System on Chip Scaling - Lecture

7/23/2019 System on Chip Scaling - Lecture

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ECE/ME/MSE 6776AIntroduction to SOP which includes

SOC, MCMs, SIP, 2.5D, 3D ICs,

3D Sste!s

2nDCl"ss

SOP by System Scaling

Prof. Rao R. TummalaJoseph M. Pettit Endowed Chair

Professor in ECE & MSEDirector, 3D Sstems Pac!a"in" Research Center


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ECE#ME#MSE $%%$ S'P ( Sstem Scalin"

Toda)s Class

*hat is S'P+ *hat are S'P Technolo"ies+ ndustr Colla(orations in S'P at -T

-T PRC model for R&D

Educational Pro"rams in S'P at -T

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-T 5PPR'5C6 T' S7STEM

SC589- Research

ndustr Colla(oration

Education

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S'P :7 S7STEM SC589-

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5n E9ode?

Year@%0 000@10 @@0 00@$0 00

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Pac!a"in" to dateA Sin"le or Multiple Cs

Slide $ / 0121204Sources: Infineon, Georgia Tech, Stats, ST Ericsson

Plastic

Packaging

Leaded Packaging

Ceramic MCM

Packaging

MCM

! Packaging

! "Cs #ith $%&

'$s ! "nterposer

! Photonics

P*

'lass Package

;0 umMemor+

Memor+

Memor+

Memor+

CP, 'P,

Logic

Logic

Laser arra+ (&C%-L)

Photo.detector arra+

/iber

1

5

Memor+Memor+Memor+Memor+

Logic

2rganic

Packaging

*'3 Packaging

*uild ,p

2rganic

%"Ps


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*hat is S'P+

S'P is li!e S'CB instead of (ein" on an C, it is on apac!a"e (ut with all hetero"eneous sstem functions

S'CA Miniaturiation at C 8e=el

SPA Miniaturiation at Module le=el

S'PA Miniaturiation at Sstem 8e=el

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S'P Concept -T

Total Sstem Miniaturiation 'ptimied Sstem ComponentsA CM'S and 9on2CM'S Miniaturie Sstem in Two *asA

. Shrin! Sstem (ul!iness & hierarch to A de=ices and sstem

. 5ll components are miniaturied & em(edded at micro & nano

scale

'ptimie for cost and performance (etween de=ice &sstem

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PRC ision of Di"ital Con=er"ence ( 000F

Digital + Analog + RF +

Optical + Sensors

Computin"#nternet

Di"ital 5udio

Di"ital ma"in"#ideo

Cellular#*ireless

-PS#Satellite

Sensors

5nd, of course,time!eepin"G

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Package is the System

SstemACon=er"ent Computin",

Communication, Consumer & :iomedical

SOP @ PRC

SOPSOPSlide 0 / 0120204


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*hat is Pac!a"in" in the new Era+

'ld EraA The S'C or Microelectronics Era >@$4222? nterconnectin"

Powerin"

Coolin"

Protectin" of "Cs 9ew EraA The S'P Era or Microsstems Era >0002?

nterconnectin"

Powerin"

Coolin" Protectin" of 3ll %+stem Components 4 $heir "ntegration

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3 Tpes of Sstems Pac!a"in" Platforms

%+stem Packaging Platorms

Continues for lo"ic Split2die on horion Can)t inte"rate lo"ic,

memor, RH, sensors,analo"

Current approach is(ul!, e


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HIGH DENSITY I/O 3D ICs POWER & BATTERIES 40m

-T ision for Sstem Scalin" ( 0240F

40mANTENNAS &FILTERS

PD/TIALASER PHOTODETECTOR

Waveguide Bio-SensorMEMS

CHIPLAST

EMBEDDED IC

EBG &

Is!"a#i!$

NANOMAGNETICS

SENSORS

GaAs RFICTHERMAL SOP

SYSTEM ON CHIP %SOC

3D CAPACITORS

G"ass !' Si C!'e30m

() ELECTRICAL MODELINGDESIGN AND TEST

*) MECHANICAL DESIGN FORRELIABILITY

3) NANO SCALE MATERIALSAND PROCESSES

+) THERMALTECHNOLOGIES

,)INTERCONNECTIONS-ASSEMBLY & RELIABILITY

.) INTERPOSERSAND PACAGES

0) THINFILMPASSI1ES

16 'lass "nterposer

6 Lo# Cost %i

"nterposer

6 ! $hinPack

6 $P"

56 M-M%

Packaging

76 ! 2pto

86 %L"

96 ! !esign $ools

and 3rchitecture

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Chap

ter.

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Difference (etween SP, 3D Cs and S'P

%"P Means %tacked "Cs and Packages (%"P)

%2P Platorm

SIP Stacked ICs SIP Stacked Packages 3D ICs with TSVSIP Stacked ICs 3D ICs with TSV

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Kltra2thin Electronics Sstem Scalin"

Technolo"ies

.4D and 3D nterposers Silicon and -lass nterposers Electrical Desi"n Thermal S'P MEMS S'P RH S'P 'pto S'P Pac!a"e Materials Chip28e=el nterconnections :oard28e=el nterconnections 'r"anic Pac!a"es Thinfilm Passi=e Components

Slide $ / 0120204


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Sstem2'n2Pac!a"e Technolo"ies

EMBEDDED COMPONENTS

MI2ED SIGNAL DESIGN

ANTENNAS AND

FILTERS

OPTOELECTRONICS

POWER

Si !' GLASS INTERPOSER

DESIGN FOR RELIABILITY

SYSTEM ON CHIP %SOC

3D ICs

MEMS PACAGING

MEMS GaAsOPTO SOP

THERMAL SOP

SENSORS

WAFER LE1EL PACAGING AND ASSEMBLY

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Sstem on Chip >S'C?

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



SYSTEM ON CHIP %SOC

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SP and 3D Cs

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



SYSTEMINPACAGE %SOP3D ICs

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Mi


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MEMS Pac!a"in"

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



MEMS

MEMS PACAGING

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5ntennas and Hilters

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



ANTENNAS AND

FILTERS

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'ptoelectronics

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



OPTOELECTRONICS

GaAsPD/TIAOPTO SOP

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Thermal S'P

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



THERMAL SOP

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, .4D and 3D nterposers and Pac!a"es

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



POWER


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9ano :io2Components

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



EMBEDDED COMPONENTS

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Sensors

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



SENSORS

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Desi"n for Relia(ilit

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS




Slide 1 / 0120204


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st8e=el

Chip2Pac!a"e nterconnections

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



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nd8e=el nterconnections

EMBEDDED COMPONENTS

SYSTEM ON CHIP %SOC

3D ICs

MI2ED SIGNAL DESIGN

MEMS PACAGING

MEMS

ANTENNAS AND

FILTERS

OPTOELECTRONICS

GaAsOPTO SOP

THERMAL SOP

POWER


SENSORS



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Sstem2'n2Pac!a"e Technolo"ies

EMBEDDED COMPONENTS

MI2ED SIGNAL DESIGN

ANTENNAS AND

FILTERS

OPTOELECTRONICS

POWER



SYSTEM ON CHIP %SOC

3D ICs

MEMS PACAGING

MEMS GaAsOPTO SOP

THERMAL SOP

SENSORS


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SC589-2 Research


Education

Slide 3 / 0121204


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9E* 9DKSTR725C5DEMC

M'DE8

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Sstem Scalin" ReLuires 9ew -lo(al

5cademic2ndustr2-o=t. Model

Ne# 3cademic."ndustr+ Collaboration Model

%mall 4 ultra.small

%+stems

%+stem%caling

Ne#3cademic."ndustr+Model

Ne# $echnologies

%killed :esources

'lobal-nd.,ser.to.%uppl+Chain Mg6

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*h Should ndustr Colla(orate with 5cademia+

-;plorator+:esearch

10 7 0

Time in 7ears

TechnicalSc

ope

%trategic:esearch $echnolog+!e


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%+stem /ab/acilities

PRC

Staff

The 9ew 5cademic2ndustr Model

3cademic/acult+

'raduate%tudents

"ndustr+Partners

:esearch/acult+

-ngineerson Campus

Slide 3$ / 0120204


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%+stem /ab/acilities

PRCStaff

'raduate%tudents

"ndustr+Partners

6i"hl2nterdiscipline Hacult

:esearch/acult+

-ngineerson Campus

"nterdisciplinar+3cademic /acult+

Prof. Rao TummalaProfessor & Center Director

Prof. - Chan"Opto

Prof. Masam-ho=anloo

Bioelectronics

Prof. Harro!h 5aiMEMS

Prof. Peter 6es!ethSensors

Prof. Joun"hoim >5ST?

Electrical Design

Prof. Satish umarLED

Prof. 7o"endraJoshi

Theral

Prof. SureshSitaraman

Mechanical Design

Prof. Madha=anSwaminathan

!"

Prof. CP *on"#olyer Materials

3cademic/acult+

Plus many more$

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-T PRC)S

-8':58 9DKSTR7 C'9S'RTKM To Stimulate -lo(al nterest

Slide 31 / 0120204


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Research Strate" & ndustr Pro"rams

16 !esign

Communication-lectronics

-lectronics Photonics mm.a


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-T2PRC ndustr Consortia Pro"ram

Slide ;0 / 0120204

Material 4

$ool %uppliers

"nterposerManuacturers

3pplication-nd ,sers

Package"ntegrators

(2%3$)

!e


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Sin"le ndustr Consortium with 0 Critical

Sstem Scalin" Technolo"ies

Lo#.cost 2rganic"4P (L2"P)

50?m Pitch 2rganicPackages

Lo#.cost 65! and! 'lass "4P

(L'"P)

X.10X Lo#er Cost 410.50?m "@2 Pitch

*oard.le


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-T PRC 2 Consortia Pro"rams

& Pro"ram Mana"ers or Hacult 8eaders16 !esign

Dr. $. #anayappan

-lectrical

.4D nterposer for

(andwidth

Si"nal, power deli=2

er, noise, F2tal!

#rof. Suresh Sitaraan

Mechanical

*arpa"e, relia(ilit

#rof. %ogen&ra 'oshi

$hermal

Thermal

conducti=it of "lass

Thermal interfaces,

characteriation

6 Photonic

%ubstrates

#rof. G$ Chang

! 'lass Photonics

:andwidth (eond

TS

#rof. Stephen !alph

2pto -lectronic Mg

Mf". processes

Photonic structures

6 -lectronic

%ubstrates

Dr. (en)y Sun&ara

'lass %ubstrates

3D -lass su(strate

;0m Pitch

.4D -lass su(2

strate 0m pitch

#rof. C.#. *ong

Pol+mer Materials

6i"h Temp.

Moldin" compounds

Dr. "uhan Liu

:!Ls

N m litho"raph

N $m micro=ia

;2$ laer RD8

02;0m pitch

6 /unctional

Components

Dr. #.M. !a+

! "P3C /unctionalComponents

3D Passi=e &

acti=es in less than

00m

Dr. iani Shara

! "P3C Po#erModules

Capacitors and

inductors

Dr. 'un)i Min

! "P3C :/ Modules

Diple


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SC589-

Research


Education

Slide ;; / 0121204


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Education Strate"

!isciplinar+-ducation

Packaging -ducation

"nter.disciplinar+4

%+stem-ducation

Slide ;4 / 0120204


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Education Strate"

8S Desi"n Semiconductor De=ices Microwa=e Desi"n *ireless C Desi"n

5nalo" Electronics 9anoscale De=ices -i"ascale nte"ration MEMS Radar and EM Sensin" 'ptoelectronics Hinite2Element Hunctional Materials Electro 'ptics 9anomaterials and Structures

Pac!a"in" Desi"n Pac!a"e Su(strates Pac!a"in" 5ssem(l Sstem Pac!a"in"

EM Pac!a"in" 6ands2on Su(strate

Ha(rication 6ands2on 5ssem(l :ioelectronics Power Electronics

!isciplinar+ -ducation Packaging and%+stem Le

Documents

System on Chip Scaling - Lecture