Section 2. Oscillatorweb.aeromech.usyd.edu.au/MTRX3700/Course_Material/reference/chips... · default oscillator (OSC1), and additional oscillators may be available, such as the Timer1

Section 2. Oscillator

Oscillato

r

2
HIGHLIGHTS
This section of the manual contains the following major topics:

2.1 Introduction .................................................................................................................... 2-2

2.2 Control Register ............................................................................................................. 2-3

2.3 Oscillator Configurations................................................................................................ 2-4

2.4 Crystal Oscillators/Ceramic Resonators ........................................................................ 2-6

2.5 External RC Oscillator.................................................................................................. 2-15

2.6 HS4 (HS oscillator with 4xPLL enabled) ...................................................................... 2-18

2.7 Switching to Low Power Clock Source......................................................................... 2-19

2.8 Effects of Sleep Mode on the On-Chip Oscillator......................................................... 2-23

2.9 Effects of Device Reset on the On-Chip Oscillator ...................................................... 2-23

2.10 Design Tips .................................................................................................................. 2-24

2.11 Related Application Notes............................................................................................ 2-25

2.12 Revision History ........................................................................................................... 2-26

2000 Microchip Technology Inc. DS39502A-page 2-1

PIC18C Reference Manual

2.1 Introduction

The device system clock is required for the device to execute instructions and for the peripheralsto function. Four device system clock periods (TSCLK) generate one internal instruction clockcycle (TCY).

The device system clock (TSCLK) is derived from an external system clock. This external systemclock can be generated in one of eight different oscillator modes. The device configuration bitsselect the oscillator mode. Device configuration bits are nonvolatile memory locations and theoperating mode is determined by the value written during device programming. The oscillatormodes are:

• EC External Clock

• ECIO External Clock with I/O pin enabled

• LP Low Frequency (Power) Crystal

• XT Crystal/Resonator

• HS High Speed Crystal/Resonator

• RC External Resistor/Capacitor

• RCIO External Resistor/Capacitor with I/O pin enabled

• HS4 High Speed Crystal/Resonator with 4x frequency PLL multiplier enabled

Multiple oscillator circuits can be implemented on an Enhanced Architecture device. There is thedefault oscillator (OSC1), and additional oscillators may be available, such as the Timer1 oscil-lator. Software may allow these auxiliary oscillators to be switched in as the device oscillator. TheTimer1 oscillator is a low frequency (low power) oscillator that is designed to be operated at32kHz. Figure2-1 shows a block diagram of the oscillator options.

The output signal of the Timer1 oscillator circuitry is a low frequency (power) clock source (TT1P).The source for the device system clock can be switched from the default clock (TSCLK) to the32kHz-clock low power clock source (TT1P) under software control. Switching to the 32kHz lowfrequency (power) clock source from any of the eight default clock sources may allow powersaving.

These oscillator options are made available to allow a single device type the flexibility to fit appli-cations with different oscillator requirements. The RC oscillator option saves system cost, whilethe LP crystal option saves power. The HS4 option allows frequency of incoming crystal oscillatorsignal to be multiplied by four for higher internal clock frequency. This is useful for customers whoare concerned with EMI due to high frequency crystals. The device configuration bits are usedto select these various options. For more details on the device configuration bits, see the “DeviceConfiguration Bits” section.

Figure 2-1: Device Clock Sources

PIC18CXXX

TOSC

4 x PLL

TT1P

TSCLK

ClockSource

MU

X

TOSC/4

Timer1 Oscillator

T1OSCENEnableOscillator

T1OSO

T1OSI

Clock Source optionfor other modules

OSC1

OSC2

Sleep

Main Oscillator

(FOSC2:FOSC0)

DS39502A-page 2-2 2000 Microchip Technology Inc.

Section 2. OscillatorO

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2

2.2 Control Register

Register 2-1 shows the OSCCON register which contains the control bit to allow switching of thesystem clock between the primary oscillator and the Timer1 oscillator.

Register 2-1: OSCCON Register

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-1

— — — — — — — SCS

bit 7 bit 0

bit 7-1 Unimplemented: Read as '0'

bit 0 SCS: System Clock Switch bitwhen OSCSEN configuration bit = ’0’ and T1OSCEN bit is set:1 = Switch to Timer1 Oscillator/Clock pin0 = Use primary Oscillator/Clock input pin

when OSCSEN and T1OSCEN are in other states:bit is forced clear

Legend

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR reset ’1’ = Bit is set ’0’ = Bit is cleared x = Bit is unknown

Note: The Timer1 oscillator must be enabled to switch the system clock source. TheTimer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 control register(T1CON). If the Timer1 oscillator is not enabled, then any write to the SCS bit will beignored (SCS bit forced cleared) and the main oscillator will continue to be the sys-tem clock source.



2.3 Oscillator Configurations

The oscillator selection is configured at time of device programming. The user can program upto three device configuration bits (FOSC2:FOSC0) to select one of eight modes.

2.3.1 Oscillator Types

PIC18CXXX devices can have up to eight different oscillator modes for the default clock source(TSCLK). These eight modes are:

• EC External Clock

• ECIO External Clock with IO pin enabled

• LP Low Frequency (Power) Crystal

• XT Crystal/Resonator

• HS High Speed Crystal/Resonator

• RC External Resistor/Capacitor

• RCIO External Resistor/Capacitor with IO pin enabled

• HS4 High Speed Crystal/Resonator with 4x frequency PLL multiplier enabled

The main difference between the LP, XT and HS modes is the gain of the internal inverter of theoscillator circuit, which allows the different frequency ranges. Table 2-1 gives information to aidin selecting an oscillator mode. In general, use the oscillator option with the lowest possible gainthat still meets specifications. This will result in lower dynamic currents (IDD). The frequencyrange of each oscillator mode is the recommended frequency cutoff, but the selection of a differ-ent gain mode is acceptable as long as a thorough validation is performed (voltage, temperature,component variations (resistor, capacitor, and internal microcontroller oscillator circuitry).

Switching the system clock source to the alternate clock source is controlled by the applicationsoftware. The user can switch from any of the eight default clock sources. This is done by settingthe SCS (System Clock Switch) bit in the OSCCON register. The requirements for switching tothe alternate clock source are:

• Timer1 clock oscillator must be enabled (T1OSCEN is set ’1’).• The OSCEN configuration bit must be cleared (‘0’).



scillator

2

Table 2-1: Selecting the Oscillator Mode for Devices

FOSC2:FOSC0Configuration

Bits

OSCMode

OSCFeedbackInverter

Gain

OSC2/CLKOFunction

Comment

1 1 1 RCIO Zero Gain.Deviceturned off tosave current.

I/O Least expensive solution for device oscillation(only an external resistor and capacitor isrequired).Most variation in time-base. Device’s defaultmode. OSC2/CLKO is configured as generalpurpose I/O pin. This pin is multiplexed with oneof the device’s PORT pins.

1 1 0 HS4 High Gain — Highest frequency application.This works with the HS oscillator circuit modeand phase lock loop. This mode consumes themost current. The internal phase lock loopcircuit multiplies the external oscillator fre-quency by 4.

1 0 1 ECIO Zero Gain.Deviceturned off tosave current.

I/O External clock mode with OSC2/CLKO config-ured as general purpose I/O pin. This pin is mul-tiplexed with one of the device’s PORT pins.OSC1/CLKI is hi-impedance and can be drivenby CMOS drivers.

1 0 0 EC Zero Gain.Deviceturned off tosave current.

Clock outwith oscillatorfrequencydivided by 4.

External clock mode with OSC2/CLKO config-ured with oscillator frequency divided by 4.OSC1/CLKI is hi-impedance and can be drivenby CMOS drivers.

0 1 1 RC Zero Gain.Deviceturned off tosave current.

Clock outwith oscillatorfrequencydivided by 4.

Inexpensive solution for device oscillation.Most variation in timebase.CLKOUT is enabled on OSC2/CLKO with oscil-lator frequency divided by 4.

0 1 0 HS High Gain — High frequency application.Oscillator circuit’s mode consumes the mostcurrent of the three crystal modes.

0 0 1 XT Medium Gain — Standard crystal/resonator frequency.

0 0 0 LP Low Gain — Low power/frequency applications.Oscillator circuit’s mode consumes the leastcurrent of the three crystal modes.



2.4 Crystal Oscillators/Ceramic Resonators

In XT, LP, HS and HS4 modes, a crystal or ceramic resonator is connected to the OSC1 andOSC2 pins to establish oscillation (Figure2-2). The PIC18CXXX oscillator design requires theuse of a parallel cut crystal. Using a series cut crystal may give a frequency out of the crystalmanufacturer’s specifications. When in EC and ECIO mode, the device can have an externalclock source drive the OSC1 pin (Figure2-3).

See Table 3-1 in the “Reset” section for time-out delays associated with crystal oscillators.

Figure 2-2: Crystal or Ceramic Resonator Operation (HS4, HS, XT or LP OscillatorMode)

Figure 2-3: External Clock Input Operation (EC or ECIO Oscillator Modes)

C1 (3)

C2 (3)

XTAL

OSC2

RS (1)

OSC1

RF (2) SLEEP

To internal logic

PIC18CXXX

Note 1: A series resistor, Rs, may be required for AT strip cut crystals.2: The internal feedback resistor, RF, is typically in the range of 2 to 10 MΩ.3: See Table 2-2 and 2-3 for example values of C1 and C2.

CLKI

CLKOOpen

Clock fromext. system PIC18CXXX



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2.4.1 Oscillator/Resonator Start-up

As the device voltage increases from VSS, the oscillator will start its oscillations. The timerequired for the oscillator to start oscillating depends on many factors. These include:

• Crystal/resonator frequency• Capacitor values used (C1 and C2 in Figure2-2)• Device VDD rise time• System temperature• Series resistor value and type if used (Rs in Figure2-2)• Oscillator mode selection of device (selects the gain of the internal oscillator inverter)• Crystal quality• Oscillator circuit layout• System noise

Figure2-4 graphs an example oscillator/resonator start-up. The peak-to-peak voltage of the oscil-lator waveform can be quite low (less than 50% of device VDD), when the waveform is centeredat VDD/2 (refer to parameters D033 and D043 in the “Electrical Specifications” section).

Figure 2-4: Example Oscillator/Resonator Start-up Characteristics

Voltage

Crystal Start-up TimeTime

Device VDD

Maximum VDD of System

0V



2.4.2 Component Selection

Figure2-2 is a diagram of the device’s crystal or ceramic resonator circuitry. The resistance forthe feedback resistor, RF, is typically within the 2 to 10 MΩ range. This varies with device voltage,temperature and process variations. A series resistor, Rs, may be required if an AT strip cut crys-tal is used. Be sure to include the device’s operating voltage and the device’s manufacturing pro-cess when determining resistor requirements. As you can see in Figure2-2, the connection to thedevice’s internal logic is device dependent. See the applicable data sheet for device specifics.The typical values of capacitors (C1, C2) are given in Table 2-2 and Table 2-3. Each device’s datasheet will give the specific values that we test to at Microchip.

Table 2-2: Example Capacitor Selection for Ceramic Resonators

Ranges tested:

Mode Frequency C1 (1) C2 (1)

XT 455 kHz2.0 MHz4.0 MHz

TBDTBDTBD

TBDTBDTBD

HS 8.0 MHz16.0 MHz

TBDTBD

TBDTBD

Resonators used:

Frequency Manufacturer Tolerance

455 kHz Panasonic EFO-A455K04B ±0.3%

2.0 MHz Murata Erie CSA2.00MG ±0.5%

4.0 MHz Murata Erie CSA4.00MG ±0.5%

8.0 MHz Murata Erie CSA8.00MT ±0.5%

16.0 MHz Murata Erie CSA16.00MX ±0.5%

Note 1: Recommended values of C1 and C2 are identical to the ranges tested above.Higher capacitance increases the stability of the oscillator but also increases thestart-up time. These values are for design guidance only. Since each resonator hasits own characteristics, the user should consult the resonator manufacturer for appro-priate values of external components or verify oscillator performance.

2: All resonators tested required external capacitors.



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Table 2-3: Example Capacitor Selection for Crystal Oscillator

Mode Frequency C1 (1) C2 (1)

LP 32 kHz200 kHz

TBDTBD

TBDTBD

XT 200 kHz1 MHz4 MHz

TBDTBDTBD

TBDTBDTBD

HS 4.0 MHz8 MHz20 MHz25 MHz

TBDTBDTBDTBD

TBDTBDTBDTBD

Crystals used:

Frequency Manufacturer Tolerance

32.0 kHz Epson C-001R32.768K-A ± 20 PPM

200 kHz STD XTL 200.000 kHz ± 20 PPM

1.0 MHz ECS ECS-10-13-1 ± 50 PPM

4.0 MHz ECS ECS-40-20-1 ± 50 PPM

8.0 MHz EPSON CA-301 8.000 M-C ± 30 PPM

20.0 MHz EPSON CA-301 20.000 M-C ± 30 PPM

Note 1: Higher capacitance increases the stability of the oscillator, but also increases thestart-up time. These values are for design guidance only. A series resistor, Rs, maybe required in HS mode, as well as XT mode, to avoid overdriving crystals with lowdrive level specification. Since each crystal has its own characteristics, the usershould consult the crystal manufacturer for appropriate values of external compo-nents or verify oscillator performance.



2.4.3 Tuning the Oscillator Circuit

Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;depending on the part and version ordered) and external components (crystals, capacitors,...) ofvarying quality and manufacture, validation of operation needs to be performed to ensure that thecomponent selection will comply with the requirements of the application.

There are many factors that go into the selection and arrangement of these external components.These factors include:

• amplifier gain

• desired frequency

• resonant frequency(s) of the crystal

• temperature of operation

• supply voltage range

• start-up time

• stability

• crystal life

• power consumption

• simplification of the circuit

• use of standard components

• combination which results in fewest components



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2.4.3.1 Determining Best Values for Crystals, Clock Mode, C1, C2, and Rs

The best method for selecting components is to apply a little knowledge and a lot of trial, mea-surement, and testing.

Crystals are usually selected by their parallel resonant frequency only, however other parame-ters may be important to your design, such as temperature or frequency tolerance. ApplicationNote AN588 is an excellent reference if you would like to know more about crystal operation andtheir ordering information.

The PICmicro’s internal oscillator circuit is a parallel oscillator circuit, which requires that a par-allel resonant crystal be selected. The load capacitance is usually specified in the 20 pF to 32 pFrange. The crystal will oscillate closest to the desired frequency with capacitance in this range. Itmay be necessary to sometimes alter these values a bit, as described later, in order to achieveother benefits.

Clock mode is primarily chosen by using the FOSC parameter specification (parameter 1A) in thedevice data sheet, based on frequency. Clock modes (except RC and EC) are simply gain selec-tions; lower gain for lower frequencies, higher gain for higher frequencies. It is possible to selecta higher or lower gain, if desired, based on the specific needs of the oscillator circuit.

C1 and C2 should also be initially selected based on the load capacitance as suggested by thecrystal manufacturer and the tables supplied in the device data sheet. The values given in thedevice data sheet can only be used as a starting point, since the crystal manufacturer, supplyvoltage, and other factors already mentioned may cause your circuit to differ from the one usedin the factory characterization process.

Ideally, the capacitance is chosen so that it will oscillate at the highest temperature and lowestVDD that the circuit will be expected to perform under. High temperature and low VDD both havea limiting effect on the loop gain, such that if the circuit functions at these extremes, the designercan be more assured of proper operation at other temperatures and supply voltage combinations.The output sine wave should not be clipped in the highest gain environment (highest VDD andlowest temperature) and the sine output amplitude should be great enough in the lowest gainenvironment (lowest VDD and highest temperature) to cover the logic input requirements of theclock as listed in the device data sheet.

A method for improving start-up is to use a value of C2 greater than C1. This causes a greaterphase shift across the crystal at power-up, which speeds oscillator start-up.

Besides loading the crystal for proper frequency response, these capacitors can have the effectof lowering loop gain if their value is increased. C2 can be selected to affect the overall gain ofthe circuit. A higher C2 can lower the gain if the crystal is being over driven (see also discussionon Rs). Capacitance values that are too high can store and dump too much current through thecrystal, so C1 and C2 should not become excessively large. Unfortunately, measuring the watt-age through a crystal is tricky business, but if you do not stray too far from the suggested values,you should not have to be concerned with this.

A series resistor, Rs, is added to the circuit if, after all other external components are selected tosatisfaction, the crystal is still being overdriven. This can be determined by looking at the OSC2pin, which is the driven pin, with an oscilloscope. Connecting the probe to the OSC1 pin will loadthe pin too much and negatively affect performance. Remember that a scope probe adds its owncapacitance to the circuit, so this may have to be accounted for in your design, (i.e. if the circuitworked best with a C2 of 20 pF and scope probe was 10 pF, a 30 pF capacitor may actually becalled for). The output signal should not be clipping or squashed. Overdriving the crystal can alsolead to the circuit jumping to a higher harmonic level or even crystal damage.



The OSC2 signal should be a clean sine wave that easily spans the input minimum and maximumof the clock input pin (4V to 5V peak to peak for a 5V VDD is usually good). An easy way to setthis is to again test the circuit at the minimum temperature and maximum VDD that the design willbe expected to perform in, then look at the output. This should be the maximum amplitude of theclock output. If there is clipping or the sine wave is squashing near VDD and VSS at the top andbottom, increasing load capacitors will risk too much current through the crystal or push the valuetoo far from the manufacturer’s load specification. Add a trimpot between the output pin and C2,and adjust it until the sine wave is clean. Keeping it fairly close to maximum amplitude at the lowtemperature and high VDD combination will assure this is the maximum amplitude the crystal willsee and prevent overdriving. A series resistor, Rs, of the closest standard value can now beinserted in place of the trimpot. If Rs is too high, perhaps more than 20k ohms, the input will betoo isolated from the output, making the clock more susceptible to noise. If you find a value thishigh is needed to prevent overdriving the crystal, try increasing C2 to compensate. Try to get acombination where Rs is around 10k or less and load capacitance is not too far from the 20 pFor 32 pF manufacturer specification.

2.4.3.1.1 Start-up

The most difficult time for the oscillator to start-up is when waking up from sleep. This is becausethe load capacitors have both partially charged to some quiescent value, and phase differentialat wake-up is minimal. Thus, more time is required to achieve stable oscillation. Remember alsothat low voltage, high temperatures and the lower frequency clock modes also impose limitationson loop gain, which in turn affects start-up. Each of the following factors makes the start-up timeworse:

• a low frequency design (with its low gain clock mode)• a quiet environment (such as a battery operated device)• operating in a shielded box (away from the noisy RF area)• low voltage• high temperature• waking up from sleep.

Noise actually helps a design for oscillator start-up, since it helps “kick start” the oscillator.



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2.4.4 External Clock Input

Two of the oscillator modes use an external clock. These modes are EC and ECIO oscillatormodes.

In the EC mode (Figure2-5), the OSC1 pin can be driven by CMOS drivers. In this mode, theOSC1/CLKI pin is hi-impedance and the OSC2/CLKO pin is the CLKO output (FOSC/4). The out-put is at a frequency of the selected oscillator divided by 4. This output clock is useful for testingor synchronization purposes. If the power-up timer is disabled, then there is no time-out after aPOR, or else there will be a power-up timer. There is always a power-up time after a brown-outreset.

The feedback device between OSC1 and OSC2 is turned off to save current. There is no oscil-lator start-up time required after wake-up from sleep mode. If the power-up timer is disabled,then there is no time-out after a POR, or else (power-up timer enabled) there will be a power-uptimer delay after POR. There is always a power-up timer after a brown-out reset.

Figure 2-5: External Clock Input Operation (EC Oscillator Configuration)

In the ECIO mode (Figure2-6), the OSC1 pin can be driven by CMOS drivers. In this mode, theOSC1/CLKI pin is hi-impedance and the OSC2/CLKO is now multiplexed with a general pur-pose I/O pin.

The feedback device between OSC1 and OSC2 is turned off to save current. There is no oscil-lator start-up time required after wake-up from sleep mode. If the power-up timer is disabled,then there is no time-out after a POR, or else (power-up timer enabled) there will be a power-uptimer delay after POR. There is always a power-up timer after a brown-out reset.

Figure 2-6: External Clock Input Operation (ECIO Oscillator Configuration)

OSC1

OSC2FOSC/4


CLKI

I/O (CLKO)IO pin




2.4.5 External Crystal Oscillator Circuit for Device Clock

Sometimes more than one device needs to be clocked from a single crystal. Since Microchipdoes not recommend connecting other logic to the PICmicro’s internal oscillator circuit, an exter-nal crystal oscillator circuit is recommended. Each device will then have an external clock source,and the number of devices that can be driven will depend on the buffer drive capability. This circuitis also useful when more than one device needs to operate synchronously to each other.

Either a prepackaged oscillator can be used or a simple oscillator circuit with TTL gates can bebuilt. Prepackaged oscillators provide a wide operating range and better stability. A well-designedcrystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator cir-cuits can be used; one with series resonance or one with parallel resonance.

Figure2-7 shows implementation of an external parallel resonant oscillator circuit. The circuit isdesigned to use the fundamental frequency of the crystal. The 74AS04 inverter performs the180-degree phase shift that a parallel oscillator requires. The 4.7 kΩ resistor affects the circuit inthree ways:

1. Provides negative feedback.

2. Biases the 74AS04 (#1) into the linear region.

3. Bounds the gain of the amplifier.

The 10 kΩ potentiometer is used to prevent overdriving of the crystal. It dissipates the power ofthe amplifier and allows the requirements of the crystal to be met.

Figure 2-7: External Parallel Resonant Crystal Oscillator Circuit

Figure2-8 shows an external series resonant oscillator circuit. This circuit is also designed to usethe fundamental frequency of the crystal. The inverter performs a 180-degree phase shift in aseries resonant oscillator circuit. The 330 kΩ resistors provide the negative feedback to bias theinverters in their linear region.

Figure 2-8: External Series Resonant Crystal Oscillator Circuit

When the device is clocked from an external clock source (as in Figure2-7 or Figure2-8) then themicrocontroller’s oscillator should be configured for EC or ECIO mode (Figure2-3).

20 pF

+5V

20 pF

10kΩ4.7 kΩ

10 kΩ

74AS04

XTAL

10 kΩ

74AS04

CLKI

To OtherDevices

PIC18CXXX

(#1)

(#2)

330 kΩ

74AS04 74AS04 PIC18CXXX

CLKI

To OtherDevices

XTAL

330 kΩ

74AS04

0.1 µF



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2.5 External RC Oscillator

For timing insensitive applications, the RC and RCIO device options offer additional cost savings.The RC oscillator frequency is a function of the:

• Supply voltage• External resistor (REXT) values• External capacitor (CEXT) values• Operating temperature

In addition to this, the oscillator frequency will vary from unit to unit due to normal process param-eter variation. Furthermore, the difference in lead frame capacitance between package types willalso affect the oscillation frequency, especially for low CEXT values. The user also needs to takeinto account variation due to tolerance of external REXT and CEXT components used. Figure2-9shows how the RC combination is connected. For REXT values below 2.2 kΩ, oscillator operationmay become unstable, or stop completely. For very high REXT values (e.g. 1 MΩ), the oscillatorbecomes sensitive to noise, humidity and leakage. Thus, we recommend keeping REXT between3 kΩ and 100 kΩ.

Figure 2-9: RC Oscillator Mode

Although the oscillator will operate with no external capacitor (CEXT = 0 pF), we recommendusing values above 20 pF for noise and stability reasons. With no or a small external capacitance,the oscillation frequency can vary dramatically due to changes in external capacitances, such asPCB trace capacitance and package lead frame capacitance.

See characterization data for RC frequency variation from part to part due to normal process vari-ation. The variation is larger for larger resistance (since leakage current variation will affect RCfrequency more for large R) and for smaller capacitance (since variation of input capacitance willaffect RC frequency more).

See characterization data for the variation of oscillator frequency due to VDD for given REXT/CEXT

values, as well as frequency variation due to operating temperature for given REXT, CEXT and VDD

values.

The oscillator frequency, divided by 4, is available on the OSC2/CLKO pin, and can be used fortest purposes or to synchronize other logic (see Figure 4-3: "Clock/Instruction Cycle" in the“Architecture” section, for waveform).

OSC2/CLKO

CEXT

VDD

REXT

VSS

PIC18CXXX

OSC1

FOSC/4 (1)

InternalClockFOSC

Note 1: This output may also be configured as a general purpose I/O pin.



2.5.1 RC Oscillator with I/O Enabled

The RCIO oscillator mode functions in the exact same manner as the RC oscillator mode. Theonly difference is that OSC2 pin does not output oscillator frequency divided by 4, but in thismode is configured as an I/O pin.

As in the RC mode, the user needs to take into account any variation of the clock frequency dueto tolerance of external REXT and CEXT components used, process variation, voltage, and tem-perature. Figure2-10 shows how the RC with the I/O pin combination is connected.

Figure 2-10: RCIO Oscillator Mode

I/O (OSC2)

CEXT

REXT

VSSPIC18CXXX

OSC1 InternalClock

VDD



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2.5.2 RC Start-up

As the device voltage increases, the RC will start its oscillations immediately after the pin voltagelevels meet the input threshold specifications (parameters D032 and D042 in the “ElectricalSpecifications” section). The time required for the RC to start oscillating depends on many fac-tors. These include:

• Resistor value used• Capacitor value used• Device VDD rise time• System temperature

There is no oscillator start-up time (TOST) regardless of the source of reset or when sleep is ter-minated. If the power-up timer is disabled, then there is no time-out after a POR, or else(power-up timer enabled) there will be a power-up timer delay after POR. There is always apower-up time after a brown-out reset.



2.6 HS4 (HS oscillator with 4xPLL enabled)

A Phase Locked Loop (PLL) circuit is provided as a programmable option for users that want tomultiply the frequency of the incoming crystal oscillator signal by 4. For an input clock frequencyof 10 MHz, the internal clock frequency will be multiplied to 40 MHz. This is useful for customerswho are concerned with EMI due to high frequency crystals.

The PLL can only be enabled when the oscillator configuration bits are programmed for HS4mode (FOSC2:FOSC0 = ‘110’). If they are programmed for any other mode, the PLL is notenabled and the system clock will come directly from OSC1. The oscillator mode is specifiedduring device programming.

The PLL is divided into four basic parts (see Figure2-11):

• Phase comparator• Loop filter• VCO (Voltage Controlled Oscillator)• Feedback divider

When in HS4 mode, the incoming clock is sampled by the phase comparator and is comparedto PLL output clock divided by four. If the two are not in phase, the phase comparator drives aninput to the loop filter to "pump" the voltage to the VCO, either up or down, depending uponwhether the input clock was leading or lagging the output clock. This process continues until theincoming clock on OSC1 and the divide by 4 output clock of the VCO are in phase. The outputclock is now "locked" in phase with the incoming clock, and its frequency is four times greater.

A PLL lock timer is used to ensure that the PLL has locked before device execution starts. ThePLL lock timer has a time-out that is called TPLL. This delay is shown in Figure2-14.

Figure 2-11: PLL Block Diagram

MU

X

VCOLoop

Filter

Divide by 4

CrystalOscillator

OSC2

OSC1

SYSCLK

Phase

ComparatorCVCO

Circuitry

FOSC2:FOSC0 = ‘110’

PIC18CXXX



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2.7 Switching to Low Power Clock Source

This feature allows the clock source to switch from the default clock source that is selected by theFOSC2:FOSC0 bits to the Timer1 oscillator clock source. The availability of this feature is devicedependent.

2.7.1 Switching Oscillator Mode Option

This feature is enabled by clearing the Oscillator System Clock Switch Enable (OSCSEN) con-figuration bit. This provides the ability to switch to a low power execution mode if the alternateclock source (such as Timer1) is configured in oscillator mode with a low frequency (32 kHz, forexample) crystal.

The enabling of the low power clock source is determined by the state of the SCS control bit inthe Oscillator control register (OSCCON). (Register 2-1)

2.7.1.2 System Clock Switch Bit

The system clock switch bit, SCS (OSCCON) controls the switching of the oscillator source. Itcan be configured for either the Timer1 Oscillator clock source, or the default clock source(selected by the Fosc2:Fosc0 bits). When the SCS bit is set, it enables the Timer1 Oscillatorclock source as the system clock. When the SCS bit is cleared, the system clock comes fromthe clock source specified by the Fosc2:Fosc0 bits. The SCS bit is cleared on all forms of reset.

Note: The Timer1 oscillator must be enabled in order to switch the system clock source.The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 ControlRegister (T1CON). If the Timer1 oscillator is not enabled, then any write to the SCSbit will be ignored, and the SCS bit will remain in the default state with the clocksource coming from OSC1 or the PLL output.



2.7.2 Oscillator Transitions

Switching from the default clock to the Timer1 Oscillator clock source is controlled as shown inthe flow diagram (Figure2-16). This ensures a clean transition when switching oscillator clocks.

Circuitry is used to prevent "glitches" due to transitions when switching from the default clocksource to the low power clock source and vice versa. Essentially, the circuitry waits for eight risingedges of the clock input to which the processor is switching. This ensures that the clock outputpulse width will not be less than the shortest pulse width of the two clock sources. No additionaldelays are required when switching from the default clock source to the low power clock source.

Figure2-12 through Figure2-15 show different transition waveforms when switching between theoscillators.

Figure 2-12: Transition From OSC1 to Timer1 Oscillator Waveform

Figure 2-13: Transition Between Timer1 and OSC1 Waveform (HS, XT, LP)

Q3Q2Q1Q4Q3Q2

OSC1

Internal

SCS

ProgramPC + 2PC

Note 1: Delay on internal system clock is eight oscillator cycles for synchronization.2: The T1OSCEN bit is set.3: The OSCSEN configuration bit is cleared.

Q1

T1OSI (2)

Q4 Q1

PC + 4

Q1

Tscs

Clock

Counter

System

Q2 Q3 Q4 Q1

TDLY

TT1P

TOSC

21 3 4 5 6 7 8

(OSCCON)

Q3Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2

OSC1

Internal

SCS(OSCCON)

ProgramPC PC + 2

Note 1: TOST = 1024TOSC (drawing not to scale).

T1OSI

OSC2TOST

Q1

PC + 6

TT1P

TOSC

TSCS

1 2 3 4 5 6 7 8

System Clock

Counter



scillator

2

Figure 2-14: Transition Between Timer1 and OSC1 Waveform (HS4)

Figure 2-15: Transition Between Timer1 and OSC1 Waveform (RC, EC, ECIO)

Additional delays may occur before switching from the low power clock source back to the mainoscillator. The sequence of events that take place will depend upon the main oscillator setting inthe configuration register (the mode of the main oscillator).

If the main oscillator is configured as a RC oscillator (RC, RCIO) or External Clock (EC, ECIO),then there is no oscillator start-up time. The transition from a low power clock to the main oscil-lator occurs after 8 clock cycles are counted on OSC1.

If the main oscillator is configured as a crystal (HS4, HS, XT or LP), then the transition will takeplace after an oscillator start-up time (TOST).

If the main oscillator is configured as a crystal with PLL (HS4) enabled, then the transition willtake place after an oscillator start-up time (TOST) plus an additional PLL time-out, TPLL (see“Electrical Specifications” section, parameter 32). This is necessary because the crystal oscil-lator had been powered down until the time of the transition. In order to provide the system witha reliable clock when the change-over has occurred, the clock will not be released to thechange-over circuit until the oscillator start-up time has expired. The additional TPLL time isrequired after oscillator start-up to allow the phase lock loop ample time to lock to the incomingoscillator frequency from OSC1.

Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2

OSC1

SCS(OSCCON)

Program PC PC + 2

Note 1: TOST = 1024TOSC (drawing not to scale).

T1OSI

TOST

Q3

PC + 4

TPLL

TOSC

TT1P

TSCS

Q4

OSC2

PLL ClockInput 1 2 3 4 5 6 7 8

InternalSystem Clock

Counter

Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3

OSC1

SCS(OSCCON)

PC PC + 2

Note 1: RC oscillator mode assumed.

PC + 4

T1OSI

OSC2

Q4TT1P

TOSC

TSCS

1 2 3 4 5 6 7 8

ProgramCounter

InternalSystem Clock



A flow diagram for switching between a low power clock and the default oscillator clock is shownin Figure2-16.

Figure 2-16: Switching Oscillator Flow Diagram

Start

SCS = 0?

Has SCS

Begin switch tolow power clock

N = 0,hold CPU clock

Transitionon Newclk?

N = N + 1

N = 8?

Sysclk = Newclk,Release Q clocks

Begin switch tohigh speed clock

FOSC2:FOSC0 =XT, LP,

Start OST,wait 1024oscillationson OSC1

Newclk =XT, HS, LP

FOSC2:FOSC0 =HS4

Newclk =HS4

Newclk =T1OSC input

Newclk = EC or RC

Start OST,wait 1024

oscillationson OSC1

Yes

Yes Yes

Yes

Yes

No

No No

No

No

T1OSCEN = 1?

Yes

No No switch to lowpower clock.Set SCS = 0

End

End

changed state?

Wait TPLL forPLL to lock

in Q1 state

OSCSEN = 0?

No

Yes

End

No switch to lowpower clock

or HS?



scillator

2

2.8 Effects of Sleep Mode on the On-Chip Oscillator

When the device executes a SLEEP instruction, the on-chip clocks and oscillator are turned offand the device is held at the beginning of an instruction cycle (Q1 state). With the oscillator off,the OSC1 and OSC2 signals will stop oscillating. Since all the transistor switching currents havebeen removed, SLEEP mode achieves the lowest current consumption of the device (only leak-age currents). Enabling any on-chip feature that will operate during SLEEP will increase the cur-rent consumed. The user can wake from SLEEP through external reset, Watchdog Timer Resetor through an interrupt.

See Table 3-1 in the “Reset” section for time-outs due to SLEEP and MCLR reset.

Table 2-4: OSC1 and OSC2 Pin States in Sleep Mode

2.9 Effects of Device Reset on the On-Chip Oscillator

Device resets have no effect on the on-chip crystal oscillator circuitry. The oscillator will continueto operate as it does under normal execution. While in RESET, the device logic is held at the Q1state so that when the device exits RESET, it is at the beginning of an instruction cycle. TheOSC2 pin, when used as the external clockout (RC, EC mode), will be held low during RESET,and as soon as the MCLR pin is at VIH (input high voltage), the RC will start to oscillate.

See Table 3-1 in the “Reset” section for time-outs due to SLEEP and MCLR reset.

2.9.1 Power-up Delays

Power-up delays are controlled by two timers, so that no external reset circuitry is required formost applications. The delays ensure that the device is kept in RESET until the device power sup-ply and clock are stable. For additional information on RESET operation, see the “Reset” sec-tion.

The Power-up Timer (PWRT) provides a fixed 72 ms delay on power-up due to POR or BOR, andkeeps the part in RESET until the device power supply is stable. When a crystal is used (LP, XT,HS), the Oscillator Start-Up Timer (OST) keeps the chip in RESET until the PWRT timer delayhas expired, allowing the crystal oscillator to stabilize on power up. The PWRTEN bit must becleared for this time-out to occur.

When the PLL is enabled (HS4 oscillator mode), the Power-up Timer (PWRT) is used to keep thedevice in RESET for an extra nominal delay (TPLL) above crystal mode. This delay ensures thatthe PLL is locked to the crystal frequency.

For additional information on RESET operation, see the “Reset” section.

OSC Mode OSC1 Pin OSC2 Pin

RC Floating, external resistor shouldpull high

At logic low

RCIO Floating, external resistor shouldpull high

Configured as I/O pin

ECIO Floating Configured as I/O pin

EC Floating At logic low

LP, XT and HS Feedback inverter disabled atquiescent voltage level

Feedback inverter disabled atquiescent voltage level

HS4 Feedback inverter disabled atquiescent voltage level

Feedback inverter disabled atquiescent voltage level



2.10 Design Tips

Question 1: When looking at the OSC2 pin after power-up with an oscilloscope, there isno clock. What can cause this?

Answer 1:

1. Executing a SLEEP instruction with no source for wake-up (such as, WDT, MCLR, or anInterrupt). Verify that the code does not put the device to SLEEP without providing forwake-up. If it is possible, try waking it up with a low pulse on MCLR. Powering up withMCLR held low will also give the crystal oscillator more time to start-up, but the ProgramCounter will not advance until the MCLR pin is high.

2. The wrong clock mode is selected for the desired frequency. For a blank device, the defaultoscillator is RCIO. Most parts come with the clock selected in the default RC mode, whichwill not start oscillation with a crystal or resonator. Verify that the clock mode has beenprogrammed correctly.

3. The proper power-up sequence has not been followed. If a CMOS part is powered throughan I/O pin prior to power-up, bad things can happen (latch up, improper start-up, etc.) It isalso possible for brown-out conditions, noisy power lines at start-up, and slow VDD risetimes to cause problems. Try powering up the device with nothing connected to the I/O,and power-up with a known, good, fast-rise, power supply. Refer to the power-up informa-tion in the device data sheet for considerations on brown-out and power-up sequences.

4. The C1 and C2 capacitors attached to the crystal have not been connected properly orare not the correct values. Make sure all connections are correct. The device data sheetvalues for these components will usually get the oscillator running; however, they justmight not be the optimal values for your design.

Question 2: The PICmicro device starts, but runs at a frequency much higher than theresonant frequency of the crystal.

Answer 2:

The gain is too high for this oscillator circuit. Refer to subsection 2.4 “Crystal Oscilla-tors/Ceramic Resonators” to aid in the selection of C2 (may need to be higher) Rs (may beneeded) and clock mode (wrong mode may be selected). This is especially possible for low fre-quency crystals, like the common 32.768 kHz.

Question 3: The design runs fine, but the frequency is slightly off. What can be done toadjust this?

Answer 3:

Changing the value of C1 has some effect on the oscillator frequency. If a SERIES resonant crys-tal is used, it will resonate at a different frequency than a PARALLEL resonant crystal of the samefrequency call-out. Ensure that you are using a PARALLEL resonant crystal.

Question 4: The board works fine, then suddenly quits or loses time.

Answer 4:

Other than the obvious software checks that should be done to investigate losing time, it is pos-sible that the amplitude of the oscillator output is not high enough to reliably trigger the oscillatorinput. Look at the C1 and C2 values and ensure that the the device configuration bits are correctfor the desired oscillator mode.

Question 5: If I put an oscilloscope probe on an oscillator pin, I don’t see what I expect.Why?

Answer 5:

Remember that an oscilloscope probe has capacitance. Connecting the probe to the oscillatorcircuitry will modify the oscillator characteristics. Consider using a low capacitance (active)probe.



scillator

2

2.11 Related Application Notes

This section lists application notes that are related to this section of the manual. These applica-tion notes may not be written specifically for the Enhanced MCU family (that is they may be writ-ten for the Base-Line, Mid-Range, or High-End families), but the concepts are pertinent, andcould be used (with modification and possible limitations). The current application notes relatedto the oscillator are:

Title Application Note #

PICmicro Microcontrollers Oscillator Design Guide AN588

Low Power Design using PICmicro Microcontrollers AN606

Note: Please visit the Microchip Web site for additional software code examples. Thesecode examples are stand alone examples to assist in the understanding of thePIC18CXXX. The web address for these examples is:

http://www.microchip.com/10/faqs/codeex/



2.12 Revision History

Revision A

This is the initial released revision of the Enhanced MCU oscillators description.


Documents

Section 2. Oscillatorweb.aeromech.usyd.edu.au/MTRX3700/Course_Material/reference/chips... · default oscillator (OSC1), and additional oscillators may be available, such as the Timer1