BGA Rework Station (RW-SV550)

Users Manual

Directory

I. Instructions on Installation and Operating Precautions ............................................. 1

.Introduction of Rework Station RW-SV550................................................................. 3

.Operating Procedures ............................................................................................................... 6

.Introduction to Touch Screen Control............................................................................ 15

.Creating a Profile ...................................................................................................................... 26

. Instruction on Installation of Supporting Clamp for Laptop PCB .................. 31

.Calibrating Camera .............................................................................................................. 33

.Maintenance ................................................................................................................................ 37

.Alarm Malfunction and Troubleshooting ..................................................................... 38

.Technical Specification ......................................................................................................... 40

1

I. Instructions on Installation and Operating Precautions To ensure safety and prevent possible damage to the rework station, it is required to install the rework station at a location complying with the following conditions.

Away from inflammables. Install the rework station at a location free from splashing of water or other liquids. Install the rework station at a location free from the direct airflow impact from air

conditioner, heater or ventilator. Install the rework station at a location with good ventilation . Install the rework station at a dry location. Install the rework station at a location free from excessive dust. Install the rework station at a location free from vibration or shock. Install the rework station at a stable and flat location.

Power Supply Power and voltage should meet the following requirements: Use the power supply with little voltage fluctuation

Voltage fluctuation AC220V10%

Frequency fluctuation 50/60Hz0.3% Space Requirements

To facilitate operation, component replacement and maintenance for the rework station, it is required to reserve >300mm space at the back of the rework station.

Operating Precautions While using the rework station, please follow the following operating precautions: 1. After turning on the power supply master switch of the rework station, check whether there

is airflow/wind blowing from both upper and lower hot air heaters. If no wind blowing, no

2

heating, otherwise the heaters will get burnt. Note: bottom IR heater area should be made good use of according to PCB size, s o as to

reduce power consumption. 2Set the different profiles for various BGA to be reworked. The maximum set

temperature of any segment of the profile shall be less than 300 . Refer to the BGA tin bead welding profile for the temperature setting while using the lead-free rework.

3Check for the perfection of the PCB plate soldering-pan and BGA tin beads one by one prior to the installation of BGA; check the appearance one by one after the BGA welded, and stop installing the BGA and measure the temperature if any abnormal symptom occurs. The welding can be continuously performed only after the proper adjusting; otherwise it may damage the BGA or PCB plate.

4Regularly clean the surface of the machine. In particular, keep the IR heating plate surface clean, and prevent the contaminated material deposits on it. The deposits may affect the proper heat radiation and result in the poor welding quality as well as considerably reduce the lifetime of the IR heating body.

If the heating body is burnt due to this cause, our company is not responsible for free replacement.

NOTENever clean the IR heater(heating panel) with liquids; the stubborn dirt on it

can be cleared of with crocus paper.

5Operator without being trained can not change any set parameter. 6Avoid electric fans or other equipment blowing towards the rework station while it is

working or it may cause abnormal temperature rise in heating zone and thus the work piece will get burnt.

7Keep the heating zone away from inflammables after startup or it may cause fire or explosion, put the PCB for process onto the PCB supporting racks.

8To avoid burn, please wear heat-proof gloves and never touch the high-temperature zone while working.

9Never use inflammable sprays, liquids or gases at any location close to the rework station while the machine is working.

10. Dont remove the front panel or cover of the electric cabinet because the electric cabinet contains HV (high voltage) components which may cause electric shock.

11In case any metal or liquid accidentally falls into the rework station while working, shut off power and remove power line immediately. Remove such foreign matter or contaminants after the machine cools down. If contaminants remain there, they may give off bad smell after restart.

12. If the rework station hasnt been powered on long, batteries in PLC are possible to be used up, resulting in parameter missing, so you need to set parameter again. Or regularly power it on to charge PLC in case data gets lost.

3

. Introduction of Rework Station RW-SV550

BGA Rework Station RW-SV550 made by Shuttle Star has 3 heaters (Upper Heater, Lower

Heater and Bottom IR Heater). Thereinto, the Upper Heater & Lower Heater which are hot air

heaters heat directly towards the BGA chip to make sure the chip get enough heat, so that it

can reach its melting point and be soldered well. The large heating area at the bottom is series

IR heating tube called Bottom IR Heater, which heats directly towards the whole PCB(preheat)

to make sure PCB be heated evenly, so that it wont get deformed.

RW-SV550 overall schematic diagram

1

2

3

4

5

6

7

8

9

4

Remote control Optical system

Zoom in / out

Focal length setting

Menu Switch

Adjust up/down

Prism fix

Lock screw up/down Screw adjusting left/right

10

11

12

13

14

15 16

17

5

Part name:

1upper heater

2upper nozzle

3optical alignment system

4optical system

5Y table adjust

6PCB clamping device

7knob for adjusting lower nozzle up/down

8switch for the bottom IR heater

9remote control

10lower nozzle

11Bottom IR heater( IR heating tube)

12X table adjust

13knob for adjust light source up/down

14touch screen

15wire sensor interface

16mains switch

17display screen

6

.Operating Procedures

BGA rework on PCB should comply with the following procedures 1.Bakeout

Both PCB and BGA chip must be baked in a constant temperature oven with a temperature range from 80100 for 8h 20h.The purpose for baking is to dehumidify the PCB as well as the BGA in case bubble phenomenon occurs during rework.

Table1 moisture sensibility grade

grade time time

1 timeless 30 /85 RH

2 1 year 30 /60 RH

2a 4 weeks 30 /60 RH

3 168h 30 /60 RH

4 72h 30 /60 RH

5 48h 30 /60 RH

5a 24h 30 /60 RH

6 Refer to the labeled

time 30 /60 RH

Table2 baking time

encapsulation

thinkness moisture

sensibility grade baking time

1.4MM 2a 4h 3 7h

4 9h

5 10h

5a 14h

2.0MM 2a 18h 3 24h

3 31h

5a 37h

4.0MM 2a 48h 3 48h

3 48h

3 48h

5a 48h

2.Clamping board

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21To choose upper nozzle and lower nozzle suitable for BGA size

22Upper nozzle is fixed onto the upper heater head. It can be adjusted according BGAs

position and angle. Lower nozzle is fixed on the lower heater head. It can be adjusted

by rotating knob adjusting lower nozzle up/down.

23. Adjust PCB clamping device and PCB support bar, close up the clamping device

and support bar both sizes before putting PCB on it, then lift the PCB support

pillar( which can be adjusted to a proper position according to PCB size) and

make it be in line with the stage of the PCB clamping device( which prevents the

PCB from getting deformed). Refer to the following picture:

Upper nozzle

Lower nozzle

Lower heater

Knob for adjusting lower nozzle up/down

8

24. Put PCB onto the support bar, then align BGA chip with the upper and lower

nozzles, make their cores in one line. Adjust PCB clamping device till the board

is in the stage of the clamp device, finally lock the positioning mechanism for

clamping.

2. 5. Adjust X & Y table till BGA chip sitting underneath the upper nozzle, then lock

the positioning mechanism for clamping. Refer to the following picture:

ConclusionA qualified board clamping should be as follows:

The whole PCB must be inside of the bottom area IR heater, so that is

can be heated evenly. The upper nozzle must properly cover the BGA, so

PCB support bar

PCB support pillar

PCB clamping device

Positioning mechanism for clamping

X table adjust

Y table adjust

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that the chip can be heated evenly. Besides, the cores of BGA chip, upper and

lower nozzle must be in one line. The PCB support pillar should touch the

board lightly.

3. Remove/DesolderClip PCB to the board supports, clamp and fix the PCB as what we

introduced above, choose a proper nozzle and a correct profile, then

press on down till the upper heater head reaches the proper

position, finally click desolder. When heating finishes, the system

will go down automatically. When the suction nozzle touches BGA,

the vacuum will star at once automatically and pick up the BGA.

Take away the PCB form the supports and BGA from the suction

nozzle only when cooling finishes.

4. Clean pad The PCB pad and BGA pad must be cleaned in a short time after desoldering.

Because damage to the pad is small while the PCB or BGA havent cooled of

completely. Please refer to the following steps.(cleaning PCB is the same) 41. Prepare a soldering iron with temperature 370 ( for leadfree chip) and 320 (for

leaded chip)

42.Apply a small layer solder flux to BGA equally

43.Mop the chip with the soldering iron to clean it.

44.Take a wick to clean the pad until it is neat.

45.Wipe pad: To ensure the reliability of BGA soldering, wipe the pad with some

volatile solvent as strong as possible, such as industrial alcohol.

Mop the pad with soldering iron Apply solder flux with brush

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5BGA Reball

51. Choose a stencil, a reballing kit and proper solder ball that match the BGA, put

the stencil between the kits frame and cover, then rotate the screw to lock

up.( But please do not lock it tight, so that it can be micro-adjusted and

moved)

52apply solder flux to BGA equally, then place BGA as the picture showing below;

adjust the locating block to make BGAs diagonal and the reball kits diagonal

match together, only in this case the BGA is located in the center of the reball kit;

finally lock the four locating block it fix it.

Wipe pad

Kits frame

stencil

Spare ball accumulator

Screw

Mop with both iron and wick

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53. Put the cover with stencil inside over the kit; then move the stencil lightly to make its

holes match the BGA pins. In case this method is not good enough to make stencils

holes and BGA pins match each other,(pay attention to the deviation place) open the

cover(frame), readjust BGA and repeat all those actions only to make sure the stencils

holes match the BGA pins; finally lock; otherwise, you have to micro-adjust the

stencil.

54Adjust the gap between BGA and stencil. By adjusting the Screw adjusting the gap between

BGA and stencil, we can make the gap between BGA and the stencil 2/33/4 of the ball

Locating block Lower die holder

Apply solder flux

Adjust stencil to make its holes match the BGA pins

Final lock

Reball kits diagonal

Screw adjusting the gap between BGA and stencil

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diameter. Make sure one hole for one ball going through only and it is convenient to

take out the stencil.

55First, exam the solder ball size whether it matches the chip and stencil; second put it on

the stencil as the following picture shows, then shake the whole kit lightly to let the

ball drop to the BGA chip through the stencils holes. Finally check whether every pin

has been reballed ( make sure no pin missing), then we can put the spare balls aside

and take out the cover.(note that tilt the kit while taking out the cover in case that the

reballed balls go out together with the stencil. After that, the qualifiedly-reballed BGA

can be taken out.( At this time if some pins found missing( not yet reballed), we can

make it up by a right tweezers. After reballing completely, recollect the spare balls.

56When change for other BGA chip of different size as well as solder ball, please repeat

steps 1-4

6BGA reball soldering

61. Prepare a soldering station for BGA reball soldering, set soldering station

temperature at 230 for leaded BGA and 250 for leadfree BGA

62. After setting temperature, start the soldering station and wait for the temperature

going to the required value and being constant.

63. When the temperature keep constant, put the reballed BGA onto the soldering

station with a high-temperature paper underlaid to heat, meanwhile use a hot

Put solder ball on Put the spare balls aside Tilt the kit

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air gun as a assistant heating from the upper surface.

64. When the balls are melted, they become liquid with light color and line up. Also

it will give off fumes. Seeing this, stop heating and take away the BGA from

the station.

7. Apply solder flux: 71.To guarantee soldering quality, make sure that the PCB pad is free of dust before

applying solder flux. The best way is to wipe the pad before applying solder flux

every time.

72.Apply a layer of soldering flux on the PCB solder pad with a brush pen. Excessive

flux may result in the balls shorted, in reverse, it easily causes missing solder. So

the soldering flux coating shall be even with a proper amount so as to remove the

dust and foreign materials from the BGA tin beads and improve the welding effect.

( Applying solder flux to BGA is the same)

8Alignment with optical system

81.First clamp the PCB.

82.Initially the BGA is on the PCB. Pull out the camera, observe the PCB pad through

the display screen, press zoom in /out on the remote control to adjust the image,

press in/out focus until the image on the display screen is clear enough. After that,

start vacuum to pick up BGA, then micro-adjust the upper heater head until the balls

of BGA can display on the screen

High temperature Soldering BGA balls are melted

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83. Adjust angle adjusting handle, Y & X axis knob to make BGA align with PCB pad

perfectly.

e.g. Angular deviation can be revised through angle adjusting handle.

Y axis deviation can be revised through Y axis adjusting knob.

X axis deviation can be revised through X axis adjusting knob.

84. Confirming BGA aligning with PCB pad perfectly, push in the camera, press on

down to lower the heater head. Once the BGA touches PCB, the system stop

vacuum, and placement completes. Next, lift the heater head a bit, leaving a gap of

1mm between the suction nozzle and BGA. And wait for being soldered.

9Solder

After alignment(carry on the previous step), select a suitable profile and nozzle, lower the

heater head until the gap between the nozzle and BGA is 1MM, then click solder on the

touch screen and the system will begin heating. Once heating completes, the upper heater

will go back to its initial place automatically, meanwhile cooling starts. When cooling

finishes, the renew PCB can be taken away from the clamping device.

15

Introduction to Touch Screen Control

Turn on the machine. The touch screen will automatically POWER ON, as shown in

Fig.1.

In Fig.1

to choose the Chinese version

Englishto choose the English version

Log inThis is operator log in button.

User ManagementOnly Administrator can add or delete user

PasswordChange ones own password

OperateClick it to enter operating mode, under this, you could only read the control

parameters, could not modify it.

DevelopmentClick it to enter debugging mode, you could modify all the control parameters.

Operating sequenceClick login, select user ID, input the password; confirm before doing

anything else, otherwise, it will give a hint of User do not have permission.

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User Password Permission

Administrator null Can do user management and all other operations

1 111 Can only enter operating mode. Can only use but not modify the profile parameter in this

model 2 222 Can enter debugging mode; can change the

profile parameter and save it, but not manage users

Management staff can add users by defining users names and passwords and later user group.

Note: touch screen program cant restore if management staff forget password, unless being

downloaded. Please remember it clearly.

NoteIn Operation(operating mode), no parameter can be changed but can be

used and read only. In Development(debugging mode), parameters can be

changed and resaved.

Fig.2 Basic menu

In Fig.2

Profile parameter: click into profile parameter setting screen, as shown in Fig 3.

Profile analysis: click into profile analysis screen, as shown in Fig 4.

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Advanced parameter: click into advanced parameter screen, as shown in Fig 5.

System help: click into BGA soldering requirements and profile debugging instructions, as

shown in Fig 6.

Debugging: the button for debugging the temperature curve.

Note: choose this key to hide history profile, display practical temperature curve, upper

and lower set temperature curves, and curve-saving key at the same time.

Tempt meas.: currently sensed temperature by wire sensor.

Solder click it to automatically perform the soldering process according to the selected

profile.

Desolderclick it to automatically perform the desoldering process according to the selected

profile or set parameters.

Manual solder: click it to manually solder, the process as follows: nozzle automatically

descends to the heating position and starts heating. Heating completing, it

automatically ascends to the cooling position to cool. Cooling ending, it gets

back to alignment point. During the whole process, nozzle does not touch the PCB

board.

Stop stop the system while running.

Vacuumvacuum start switch. Press-down means ON, reset means OFF

Cooling start cooling function ( it will stop cooling automatically while heating)

Alignment: click and nozzle automatically aligns.

Shaft lockclick to lock the upper heater from moving forward & backward.

Profile selection: click to enter profile selection screen.

Cooling at the upper displays the cooling time currently remained, at the lower displays the

current total cooling time.

Heating at the upper displays the constant-temperature time of this stage, at the lower

displays the total heating time.

The yellow zone displays the profile running, where, click the zoom on the top left to enter

curves analysis window. The red letter T with a ring on the top right stands for nozzle

touching item. The top middle displays the current status.

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PCB next is the profile name( usually are the BGA model numbers)

X-coordinate indicates time, unit: second

Y-coordinate represents temperature, unit: centidegree

: is the key for hiding history profile data or not, system default is hidden.

History profile: save practically-measured temperature data when debugging PCB board. This

function choosen, when heating, screen can accordingly replay the

practically-measured temperature data.

Parameter: below is parameter column, as shown in Fig 2.

Alarm: below is alarm column, as shown in Fig 7.

Debugging: below is debugging column, as shown in Fig 8.

Fig.3

In Fig.3:

PCB: to describe PCB board model or curve code.

Nozzle: to display the used nozzle size.

Rate: to represent the warming rate.

Tempt. : to represent constant temperature.

Time: to represent the constant-temperature Time.

Profile selection: click into the screen for profile selection.

1-8 No.: to separately represent temperature Profile parameter in each stage.

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The illustration of curve in Fig 3 is below:

Curves in the figure read as: If the temperature in the upper part is below indoor Temperature it will be heated up to 55 at the speed of 200/s;maintain 55 ( for 45s(this is stage 1); (enter stage 2)continue to heat up to 205 at the same speed; maintain 205 for 80s;(enter stage 3) in this stage, temperature drops to 180 , maintain 185 for 45s; (enter stage 4) continue to heat up to 250 at the speed of 200/s, maintain 250 for 80s; (enter stage 5), cool down to 230 at the speed of 2005/s, maintain 230 for 5s; the profile running ends at stage 5 The total running time is (if the starting temperature is 20): 55-20/200+45+205-55/200+80+205-185/200+45+250-180/200+80+250-230/200+5+4=297 seconds. The profile parameter in lower part is the same as the upper part, but the lower part should follow the upper part; i.e. when the upper part stops heating, the lower part also stops even if it hasnt finished.

Preheat tempt: the highest temperature limit the lower IR heating panels can come to when

preheating the system.

Note: when the bottom temperature tested exceeds the preheat temperature, system

automatically bans the bottom area to continually heat in standby.

Preheat power: the settled output power when bottom IR heater preheats in standby mode of

system.

Bottom tempt.: the temperature set for lower IR heating panels when soldering or desoldering.

Tempt. Compensation: the value for temperature compensation of the lower part. When the

value is 10, the temperature increases by 10 centidegree wholely.

Cooling time: the automatic-cooling time when heating completes.

High temperature alarm: warn the alarm time before highest temperature stage ends. In Fig 3,

the system starts alarming within the last 5s of the 4th stage, namely

from the 75th second, to reminding users of the current state of PCB.

The set alarm time is 5s.

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Fig.4

In Fig.4

Tempt meas.: the practical temperature sensed by the wire sensor.

X: the corresponding time at the touch point when touching the temperature curve diagram

by mouse or hand

Y: the corresponding temperature at the touch point when touching the temperature curve

diagram by mouse or hand.

Hint: the real-time value produces when mouse or hand slides along the curve.

Tempt line: input temperature value and then produce a graticule on the curve.

++respective time and temperature values of the two points-the blue and red

Tempt. Difference: the temperature difference between the red and blue points.

Time difference: the time difference between the red and the blue

Three Operation ways:

1. directly input approximate temperature and time values in A/B input columns,

observe whether A/B intersect the curve.

2. first input the graticule temperature, later click the graticule and A/B are the joints of

the graticule and curve.

3. click the curve all the time. After A/B emerges, drag A/B to analytic temperature.

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Note: A and B alternatively arises. B arises when firstly click , then A when secondly

click , and B when click again.

Warming gradient: average warming gradient between the red and blue points.

Highest tempt. : the highest temperature value sensed by the wire sensor during soldering

or desoldering.

Preheat time: the preheat time when soldering or desoldering.

Reflow time: the reflow time when soldering or desoldering.

Preheating: to set the preheat temperature interval.

Reflow: to set the reflow temperature interval.

Printscreen: to plug into U disk and store the whole screen into it in image form for the

convenience of print.

Fig.5

In Fig.5

P1: constant temperature P value. The bigger the value, the more sensitive the reaction to

temperature departure. Excessively-big value can easily cause temperature oscillation.

D1: constant temperature D value. The bigger the value, the more steady temperature

changes. Excessively-bigger value can cause temperature oscillation.

P2: warming P value.

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D2: warming D value.

E1: temperature compensation value during heating up.

Upper rate: to set temperature protection rate of the upper heater.

Lower rate: to set temperature protection rate of the lower heater.

Software: software edition PLC uses currently.

Power setting: percentage of power of lower heater.

Upper nozzle: to show nozzle size.

Upper compensation: temperature compensation for upper heater (with positive value,

temperature rises, in reverse, it drops.)

Lower compensation: temperature compensation for lower heater (with negative value,

temperature rises, or else, it drops.)

User management: to enter user management interface, add or delete users.

Fig 6

In Fig 6:

it describes BGA soldering requirements and skills of debugging temperature curves.

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Fig.7

In Fig.7

It records alarm information produced that day, and can store it even if powered off. The

cursor keys are for previewing the information up/down.

Fig.8

In Fig.8

Current position: to indicate the nozzles position at present.

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Alignment positionto show nozzle position after optical alignment. Camera extends out,

Adjust the nozzle and save the final nozzles position after aligning.

Heating position: to show nozzles position after heating. That is the position which nozzle

bounces to after it touches BGA.

Height: the height by which nozzle bounces when touching objects.

Quick speed: writable, the frequency of nozzles moving fast, the bigger the value, the faster

the speed.

Slow speed: writable, the frequency of nozzles moving fast, the smaller the value, the slower

the speed.

Direction key: manually adjust nozzles position. The moment nozzle reaches the upper and

lower limitations, blink aside to remind you.

Fig.9

In Fig 9

PCB: curve name selected currently.

PCB SUM: the total of currently-saved curves

Previous page: to page up

Next page: to page down

Serial number: the serial number of currently chosen curve

Pages: the pages of currently saved curves

Delete: to delete the curve currently selected

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Read: to download the curve currently chosen as use curve

Shut/close: to close the screen

Note: the chosen curve is in green grounding. Three ways of selecting a cueve:

1. to directly input the PCB name

2. to directly input the PCB serial number.

3. to directly choose curve name.

Hint: curves are in descending/ascending order by clicking the names or serial

numbers. The system default is descending order.

26

. Creating a Profile

Usually speaking, our company make and save 2 standard profiles in the machine during

adjustment, 1 for leaded chip called leaded profile, 1 for leadfree chip called leadfree profile.

The user can create new appropriate profiles for different BGA chips based on the existing

standard profiles in the machine. Before creating a new profile for a BGA, we have to use a

existing profile and test whether the profile fits the BGA by inserting the wire sensor into the

BGA while desoldering to see the temperature.

e.g.

Leadfree profile setting (Fig.1)

During the whole heating process, there 8 stages from preheating to cooling, but usually

only 5 stages are enough and available.

1Stage 1, preheating the board; in this stage, temperature is low, usually below 100 ; like

in Fig.1 55

2Stage 2, temperature rising; in this stage, we want temperature rise quickly, so we usually

set 205 for leadfree and 190 for leaded.

3Stage 3, keeping temperature constant, in this stage, we keep a constant temperature of

20-30 lower than stage 2 so as to wipe off the impurity on the board, becaus e during

this period the flux is volatilizing which does good for wiping off the impurity.

4Stage 4, ball melting and reflowing; in this stage, the ball begins to melt and reaches to the

peak, so the temperature should be high( usually is highest) and time should be long.

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5Stage 5, reflowing( from the peak to balls melting point); in this stage, temperature must

be lower than Stage 4, and time usually is 5~10S in upper heater.

As we can see in the picture, the setting for upper and lower heater in Stage 1,2,3 are the same.

In Stage 4 & 5, lower heaters temperatures are higher than upper heaters. The total time for

lower heater is a little (usually 10S) longer than that for upper heater.

Leadfree profile analyze setting (Fig.2)

Testing temperature (Fig.3)

6Check the PCB to be repaired, and confirm it is leaded or leadfree. E.g. PCB is

leadfree ( of course BGA also leadfree): First of all, we choose a leadfree profile

and check the settings(as in shown Fig.1 Fig.2). Second, clamp the PCB to the

Insert the wire sensor into the BGA to test the temperature of it.

Best leadfree pfrofile: Preheat temperature150-190 time60-90 S reflow temperature217-217 time40-90 S highest temperature240 5

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supports and insert wire sensor into BGA (for testing temperature). Third, star

desolder (as in shown Fig.3). When heating completes, look over the Analyze

column to check the preheat time, reflow time and max. temperature(peak) whether

they meet the requirement of leadfree technology.( as in shown Fig.2)

7If every parameter in Analyze column meets requirement, that means this profile is

suitable for this BGA, then we can save it as LF+..(BGA model number). Next time

we repair the same BGA chip as this, we no need to test the profile any more, but

use it directly. In reverse, we have to change settings then save.

8If the max temperature/peak(TC) is lower or higher than the standard required

temperature 245 ( leadfree), we can take a method as follows:

e.g. The tested Max temperature is 220 , 245-2201.2=30

e.g. The tested Max temperature is 260 , 245-2601.2= -18

we put 30 or -18 to offset, then we can get a suitable profile.

9If the preheat time is too short which doesnt meet requirement(60~90s leadfree),

there are two solutions to make a suitable profile:

91When the profile running finishes stage 2 with a temperature(TC) below

150 , we can increase the set temperature or prolong the time in this stage

on both upper and lower parts. The standard requirement is that TC/ wire

sensed temperature must up to 150 when stage 2 ends.

92 The profile running finishes stage 2 with a temperature(TC) of 150 or

more. In this case, we should prolong the time in stage 3. The prolonged

time must be the number missing in preheat time. i.e. We prolong how

much seconds it misses in the preheat time( preheat time must be between

60~90s).

10If reflow time is too short below (40~90s) which also does not meet requirement, the

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solution is to prolong time in stage 4 or 5. The same as point 92i.e. to prolong

how much seconds it misses in the reflow time( reflow time must be between

40~90s)

11Suppose the preheat time and reflow time are too long (preheat time over 60~90s,

reflow time over 40~90s), we can take a reverse method of the above.

12After changing the setting, we get a new profile. Also we have to test this new profile

again. The method of testing is the same as what we mentioned in Fig.2. Even this

profile is still not qualified, we have to change and readjust setting again and again

until it is qualified, then save in the machine.

Leaded profile setting

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The method worked on leaded BGA chip is the same as leadfree one.

Rework Skills 1If we are not sure the BGA is leaded or leadfree, for safety concerns, we take a leaded

profile to test (To test means to desolder a BGA with the wire sensing inserted). During

heating, when TC on the touch screen goes to 190 , flip the BGA with a tweezers. Here, if

the balls are already melted, we can say it is leaded. In reverse, we can say it is leadfree. Only

when TC goes to 217 can the BGA balls be melted, we might know it is leadfree.

2Usually we select or make an appropriate profile according to the size of BGA and the

thickness of PCB. The thicker PCB is, the more temperature in lower part we need to

increase.

3Profile setting for South Bridge and North Bridge is almost the same. But exactly

NB(North Bridge) needs a little more temperature than SB(South Bridge).(usually a few

degrees only) For the two-store VGA on laptop motherboard, we need to increase temperature

in lower part and decrease temperature in upper part a bit( in stage 4 of upper part, set

210-220 ). The reason why we do so is that high temperature in upper part will damage the

small chips on the VGA.

Best leadfree profile requirement Preheat temperature: 150-183 Preheat time: 60-120 S Reflow temperature: 183-183 Reflow time: 60-90 S Max temperature(peak/TC) 210 5

31

. Instruction on Installation of Supporting Clamp for Laptop PCB

1. we offer a set of clamping device of Laptop PCB with 6pcs clamps, 6 pcs knobs, 4pcs

spacer, 2pcs bars onto which clamps are fixed onto, shown as

2. Place spacers under both ends of bars for fixing clamps, lock bars onto PCB supporting

boards and later use knobs to fasten clamps, shown as follows:

Knob

Clamps

Spacers Bars for fixing clamps Clamps neck

Holes for fixing screws

Screw holes for fixing clamps

Bars for fixing clamps

Screw fixing

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2. Clamping laptop PCB, put PCB on the supports, make sure the cores of BGA, upper

nozzle and lower nozzle are in a line. Adjust PCB clamping device, move clamps close to

the left/right edges of PCB boards, which are stuck into clamps neck, tighten knobs to fix

clamps onto PCB support board to make PCB board even.

Tighten clamps

Screw fixing

33

. Calibrating Camera

How to judge whether the camera has to be calibrated.

Due to the shaking during transition or moving, the lens might get loosed which causes bad

alignment while reworking PCB. In this case, we need to calibrate it. We can use a special

measure to calibrate the camera, (We supply the special measure) or take a small IC. The

following is the method taking a special measure to calibrate

Procedures:

1Clamp the measure to PCB clamping device as clamping motherboard, choose appropriate

suction nozzle, observe the image on the display, adjust the measure until it is beneath

the nozzle. As shown in Fig.1

Fig.1

Image for measure

The blue line is the nozzles image

Measure Alignment module

34

2Lock the Shaft Locked, back to vision system, lower the nozzle to touch the module, start

vacuum to pick up the module, pull out the camera and remove the locating module (as

shown in Fig.2), regulate the image definition as what shown in Fig3. The measure image

and alignment module image mismatch each other. In this case, we need to calibrate the

camera, otherwise no need.

Fig.2

Fig.3

Measure image

Alignment module image

Pick up alignment module

Optical vision

Suction

35

3Regulate the measure image through the remote to make it in the clearest situation. After

that, regulate the definition of alignment module. Select the debugging column to press

keys(in Fig 4), to adjust the height of camera and alignment module to make the image of

alignment module in the clearest situation.

4Make sure the camera is fixed before being calibrated (i.e. the fixing screw for prism is

locked.) Take a inner hex wrench with M3 to loose locking screw for up/down, then

adjust the adjusting screw for up/down until we can see the measure image and the

alignment module image perfectly match each other, finally lock the locking screw for

up/down as shown in Fig.4

Fig 4

4Make sure the camera is fixed before being calibrated (i.e. the fixing screw for prism is

locked.) Take a inner hex wrench with M3 to loose locking screw for up/down, then

adjust the adjusting screw for up/down until we can see the measure image and the

alignment module image perfectly match each other, finally lock the locking screw for

up/down as shown in Fig 5

Key for moving nozzle up and down

36

Fig 5

5. restore optical alignment system, press down key in the debugging column to control the

hot air head to place alignment module down to mount with measure. When suction reaches

the lowest point, vacuum is automatically cancelled. Then press down key to move up

the suction.

6. apply optical alignment system to inspect the mounting effect, complete inosculation of

alignment and measure shows the camera is exactly regulated, as shown in Fig6

Fig 6

Adjusting screw for up/down

Fixing screw for up/down

Locking screw for up/down

Adjusting screw for left/right

37

. Maintenance

In order to guarantee the machine function and prolong service life of the machine,

during usage, we have to do some maintenance on the system regularly as follows:

Components name Maintenance method Maintenance period

Upper heater Open the cover, clean the fan with high-pressure air

1 month

Drive mechanism on upper heater

Apply some butter on lead rail, rack, gear and other drive mechanism

1 month

Electronic box

Open the back cover of the machine, use vacuum cleaner to suck the dust and dirt, and check whether the components fixed well

3 months

Drive mechanism on optical system

Apply some butter on the drive parts

1 month

Bottom IR heating tube Clean the heating tube with dry cloth(do not use wet one)

1 day

PCB clamps Apply some lubricant to the PCB supports and shaft of support guiding axle

1 month

38

. Alarm Malfunction and Troubleshooting

1. Upper part heating abnormal!

11. Reason

a. After starts heating, with the power consumption of more than 99%, if the

practically-sensed temperature is below 150 , the upper heater should heat up at a

speed of more than twice of the its normal

b. If the practically-sensed temperature is over 150 , the upper heater should heat up

at the speed of 0.1 /S.

c. If any of the above two situations can not be qualified, the system will give alarm.

12. Troubleshooting:

a. make sure the temperature parameter setting is correct

b.check whether the blast blower, upper heating coil and upper temperature-sensing

wire is working.

2. Lower part heating abnormal!

21. ReasonAfter starts heating, with the power consumption of more than 99%, if the

practically-sensed temperature is below 150 , the lower heater should

heat up at a speed of more than twice of the its normal speed. If it can not

reach that temperature standard continuously for 5s, the system will give

alarm.

22. Troubleshooting:

a. make sure the temperature parameter setting is correct

b. check whether the blast blower, lower heating coil and lower temperature-sensing

wire is working.

39

Alarim setting for upper temperature increasing rate, default 1.3

Alarim setting for lower tem perature increasing rate, default 1.0

40

. Technical Specification

Technical specification

Max PCB size 430mmX400mm

Workable area 430X400mm Applicable PCB

Max PCB thickness 4mm

Max size 55mm x 55mm

Min size 1mm x 1mm Applicable BGA

Max weight 80g

Upper heater 350

Lower heater 350

Bottom IR heater 300

Temperature control

Temperature control 16sections of programmable temperature control setting

Power for operation 5000W

Upper(Main) heater 600W

Lower heater 800W Power consumption

Bottom IR heater 3600W

Machine Dimension 750*850*850mm System parameter

Machine Weight 60KG

Input voltage Power for requirement AC 220V 5.0KW

SHUTTLE STAR INDUSTRIAL CO., LTD.

Our company has been delicated into the R&D of the new products

and the improvement of technology. All the parameters of our products

are subject to our latest information .

Welcome to select and purchase other products of our company, we

will provide goods as per your particular requirement.