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Status of Microchannel Cooling. J. Daguin (CERN PH/DT) A. Mapelli (CERN PH/DT) M. Morel (CERN PH/ESE) J. Noel (CERN PH/DT) G. Nuessle (UCL) P. Petagna (CERN PH/DT). Status of thermal tests Status of integration/infrastructure Micro-fabrication plans. Tests on “GTK SFB” Design Continue. - PowerPoint PPT Presentation
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GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 1/9
PH-DT
Status of Microchannel CoolingJ. Daguin (CERN PH/DT)A. Mapelli (CERN PH/DT)M. Morel (CERN PH/ESE)J. Noel (CERN PH/DT)G. Nuessle (UCL)P. Petagna (CERN PH/DT)
• Status of thermal tests
• Status of integration/infrastructure
• Micro-fabrication plans
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 2/9
PH-DT
Tests on “GTK SFB” Design Continue
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 3/9
PH-DT
New Kapton Heater: “GTKSym v1.1” FLOW IN
FLOW OUT
HEATING SURFACE• Better adapted size (40 x 60 mm)
• 3 separated heating regions
• 15 PT100 temperature sensors
• Test under mild vacuum (1÷2 ·10-2 mbar)
• No detectable leak
• Contact by thermal grease
(Electronics)
(Electronics)
(Sensor)
Waiting for new 3D thermo-mechanical simulator (“GTKSym v2.0) -> see talk by M.
Morel
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 4/9
PH-DT
Some Thermal Results (T uniformity)
FLOW IN (T ~ -2 °C)
FLOW OUT (T ~ +1.5 °C)
HEATING SURFACE(middle row of temperature sensors)
1 2 3 4 50123456789
10
Temperature distribution on heater surfaces
temperature sensor positionte
mpe
ratu
re [°
C]
1 2 3 4 5
1 2 3 4 5
• P = 15 W (½ nominal)
• Q = 0.0036 kg/s (½ nominal)
• DTIN-OUT ~ 3.5 °C
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 5/9
PH-DT
Thermal Results (Preliminary transients)
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 6/9
PH-DT
Thermal Test Programme
• Explore temperature uniformity in design conditions
• Explore temperature on sensor vs. inlet coolant temperature
• Explore sensitivity to flow rate errors
• Explore off-design conditions (e.g. partial chip failure)
• Explore time gradient of temperature in case of cooling failure
• Define electronics on/off transient properties (cooling on)
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 7/9
PH-DT
Integration in GTK Module
• Work space prepared inside the Divisional Silicon Facility (bldg 186)
• Dedicated Technical Student starts end of August
• Possibly one US Summer Student available before then
• Staystik: paste -> received; film -> sent from firm
• Also available: diamond-loaded SU-8 (spin-coatable in thickness < 1 mm
Diamond-loaded epoxy ME7159 from “Al Technology”
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 8/9
PH-DT
Infrastructure
Meeting agreed with EN/CV-DC on May 26th to start discussing detailed specs for the cooling plant (preferred option: cold liquid C6F14, scaled down from CMS PIX unit, single unit with 3 branches, controls under Unicos+PVSS)
1 rack needed in the cavern (exp. site visited on May 6th, preliminary requirements provided to Gilles Maire on May 17th).
Option A: rack in TCC8 + minimal distance from GTK– longer access time after dump
Option B: rack in ECN3 + shorter access time after dump– very long transfer lines
Open question: optimal position for controlling PLC?
GTK WG MeetingMay 24th 2011
Status of Microchannel Cooling - Paolo Petagna 9/9
PH-DT
Micro-fabrication plans
• Final round of optimization of micro-fluidics
design
• Define minimal thickness (long process, requires
many hours in clean room). Target: 150 mm
• Increase reliability of bonding process, in
particular for Si-Si
• Enhance analysis via non-destructive methods to
improve QA/QC for serial production
