5V
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
USB 3.2 Gen2 10Gb/s
3D NAND
Read: Up to 1000MB/s ; Write: Up to 900MB/s
512GB / 1TB / 2TB● USB 3.2 Gen2 Super high-speed transmission.● Dustproof & Water Repellent (IP68,under water 1m,1hr).● 3D NAND SSD.● Us Military Grade Shock Proof(MIL-STD 810G 516.6).
107.0 x 40.0 x 10.9 mm
DC 5V
MP33 M.2 PCIe SSD
MS30 M.2 PCIe SSD
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
PCIe 3.0 x4 with NVMe 1.3
3D NAND
Read: Up to 1800MB/s ; Write: Up to 1500MB/s
512GB / 1TB / 2TB● High-speed reading and writing for more efficiency.● Stable and durable- Not only fast, but reliable.● Up to 2TB of storage capacity.● Five year warranty providing customers with peace of mind.
80.1 x 22.0 x 3.1 mm
DC +3.3V
● Optimized performance.● Complete lineup of capacities.● Trustworthy reliability.
Interface
NAND Flash
Performance
Capacity
Features
Dimensions
Voltage
M.2 2280 SATA III
M.2 2242 SATA III
3D NAND
Read: Up to 550MB/s ; Write: Up to 500MB/s
M.2 2242 : 128GB / 256GB / 512GB
M.2 2280 : 128GB / 256GB / 512GB / 1TB● Read/write speed: up to 530/430 MB/s*(512GB).● Mainstream M.2 interface.● Supports Intel's SRT.
M.2 2242:42.0 x 22.0 x 3.5 mm
M.2 2280:80.0 x 22.0 x 3.5 mm
DC +3.3V
● Supports S.M.A.R.T.● Supports TRIM.● DRAM-less.
37 38
TEAMGROUP CARDTEAMGROUP CARD
ELITE SDXCMEMORY CARD
CLASSIC SDXC / SDHCMEMORY CARD
PRO SDXCMEMORY CARD
XTREEM SDXCMEMORY CARD
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
SDXC:128GB / 256GB
up to 100/90 MB/s
Yes
SDXC UHS-I U3 V30
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
SDXC:64GB / 128GB / 256GB
up to 250/120 MB/s
Yes
SDXC UHS-II U3 V60
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
SDXC:64GB / 128GB / 256GB
up to 90/45 MB/s
Yes
SDXC UHS-I U3 V30
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
SDXC:64GB / 128GB / 256GB
SDHC:16GB / 32GB
up to 80/15 MB/s
Yes
SDHC/SDXC UHS-I U1 C10
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
SDXC / SDHCUHS-I U1
SDHCClass 10 / Class 4
CF233X / 133X
Capacity
Write Protection
Interface
Dimensions
Voltage
133X:4GB / 8GB / 16GB
233X:4GB / 8GB / 16GB / 32GBB
Yes
CF 6.0 Type I
32.0 x 24.0 x 2.1 mm
3.3V ~ 5V
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
4GB / 8GB / 16GB / 32GB
up to 10/4 MB/s
Yes
SDHC C4/C10
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Write Protection
Interface
Dimensions
Voltage
SDXC:64GB / 128GB / 256GB
SDHC:16GB / 32GB
up to 60/20 MB/s
Yes
SDHC/SDXC UHS-I U1 C10
32.0 x 24.0 x 2.1 mm
2.7V~3.6V
39 40
TEAMGROUP CARDTEAMGROUP CARD
COLOR CARDMicro SDHC / SDXCUHS-I U1
COLOR CARD IIMicro SDXC / SDHCUHS-I U3
Capacity
Performance
Interface
Dimensions
Voltage
16GB / 32GB / 64GB / 128GB / 256GB / 512GB
up to 80/20 MB/s
Micro SDHC/SDXC UHS-I U1 C10
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Interface
Dimensions
Voltage
16GB / 32GB / 64GB / 128GB
up to 90/45 MB/s
Micro SDHC/SDXC UHS-I U3 C10
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Micro SDXC / SDHCUHS-I U1
Micro SDHCClass 10 / Class 4
Capacity
Performance
Interface
Dimensions
Voltage
4GB / 8GB / 16GB / 32GB
up to 10~13/4~5 MB/s
Micro SD/SDHC
15.0 x 11.0 x 1.0 mm
2.7V~3.6V
Capacity
Performance
Interface
Dimensions
Voltage
Micro SDXC:64GB / 128GB
Micro SDHC:16GB / 32GB
up to 80/15 MB/s
Micro SDHC/SDXC UHS-I U1 C10
15.0 x 11.0 x 1.0 mm
2.7V~3.6V
PRO A1 U3 V30MicroSD CARD
ELITE A1 U3 V30MicroSD CARD
Dash CardMicro SDHC / SDXCUHS-I U1
GO CARD (for action cameras)
Micro SDHC / SDXCUHS-I U3
Capacity
Performance
Interface
Dimensions
Voltage
128GB / 256GB
up to 100/90 MB/s
Micro SDXC UHS-I U3 V30 A1
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Interface
Dimensions
Voltage
64GB / 128GB / 256GB / 512GB / 1TB
up to 90/45 MB/s
Micro SDXC UHS-I U3 V30 A1
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Interface
Dimensions
Voltage
32GB / 64GB / 128GB / 256GB / 512GB / 1TB
up to 90/45 MB/s
Micro SDHC/SDXC UHS-I U3 V30
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
Capacity
Performance
Interface
Dimensions
Voltage
8GB / 16GB / 32GB / 64GB / 128GB
up to 80/20 MB/s
Micro SD/SDHC/SDXC UHS-I U1 C10
Micro SD:15.0 x 11.0 x 1.0 mm
Adapter:32.0 x 24.0 x 2.1 mm
2.7V~3.6V
41 42
TEAMGROUP UFDTEAMGROUP UFD
T193 USB3.2FLASH DRIVE
T183 USB3.2FLASH DRIVE
C212 USB3.2FLASH DRIVE
C211 USB3.2FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
32GB / 64GB / 128GB
Nickel Black
USB 3.2 Gen 1
72 x 24 x 4.6 mm
19g
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB / 128GB
Nickel Black
USB 3.2 Gen 1
60.3 x 18.0 x 4.6 mm
19g
Taiwan Utility Patent / M581756Taiwan Design Paten / D199855China Utility Model Patent / ZL 2019 2 0808175.3
C201 USB3.2FLASH DRIVE
C188 USB3.2FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
32GB / 64GB / 128GB
Grown-up Pink / Matcha Green / Monday Blue
USB 3.2 Gen 1
41.0 x 17.5 x 7.5 mm
3g
Capacity
Color
Interface
Dimensions
Weight
32GB / 64GB / 128GB / 256GB
Blue
USB 3.2 Gen 1
78.2 x 20.5 x 12.2 mm
9g
Taiwan Invention Patent / I672986
C186 USB3.2FLASH DRIVE
C183 USB3.2FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB /128GB
Black
USB 3.2 Gen 1
78.2 x 20.5 x 12.2 mm
9g
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB / 128GB / 256GB
Black
USB 3.2 Gen 1
58.0 x 17.6 x 7.0 mm
7g
Taiwan Invention Patent / I672986
Capacity
Color
Interface
Performance
Dimensions
Weight
256GB / 512GB / 1TB
Black
USB 3.2 Gen 1
256GB: 590/290MB/s, 512GB/1TB: 600/500MB/s
78.2 x 20.5 x 12.2 mm
9g
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB / 128GB / 256GB
Blue
USB 3.2 Gen 1
56.0 x 17.2 x 7.6 mm
8g
43 44
TEAMGROUP UFDTEAMGROUP UFD
C182 USB2.0FLASH DRIVE
C173 USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB
Black / White
USB 2.0
54.9 x 20.5 x 9.5 mm
15g
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB / 64GB
Black / White
USB 2.0
58.0 x 17.6 x 7.0 mm
7g
C175 USB3.2FLASH DRIVE
C162 USB3.2FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB / 128GB / 256GB
Black
USB 3.2 Gen 1
54.9 x 20.5 x 9.5 mm
15g
Capacity
Color
Interface
Dimensions
Weight
16GB / 32GB / 64GB / 128GB
Black
USB 3.2 Gen 1
24.0 x 12.2 x 7.0 mm
3.4g
C155 USB3.2FLASH DRIVE
C145 USB3.2FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB / 128GB / 256GB
Gold
USB 3.2 Gen 1
54.4 x 19.3 x 7.3 mm
12g
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB / 128GB
Red / Blue / Yellow / Green
USB 3.2 Gen 1
56.7 x 20.0 x 8.4 mm
10g
T181 USB2.0FLASH DRIVE
C185 USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB
Blue / Gray
USB 2.0
44.5 x 17 x 11.6 mm
10g
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB / 64GB
Black
USB 2.0
78.2 x 20.5 x 12.2 mm
9g
Taiwan Invention Patent / I672986
45 46
TEAMGROUP UFD TEAMGROUP UFD
C171 USB2.0FLASH DRIVE
C161 USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB / 64GB
Black / White
USB 2.0
34.1 x 14.5 x 6.1 mm
3.4g
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB
White / Blue
USB 2.0
24.0 x 12.2 x 7.0 mm
3.4g
C156 USB2.0FLASH DRIVE
C153 USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB
Silver
USB 2.0
19.5 x 12.2 x 4.6 mm
3g
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB / 64GB
Black / Silver / Blue / Pink
USB 2.0
54.4 x 19.3 x 7.3 mm
12g
C151 USB2.0FLASH DRIVE
C141 USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB / 64GB
Purple / Red / Blue / Black / Silver
USB 2.0
19.5 x 17.2 x 9.7 mm
3g
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB / 64GB
Red / Blue / Yellow / Green
USB 2.0
56.7 x 20.0 x 8.4 mm
10g
C12G USB2.0FLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
4GB / 8GB / 16GB / 32GB
Black / White
USB 2.0
18.0 x 15.0 x 7.0 mm
2.5g
47 48
TEAMGROUP OTG
M141 USB OTGFLASH DRIVE / READER
Capacity
Color
Interface
Dimensions
Weight
-
Black
USB 2.0 & Micro USB
43.8 x 14.7 x 7.2 mm
2.97g
Capacity
Color
Interface
Dimensions
Weight
8GB / 16GB / 32GB
Gray
USB 2.0 & Micro USB
31.0 x 12.0 x 4.5 mm
2.1g
M151 USB OTGFLASH DRIVE
M211 USB3.2 OTGFLASH DRIVE
Capacity
Color
Interface
Dimensions
Weight
32GB / 64GB / 128GB / 256GB
Black
USB3.2 Gen1 type-C & type-A
40.0 x 17.7 x 8.4 mm
5g
TEAMGROUPIndustrial
Embedded DDR4 U-DIMM
Embedded DDR4 SO-DIMM
Embedded DDR3 U-DIMM
Embedded DDR3 SO-DIMM
49 50
INDUSTRIAL MEMORYINDUSTRIAL MEMORY
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
288pin
64Bits
1.2V
1.23 Inches
0~70°C
0~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
260pin
64Bits
1.2V
1.18 Inches
0~70°C
0~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
240pin
64Bits
1.5V / 1.35V
1.18 Inches
0~70°C
0~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
204pin
64Bits
1.5V / 1.35V
1.18 Inches
0~70°C
0~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating / Graphene heatsink
51 52
INDUSTRIAL MEMORYINDUSTRIAL MEMORY
Server DDR4 R-DIMM
Server DDR4 ECC SO-DIMM
Server DDR4 ECC U-DIMM
Server DDR3 R-DIMM
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s,
2GB / 4GB / 8GB / 16GB
240pin
72Bits
1.5V/1.35V
1.18 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
260pin
72Bits
1.2V
1.18 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
288pin
72Bits
1.2V
1.23 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz/random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine(compliant with MIL-STD-810G General)
√
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
288pin
72Bits
1.2V
1.23 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating / Graphene heatsink
53 54
INDUSTRIAL MEMORYINDUSTRIAL MEMORY
Server DDR3 ECC SO-DIMM
Server DDR3 ECC U-DIMM
DDR4 WT ECC U-DIMM
DDR4 WT ECC SO-DIMM
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
204pin
72Bits
1.5V / 1.35V
1.18 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s,
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
240pin
72Bits
1.5V / 1.35V
1.18 Inches
0~85°C
-40~85°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating / Graphene heatsink
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
288pin
72Bits
1.2V
1.23 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
260pin
72Bits
1.2V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
55 56
INDUSTRIAL MEMORYINDUSTRIAL MEMORY
DDR3 WT ECC U-DIMM
DDR3 WT ECC SO-DIMM
DDR4 WT U-DIMM
DDR4 WT SO-DIMM
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
240pin
72Bits
1.5V/1.35V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s,
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
240pin
72Bits
1.5V/1.35V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
288pin
64Bits
1.2V
1.23 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
2133MT/s, 2400MT/s
2666MT/s, 3200MT/s
4GB / 8GB / 16GB / 32GB
260pin
64Bits
1.2V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
√
Conformal Coating
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
57 58
INDUSTRIAL SSDINDUSTRIAL MEMORY
DDR3 WT U-DIMM
DDR3 WT SO-DIMM
S540M SSD
S530K SSD
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
240pin
64Bits
1.5V / 1.35V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating
Data RATE
Capacity
Pin Count
Width
Voltage
PCB Height
Standard Operating Temperature ( °C )
Extended Operating Temperature ( °C )
Shock
Vibration
Anti-Sulfuration
Value-Added Service
1066MT/s, 1333MT/s
1600MT/s, 1866MT/s
2GB / 4GB / 8GB
204pin
64Bits
1.5V / 1.35V
1.18 Inches
-40~85°C
-40~95°C
Operation: 50G/11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
-
Conformal Coating
SATA III 6.0Gb/s
3D TLC
128GB~512GB
550 / 510
5V x 325mA
69.85(W) x 100(L) x 6.9(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
10K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
64GB~512GB
550/490
5V x 345mA
69.85(W) x 100(L) x 6.9(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
N
Y
Y
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
Taiwan Invention Patent / I703921Taiwan Utility Patent / M611951
59 60
INDUSTRIAL SSDINDUSTRIAL SSD
S522K SSD
S520M-W SSD
S520M-W M.2 SATA SSD
S540M M.2 SATA SSD
SATA III 6.0Gb/s
3D TLC
128GB~256GB
550 / 510
3.3V x 495mA
22.0(W) x 80.0(L) x 3.5(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Wide Temp. -40°C (-40°F) ~ 85°C (185°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
128GB~256GB
560 / 520
3.3V x 590mA
22.0(W) x 80.0(L) x 3.5(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
10K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
64GB~512GB
560 / 510
5V x 280mA
69.85(W) x 100(L) x 6.9(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
128GB~512GB
550 / 510
5V x 390mA
69.85(W) x 100(L) x 6.9(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Wide Temp. -40°C (-40°F) ~ 85°C (185°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
61 62
INDUSTRIAL SSDINDUSTRIAL SSD
S530K M.2 SATA SSD
S522K M.2 SATA SSD
S750-3A mSATA SSD
S540 mSATA SSD
SATA III 6.0Gb/s
3D TLC
512GB~1TB
560 / 510
3.3V x 495mA
29.85(W) x 50.80(L) x 3.86(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F) / Wide Temp. -40°C (-40°F) ~ 85°C (185°F)
3K for W.T / 10K for S.T
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
128GB~256GB
560 / 500
3.3V x 460mA
29.85(W) x 50.80(L) x 3.86(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
10K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
SATA III 6.0Gb/s
3D TLC
64GB~256GB
550 / 500
3.3V x 355mA
22.0(W) x 80.0(L) x 3.5(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
N
Y
Y
SATA III 6.0Gb/s
3D TLC
64GB~256GB
560 / 500
3.3V x 450mA
22.0(W) x 42.0(L) x 3.5(H) mm / 22.0(W) x 80.0(L) x 3.5(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -50°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
Taiwan Invention Patent / I703921China Utility Patent / CN 211019739 U
63 64
INDUSTRIAL SSDINDUSTRIAL SSD
S520 mSATA SSD
N540M M.2 PCIe SSD
N522K M.2 PCIe SSD
N430K M.2 PCIe SSD
SATA III 6.0Gb/s
3D TLC
128GB~256GB
560 / 500
3.3V x490mA
29.85(W) x 50.80(L) x 3.86(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Wide Temp. -40°C (-40°F) ~ 85°C (185°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
PCIe Gen3 x4
3D TLC
256GB~512GB
3500 / 3200
3.3V x 1290mA
22.0(W) x 80.0(L) x 3.8(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
10K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
PCIe Gen3 x4
3D TLC
128GB~512GB
3300 / 2500
3.3V x 1210mA
22.0(W) x 80.0(L) x 3.8(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
Y
Y
Y
PCIe Gen3 x4
3D TLC
128GB~512GB
2100 / 1700
3.3V x 1250mA
22.0(W) x 80.0(L) x 3.8(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
> 3 million hours
Storage Temperature: -55°C ~ +95°C
Standard Temp. 0°C (32°F) ~ 70°C (158°F)
3K
3 years
Interface
Flash Type
Capacity
Sequential R/W (MB/sec, max.)
Max. Power consumption(operation)
Dimension (WxLxH/mm)
Shock
Vibration
MTBF
Environment
Operating Temperature
P/E Cycle
Warranty
Thermal Sensor
External DRAM Buffer
TRIM
S.M.A.R.T
Y
N
Y
Y
65 66
INDUSTRIAL CARDINDUSTRIAL CARD
D900-W ISD
D700 ISD
D500 ISD
D900-W MSD
‧Compliant SD Card Specification 2.0 / 3.0
‧SLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD2.0 / SD3.0
SD 2.0:512MB~2GB / SD3.0:4GB~32GB
90 / 70 MB/s
3.3V x 300uA
24.0(W) x 32.0(L) x 2.1(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
-
-50°C ~ +95°C
TEAMGROUP industrial-grade memory cards built with top-quality SLC NAND Flash chips, can endure
operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even in
the harshest conditions.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
SLC
Y
●
‧Compliant SD Card Specification 3.0
‧MLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD 3.0
8GB~256GB
90 / 70 MB/s
3.3V x 465uA
24.0(W) x 32.0(L) x 2.1(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
●
-25°C ~ +85°C
TEAMGROUP industrial-grade memory cards built with high-quality MLC NAND Flash chips, can endure
operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even
in the harshest conditions.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
MLC
Y
Optional
‧Compliant SD Card Specification 3.0
‧3D TLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD3.0
16GB~256GB
90 / 30 MB/s
3.3V x 400mA
24.0(W) x 32.0(L) x 2.1(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
●
-50°C ~ +95°C
TEAMGROUP industrial-grade memory cards built with high-quality 3D TLC NAND Flash chips, can endure
operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even
in the harshest conditions.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
3D TLC
Y
Optional
‧Compliant SD Card Specification 2.0 / 3.0
‧SLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD2.0 / SD3.0
SD2.0:512MB~2GB / SD3.0:4GB~8GB
30 / 25MB/s
3.3V x 250uA
11.0(W) x 15.0(H) x 1.0(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
-
-50°C ~ +95°C
TEAMGROUP industrial-grade memory cards built with top-quality SLC NAND Flash chips, can endure
operating temperatures from -40°C to 85°C for industrial use and provide long-term performance even
in the harshest conditions. These cards are the ideal solution for small form factor applications.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
SLC
Y
●
67 68
INDUSTRIAL CARD INDUSTRIAL CARD
D700 MSD
D500 MSD
‧Compliant SD Card Specification 3.0
‧MLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD3.0
8GB~128GB
90 / 70 MB/s
3.3V x 500uA
24.0(W) x 32.0(L) x 2.1(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
●
-40°C ~ +85°C
Team Group industrial-grade memory cards built with top-quality MLC NAND Flash chips, can endure
operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even
in the harshest conditions. These cards are the ideal solution for small form factor applications.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
MLC
Y
Optional
‧Compliant SD Card Specification 3.0
‧3D TLC NAND Flash
‧Power fail management
‧Advance wear leveling
SD3.0
16GB~256GB
90 / 30 MB/s
3.3V x 400mA
24.0(W) x 32.0(L) x 2.1(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
3 million hours
●
-40°C ~ +85°C
TEAMGROUP industrial-grade memory cards built with top-quality 3D TLC NAND Flash chips, can endure
operating temperatures from -25°C to 85°C for industrial use and provide long-term performance even
in the harshest conditions. These cards are the ideal solution for small form factor applications.
Key Features
Interface
Capacity
Sequential R/W(MB/sec, max.)
Max. Power Consumption
Dimension(WxLxH/mm)
Vibration
Shock
MTBF
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Bad block mangement
‧Support Auto-Reflash
‧Support SMART health monitoring
Flash Type
S.M.A.R.T.
Wide Temp. OP (-40°C~+85°C)
3D TLC
Y
NA
F900
‧S.M.A.R.T. disk health monitoring
‧Intelligent error recovery system
PATA(50-pin)
512MB / 1GB / 2GB / 4GB
2
30 / 20 MB/s
42.8(W) x 36.4(L) x 3.3(H) mm
Operation: 50G / 11ms(compliant with MIL-STD-202G Test condition E)
Non-operation: 1500G / 0.5ms(compliant with MIL-STD-883K Test condition B)
Operation: 7.69 Grms, 20~2000 Hz / random(compliant with MIL-STD-810G General)
Non-operation: 4.02 Grms, 15 ~ 2000 Hz / sine(compliant with MIL-STD-810G General)
0-95%
●
-55°C ~ +95°C
TEAMGROUP's industrial-standard CF card is designed for industrial and major mission applications to
meet the stringent requirements of high-end equipment operating under extreme temperatures. In
addition, it has anti-shock and anti-vibration functions, low power consumption, and greater error detection
and correction functions, providing industrial users with durability and reliability.
Key Features
Interface
Capacity
Max. Channel
Sequential R/W(MB/sec, max.)
Dimension(WxLxH/mm)
Vibration
Shock
Relative Humidity
Standard Temp. OP (-25°C~+85°C)
Storage Temperature
General Description
‧Excellent data transfer speed
‧Mechanical design for anti-vibrationFlash Type
Max. Power Consumption
ATA Security
S.M.A.R.T.
MTBF
Wide Temp. OP (-40°C~+85°C)
SLC
3.3V x 62mA
Y
Y
> 2 million hours
Optional
www.teamgroupinc.com
Japan株式会社TeamジャパンAddress : 〒101-0032東京都千代田区岩本町三丁目10番9号 秋葉原花岡ビル5階Tel : 03 (6240) 9961E-mail : [email protected]
Hong KongDatacell Technology Ltd.Address : Room 909, 9/F, Nan Fung Commercial Centre, 19 Lam Lok Street, Kowloon Bay, Hong Kong.Tel : +852-2972-2578Fax : +852-2972-2655E-mail : [email protected]
China十铨恒泰科技(深圳)有限公司地址:广东省深圳市福田区车公庙天安创新科技广场一期B座1609电话:400-069-0188 总代理售后专线 (服务时间:周一到周五9:30-17:30)信箱:[email protected] [email protected]
TaiwanTeam Group Inc.Address : 3F., No.166, Jian 1st Rd., Zhonghe Dist., New Taipei City 235, Taiwan (R.O.C.)Tel : +886-2-8226-5000 (Taiwan's Customer Service Line: 0800-821-688)Fax : +886-2-8226-5011Service E-mail : [email protected] E-mai : [email protected]