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A Y
2 4
S N 74 L V 1T 04SCLS738A SEPTEMBER 2013REVISED SEPTEMBER 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTION TABLE
INPUT OUTPUT
(Lower Level Input) (VCCCMOS)
A Y
H L
L H
SUPPLY VCC= 3.3V
A Y
VIH(min) =1.35 V VOH(min) = 2.9 V
VIL(max) =0.8 V VOL(max)= 0.2 V
Figure 1. Logic Diagram (NAND Gate)
Figure 2. Excellent Signal Integrity (1.8V to 3.3V at 3.3V VCC)
2 Submit Documentation Feedback Copyright 2013, Texas Instruments Incorporated
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S N 74 L V 1T 04www.ti.com SCLS738A SEPTEMBER 2013 REVISED SEPTEMBER 2013
Figure 3. Excellent Signal Integrity (3.3V to 3.3V at 3.3V VCC)
Figure 4. Excellent Signal Integrity (3.3V to 1.8V at 1.8V VCC)
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VIH min = 1.36V
VIL min = 0.8V
VOH min = 2.4V
VOL max = 0.4V
LV1Txx Logic 3.3VSystem5.0V, 3.3V2.5V, 1.8V
System
Vcc = 3.3V
VIH = 2.0VVIL = 0.8V
VIH = 0.99VVIL = 0.55V
5.0V3.3V
System
Vcc = 5.0V
LV1Txx Logic 5.0VSystem
Vcc = 1.8V
5.0V, 3.3V2.5V, 1.8V1.5V, 1.2V
System
LV1Txx Logic 1.8VSystem
S N 74 L V 1T 04SCLS738A SEPTEMBER 2013REVISED SEPTEMBER 2013 www.ti.com
TYPICAL DESIGN EXAMPLES
Figure 5. Switching Thresholds for 1.8-V to 3.3-V Translation
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range 0.5 7.0 V
VI Input voltage range(2) 0.5 7.0 V
Voltage range applied to any output in the high-impedance or power-off state (2) 0.5 4.6 VVO
Voltage range applied to any output in the high or low state (2) 0.5 VCC+ 0.5 V
IIK Input clamp current VI < 0 20 mA
IOK Output clamp current VO< 0 or VO> VCC 20 mA
IO Continuous output current 25 mA
Continuous current through VCC or GND 50 mA
DBV package 206JA Package thermal impedance(3)
DCK package 252 C/W
Tstg Storage temperature range 65 150 C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
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S N 74 L V 1T 04www.ti.com SCLS738A SEPTEMBER 2013 REVISED SEPTEMBER 2013
RECOMMENDED OPERATING CONDITIONS(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 1.6 5.5 V
VI Input voltage 0 5.5 V
VO
Output voltage 0 VCC
V
VCC= 1.8 V 3
VCC= 2.5 V 5IOH High-level output current mA
VCC= 3.3 V 7
VCC= 5.0 V 8
VCC= 1.8 V 3
VCC= 2.5 V 5IOL Low-level output current mA
VCC= 3.3 V 7
VCC= 5.0 V 8
VCC= 1.8 V 20t/
Input transition rise or fall rate VCC= 3.3 V or 2.5V 20 ns/VvVCC= 5.0 V 20
TA Operating free-air temperature 40 125 C
(1) All unused inputs of the device must be held at VCCor GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature numberSCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25C TA = 40C to 125CPARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX
VCC= 1.65 V to 1.8 V 0.94 1.0
VCC= 2.0 V 1.02 1.03
VCC= 2.25 V to 2.5 V 1.135 1.18
VCC= 2.75 V 1.21 1.23High-level inputVIH Vvoltage
VCC= 3 V to 3.3 V 1.35 1.37VCC= 3.6 V 1.47 1.48
VCC= 4.5 V to 5.0 V 2.02 2.03
VCC= 5.5 V 2.1 2.11
VCC= 1.65 V to 2.0 V 0.58 0.55
VCC= 2.25 V to 2.75 V 0.75 0.71Low-level inputVIL Vvoltage VCC= 3 V to 3.6 V 0.8 0.65
VCC= 4.5 V to 5.5 V 0.8 0.8
IOH= 20 A 1.65 V to 5.5 V VCC 0.1 VCC 0.1 V
1.65 V 1.28 1.21IOH= 2.0 mA V
1.8V 1.5 1.45
IOH= 2.3 mA 2 22.3V V
IOH= 3 mA 2 1.93
IOH= 3 mA 2.5V 2.25 2.15 VVOH
IOH= 3.0 mA 2.78 2.73.0 V
IOH= 5.5 mA 2.6 2.49 V
IOH= 5.5 mA 3.3 V 2.9 2.8
IOH= 4 mA 4.2 4.14.5 V
IOH= 8 mA 4.1 3.95 V
IOH= 8 mA 5.0 V 4.6 4.5
Copyright 2013, Texas Instruments Incorporated Submit Documentation Feedback 5
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S N 74 L V 1T 04SCLS738A SEPTEMBER 2013REVISED SEPTEMBER 2013 www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25C TA = 40C to 125CPARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX
IOL= 20 A 1.65 V to 5.5 V 0.1 0.1
IOL= 1.9 mA 1.65 V 0.2 0.25
IOH= 2.3 mA 0.1 0.152.3V
IOH= 3 mA 0.15 0.2VOL
IOL= 3 mA 0.1 0.153.0 V
IOL= 5.5 mA 0.2 0.252 V
IOL= 4 mA 0.15 0.24.5 V
IOL= 8 mA 0.3 0.35
II A input VI = 0 V or VCC 0V, 1.8V, 2.5V, 3.3V, 5.5 V 0.12 1 A
5.0 V 1 10
3.3 V 1 10VI= 0 V or VCC,ICC AIO= 0; open on loading 2.5 V 1 10
1.8V 1 10
One input at 0.3V or 3.4V,
Other inputs at 0 or VCC, 5.5 V 1.35 1.5 mA
IO= 0ICC
One input at 0.3V or 1.1V
Other inputs at 0 or VCC, 1.8V 10 10 A
IO= 0
Ci VI = VCCor GND 3.3 V 2 10 2 10 pF
Co VO = VCCor GND 3.3 V 2.5 2.5 pF
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (seeFigure 7)
TA = 25C TA = 65C to 125CFROM TO FREQUENCYPARAMETER VCC CL UNIT(INPUT) (OUTPUT) (TYP) MIN TYP MAX MIN TYP MAX
15pF 4 5 4 55.0V ns
30pF 5.5 7.0 5.5 7.0DC to 50 MHz15pF 4.8 5 5 5.5
3.3V ns30pF 5 5.5 5.5 6.5
tpd Any In Y15pF 6 6.5 7 7.5
DC to 25 MHz 2.5V ns30pF 6.5 7.5 7.5 8.5
15pF 10.5 11 11 12DC to 15 MHz 1.8V ns
30pF 12 13 12 14
OPERATING CHARACTERISTICS
TA= 25C
PARAMETER TEST CONDITIONS VCC TYP UNIT
1.8 V 0.15 V 102.5 V 0.2 V 10
Cpd Power dissipation capacitance f = 1 MHz and 10 MHz pF3.3 V 0.3 V 10
5.5 V 0.5 V 10
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VMI
From Output
Under Test
CL(see Note A)
LOAD CIRCUIT
1 M
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 VInput
Output
Output
NOTES: A. CLincludes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO= 50 , slew rate 1 V/ns.
C. The outputs are measured one at a time, with one transition per measurement.
D. tPLHand tPHLare the same as tpd.
VMO VMo
VMo VMo
VMI
VCC= 2.5 V
0.2 V
VCC= 3.3 V
0.3 V
CL
VMIVMO
5, 10, 15, 30 pF
VI/2VCC/2
5, 10, 15, 30 pF
VI/2VCC/2
S N 74 L V 1T 04www.ti.com SCLS738A SEPTEMBER 2013 REVISED SEPTEMBER 2013
PARAMETER MEASUREMENT INFORMATION
Figure 6. Load Circuit and Voltage Waveforms
MORE PRODUCT SELECTION
DEVICE PACKAGE DESCRIPTION
SN74LV1T00 DCK, DBV 2-Input Positive-NAND Gate
SN74LV1T02 DCK, DBV 2-Input Positive-NOR Gate
SN74LV1T04 DCK, DBV Inverter Gate
SN74LV1T08 DCK, DBV 2-Input Positive-AND Gate
SN74LV1T17 DCK, DBV Single Buffer Gate with 3-state Output
SN74LV1T14 DCK, DBV Single Schmitt-Trigger Inverter Gate
SN74LV1T32 DCK, DBV 2-Input Positive-OR Gate
SN74LV1T50 DCK, DBV Single Buffer Gate with 3-state Output
SN74LV1T86 DCK, DBV Single 2-Input Exclusive-Or GateSN74LV1T125 DCK, DBV Single Buffer Gate with 3-state Output
SN74LV1T126 DCK, DBV Single Buffer Gate with 3-state Output
SN74LV4T125 RGY, PW Quadruple Bus Buffer Gate With 3-State Outputs
Copyright 2013, Texas Instruments Incorporated Submit Documentation Feedback 7
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S N 74 L V 1T 04SCLS738A SEPTEMBER 2013REVISED SEPTEMBER 2013 www.ti.com
REVISION HISTORY
Changes from Original (September 2013) to Revision A Page
Updated VCCvalues for VIHparameter in the ELECTRICAL CHARACTERISTICS table. ................................................... 5
8 Submit Documentation Feedback Copyright 2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type PackageDrawing
Pins PackageQty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (C) Device Marking
(4/5)
Sampl
SN74LV1T04DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (NEC3 ~ NECS)
SN74LV1T04DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (WC3 ~ WCS)
(1)
The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND:Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production. Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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TAPE AND REEL INFORMATION
*All dimensions are nominal
Device PackageType
PackageDrawing
Pins SPQ ReelDiameter
(mm)
ReelWidth
W1 (mm)
A0(mm)
B0(mm)
K0(mm)
P1(mm)
W(mm)
Pin1Quadrant
SN74LV1T04DBVR SOT-23 DBV 5 3000 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LV1T04DBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74LV1T04DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
SN74LV1T04DCKR SC70 DCK 5 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2013
Pack Materials-Page 1
8/13/2019 sn74lv1t04
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*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LV1T04DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LV1T04DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
SN74LV1T04DCKR SC70 DCK 5 3000 202.0 201.0 28.0
SN74LV1T04DCKR SC70 DCK 5 3000 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2013
Pack Materials-Page 2
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