SEMICONDUCTOR ROADMAPS SYMPOSIUM - MEPTEC - 2013 Roadmaps Proceedings.pdf · Ivor Barber, Senior Director of Package Technology Development, Xilinx Inc. John Xie, Director, Packaging

2013 MEPTEC SEMICONDUCTOR ROADMAPS

SYMPOSIUMA Collaborative Update from Standards Bodies,

Industry Groups, and the Entire Supply Chain

Media Sponsors

S E P T E M B E R 2 4 , 2 0 1 3 • S A N T A C L A R A , C A L I F O R N I A

Participating Companies:

n Altera Corporation

n Amkor Technology, Inc.

n Amonix Inc.

n Aptina Imaging Corporation

n Broadcom Corporation

n Cadence Design Systems

n Cisco Systems Inc.

n eda2asic Consulting, Inc.

n eSilicon Corporation

n Invensas Corporation

n IPC

n LSI Corporation

n Microsoft Corporation

n NVIDIA Corporation

n PPM Associates

n SanDisk Corporation

n SEMI

n STATSChipPAC, Inc.

n SVXR

n TechSearch International, Inc.

n Xilinx Inc.

Gold Sponsor

Association Sponsors

CONTENTSAgenda

Sponsor and Exhibitor Directory

Participant Biographies

PANEL ONE Product Drivers Panelists: •MudasirAhmad,DistinguishedEngineer,CiscoSystemsInc. •FarshadGhahghahi,DirectorofPackaging,LSICorporation •LarryKinsman,DistinguishedMember,TechnicalStaff, PackageProductDevelopment,AptinaImagingCorporation •TomStrothmann,WaferLevelProductBusinessDevelopment,STATSChipPAC •SureshUpadhyayula,SeniorDirector,SanDiskCorporation

PANEL TWO Manufacturing Drivers in Semiconductor Roadmaps Panelists: •RichardCrisp,VicePresidentandChiefTechnologist,InvensasCorporation •JavierDeLaCruz,SeniorDirector,ManufacturingTechnology,eSiliconCorporation •RonHuemoller,SeniorVP,AdvancedProducts/PlatformDevelopment, AmkorTechnology,Inc. •RajMaster,GeneralManager,ICPackaging,Quality&Reliability,Microsoft •DongkaiShangguan,Ph.D.,CEO,NationalCenterforAdvancedPackaging(NCAPChina)

KEYNOTE The Collaboration Engine: Enabling Innovation in Microelectronics KarenSavala,PresidentofSEMIAmericas,SEMI

PANEL THREE Electrical Performance Requirements to meet Emerging Interconnect Standards Panelists: •TomGregorich,Director,PackageElectrical&ThermalOptimization,Broadcom •BradGriffin,ProductMarketingDirector,CadenceDesignSystems •AnthonyTorza,ProductMarketingDirector,FPGAProductPlanning,XilinxInc. •AbeYee,Director,AdvancedTechnology,NVIDIACorporation

PANEL FOUR The Importance of Industry Organization Collaboration Panelists: •CAMEST–DieterBergman,DirectorTechnologyTransfer,IPC •EDPS-HerbReiter,Founder,eda2asicConsulting,Inc. •GSA-KennethPotts,GroupDirectorofStrategicPlanning,CadenceDesignSystems •IPC–JasbirBath,PrincipalEngineer,IPC •SEMI–PaulTrio,Sr.Manager,NorthAmericanStandardOperations,SEMI

2013 SEMICONDUCTOR ROADMAPS SYMPOSIUM

Tuesday, September 24, 2013 • Biltmore Hotel • Santa Clara, California

A Collaborative Update from Standards Bodies, Industry Groups, and the Entire Supply Chain

MORNING AGENDA

7:30am Registration Opens

8:15am–8:30am Welcome and Introduction

PANEL ONE PRODUCT DRIVERS 8:30pm–9:45am Moderator:JoelCamarda SeniorDirector,CPVReceiverManufacturingandProcessTechnology,AmonixInc.

Panelists: •MudasirAhmad,DistinguishedEngineer,CiscoSystemsInc. •FarshadGhahghahi,DirectorofPackaging,LSICorporation •LarryKinsman,DistinguishedMember,TechnicalStaff, PackageProductDevelopment,AptinaImagingCorporation •TomStrothmann,WaferLevelProductBusinessDevelopment,STATSChipPAC •SureshUpadhyayula,SeniorDirector,SanDiskCorporation

9:45am–10:15am Morning Break and Exhibits

PANEL TWO MANUFACTURING DRIVERS IN SEMICONDUCTOR ROADMAPS 10:15am–11:30am Moderator:JeffreyC.Demmin,DirectorOEMMarketing,STATSChipPAC

Panelists: •RichardCrisp,VicePresidentandChiefTechnologist,InvensasCorporation •JavierDeLaCruz,SeniorDirector,ManufacturingTechnology,eSiliconCorporation •RonHuemoller,SeniorVP,AdvancedProducts/PlatformDevelopment, AmkorTechnology,Inc. •RajMaster,GeneralManager,ICPackaging,Quality&Reliability,Microsoft •DongkaiShangguan,Ph.D.,CEO,NationalCenterforAdvancedPackaging

11:30am-12:30pm Lunch and Exhibits



A Collaborative Update from Standards Bodies, Industry Groups, and the Entire Supply Chain

AFTERNOON AGENDA

KEYNOTE: THE COLLABORATION ENGINE: ENABLING INNOVATION IN MICROELECTRONICS12:30pm–1:15pm KarenSavala,PresidentofSEMIAmericas,SEMI

PANEL THREE ELECTRICAL PERFORMANCE REQUIREMENTS TO MEET 1:15pm–2:30pm EMERGING INTERCONNECT STANDARDS Moderators: IvorBarber,SeniorDirectorofPackageTechnologyDevelopment,XilinxInc. JohnXie,Director,PackagingTechnologyResearchandDevelopment,AlteraCorp.

Panelists: •TomGregorich,Director,PackageElectrical&ThermalOptimization,Broadcom •BradGriffin,ProductMarketingDirector,CadenceDesignSystems •AnthonyTorza,ProductMarketingDirector,FPGAProductPlanning,XilinxInc. •AbeYee,Director,AdvancedTechnology,NVIDIACorporation

2:30pm–3:00pm Afternoon Break and Exhibits

PANEL FOUR THE IMPORTANCE OF INDUSTRY ORGANIZATION COLLABORATION 3:00pm–4:15pm Moderator:PhilMarcoux,President,PPMAssociates

Panelists: •CAMEST–DieterBergman,DirectorTechnologyTransfer,IPC •EDPS-HerbReiter,Founder,eda2asicConsulting,Inc. •GSA-KennethPotts,GroupDirectorofStrategicPlanning, CadenceDesignSystems •IPC–JasbirBath,PrincipalEngineer,IPC •SEMI–PaulTrio,Sr.Manager,NorthAmericanStandardOperations,SEMI

4:15pm–5:00pm Event Wrap-up

5:00pm–6:30pm Sponsor and Exhibitor Reception



A SPECIAL THANKS TO OUR MEDIA SPONSORS



A SPECIAL THANKS TO OUR GOLD SPONSOR



"Collaborate For Success"

Collaboration is the key to

efficiency & profitability

in today's challenging

semiconductor industry. The

unique goal of the FOA is to

enable our nearly 100 members -

semiconductor & MEMS

manufacturers along with their

suppliers - to share their strengths

& resources for the benefit of all.

Learn more at www.waferfabs.org

We would like to thank our sponsors and exhibitors for supporting this event!

PO Box 222, Medicine Park, OK 73557Tel: 650-714-1570 Fax: 866-424-0130

www.meptec.org

GOLD SPONSOR

Fab Owners Association19925StevensCreekBlvd.,Ste.100Cupertino,CA95014408-725-7127www.waferfabs.com The Fab Owners Association (FOA) is anon-profit, mutual-benefit trade associa-tionforsemiconductormanufacturersandtheir suppliers. They are an associationwhere fab owners, operators and suppli-ers meet regularly to discuss and act oncommon semiconductor manufacturingissues, combining strengths andresourcesto become more globally competitive.TheFOA consists of member companies whoare semiconductor, MEMS and LED devicemanufacturersalongwithsupplierstothesemiconductor manufacturing industry.Their 25 voting members, who are eitherIDM’s,foundriesordevelopmentfabs,havecombined annual revenues of over $40B,maintain 40+ fabrication facilities aroundtheworldandstartover1.5million8”waferequivalentspermonth.Theirapproximate-ly 70 non-voting associate members areimportant suppliers to the semiconductormanufacturingindustry.

EXHIBITORS

Amkor Technology, Inc. 1900S.PriceRoadChandler,AZ85286480-821-5000www.amkor.comAmkorTechnology,Inc.isoneoftheworld’slargestprovidersofadvancedsemiconduc-tor assembly and test services. Foundedin 1968, Amkor has become a strategicmanufacturing partner for many of theworld’s leading semiconductor companiesand electronics OEMs, providing a broadarray of advanced package design, assem-blyandtestsolutions.Amkor’soperationalbase encompasses more than 5 millionsquare feet of manufacturing facilities,product development centers, and sales& support offices in Asia, Europe and theUnitedStates.Amkoroffersasuiteofser-vices,includingelectroplatedwaferbump-ing,probe,assemblyandfinal test.Amkorisaleaderinadvancedcopperpillarbumpandpackagingtechnologieswhichenablesnextgenerationflipchipinterconnect.

E-tec Interconnect Ltd.P.O.Box4078MountainView,CA94040408-746-2800www.e-tec.com E-tecInterconnectisanISOcertifiedmanu-facturer of sockets, contactors and adapt-ers for semiconductor development andtest. They can accommodate virtually anyfootprint down to .3mm pitch, including“mixed” pitch and “non-Jedec” packages.Solutions are available for high tempera-tureandhighfrequencyrequirements.Topand bottom openings can be modified tosatisfy a variety of test set-ups includingthermal emission microscopy and opencavity probe. SMT, thru-hole and solder-less mount options are available as wellas various closure styles. Engineered andmanufactured by Swiss craftsmen … eco-nomicallypriced…withfastdelivery.

Gel-Pak31398HuntwoodAvenueHayward,California94544888-621-4147/510-576-2220www.gelpak.com Gel-Pak manufactures Gel-Coated boxes,trays, slides, and films that are designedto protect sensitive devices during trans-portandprocessing.Thecompany’spropri-etary elastomer technology holds devicesinplacewithouttheuseofcustommoldedpockets.Thesystemsaredistributedworld-wide.

Micrel, Inc.2180FortuneDriveSanJose,CA95131408-944-0800www.micrel.comMicrel,Inc.,isaleadingmanufacturerofICsolutions.Micrel’sCustomFoundryServicesallow customers to develop proprietaryprocess flows, from R&D to high-volumeproduction.Productsincludemixed-signal,analog, and power semiconductors, com-munication, clock management, Ethernetswitch, and physical layer transceivers.Headquarters and state-of-the-art waferfabrication facilities are in San Jose, CA,withofficesanddesigncentersglobally.

Mühlbauer226Pickett’sLaneNewportNews,VA23603757-947-2820www.muhlbauer.comMühlbauer is a global, independentconsultant and manufacturer of turn-key automation solutions for the SmartCard, RFID Smart Label, SemiconductorBackend, Flexible Solar Cell manufactur-ing and Vision industries. In addition, thecompany is active in the areas of enroll-ment and verification of personal data,CPV(ConcentratorPhotoVoltaic),precisionpartsandOEMproduction.Withmorethan3,000 employees in 25 locations on fivecontinents,Mühlbauerisaleadingsupplierof (Flip Chip) Die Sorting-and inspectionequipment.

SPONSOR AND EXHIBITOR DIRECTORY



Pac Tech USA328MartinAvenueSantaClara,CA95050408-588-1925www.pactech.comPac-Tech USA Packaging Technologies Inc.facilityinSantaClara,Californiaofferscon-tract wafer bumping services using lowcost electroless Ni/Au under-bump metal-lization, solder stencil printing and solderball placement for quick-turn and mass-production. PacTech USA also providesproductdemonstrations,trainingandsalessupport.PacTechdesignsandbuildsstate-of-the-art wafer bumping and assemblyequipment for flip-chip and chip-scalepackaging.PacTechistheworldwideleaderin laser reflow and heating technology asimplemented in systems for solder jetting(SB2) and flip-chip attach (LAPLACE) foradvancedpackagingapplications likeHGAassembly, MEMS and optoelectronic pack-aging,LCDdriverassembly,etc.

PROMEX Industries, Inc.3075OakmeadVillageDriveSantaClara,CA95051408-496-0222www.promex-ind.comPromex,SiliconValley’sPackagingFoundry,integrates IC assembly and materials-cen-tric packaging expertise with broad pro-cess and technical knowledge, enablingcustomerstotakenewproductstomarketfasterthanbyanyotherroute.JEDECstan-dardandcustomplasticovermoldedQFN/TQFN and DFNs. Promex is a recognizedleader in stacked die, thin molded, 2D, 3D,SMT and RoHS compliant packaging. SiPs,MEMS,MOEMS,MCM,LGAandRFpackag-ing development and assembly. ITAR reg-istered, ISO 13485 Medical certified.Worldwide customers are provided quick turns,development prototyping, NPI, scalableonshoreandpre-Asiavolumeproduction.

Quik-Pak 10987ViaFronteraSanDiego,CA92127858-674-4676www.icproto.comQuik-Pak, a division of Delphon Industries,provides IC packaging and assembly ser-vices. The company’s newest offering isits OmPP package.These pre-molded QFNpackages provide a fast, inexpensive solu-tionforyourprototypeorsample require-ments.Quik-Pakalsospecializesinavarietyofservicesthattogetherprovideafullturn-key solution including wafer preparation,die/wirebonding,remoldingandmarking/branding. Custom assembly services arealsoofferedforFlipChip,CeramicPackages,Chip-on-Board,StackedDie,MEMS,etc.

Reflex Photonics 1250OakmeadParkway,Ste.210Sunnyvale,CA94085408-501-8886www.reflexphotonics.comReflex Photonics is an advanced develop-er of extreme high-speed, parallel chan-nel optical connectivity solutions for datatransfer and semiconductor packagingapplications. The company addresses thegrowing demand for high-speed intercon-nects in enterprise-class storage/serverenvironmentsandtelecom-classswitches/routers,enablingequipmentdeveloperstodesignsmaller, lowercostandlowerpow-ered systems that result in higher fidelityandfasterconnectivity.

Signetics 39899BalentineDrive,#365Newark,CA94560408-907-0120www.signetics.comSignetics launched its semiconduc-tor assembly and test operations inYoumchang-Dong in Seoul, South Koreain 1966 as part of Signetics Corporation,which was at the time, an IDM based inSunnyvale, California. With over 40 yearsintheindustry,Signeticsisthemostexpe-rienced semiconductor assembly and testservices provider in Korea. Signetics hasbeen certified to the major quality stan-dards including ISO/TS16949, ISO14001,Sony Green Partner and Samsung EcoPartner.

SPONSOR AND EXHIBITOR DIRECTORY



BIOGRAPHIES

SESSION CHAIRS

Ivor BarbergraduatedfromNapierUniversityinEdinburgh,Scotlandin1981withaBachelorsdegreeinTechnology.HehasworkedinpackageassemblyanddesignatNationalSemiconductor,FairchildSemiconductorandVLSITechnology.Ivorspent23yearsatLSICorporationinMilpitasinvariousEngineeringandManagementpositionsinAssembly,PackageCharacterizationandPackageDesign.IvoriscurrentlySeniorDirectorofPackageTechnologyDevelopmentatXilinx.Ivorholds13USpatentsrelatedtopackagedesign.

Joel Camardaisanindustryconsultant,concentratingonmanufacturingoperationsmanagementandisalsoaSr.MemberTechnical Staff for Amonix, a leading CPV system supplier. He well known in the international packaging community via hisworkhistoryof30+yearsintheUSAandAsia.HehasbeenactiveinIMAPSandisanadvisorforMEPTEC.Joelhasheldseveralexecutivemanagementpositions:VPOperationsatSipex/Exar,PresidentofK&SFlipChipTechnology,andDirectorofWorldwideAssemblyandPackagingatCypressSemiconductor.HestartedhiscareeratNationalSemiconductor.

Jeffrey C. DemministheDirectorofOEMMarketingatSTATSChipPAC,aleadingproviderofsemiconductorassemblyandtestservices.BeforethatheworkedatTesseraTechnologies inmarketing,corporatedevelopment,andIPacquisition.HewaspreviouslytheEditor-in-ChiefofAdvancedPackagingmagazineandSeniorTechnicalEditorofSolidStateTechnologymagazine.HiscareerstartedinsemiconductorpackagedesignatNationalSemiconductor,andasequenceofengineeringrolesatnCHIP,Seagate,andTextronfollowedthat.Jeffearnedabachelor’sdegreeinPhysicsfromPrincetonUniversityandamaster’sdegreeinMaterialsSciencefromStanfordUniversity.HehasbeenawardedfivepatentsandagoldmedalfromtheAmericanSocietyofBusinessPublicationEditors(ASPBE).

Phil MarcouxisoneofmanySMTandICPackagingPioneers.In2007hewasnamed“TheFatherofUSSMT”bytheIPC.In1981hefounded,AWI,thefirstUSCompanydevotedexclusivelytoSMTwhichwaslateracquiredbySCISystems.In1992hefounded,ChipScale,oneofthefirstWaferLevelPackagingcompanieswhichdevelopedaportfolioofover36patents.Thepatentsarenowthecornerstoneof thecameramodulescommonlyfound in thecurrentcellphones,computers,andgames.Today,Phil isanactiveBusinessDevelopmentconsultantintheareaof2.5Dand3DICpackaginginfrastructure,design,andassembly.

John Yuanlin Xie, Ph.D. has been with Altera Corporation for 14 years. His current position is Director of PackagingTechnology Research and Development. Prior to Altera, he was a technology development manager at Prolinx Labs. Dr. XiegraduatedfromDepartmentofPhysics,PekingUniversity,andholdsaPh.D.DegreeinPhysicsfromInstituteofPhysics,ChineseAcademyofSciencesandPostDoctoralfromDepartmentofPhysics,UniversityofCalifornia,BerkeleyandLawrenceBerkeleyLaboratory.Dr.Xiehas24publishedpatentswith10morepending;andover40academicandtechnicalpublications.HeisthePresidentofChineseInstituteofEngineersUSA,SanFranciscoBayAreaChapter.

KEYNOTE SPEAKER

Karen Savala is president of SEMI Americas and is responsible for the association’s Americas programs, including events,productsandservices.SheisresponsibleforrelationshipswithSEMImembersaswellasindustry,governmentandacademiain theregion.Savala joinedSEMI in 1984andhasserved innumerousmanagerialandexecutive roles, includingpositions inInternationalStandards,executiveprograms,andoutreachandmembership.Sheestablishedthe“VoiceoftheCustomer”pro-gramwhichhelpeddriveproductandservice improvementsto improveSEMImembersatisfaction.SavalaearnedabusinessmanagementandcommunicationsdegreefromSanJoseStateUniversityinSanJose,California.

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PARTICIPANTS / PANELISTS

Mudasir Ahmad isaDistinguishedEngineeratCiscoSystems, Inc.Hehasbeeninvolvedwithmicroelectronicspackagingdesignandreliabilityanalysis for 15years.HereceivedhisBachelors fromOhioUniversityandhisM.S.degree inMechanicalEngineeringfromGeorgiaInstituteofTechnology.HeiscurrentlypursuinghisMastersinManagementScience&Engineeringat Stanford. At Cisco, Mudasir is leading the Center of Excellence for Numerical Analysis, developing new analytical algo-rithms,experimentaldesignandreliabilitycharacterizationofnextgeneration3Dpackaging,System-in-PackageModulesandSiliconPhotonics.MudasirisalsoinvolvedwithimplementingnewtechnologieslikeCloudComputingandBigDataAnalyticsto streamline Supply Chain Operations at Cisco. Outside of Cisco, he is the Vice Chair of the Silicon Valley Chapter of theComponentsPackagingandManufacturingTechnology(CPMT)SocietyoftheIEEE.Mudasirhasover25publicationsonmicro-electronicpackaging,twobookchapters,and7USPatents.

Jasbir Bath is a Principal Engineer in the Assembly Technology Group at IPC. He was the Corporate Lead Engineer withSolectronCorporationandFlextronicsInternationalfor10yearswitharoleinvolvingtin-leadandlead-freesolderprocessdevel-opment.PreviouslyhewasaTechnicalOfficerat ITRI (InternationalTinResearch Institute/TinTechnology)Ltd in theU.K.HeholdsBSandMSdegreesinMaterialsSciencefromtheUniversityofManchester/UMISTinEngland,U.K.JasbiristheeditoroftheSpringerPublicationsbook:Lead-freeSolderingandco-editorof2IEEE-Wileybooks:Lead-freeElectronics,iNEMIProjectsLeadtoSuccessfulManufacturingandLead-freeSolderProcessDevelopment.Hehasalsoco-authoredtheLead-freeManufacturingchapteroftheIEEE-Wileybook:Lead-freeElectronics.

Dieter Bergman,IPCAmbassadorofTechnicalPrograms,hasworkedintheElectronicsIndustryforover55years.Hebeganhiscareerin1956asanelectromechanicaldesignerforPhilco-FordinPhiladelphia,PA.Hebecamesupervisoroftheprintedcircuitdesigngroupin1967,andjoinedthecompany’sadvancedtechnologygroupwherehespecializedinprintedcircuitcomputer-aideddesign.HejoinedIPCasTechnicalDirectorin1974,andwasinstrumentalinthedevelopmentofmanyoftheIPCDesignandPerformancestandards.AtpresentheisdoescontractworkforIPConrelatedtopicsofDataTransfer,ComputerFormatsandDesignrelatedImplementationprojects.

Richard Crisp is Vice president and Chief Technologist at Invensas Corporation, a wholly owned subsidiary of TesseraTechnologies,Inc.(Nasdaq:TSRA).Crispisresponsibleforproductstrategy,developmentandpromotionofInvensas’semicon-ductorpackagingtechnologieswithaparticularfocusonadvancedsystemintegrationstructures.CrisphasworkedforMotorola,Intel,MIPSandRambus.CrispbeganhisdesigncareerasakeycircuitdesigneroftheMotorolaMC68000Microprocessor.HeledthedesignofthefirsttwogenerationsofRAMBUSDRAMs,introducinganumberoffundamentalinventionsnowincommonusagethroughouttheDRAMindustry.CrispwastheProgramCommitteeChairmanandViceChairforIEEE’sInternationalSolidStateCircuitsConference(ISSCC2000andISSCC1999)andwastheMemorySubcommitteeChairmanbefore.Crisphasauthorednumerouspeer-reviewedpapersforIEEEandSPIEjournalsandconferences.Crisphasbeenawarded35USPatentsandhas43publishedUSPatentapplications.HereceivedhisBachelor’sdegree,withCumLaudehonors,inElectricalEngineeringfromTexasA&MUniversityin1976.

Javier DeLaCruz istheseniordirectorofengineeringateSiliconCorporation.Heisresponsibleforfoundry,packaging,sig-nalintegrity,productandtestengineering.Hehasalsoleadthe2.5Dand3Dpackage/systeminitiativesbrandedasMoZAIC™devices.DeLaCruzhasover17yearsofexperienceinsemiconductorpackagingandisaseniormemberofIEEE.Hehasextensiveknowledgeinanalogdesign,high-speeddigitaldesign,thermalandelectricalsimulation,andpackageassembly.

Farshad Ghahghahi graduated from Southwest Minnesota State University in Minnesota, in 1982 with a degree inMechanical Engineering. He has worked atTandem Computers in development of component and system packaging for 14years.Farshadhasspentthelast16yearsatLSICorporationinSanJose,CAinvariousEngineeringandManagementpositionsinPackageDesign.FarshadiscurrentlyDirectorofPackageDesignandCharacterizationatLSICorporation.Farshadholds17USpat-entsrelatedtocomponentpackagedesign,andhaspresentedpapersintheareaofPackageCo-DesignandnewDevelopments.

Tom GregorichisDirectorofPackageSignalIntegrityandThermalDesignOptimizationatBroadcom.PreviouslyMr.GregorichheldpositionsatMediaTek,wherehedevelopedoneofthefirstcommercialproductstousecorelessCu-pillartechnology,andQualcomm,whereheestablishedthePackageEngineeringDepartmentandfor12years ledthedevelopmentofQualcomm’s



small form-factor package portfolio including 0.4mm CSP, molded-laser POP and package-in-package. A large portion of theQualcommpackageportfoliois3D,andMr.GregorichestablishedtheTSVprogramatQualcommwithIMEC.PriortohispositionatQualcomm,Mr.GregorichworkedforMotorolaandhadassignmentsintheSemiconductorProductsSectorandCorporateResearch,bothintheUnitedStatesaswellasJapanandChina.Mr.GregorichhasaBSinMechanicalEngineeringfromBradleyUniversity,anMBAfromNorthernIllinoisUniversityandisaSeniorMemberofIEEE.

Brad Griffin is a product marketing director, High-Speed Solutions for SiP, IC Packaging, and PCB in the Cadence DesignSystemsSystemCustomICandPCB(CPG)Group.Hehasover22yearsofexperienceinEDAtechnologiesthatenablethedesignandanalysisofintegratedcircuitpackagingandprintedcircuitboardsystems.GriffinisagraduateofArizonaStateUniversity.

Ron Huemoeller isSrVicePresident,AdvancedProductDevelopment,atAmkorTechnology.RonjoinedAmkorin1995,andhasservedinseveralseniorlevelroleswithrespecttoProductManagement&Development.Currently,Ronisresponsibleforcorporatestrategy,businessdevelopmentanddeploymentofadvancedproductplatforms, includingTSV,PLFO,AdvancedFlipChip,embeddeddieandMEMSdevices.PriortojoiningAmkor,RonwasDirectorofEngineering/HeadEngineeratCrayComputerCorp.inColoradoSprings,leadingthestartupanddevelopmentofstateoftheartmotherboardsfortheworld’sfastestsuper-computer.Ronhasauthorednumerous technicalpublications,co-authored thechapteron‘AssemblyandTestAspectsofTSVTechnology’intheHandbookof3DStacking(McGrawHill)andhasbeengrantedmorethan75U.S.patents.RonholdsaB.S.inchemistryfromAugsburgCollegewithhighesthonors,aMBAinBusinessManagementfromArizonaStateUniversityandaMastersinTechnologyManagementfromtheUniversityofPhoenix.

Scott Jewlerisaco-founderofSVXR,aninnovativex-raymicroscopyequipmentcompanythatdesignsanddevelopsmeasure-mentanddefectdetectiontoolsforadvancedsemiconductorinterconnectincludingTSV,SiInterposers,finepitchchiptochipbondingandotherdemandingapplications.PriortofoundingSVXR,ScottheldexecutivepositionsatAmkor,STATSChipPAC,andPowertechTechnology,threeofthesixlargestmerchantsemiconductorassemblyandtestdesignandmanufacturingcompa-niesintheworld.ScottledanR&DorganizationatPTITaiwanthatinstalledonofthefirst3DICmanufacturinglinesinthewordwithcapabilitiesforTSVformation,waferandinterposerthinning,viaexpose,andthindietodieinterconnectstacking.PriortoPTI,ScottledproductorganizationsatbothSTTSandAMKRthatdirectedmorethanabilliondollarsayeareachinsemiconductorassemblyandtestbusiness.Scottalsohasexperienceleadingorganizationsresponsibleforpackagedesign,laminatesubstratedevelopment,productionplanning,sales,andcorporatestrategy.

Larry Kinsman received a BS in Ceramic Engineering from Iowa State University in 1984 and an MBA from George FoxUniversityin2008.HebeganhiscareerinthesemiconductorindustryatInmosCorporationin1985workingasamaterialsengi-neeronDRAMandSRAMpackaging.HejoinedMicronTechnologyin1986workingonhermeticpackagingforhighreliabilityanddefenseapplications.AtMicronheleadthepackageproductdevelopmenteffortsforleadsoverchip,ballgridarray,flipchip,andstackedwirebondedpackagingforDRAM,SRAM,FLASH,graphics,andRISCmicroprocessorproducts.HisfocuschangedtoCMOSimagerpackagingdesignandproductdevelopmentin2001whenMicronacquiredPhotobit.HewasaFellowatMicronfrom1997-2008.HeiscurrentlyaDistinguishedMember,TechnicalStaffatAptinaImagingwhereheleadsthepackagingdesignanddevelopmentgroup.Hecurrentlyholds202USpatents.

Raj N. Master joinedMicrosoftin2008.HeisGeneralManagerforICPackaging,SiliconOperations,QualityandReliabilityforallhardwareproductsinMicrosoft.TheseincludeXbox,Kinect,Surface,Accessories,Zune,Keyboard,Mouse,Webcam,andRoundtableetc.RajwasCorporateFellowandChiefTechnologististforAMDfrom1996-2008.HewasresponsibletosuccessfullytransfertheIBMC4/BGAtechnologiestoAMDandsetuphighvolumemanufacturinginPenangwhichhastodateproducedmorethen200millionflipchipassemblies.HeledtheOrganicpackagingdevelopmentandmanufacturingwhichisnowinhighvolumeproduction.Asapartofthatdevelopmenthewasresponsibletoselectanddeveloppackage,componentandmaterialsuppliersinUSAtosupporthighvolumeproduction.HeisalsoresponsibletoqualifyandprovidetechnicaldirectiontoAMDbumpingandprobingoperationsinDresden,Germany.HeledtheselectionandqualificationofUnitiveandbumpingfoundryandAmkorandASEasassemblyandtestfoundries.HeprovidestechnicalguidanceforequipmentandprocessesforC4/BGAmanufacturing lines in Suzhou, Penang and Singapore. He also provides technical expertise and guidance to product lines,Failureanalysis,andreliabilityandqualityorganizationswithinAMD.Hemanagesadvancedpackaginggroupinvolvedindevel-opingstrategicenablingtechnologies.HeisalsomanageroftheLeadFreeprogramofAMD.RajjoinedAMDafterspending21

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yearsatIBM.HewasSeniorTechnicalStaffmemberatIBMpriortojoiningAMD.HewasresponsibleforpackagingdevelopmentandmanufacturingasrelatedtoC4,BallGridArray,ColumnGridArray,BoardLevelReliabilityandMultiLayerCeramicSubstrate.Rajhas55U.S.patentsissuedtohimandhaspublishedover80technicalpapers.

Linda Matthew,SeniorAnalystatTechSearch,earnedherB.S.andM.S.degreesinMaterialsScienceandEngineeringfromMIT.ShewasadevelopmentengineerattheIBMWatsonResearchCenterinNewYorkforsevenyears,workingonleadingedgeflexpackagingtechnologies.ShejoinedTesserawhenithad19employeesandwasbasedinNewYork,andsubsequentlymovedwiththecompanytoSiliconValley.AtTessera,shewasresponsiblefirstfordevelopment,andlaterfortechnicalmarketing,oftheµBGA®.ShesubsequentlyworkedatnCHIP,doingtechnicalmarketingofMCMs,thenatLSILogic.Shehasnumerouspublica-tions,andholdssevenU.S.patentsandfourforeignpatents.ShehasservedaspresidentoftheSantaClara,CaliforniaIEEECPMTchapter,andservedforfouryearsonthecommitteeoftheInternationalElectronicsManufacturingTechnologysymposium.

Kenneth Potts isCadenceDesignSystemsGroupDirectorofStrategicMarketingforStrategicPlanning,andisresponsiblefor leading thecompany’s efforts incapturingandanalyzing thedata associated with all facets of themarketandbusinesslandscape.Heisalsoresponsibleforcreatingandmanagingallofthecorporateplanningprocesses.Priortore-joiningCadenceDesignSystemsinOctober2010,PottsservedasVirageLogic’sVicePresidentofAsiaandFoundrySalesresponsibleforleadingthecompany’ssaleseffortsintheAsiaregionandwithitsstrategicfoundrypartners.PreviouslyPottsservedasVicePresidentofProductMarketingwherehewasresponsibleforleadingthemarketingstrategyforthebreathofVirageLogic’sphysicalIPproductline.PriortojoiningVirageLogicinApril2005,PottsservedasVicePresidentofX-ArchitectureMarketingforCadenceDesignSystems.Inthisrole,hewasresponsibleforleadingtheproductspecification,marketintroduction,andproliferationofthekeyEDAtechnologyrequiredtoenabletheICindustrytodesignwithdiagonalwires.PottsholdsaBSEEfromMontanaStateUniversity

Herb Reiterfoundededa2asicConsulting,Inc.inthespringof2002,aftermorethan20yearsintechnical-andbusinessrolesatsemiconductor-andEDAcompanies,withtheintentiontofocusonincreasingthecooperationbetweenEDAsuppliersandsemiconductorvendors. In this rolehe introduced innovative ICdesign tools to themajorsemiconductorvendorsworldwideforseveralyears.HealsopromotedthebenefitsofSilicon-on-Insulatortechnology,especiallythetransitionfrompartially-tofully depleted SOI. As chair of the GSA’s 3D-ICWorking Group from early 2008 until end of 2011 and as SEMATECH businessdevelopmentconsultantduring2012,heexpandedhishorizonfurther,toinclude3D-ICs,packagingtechnology,semiconductormaterialsaswellasmanufacturing-andtestequipment.SinceJanuary2013HerbalsoworksonICdesign-andmanufacturingtopicstoenhanceFinFETyieldsaswellasacceleratefailureanalysisandproductionramp-upofthisimportantICtechnology.HerbearnedanMBAatSanJoseStateUniversityandMasterDegreesinBusinessandElectricalEngineeringattheUniversityandtheTechnicalCollegeinLinz/Austria,respectively.HerbtookalsomorethanfortyContinuingEducationcoursesatStanfordUniversityinrecentyears.

Dongkai Shangguan, Ph. D.iscurrentlytheFoundingCEOoftheNationalCenterforAdvancedPackaging(NCAPChina),inWuxi,China,focusingondevelopingandcommercializingadvancedmicroelectronicspackagingtechnologiesfortheindus-try.Concurrently,healsoserves asanExecutive Advisor andLaboratory Director at the Institute ofMicroelectronics,ChineseAcademyofSciences(IMECAS).Throughhis20+yearswiththeindustry,Dr.ShangguanworkedattheElectronicsOperationswithFordMotorCo./VisteonCorporationinvarioustechnicalandmanagementfunctions,andatFlextronicsasCorporateVicePresidentofAdvancedTechnology&EngineeringLeadership.DongkaireceivedhisBSdegreeinMechanicalEngineeringfromTsinghuaUniversity,China,Ph.D.degreeinMaterialsfromtheUniversityofOxford,U.K.,andMBAdegreefromtheSanJoseStateUniversity.Heconductedpost-doctoralteachingandresearchattheUniversityofCambridgeandTheUniversityofAlabama,andiscurrentlyaGuestProfessoratseveraluniversities.Dr.Shangguanhaspublishedtwobooksandauthored/co-authored250technicalpapersandarticles.Hehasover20patentsissued.Dr.ShangguanisanIEEEFellow,servesontheIEEECPMTSocietyBoardofGovernors，andisaDistinguishedLecturerfortheIEEECPMTSociety.Healsoservesontheeditorial/advisoryboardofseveral technical journals.Dongkaihasreceivedanumberof recognitionsforhiscontributions to the industry, including the“OutstandingSustainedTechnicalContributionAward”fromIEEECPMT,“LeadershipAward”from theSustainableElectronicsManufacturingWorkingGroup,“President’sAward”fromIPC,“TotalExcellenceinElectronicsManufacturingAward”fromtheSocietyofManufacturingEngineers(SME),andthe“SoldertecLead-FreeSolderingAward”.Healsoreceivedthe“DistinguishedMBAAlumnusAward”fromtheCollegeofBusiness,SanJoseStateUniversity.





Tom Strothmann managesWafer Level Product Business Development for STATS ChipPAC, including Fan-in, Fan-out, andultra-thin3DFan-outwaferlevelproducts.PriortojoiningSTATSChipPAC,TomwasVPofNewBusinessDevelopmentatFlipChipInternational. He has over 30 years of experience in semiconductor manufacturing, including extensive experience in waferprocessingandflipchipwaferlevelpackaging.

Dr. Hongxia SunobtainedherPhDdegreeincomputerandelectricalengineeringandhasworkedintheindustryformorethan14years.HercurrentpositioniswithProductandTechnologyMarketingteaminSTATSChipPACinthesemiconductorpack-agingindustry,mainlyfocusonwaferlevelproductstrategyandmanagement.Shehaspreviousexperiencesworkinginresearchlabsandconsultingcompaniesasresearchengineerandtechnicalconsultant,withExperimentalLaboratoryforInternetSystemsandApplicationsinCanada,WirelessCommunications&HighSpeedNetworksLaboratoryinMichigan,andTelecommunicationResearchCenterinArizona.Dr.Sunhas34publicationsinvariousconferencesandjournals.Shewaslocalorganizingcommitteemember for international conferencessuchas 16th InternationalWorldWideWeb Conference,ACM SIGMETRICS’05,etc.andhasbeenwithseveralIEEEtechnicalprogramcommitteessince2002,suchasIEEEGLOBALCOMandICCetc.Sheisalsoreviewerforinternationalconferences,journalsandacademicpublishers,suchasJohnWiley&Sons,JournalofNetworks,InternationalJournalofCommunicationSystems,ACMMobileHocetc.Herexpertiseincludesrequirementengineeringanalysis,performanceandstatisticalanalysis,packagingmodelingandsimulation,marketanalysisandproductmanagement.

Anthony TorzaBiographynotavailableattimeofprinting.

Paul Trio is the Senior Manager of Standards Operations at SEMI North America. He joined SEMI in 2002 as a StandardsEngineerwherehesupportedtechnicalcommitteesresponsiblefordevelopingfactoryautomationsoftware,microlithography,andautomated testequipmentstandards.HewasgraduatedwithaBSdegree inElectricalEngineeringfromSanJoseStateUniversityin2001.In2008,hereceivedadualMaster’sDegreeinSystemsEngineeringandBusinessAdministrationfromSanJoseState.InadditiontohisresponsibilitiesasStandardsoperationsmanager,hecontinuestosupportseveraltechnicalcom-mitteesincluding:environment,health,andsafety(EHS);three-dimensionalstackedintegratedcircuits(3DS-IC);high-brightnessLEDs;aswellastheNorthAmericaRegionalStandardsCommittee.

Suresh Upadhyayulahasover25yearsofManagementandPackageEngineeringexperienceinthevalleyinsuchdiverseindustriesascomponentASIC&memorypackaging,SMT,LCDtechnologyandpackagingandHDISubstratemanufacturing.InadditionhemanagedcomplexprojectsfornewproductsintroductionandOperationsforrelevantareasrelatedtopackagingsuchasquality&reliability,procurementandplanning.SureshhasMasters’degreesinChemicalEngineering,MaterialsScienceandMBAandattendedtheexecutiveMBAprogramatStanford.

Paul Werbanethwritesregularlyfor3DInCiteson2.5D/3DICtechnologyandcommercialization.Paul’sotherwritingactivi-tiesincludehisworkasaguesteditorforIEEETransactionsonSemiconductorManufacturing,thecontributedchapteronTSVEtching in the book“3D Integration forVLSI Systems,” and an extensive number of articles, papers, and blogs regarding thesemiconductorcapitalequipmentbusiness.PaulhasworkedasabusinessdevelopmentmanageratEVGroup;vicepresidentofmarketingandapplicationsatTegalCorporation;countrymanagerforTegalJapanInc.;seniorplasmaetchprocessengineerwithHitachiHighTechnologies;andasahands-onprocesssustainingengineerinanIntelwaferfab.Mr.WerbanethholdsaChemicalEngineeringdegreefromCornellUniversity,andrecentlycompletedstudiesinspokenJapaneseintheCornellSummerFALCONprogram.

Abe YeeiscurrentlySr.DirectorofAdvancedTechnologyandPackageDevelopmentatNVIDIACorporation.Hisresponsibilitiesincludepathfindingandbenchmarkingtechnologies,investigatingnewtechnologiesandsettingNVIDIA’spackagingroadmapforbothGPUandMobileproducts.From2000-2002hewasDirectorofEngineeringatSUNMicrosystemsresponsibleforSPARCprocessormanufacturingandreliability.HeservedasVPofOperationsatEquatorTechnologiesfrom1996-2000responsibleforallaspectsofdevelopment,NPIandproductionwithmanufacturingpartners.From1983-1996hewasatLSILogicCorp,whereheheldvariousseniormanagementrolesintechnologydevelopmentandoperations.Dr.YeereceivedhisBAinMathematicsandPhysicsandhisMAandPhDinPhysicsfromUCBerkeley.



PANEL ONE

PRODUCT DRIVERSModerator:

Joel Camarda Senior Director, CPV Receiver Manufacturing and Process Technology

Amonix Inc.

Productrequirementsdrivebothwaferprocessnodesandpackagetechnologyforward.Processor,ASIC,andFPGAadvances have driven the industry to nano-scale geometries and 300 mm wafer size for silicon, and to flip chipinterconnectand2.5/3Dtechnologiesforpackaging.Requirementsindevicefunctionality,power,speed,andmobil-ity continue to drive the packaging roadmap.We shall assemble a panel of product packaging experts, includingrepresentativesfromdifferentsemiconductordeviceandsystemmarkets,todiscusstheirpackagingroadmapsandthechallengestherein.

Panelists:

Mudasir AhmadCisco Systems Inc.

Farshad GhahghahiLSI Corporation

Larry KinsmanAptina Imaging Corporation

Tom StrothmannSTATSChipPAC, Inc.

Suresh UpadhyayulaSanDisk Corporation

Transcriber:

Paul Werbaneth3D InCites



PANEL TWO

MANUFACTURING DRIVERS IN SEMICONDUCTOR ROADMAPSModerator:

Jeffrey C. Demmin Director OEM Marketing

STATS ChipPAC, Inc.

It ismore important thanever thatcompaniesconsider their supplychainpartners --bothupstreamanddown-stream–whencreatingtheirroadmapsfortheirownbusinesses.Forexample,muchofthevalueofsemiconductorsis inminiaturizationandperformanceadvances,which isa functionofpackagingbutofmostvalue to theOEM.Acompanyinanyofthesethreesegments–OSAT,IC,andOEM–mustmakesurethatitsplansforthefutureareintegratedwiththoseofothercompaniesthroughoutthesupplychain.Thispaneldiscussionwillallowrepresenta-tivesofallofthesetypesofcompaniestodiscusshowtheyinteractwithsuppliers,customers,andtheircustomers’customerstohelptheirbusinessesmoveforwardwithcoordinatedroadmaps.

Panelists:

Richard CrispInvensas

Javier DeLaCruzeSilicon

Ron HuemoellerAmkor Technology Inc.

Raj N. MasterMicrosoft Corporation

Dongkai Shangguan, Ph.D.National Center for Advanced Packaging (NCAP China)

Transcriber:

Linda MatthewTechSearch International, Inc.

KEYNOTE

THE COLLABORATION ENGINE: ENABLING INNOVATION IN MICROELECTRONICS

Karen Savala President of SEMI Americas

SEMI

The most significant innovations in the microelectronic industry have been made possible as much by collabora-tion as they have by scientific breakthroughs and discoveries. Big innovations, especially in our industry, requiresomething more than scientific or engineering brilliance; they require successful collaborations among competi-tors,universitiesandresearchconsortiums,andgovernmentpolicymakers--anddeepintothesupplychaintohavemeaningfulglobalimpact.Thiscanbeseenmostclearlyinfrontendsemiconductorprocessing,butalsoinadjacentindustriessuchasLEDandsolar,andincreasinglyinsemiconductorpackagingandtestoperations.ThispresentationwillexaminetheCollaborationEngineinmicroelectronicsmanufacturing,withanupdateonthecriticalcollabora-tionchallengesfacing3DICtechnologiesandsemiconductortest.





PANEL THREE

PACKAGE ELECTRICAL PERFORMANCE REQUIREMENTS TO MEET EMERGING INTERCONNECT STANDARDS

Moderators:Ivor Barber

Senior Director of Package Technology DevelopmentXilinx Inc.

John Xie Director, Packaging Technology Research and Development

Altera Corporation

ThehistoricdutiesofsemiconductorpackagingaretoprotectthesiliconcircuitfromtheuseenvironmentandtoredistributetheinterconnectdensityofthesilicontothedensityofthePCB.Themodernpackagingengineerneedsto satisfy a plethora of non-mechanical requirements associated with high speed and high bandwidth signal-ing,power integrityandmultidiepackaging.Newconsiderationsareapplied tomaterialselectionsuchas lowerLossTangentdielectricorsmoothersurfaceconductorswhileotherdesignstrategiesminimizereflections,reduceinductance, control impedance and maintain Power Integrity. Package designers must receive design objectivesfromsystemarchitectsandIOdevelopers.Materialprovidersmustdevelopcosteffectivesubstratesolutionswhilecharacterizationspecialistsguidedesignmethodologyand judge theeffectivenessof thefinaldesign inmeetingendproductobjectives.Thepanelistswilldiscusstheimpactofemerginginterconnectstandardsonpackageper-formancerequirementsanddiscussthelevelofcollaborationbetweenusersandproviderswithintheirdiscipline.

Panelists:

Tom GregorichBroadcom Corporation

Brad GriffinCadence Design Systems

Anthony TorzaXilinx Inc.

Abe YeeNVIDIA Corporation

Transcriber:

Scott JewlerSVXC

PANEL FOUR

THE IMPORTANCE OF INDUSTRY ORGANIZATION COLLABORATIONModerator:

Phil Marcoux PPM Associates

ThecostofresearchanddevelopmentforcriticalnewtechnologyinareassuchasICpackagingandelectronicassem-blyhavestretchedbeyondthereachofmanycompanies.Thisimpactstheacceptanceofpromisingnewtechnologiesanddelaysimprovementsinperformanceandcost.Recenttechnologiessuchas3DaregettingR&Dhelpfromtheincreasinglycoordinatedeffortsofinternationalconsortia,andinfrastructuretoboostthesuccessfultechnologiesiscomingfromthemajorstandardsgroups.Thissessionwillconsistofapanelofrepresentativesfromtheseorgani-zationswhowillprovideanupdateontheirprogressanddiscusshowtheycanworktogethertofurtherassisttheindustryindevelopingandadoptingadvancedtechnologies.

Panelists:

CAMESTDieter Bergman, Director Technology Transfer, IPC

EDPSHerb Reiter, Founder, eda2asic

GSAKenneth Potts, Group Director of Strategic Planning, Cadence Design Systems

IPC Jasbir Bath, Principal Engineer, IPC

SEMI Paul Trio, Sr. Manager, North American Standard Operations, SEMI

Transcriber:

Hongxia SunSTATSChipPAC



About MEPTEC

MEPTEC is a trade association of semiconductor companies and professionals involvedinthemanufacturing,packaging,assemblingandtestingofintegratedcircuits.Sinceitsinceptionover30yearsago,MEPTEChasprovidedaforumforthesemiconductorindustrytolearnandexchangeideasthroughourmonthlyluncheons,conferences,andourquar-terlypublication,theMEPTECReport.WiththesupportofanAdvisoryBoardconsistingofindividualsfromallsegmentsoftheindustry,MEPTEChas,overtheyears,keptcurrentnotjustwithsemiconductorindustrydevelopments,buthasexpandeditsscopetocoverrelevantindustrysegmentssuchasMEMSandmedicalelectronics.FormoreinformationaboutMEPTECeventsandmembership,pleasevisitwww.meptec.org.

P.O.Box222,MedicinePark,OK73557Tel:650-714-1570Fax:1-866-424-0130

Email:[email protected]

Visit the MEPTEC website at www.meptec.org for more information.

Documents

SEMICONDUCTOR ROADMAPS SYMPOSIUM - MEPTEC - 2013 Roadmaps Proceedings.pdf · Ivor Barber, Senior Director of Package Technology Development, Xilinx Inc. John Xie, Director, Packaging