Compression Molding

Solutions for 3D TSV and other advanced packages as well as cost savings for standard package applications

1. Company Introduction

2. Package Development Trend

3. Compression FFT Molding Technology

4. Advantages by Compression FFT Mold

5. Cost reduction by Compression FFT Mold

6. Mass production equipment (PMC1040)

7. LED Lense Compression Molding

8. Summary / Conclusion

2

Source : VLSI Research

• TOWA Europe GmbH has been established in 2004.

• A division of The TOWA Corporation of Japan, founded in

1979. Towa Corporation, a Molding Pioneer

• With a 40% WW market share, Towa is largest supplier of Mold

equipment

• Cooperation with the package/product development centres of

our European customers as well as with European

institutes, enables us to play a leading role in the development

of new products by European companies

• With our Towa Europe PDC (Package Development Center) we

give full support in package development of Semiconductor

and LED packages, from the designing stage to mass

production.

1 Company Introduction

3

1 Company Introduction

4

Former generation New generation

1980 1990 2000

Str

uct

ure

P

ack

ag

e

Tre

nd

A

ssem

bly

Sty

le

SOP/TSOP

DIP

QFP/TQFP

PBGA

FBGA

CSP

FC BGA

WL CSP

Matrix

Cavity

Map

Cavity

Single

Cavity

Matrix

Cavity

Chip stack

Package stack

2014

POP

Single

Cavity

Future

mainstre

am

Large Substrate

Through Silicon Via

High end SIP

Map Unit

Cavity

WL CSP

Large Frame

2 Package Road Map and Towa Mold Solutions

5

2 Package Road Map and Towa Mold Solutions

20 18 15 12

DIP

QFP/TQFP

SOP/TSOP PBGA

FBGA CSP

FC BGA

WL CSP

Chip stuck

Single Chip

Matrix Cavity

L/F

Matrix allay

package(MAP)

Year 1990 2000 2014

Mold thickness (mm)

Mold Width (mm)

3 1 0.5 0.4 0.3 0.2

30 50 75 100 120 150

2 5 7 No of stack chip 1

Wire length (mm)

Wire dia (μm)

4 5 6 7 10

Stack Die & long wire

& low loop height

Flow Free Thin Molding ・Fine & Long wire ・Thin Package

・Multi-Stack Die ・Low-K Die

Single Cavity LF

Package stuck

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High Power

UV LED

1st Generation

Mold method

Transfer Single plunger

2.5th Generation

Mold method

Transfer Multi-plunger

with vacuum

3rd Generation

Mold method

Compression FFT molding

8 10 16

8

23

20

2nd Generation

Mold method

Transfer Multi-plunger

6

2 Package Road Map and Towa Mold Solutions

7

Advance packaging 2013 =>

Mold compound ( Pellet ) is set in the pot.

Melted compound is transferred

into mold chase.

Upper

Chase

Lower Chase

Transfer Speed

Transfer Pressure

FM Seal

Upper

Lower

MAP Substrate Wafer LED

Mold compound ( Granule / Liquid)

is set in lower chase. Substrate

is slowly “dipped” into melted compound.

Compression Molding Transfer Molding

3 Compression FFT Molding Technology

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・Film Width : 100 ～ 140mm

・Film roll diameter : φ180 MAX.

・Film exchange time : about 10 minute

・Film usage length per shot : length 400mm

Unwind Wind

Upper Mold Die

Release Film

Lower Mold Die

Middle Plate

Ion Blow

3 Compression Molding Technology: Film Handler

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FM Die

Steam

Air in tablet

Packed air

In filling

FM position

STD Molding

FM Molding 1mm

FM unit

◇Feature With vacuum unit, vacuum tank and unique seal enable gas & air inside of tablet or during resin

fusion to deaerate within 1 second just 1mm away from final clamping position.

◇Effect Void free and stable molding.

Adequate to Thin Large Package, Stack Die, Stack Package, Flip Chip，Clear Resin etc…

3 Compression Molding Technology: FM Technology

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Compression

molding

Protect cavities from

contamination and abrasion.

Remove air and out-gas while

molding.

Pressurized encapsulation. Stable molding.

Reduce cleaning or

maintenance process

Release molded products from

mold cavity. No damage caused by

ejection stress.

No ejector pin marks

Set resin into cavity area only. No cull / runner

No voids

No burnt spot caused

by gas or air

-

-

-

-

-

-

-

Fundamentals

Release film

FM

3 Compression FFT Molding Technology

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Transfer molding Compression FFT molding

Compound flow unbalance

Compound flow-free

GATE side

Compression FFT Molding Method is able to minimize resin flow comparing with Transfer

Molding Method. To fill out all part of molding area, Transfer Molding Method takes much

longer time. Compression FFT molding method has an advantage at larger substrate

due to this reason.

Cost reduction by using larger substrate up to 100 x 300 or

Large Panels

4 Advantages: Enlarged substrate Size

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Multi-stack die package

Compression FFT molding

Void

Resin flow

Transfer molding

4 Advantages: High Quality Molding

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Sensitive packaging - Overhanging dies, Low K die, fragile

MEMS can be molded by compression molding by low

encapsulation pressure.

Compression FFT molding

4 Advantages: High Quality Molding

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Wire sweep max. 0.3% Wire sweep max. 5%

Resin : Green compound

Wire diameter : 20 µm

Wire length : 5.5 mm MAX.

Long or fine wire bonded package

Compression FFT molding Transfer molding

4 Advantages: High Quality molding

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With FM Without FM

Flip chip underfill

Comparison picture With/Without FM（Flip chip / Matrix）

Chip size ： □7mm、Gap : 70μm

4 Advantages: High Quality molding

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Compression FFT Molding Method enables gold wire to be smaller by

minimized resin flow.

● Mold evaluation example of fine & long Wire

φ25μm ⇒ φ15μm Approx. 64% reduction

φ22μm ⇒ φ15μm Approx. 54% reduction

● Cost down proposal of finer gold wire

※Cross-section ratio

【 MOLDING CONDITION 】 Wire： φ15μm

Wire length 5mm

Fine wire

5 Cost Reduction: Reduction of Gold Wire

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100% resin usage Approx. 40~60% resin

usage

Compression FFT Molding Transfer Molding

Improved resin utilization and reduction of waste

material and disposal cost

5 Cost Reduction: Improved Resin Utalization

Minimum

Mold Gap

over Die

Transfer molding CompressionFFT molding

By reducing CMP, Back grinding process,

Reduction of one process and equipment cost

CMP, Back grinding

process is required

Chip thickness is free so that

CMP, Back grinding process

can be eliminated.

5 Cost Reduction: Reduction CMP / Backgrinding

1．Flexibility to different thickness products a. Available range from initial setting is +0.3mm of

thickness of substrate or package by parameter.

b. No conversion is required.

・Effective usage of chase and parts.

2．Decrease cleaning time of chase with release film.

3. Same Granular Compound can be used for

different package type vs. troublesome pellet

control management

5 Cost Reduction: Progress of productivity and

workability

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PMC1040 appearance

6 Mass Production equipment

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• By using pre-cut release film method, release film usage is improved

• Advanced resin supply accuracy.

• Small foot print by using Hold Frame structure.

• Possible to connect maximum 4 Hold Frame module (= 8 strips) to meet mass production requirement.

• PMC can handle 30% wider substrate (Max 100 x 300mm)

• Possible to detect number of stack chip by Laser scan sensor

• Resin cooling ability.

• Molded substrate warpage compensation function equipped.

Feature of PMC1040-S

6 Mass Production equipment

Silicon lens Die bonding

Silicon, phosphor layer

Compression FFT molding

Conventional package

Pre-molding

Lens shape

Compression

molding

Substrate (ceramics etc.) Epoxy, phosphor layer

Compression FFT molding,

Simplify high power LED manufacturing process

Substrate (ceramics etc.)

Die bonding

No lens misalignment!

7 Led Lense Compression Molding

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1. Improves productivity by molding a lot of LED packages at one time.

2. Enables to miniaturize LED packages as thin package and small dia. Lens can be

molded.

3. Enables to reduce LED package assembly process by making lens shape

simultaneously by compression molding with silicone, instead of mounting

separated lens.

4. Improves effective usage of reisn (over 95%)

5. Enables to encapsulate by phosphor mixed resin.

6. Improve reliability as release agent is not required to add in silicone resin.

7. Contributes improvement of heat radiation by wide substrate material selection

(Ceramics etc.).

8. It's applicable to various lens shape not only dome type. (e.g., to make hollow on

vertex of lens in order to spread light.)

Advantages of LED Compression FFT molding

LED application

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• Larger substrate

• Finer wire

• Effective resin usage

• Cost reduction of CMP and other process

• Progress of productivity and workability

Superiority of Compression FFT Mold

Compression FFT molding method is capable for

molding not only existing packages, but also for

advanced packaging with the most beneficial

cost reduction.

8 Summary and Conclusion

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Semiconductor / IC

LED Mold

Solar Cell Surface protection,

Focus lens Mold Complex

Tooling

MEMS Cavity

TOWA Compression FFT Mold

The solution for difficult-to-mold packages, thin large area molding and automating.

High filler contents, high adhesion,

・Silicone Resin (Heat proof, ultra-violets transit)

・Epoxy Resin ( High Adhesion etc. )

Electric Components

Module

Free from Vibration and

Outer Conditions

Various applications by Compression FFT molding

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8 Summary and conclusion

★Strip Single /Multi Cap

8 Summary and conclusion

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Various assembly style by Compression FFT molding

★Panel Size ★Wafer Level

★LED（ Strip and panel size )

Thank you for your attention!

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