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SOI EDA/IP OverviewJon Cheek
Executive Director
SOI Industry Consortium
SOI EDA/IP Overview
Apr/9, 2019 Silicon Valley Symposium 2
Substrates
Supply Chain & Eco-system
Technology
Foundry
EDA & IP
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✓
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© 2018 Cadence Design Systems, Inc. All rights reserved.3
Design Capabilities 22FDX 28FDS
Logic Simulation (Incisive®)
Dig
ital Im
ple
menta
tion a
nd S
ignoff
(RT
L to G
DS
)
Synthesis (Genus™)
Power Analysis (Joules™)
Test (Modus)
Place and Route (Innovus™)
Timing Analysis (Tempus™)
Extraction (Quantus™)
EM/IR Analysis (Voltus™)
Physical Verification (PVS)
Litho Physical Analysis (DFM/LPA)
Litho Electrical Analysis (DFM/LEA)
Chemical Mechanical Polishing (DFM/CMP)
Custo
m a
nd A
nalo
g
Desig
n
Schematic Editing (Virtuoso® VSE)
Analog Design Environment (Virtuoso ADE)
Layout System (Virtuoso VLS)
Circuit Simulation (Spectre® APS/XLS)
Electrically Aware Design (EAD)
EM/IR Analysis (Voltus-Fi)
Cadence EDA Enablement and Proof-Points for 22FDX and 28FDS
Certified
Enabled
Recent CES demos on 22FDX: Vision Processing;
Artificial Intelligence: Image Classification – Pedestrian
and Gender Detection
• NXP-Cadence-Samsung Foundry
28 FDS
• i.MX product line multiple tapeouts
• Cadence EDA Digital and Custom
tools, DIP and Tensilica HiFi 4 DSP
Silvaco Modeling
Apr/9, 2019 Silicon Valley Symposium 4
Apr/9, 2019 Silicon Valley Symposium 5
Apr/9, 2019 Silicon Valley Symposium 6
Apr/9, 2019 Silicon Valley Symposium 7
Apr/9, 2019 Silicon Valley Symposium 8
Apr/9, 2019 Silicon Valley Symposium 9
Apr/9, 2019 Silicon Valley Symposium 10
SOI Industry Consortium
Apr/9, 2019 Silicon Valley Symposium 11