SEMI International Standards - Enable450 · SEMI® International Standards ... –Drafting: 7 Updated Mayl 17, ... Specification for 450 mm Cluster Module Interface: Mechanical Interface

SEMI® International Standards

Information on 450 mm Wafer Activities

Updated May 17, 2013

“Quick Stats” on 450 mm Activities

• Published Standards and Auxiliary Info: 15

• In the pipeline: 13

– Submitted for ballots: 6

– Drafting: 7

2 Updated Mayl 17, 2013


Published 450 mm Standards &

Auxiliary Information [1/2] Assembly & Packaging

• SEMI G88-0211- Specification for Tape Frame for 450 mm Wafer

• SEMI G92-0412 - Specification for Tape Frame Cassette for 450 mm Wafer

Physical Interfaces & Carriers (PIC)

• SEMI E154-0612 - Mechanical Interface Specification for 450 mm Load Port

• SEMI E156-0710 - Mechanical Specification for 450 mm AMHS Stocker to Transport Interface

• SEMI E158-0912 - Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling

• SEMI E159-0912 - Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450 mm Wafers

• SEMI E162-0912 - Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port

• SEMI AUX023-1211 - Overview Guide to SEMI Standard for 450 mm Wafers


Published 450 mm Standards &

Auxiliary Information [2/2] Silicon Wafers

• SEMI M1-0413 - Specification for Polished Single Crystal Silicon Wafers

• SEMI M49-0912 - Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations

• SEMI M52-0912 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations

• SEMI M62-0413 - Specifications for Silicon Epitaxial Wafers

• SEMI M74-1108 (Reapproved 0413) - Specification for 450 mm Diameter Mechanical Handling Polished Wafers

• SEMI M76-0710 - Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers

• SEMI M80-0812 - Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers

450 mm Wafer Documents in

Development – Silicon Wafer TC [1]


Doc. # Description Status

4812 New Standard: Guide for Flatness Measurement on 450 mm

Wafers

Drafting

5069 New Standard: Specification for 450 mm Wafer Shipping System Drafting

5070A Revision to SEMI M76, Specification for Developmental 450

mm Diameter Polished Single Crystal Silicon Wafers [Re: Wafer

Edge Design]

Drafting

5071 Revision to SEMI M76, Specification for Developmental 450

mm Diameter Polished Single Crystal Silicon Wafers [Re: Back

Surface Contamination and Defect Requirements]

Drafting


Development – Silicon Wafer TC [2]


Doc. # Description Status

5430A Revision to SEMI M73-0309, Test Methods for Extracting

Relevant Characteristics from Measured Wafer Edge Profiles

(To include 450 mm wafer edge profile parameters)

Submitted in Cycle

1-13 for review at

SEMICON West ’13

5450A Revision to SEMI M49-0912, Guide for Specifying Geometry

Measurement Systems for Silicon Wafers for the 130 nm to 22

nm Technology Generations (Extension to 16 nm)

Approved, pending

review by Audit and

Review SC


Development – PIC TC [1]


Document # Description Status

TBA Revision to Overview Guide to SEMI Standard for 450

mm Wafers

Drafting

5069 Specification for 450 mm Wafer Shipping System Drafting

5463 Revision to SEMI E83-1106, Specification for 300 mm

PGV Mechanical Docking Flange with title change to:

Specification for PGV Mechanical Docking Flange

[Update for 450 mm usage]

Approved by Audit

and Review SC. In

publication stage.

5464 Revision to SEMI E154-0612, Mechanical Interface

Specification for 450 mm Load Port

Approved, pending

review by Audit and

Review SC


Development – PIC TC [2]



5488A New Standard: Specification for 450 mm Cluster Module

Interface: Mechanical Interface and Transport Standard

Approved by Audit

and Review SC. In

publication stage.

5524 Line item revisions to SEMI E156-0710, Mechanical

Specification for 450 mm AMHS Stocker to Transport

Interface

Drafting


Development – Assembly & Packaging TC



4965C New Standard: Mechanical Interface

Specification for 450 mm Load Port for Tape

Frame Cassettes in the Backend Process

Approved, pending

review by Audit and

Review SC

SEMI Standards Task Forces (TFs) on 450 mm

• Silicon Wafer – International 450 mm Wafer TF

– International Advanced Surface Inspection TF

– International Advanced Wafer Geometry TF

– International Annealed Wafer TF

– International Epitaxial Wafer TF

– International Polished Wafer TF

• Physical Interfaces & Carriers – International 450 mm Physical Interfaces & Carriers TF

(450 mm IPIC TF)

– International 450 mm Shipping Box TF

– North America 450 mm Assembly Test Die Prep TF

– North America 450 mm Shipping Box TF

– International Process Module Physical Interface TF (IPPI-TF)

– 450 mm AMHS TF

• Assembly & Packaging – Japan 450 mm Assembly and Test Die Prep TF


New

New Task Forces (TFs)


International Process Module Physical Interface TF TF under PIC

• Formation Date – SEMICON West 2011 (July)

• Charter – The TF is formed to discuss standardization of physical interface and other

interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.

• Scope – The TF will assess the industry needs and necessary extent for standardization

of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.

– For the area that are agreed upon a need for standardization, the TF is expected to develop Standards that define physical interface and other interoperability related specification between the process chamber and the different modules (e.g. transfer module) of a cluster tool, which may be 450mm equivalent of or similar to E21.1 and E22.1 (So-called 300mm MESC Standards).


450 mm AMHS TF New TF under PIC

• Formation Date – Physical Interfaces & Carriers TC during Japan Standards Spring Meetings 2012

(April)

• Charter – For 300 mm fabs, different device makers (DMs) have different signal tower

specifications for AMHS devices. Sometimes, even one DM has different specifications per fab. Basically, discussions to fix specifications have been required on a case-by-case basis.

– DMs occasionally provide their signal tower specifications as common specifications. Most of them are prepared for production devices and not applicable to AMHS devices.

• Scope – Standardize Factory interface for 450mm AMHS devices to be delivered to

fabs, such as Signal Tower

Published 450 mm Standards & Auxiliary

Information


SEMI M1-0413

• Specification for Polished Single Crystal Silicon Wafers

– Single crystal silicon wafers are utilized for essentially all integrated circuits and many other semiconductor devices. To permit common processing equipment to be used in multiple device fabrication lines, it is essential for the wafer dimensions to be standardized.

– In addition, as technology advances to smaller and smaller dimensions for the elements of high-density integrated circuits, it has become of interest to standardize additional properties of the wafers.

– This Specification provides the essential dimensional and certain other common characteristics of silicon wafers, including polished wafers as well as substrates for epitaxial and certain other kinds of silicon wafers.

– Responsible TF:

• International Polished Wafer TF under the Silicon Wafer Committee


SEMI M49-0912

• Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations

– This guide provides recommendations for specifying measurement systems for geometry and flatness of silicon wafers of the 130, 90, 65, 45, 32 and 22 nm technology generation as anticipated by the International Technology Roadmap for Semiconductors (ITRS) and in the forecasts of the major manufacturers of semiconductor devices. Wafer parameters as defined by SEMI M1, SEMI M8, SEMI M11, SEMI M24, or SEMI M38 are specified by customers of silicon wafer suppliers and are usually part of Certificates of Compliance. Suppliers of silicon wafers and their customers might measure these parameters using equipment provided by different manufacturers of such equipment or using different generations of equipment of one supplier. Agreement on basic features and capability of such measurement systems improves data exchange and interpretation of data as well as procurement of appropriate measurement systems.

– Responsible TF:

• International Advanced Wafer Geometry TF under the Silicon Wafer Committee


SEMI M52-0912

• Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations – This guide provides recommendations for specifying Scanning Surface

Inspection Systems (SSIS) for the 130, 90, 65, 45, 32, 22, 16, and 11 nm technology generations. The number and size of localized light scatterers (LLS) on silicon wafers are specified by customers of silicon wafer suppliers and are usually part of Certificates of Compliance. Suppliers of silicon wafers and their customers might measure these parameters using measurement systems provided by different manufacturers of such systems or using different generations of measurement systems from one supplier. Therefore, standardization of various aspects of such measurement systems both improves data exchange and data interpretation and aids in procurement of appropriate measurement systems.

– Responsible TF:

• International Advanced Surface Inspection TF under the Silicon Wafer Committee


SEMI M62-0413

• Specifications for Silicon Epitaxial Wafers – NOTICE: This Standard replaced SEMI M2 and SEMI M11 in 2005.

– Epitaxial silicon wafers are utilized for many integrated circuits and discrete semiconductor devices. To permit common processing equipment to be used in multiple device fabrication lines, it is essential for the dimensions of epitaxial wafers to be standardized.

– In addition, as technology advances to smaller and smaller dimensions for the elements of high density integrated circuits, it has become of interest to standardize additional properties of epitaxial wafers.

– Responsible TF:

• International Epitaxial Wafer TF under the Silicon Wafer Committee


SEMI M74-1108 (Reapproved 0413)

• Specification for 450 mm Diameter Mechanical Handling Polished Wafers

– This document specifies 450 mm diameter mechanical handling wafers intended for use in research, development and early design investigation of 450 mm semiconductor equipment such as 450 mm wafers, carriers, load ports, AMHS, and robotics.

– This specification covers dimensional requirements for 450 mm diameter polished silicon wafers. This specification is intended to address a short-term need for handling wafers. It is not intended to specify wafers used in process development or for technology-specific circuit-quality applications. This document should be superseded by a process development wafer specification, a prime wafer specification and technology-specific guidelines for circuit-quality wafers.

– A complete purchase specification may require that additional physical properties be specified along with test methods for determining their magnitude (see § 5).

– Wafers meeting the basic specification requirements herein are suitable for use as “mechanical handling” wafers for equipment set-up and robotic handling applications.

– For referee purposes, SI (System International, commonly called metric) units shall be used.

– Responsible TF:

• International 450 mm Wafer TF under the Silicon Wafer Committee


SEMI M76-0710

• Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers

– The developmental wafers covered by this specification are intended for use in research and development of process and metrology equipment and fabrication processes required for manufacturing high-density integrated circuits on 450 mm diameter single crystal silicon wafers. They can also be used to establish the techniques and metrology necessary to support a dimensional specification for 450 mm diameter circuit-quality (prime) wafers.

– This specification covers dimensional and crystallographic orientation requirements for 450 mm diameter, polished single crystal silicon wafers needed in development. This document should be superseded by dimensional specification and technology-specific guidelines for circuit-quality wafers.

– A complete purchase specification requires that additional physical properties be specified along with test methods for determining their magnitude. If a test instrument is not available, the acceptance criteria should be agreed upon between supplier and customer.

– This specification also contains guidance to assist equipment manufacturers and others to specify wafers for use in developing selected process equipment and unit processes.

– The specification for 450 mm diameter mechanical handling wafers used in development of 450 mm semiconductor equipment such as 450 mm wafers carriers, load ports, Automated Materials Handling System (AMHS), and robotics has already been published as SEMI M74.

– This specification is not intended to be a product wafer specification.

– Responsible TF:

• International 450 mm Wafer TF under the Silicon Wafer Committee


SEMI M80-0812

• Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers – This Standard specifies the front-opening shipping box

(FOSB) used to ship 450 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

– Responsible TF: • International 450 mm Shipping Box TF under the Silicon Wafer

Committee


SEMI E154-0612

• Mechanical Interface Specification for 450 mm Load Port

– The purpose of this document is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment, where a 450 FOUP can be loaded and unloaded. The intention of this document is to define a set of requirement and features to enable interoperability of load ports and carriers without limiting innovative solutions.

– Responsible TF:

• 450 mm IPIC TF under PIC Committee


SEMI E156-0710

• Mechanical Specification for 450 mm AMHS Stocker to Transport Interface – This specification defines the dimensional requirements for the load ports of

450 FOUP stockers. It is intended to provide the required features and dimensions that define the physical interfaces between different types of transport equipment and stockers and to facilitate the use of different automated transport systems in order to meet the different material handling requirements found throughout the factory. This is done by defining four options of interfaces that both the stocker and transport system must comply with.

– Options defined are as follows: Option A: Active transport (e.g., active OHS) loads a FOUP horizontally to an internal stocker load port. Option B: Active Transport (e.g., OHT) picks or places a FOUP vertically to/from an external stocker load port. Option C: Passive Transport (e.g., passive OHS or conveyor) carries a FOUP to/from stocker port location. Option D: Passive Transport (e.g., conveyor) carries a FOUP to/from an internal stocker port location.

– Responsible TF: • 450 mm IPIC TF under PIC Committee


SEMI E158-0912

• Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling

– The purpose of this document is to establish basic physical dimensions for the carriers intended to be used to transport and store 450 mm wafers, as specified by SEMI M74, within semiconductor device manufacturing facilities.

– This document is intended to define the reference planes for the dimensions of the carriers and the load port features that will interact with the carriers.

– This document is intended to define a set of requirements to ensure interoperability of load ports and carriers without limiting innovative solutions.

– Responsible TF: • 450 mm IPIC TF under PIC Committee


SEMI E159-0912

• Mechanical Specification for Multi Application Carrier (MAC)

Used to Transport and Ship 450 mm Wafers

– The purpose of this document is to establish basic physical dimensions for the

carriers intended to be used to transport and ship 450 mm wafers, as specified

by SEMI M74.

– This document is intended to define the reference planes for the dimensions

of the carriers and the load port features that will interact with the carriers.

– This document is intended to define a set of requirements to ensure

interoperability of load ports and carriers without limiting innovative solutions.

– Responsible TF:

• NA 450 mm Shipping Box TF under PIC Committee


SEMI E162-0912

• Mechanical Interface Specification for 450 mm Front-Opening

Shipping Box Load Port

– The purpose of this Document is to define the basic interface

dimensions of a load port on the semiconductor manufacturing

equipment, where a 450 front-opening shipping box (FOSB) can be

loaded and unloaded. The intention of this Document is to define a set

of requirement and features to enable interoperability of load ports

and carriers without limiting innovative solutions.

– Responsible TF:



SEMI AUX023-1211

• Overview Guide to SEMI Standard for 450 mm Wafers

– This auxiliary information document is intended to help users and

suppliers of 450 mm carriers and production equipment to understand

the complex interdependence among the SEMI standards for 450 mm

Wafer, Carrier and physical interface and to determine which

standards apply to which products.

– Responsible TF:



SEMI G88-0211

• Specification for Tape Frame for 450 mm Wafer – The purpose of this document is to standardize the

specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process and also used for shipping and handling.

– Responsible TF • Japan 450 mm Assembly and Test Die Preparation TF under

Assembly & Packaging Committee


SEMI G92-0412

• Specification for Tape Frame Cassette for 450 mm Wafer

– The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.

– Responsible TF: • Japan 450mm Assembly and Test Die Preparation Task Force

450 mm Documents in Development

Document 4812

• New Standard: Guide for Flatness Measurement on 450 mm Wafers – Rationale:

• The characterization of 450mm wafers is one prerequisite for developing these wafers and for qualification of the material for IC processes. One of the most challenging requirements to the new material is the wafer flatness therefore the industry needs and has to agree as soon as possible how flatness has to be measured on 450mm. Within the Advanced wafer geometry taskforce a guide for flatness measurement of 450mm wafers is planned to be developed. Changing from 300mm to 450 mm wafer may result in a methodology which differs significantly from that for 300mm .

– Scope: • 450mm wafer development, specification of 450mm wafers

– Responsible TF: • International Advanced Wafer Geometry Task Force


Document 4965C

• New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process – Rationale:

• Equipment suppliers and IC makers have identified a need to develop standards for die prep factory interfaces to support 450mm equipment development and prototyping.

– Scope: • Standardize the dicing process, die bonding process and the load port

specification of the cassette for 450 mm frame (used for shipping) 1. The frame cassette of manufacturing unit and the mechanical interface

2. Mechanical interface with manufacturing unit and handling device such as PGV

3. Other

– Responsible TF • Japan 450 mm Assembly & Test Die Prep. TF


Document 5069

• New Standard: Specification for 450 mm Wafer Shipping System – Rationale:

• 450 mm wafers are expected to be used for the next generation Fab. The standards for 450 mm wafer specification (mechanical and developmental wafer) and for 450 mm in-fab carriers & Load port have been approved at technical committees and some are published already. Yellow ballot for 450 mm Shipping Box Specification document 4760 was reviewed at SEMICON West 2010, and re-ballot document 4760 A is to be issued for cycle 7, 2010 by solving remaining issues. The development of 450mm Wafer Shipping System Standard is requested as a next step.

– Scope: • The materials, dimensions and necessary items related to 450 mm wafer shipping system, such

as wafer shipping boxes, bags, labels, cushions, secondary containers, pallets, and shipping documentation.

• Review 300 mm wafer shipping system SEMI M45, and define appropriate shipping system for 450 mm wafer.

• Standardization items such as – Drop Height Assumption , Wafer Shipping Box Bagging System

– Wafer Shipping Box and Bag Labeling, Secondary Container Labeling

– Secondary Container, Cushions, Pallet

– Shipment Documentation , Transportation Logistics

– Responsible TF • International 450 mm Shipping Box TF


Document 5070A

• Revision to SEMI M76-0710, Specification for

Developmental 450 mm Diameter Polished

Single Crystal Silicon Wafers

– Rationale:

• An update of M76 to improve the edge shape design.

– Scope:

• Improve M76 with better edge shape definition.

– Responsible TF

• International 450 mm Wafer TF


Document 5071

• Revision to M76, Specification for developmental 450 mm diameter polished single crystal silicon wafers

– Rationale: • Industry needs guidance with respect to handling of 450mm wafers

before arriving at IC manufacturers. For being able to develop the appropriate handlings concept M76 should contain information about wafer back surface contamination and defectively requirements.

– Scope: • Technology generation 32nm and higher, Wafer specification,

450mm activities

– Responsible TF • International 450 mm Wafer TF


Document 5430A

• Revision to SEMI M73-0309, Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles (To include 450 mm wafer edge profile parameters) – Rationale:

• SEMI M73 does not explicitly refer to the Si wafer diameter, but it was written with respect to 300 mm wafers. It needs to be updated so that it includes also 450 mm wafers, in particular the values for apex length in Tab. 3 of M73.

– Scope:

Modify SEMI M73, Tab. 3 and elsewhere in the document where necessary, so that it includes 450 mm wafers. Change text correspondingly where needed.

Responsible TF:

• International Advanced Wafer Geometry TF


Document 5450A

• Revision to SEMI M49-0912, Guide for Specifying Geometry Measurement Systems for

Silicon Wafers for the 130 nm to 22 nm Technology Generations with Title Change to:

Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to

16 nm Technology Generations

– Rationale:

• Along with progress for further wafer fabrication technology, the market needs to add the data for advanced

technology. The current SEMI Standard M49 defines up to 22nm technical generation and need to add next

generation technology of 16nm. The market already have consensus HVM of next generation will be started

within several years.

– Scope: • This revision includes all necessary parameter data to be applied to requirements of 16nm technical generation

• Title change to “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130

nm TO 16 nm”

• Add Level3 Variability, Matching Tolerance and Bias for 16nm technology generation in Table 4 also add 16nm Scaling models

in Table A!-2

• Change 200mm usage for 32nm and 22nm Technical generation at Table 4.1.1

• Change 450mm usage for 130nm, 90nm, 65nm and 45nm Technical generation at Table 3.1.3 and Table 4.1.3

• Add SEMI M80 in 3.1 SEMI Standards and Table 1-1.7 Type of Cassettes as references.

• Clean up erroneous items and add information at Reference Wafer Properties in table 3, 4 and 5.

– Responsible TF: – International Advanced Wafer Geometry Task Force


Document 5463

• Revision to SEMI E83-1106, Specification for 300 mm PGV Mechanical Docking Flange with title change to: Specification for PGV Mechanical Docking Flange

– Rationale:

• Although ISMI Guidelines call for use of an E83 compliant PGV docking flange for 450mm, the actual E83 standard is titled “Specification for 300mm PGV mechanical docking flange”. There is a need to update to the standard both to align the standard with ISMI guidelines by making E83 valid for multiple wafer sizes and load port types.

– Scope: • Wording changes so that, per scope of the standard, the PGV flange described

in the standard can be used for both 300mm and 450mm wafer sizes. Include D16 dimensions as needed to specify the position of the flange for 450mm load ports (FOUP and tape frame). Scope does not include changes to the dimensions of the docking flange itself.

– Responsible TF • International 450 mm Physical Interfaces & Carriers TF


Document 5464

• Revision to SEMI E154-0612: Mechanical Interface Specification for 450mm Load Port – Rationale:

• MAC (E159) is the same specifications with respect to interoperability interfaces with 450 FOUP (E158). Therefore, we want to add the MAC term in the documentation of FOUP-LP (E154).

– Scope: • Add the description of the Mechanical Specification for Multi Application

Carrier (MAC) into sections 1 through 4. This scope is limited to inclusion of MAC to the document only and no other technical changes.

– Responsible TF • International 450 mm Physical Interfaces & Carriers TF


Document 5488A

• New Standard: Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard

– Rationale:

• Standardization of transport module/process module interface is beneficial for both process equipment supplier and users as it can shorten the period between chamber development stage and volume production tool qualification stage.

• The standard to be developed should ensure minimum necessary level of physical connectivity to the transport module part of a process tool for any process module without any significant design change when the process module is incorporated into the process tool.

– Scope: • The proposed document will be a Subordinate Standard to E21, and is expected to provide 450 mm

compatible values for all the parameters defined in SEMI E21.

• The proposed document covers tool/chamber physical interface and interoperability related specifications for the 450mm single wafer vacuum process tools.

• Wafer transport plane specifications

• Transport maximum reach

• Wafer + arm Clearance specifications at the interface plane

• Connectivity specifications at the interface plane

– Responsible TF • International Process Module Physical Interface TF (IPPI-TF)


Document 5524

• Line item revisions to SEMI E156-0710, Mechanical Specification for 450 mm AMHS Stocker to Transport Interface – Rationale:

• Key definitions for the 450 mm standards are not aligned with one another

– Scope: • Revise SEMI E156 Acronyms to add KCP and Terminology to

change KC pin to KCP. Revise the definition for facial plane to agree with that in the other 450mm standards. The location of the FP is not changed by this revision. These changes align SEMI E156 with SEMI E159 and SEMI M80.

– Responsible TF • International 450 mm Physical Interfaces & Carriers



Standards Staff Contacts for

PIC, Silicon Wafer, and Assembly & Packaging

Japan (PIC, Silicon Wafer)

Hirofumi Kanno

[email protected]

81.3.3222.5862

(Assembly & Packaging)

Naoko Tejima

[email protected]

81.3.3222.5804

Europe Yann Guillou

[email protected]

33.4.3878.3971

North America (PIC)

Michael Tran

[email protected]

408.943.7019

(Silicon Wafer)

Kevin Nguyen

[email protected]

408.943.7997