ELECTRONIC MATERIALS CONFERENCE

June 25-27, 2008 • University of CaliforniaSanta Barbara, California

CALL FOR PAPERS

EMCElectronic Materials Conference

50thAnniversary

2008

Sponsored by

Electronic Materials Committee

www.tms.org/EMC.html

The Premier Annual Forum on the Preparation and Characterization of Electronic Materials for 50 Years

June 25-27, 2008 • Santa Barbara, California

For 50 years, the Electronic Materials Conference (EMC) has been presenting research and developments to advance the field as well as our attendees, who include:

ScientistsEngineersProfessorsResearchersTechniciansResearch and Development ManagersProduct ManagersStudents

You are invited to participate in this year’s event by submitting an abstract for any of the more than 30 topics being presented.

About the TopicsElectronic materials are defined as relating to, produced or operated by the controlled flow of electrons through a semiconductor, gas or free space along with those relating to devices, systems or circuits that employ components such as vacuum tubes, integrated circuits or transistors in their design. In practice, the field is much broader as we have tried to capture in the topics covered.

See the following pages for information on the technical topics and submit your abstract before February 1, 2008.

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LEARN • NETWORK • ADVANCELEARN • NETWORK • ADVANCE

EMCElectronic Materials Conference

50thAnniversary

2008

www.tms.org/EMC.html �

EMC 2008 will include both invited and contributed oral presentations, an exhibition of related products and

services, and special networking and social activities.

General ChairRobert Biefeld, Sandia National Laboratories

(505) 844-1556 • rmbiefe@sandia.gov

Program ChairMark Goorsky, University of California

(310) 206-0267 • goorsky@seas.ucla.edu

EMC and DRCEMC is being coordinated with the Device Research Conference (DRC),

June 23-25, 2008, at the University of California. The coordinated efforts are made in recognition of the strong interaction between electronic materials and device research. This provides for maximum exchange of information

between attendees of both conferences.

DRC InquiriesSteven Koester, IBM TJ Watson Research Center

(914) 945-2189 • skoester@us.ibm.com

Abstracts submitted to DRC may not be submitted to EMC.

For more information about EMC, contact TMS.Meeting Services

(724) 776-9000, ext. 243 • (800) 759-4TMS • mtgserv@tms.org

Table of ContentsInformation for Prospective Authors ...................................... 4Technical Program Topics ..................................................... 6

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Information for Prospective Authors

Abstract Submission

ABSTRACT DEADLINE: FEBRUARY 1, 2008

How to Submit an AbstractSubmit your 450-word abstract by February 1, 2008, using CMS-Plus, the online TMS conference management system, at http://cmsplus.tms.org. Conference organizers receive electronic notification of abstract submissions upon entry. Log in to CMS-Plus to begin.

Author RequirementsAbstracts submitted must reveal and demonstrate reasonable scientific content. Do not submit abstracts describing work that has not been released for public disclosure.Students should clearly mark abstracts as “Student Paper” and must also satisfy format guidelines.Authors are expected to present their papers in person at the conference. If an author must be absent or withdraw a paper, the author must notify the program chair well in advance.

Extended AbstractA one-page, additional abstract is also required to assist organizers in considering the material planned for presentation. The additional page (referred to as “extended abstract” in CMS-Plus) should be uploaded as a Microsoft Word or Portable Document Format (PDF) attachment when your initial abstract is submitted. (Only the required 450-word abstract will be printed in the program book).

“Late News” PapersLate news papers will be considered between February 2 and June 2, 2008. They should be submitted online at http://cmsplus.tms.org by selecting “Late News.” The same formatting instructions for abstract submission apply.

Questions about submitting your abstract? Contact TMS.Christina Raabe Eck, Technical Programming and Publications Manager(724) 776-9000, ext. 212 • (800) 759-4TMS • raabe@tms.org

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Student Awards and AssistanceThe top 5 percent of student presentations, as voted upon by the EMC committee, will receive the EMC Best Student Paper Award at the 2009 conference. Papers are judged on both written abstract and oral presentation.

The EMC committee has allocated funds to assist students to attend the 2008 conference in order to make oral presentations. Those wishing to be considered to receive funds should e-mail Robert Biefeld at rmbiefe@sandia.gov no later than Monday, June 2, 2008.

Publication of PapersSelected technical sessions will be published in the Journal of Electronic Materials. You also are strongly encouraged to submit manuscripts of your work to the journal. Details on eligibility and manuscript submission will be included in the EMC advance program and are available on the Web at http://www.tms.org/jem.html.

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Technical Program Topics

ISSUES FOR WIDE BANDGAP MATERIALS

Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices

Andrew Allerman, Sandia National Laboratories(505) 845-3697 • aaaller@sandia.gov

Russell Dupuis, Georgia Institute of Technology(404) 385-6094 • russell.dupuis@ece.gatech.edu

Randy Feenstra, Carnegie Mellon University(412) 268-6961 • feenstra@cmu.edu

Jung Han, Yale University(203) 432-7567 • jung.han@yale.edu

Michael Manfra, Bell Labs, Lucent Technologies(908) 582-1137 • manfra@lucent.com

Thomas Myers, West Virginia University(304) 293-3422, ext. 1469 • tmyers@wvu.edu

Zinc Oxide: Growth, Doping, Defects, Nanostructures and Devices

Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov

Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu

Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it

Yicheng Lu, Rutgers University(732) 445-3466 • ylu@ece.rutgers.edu

Shelby Nelson, Eastman Kodak Company(585) 477-8417 • shelby.nelson@kodak.com

David Norton, University of Florida(352) 846-0525 • dnort@mse.ufl.edu

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Jamie Phillips, University of Michigan(734) 764-4157 • jphilli@umich.edu

Silicon Carbide: Growth, Processing, Characterization, Theory and Devices

Michael Capano, Purdue University(765) 494-3563 • capano@purdue.edu

Stephen E. Saddow, University of South Florida(813) 974-4773 • saddow@ieee.org

Robert Stahlbush, Naval Research Laboratory(202) 767-3357 • stahlbush@nrl.navy.mil

Point Defects, Extended Defects and Doping in Wide Bandgap Materials

Leonard Brillson, The Ohio State University(614) 292-8015 • brillson.1@osu.edu

Shigefusa Chichibu, Tohoku University+81-22-217-5363 • chichibu@tagen.tohoku.ac.jp

James Speck, University of California(805) 893-8005 • speck@mrl.ucsb.edu

Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • wetzel@ieee.org

Huili Xing, University of Notre Dame(574) 631-9108 • hxing@nd.edu

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NANOSCALE SCIENCE AND TECHNOLOGY IN MATERIALS

Low-Dimensional Structures: Quantum Dots, Wires and Wells

Diana Huffaker, University of New Mexico(505) 272-7845 • huffaker@chtm.unm.edu

Jim Merz, University of Notre Dame(574) 631-3111 • jmerz@nd.edu

Mark Miller, University of Utah(801) 587-7718 • mark.miller@ece.utah.edu

Akio Sasaki, Osaka Electro-Communication University+81-72-824-1131 • sasaki@isc.osakac.ac.jp

Ben Shanabrook, Naval Research Laboratory(202) 767-3693 • ben.shanabrook@nrl.navy.mil

Glenn Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu

Nanoscale Characterization: Scanning Probes, Electron Microscopy and Other Techniques

Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu

Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov

Susanne Stemmer, University of California(805) 893-6128 • stemmer@mrl.ucsb.edu

Edward Yu, University of California(858) 534-6619 • ety@ece.ucsd.edu

Molecular Electronics: Devices, Materials and Contacts

Mark Hersam, Northwestern University(847) 491-2696 • m-hersam@northwestern.edu

Technical Program Topics

www.tms.org/EMC.html �

David Janes, Purdue University(765) 494-9263 • janes@ecn.purdue.edu

Gregory Lopinski, Steacie Institute for Molecular Sciences(613) 990-4155 • gregory.lopinski@nrc.ca

Theresa Mayer, The Pennsylvania State University(814) 863-8458 • tsm2@psu.edu

Shalom Wind, Columbia University(212) 854-5122 • sw2128@columbia.edu

Nanotubes and Nanowires

Kris Bertness, National Institute of Standards and Technology(303) 497-5069 • bertness@boulder.nist.gov

Theresa Mayer, The Pennsylvania State University(814) 863-8458 • tsm2@psu.edu

Hou T. Ng, Hewlett-Packard Company(650) 857-4169 • hou-t.ng@hp.com

Timothy Sands, Purdue University(765) 496-6105 • tsands@purdue.edu

Raymond Tsui, Motorola(480) 413-4182 • ray.tsui@motorola.com

Chemical and Biological Sensors: Materials, Interfaces and Integration

April Brown, Duke University(919) 660-5442 • abrown@ee.duke.edu

David Janes, Purdue University(765) 494-9263 • janes@ecn.purdue.edu

Laura Rea, U.S. Air Force Research Laboratory(937) 255-9871 • laura.rea@wpafb.af.mil

Albert Alec Talin, Sandia National Laboratories(925) 294-1445 • aatalin@sandia.gov

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Lloyd Whitman, Naval Research Laboratory(202) 404-8845 • whitman@nrl.navy.mil

William Wong, Palo Alto Research Center(650) 812-4660 • wsw@parc.com

ADDITIONAL TOPIC AREAS

Contacts to Semiconductor Epilayers, Nanowires, Nanotubes and Organic Films

Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • mohney@ems.psu.edu

Lisa Porter, Carnegie Mellon University(412) 268-4047 • lporter@andrew.cmu.edu

Tae-Yeon Seong, Korea University+82-2-3290-3288 • tyseong@korea.ac.kr

Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu

Epitaxy

April Brown, Duke University(919) 660-5442 • abrown@ee.duke.edu

Diana Huffaker, University of New Mexico(505) 272-7800 • huffaker@chtm.unm.edu

Amy Liu, IQE Inc.(610) 861-6930 • aliu@iqep.com

Epitaxy for Devices

Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu

Technical Program Topics

www.tms.org/EMC.html 11

Kei-May Lau, Hong Kong University of Science and Technology+852-2358-7049 • eekmlau@ust.hk

Charles Lutz, Kopin Corporation(508) 824-6696, ext. 415 • clutz@kopin.com

Michael Tischler, Ocis Technologies(602) 317-6249 • tisch@ocistech.com

Epitaxy: Configurable �-D, Metamorphic and Template Growth (Other Areas)

Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu

Alan Doolittle, Georgia Institute of Technology(404) 894-0631 • alan.doolittle@ece.gatech.edu

Steven Ringel, The Ohio State University(614) 292-6904 • ringel.5@osu.edu

Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • wang@ll.mit.edu

Point and Extended Defects in Mismatched Materials

Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu

Steven Ringel, The Ohio State University(614) 292-6904 • ringel.5@osu.edu

Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu

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Nondestructive Testing and In Situ Monitoring and Control

Kurt Eyink, U.S. Air Force Research Laboratory(937) 656-5710 • kurt.eyink@wpafb.af.mil

Mark Goorsky, University of California(310) 206-0267 • goorsky@seas.ucla.edu

Andrew Hoff, University of South Florida(813) 974-4958 • hoff@eng.usf.edu

Semiconductor Processing: Oxidation, Passivation, Functionalization and Etching

Michael Capano, Purdue University(765) 494-3563 • capano@purdue.edu

Douglas Hall, University of Notre Dame(574) 631-8631 • dhall@nd.edu

Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it

Suzanne Mohney, The Pennsylvania State University(814) 863-0744 • mohney@ems.psu.edu

Materials Integration: Wafer Bonding and Engineered Substrates

Harry Atwater, California Institute of Technology(818) 395-2197 • haa@daedalus.caltech.edu

Karl Hobart, Naval Research Laboratory(202) 404-8542 • karl.hobart@nrl.navy.mil

Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu

Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu

Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu

Technical Program Topics

www.tms.org/EMC.html 1�

Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides and Metal Gates

Evgeni Gusev, Qualcomm MEMS Technologies(408) 546-2096 • gusev@qualcomm.com

Pat Lenahan, The Pennsylvania State University(814) 863-4630 • pmlesm@engr.psu.edu

Maria Losurdo, Institute of Inorganic Methodologies and Plasmas+39-080-544-3562 • maria.losurdo@ba.imip.cnr.it

Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu

Shriram Ramanathan, Harvard University(617) 496-0358 • shriram@seas.harvard.edu

Susanne Stemmer, University of California(805) 893-6128 • stemmer@mrl.ucsb.edu

Si-Based Heterojunctions

Eugene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu

Sarah Olsen, University of Newcastle-upon-Tyne+44-191-222-8552 • sarah.olsen@ncl.ac.uk

Michael Tischler, Ocis Technologies(602) 317-6249 • tisch@ocistech.com

Ya-Hong Xie, University of California(310) 825-2971 • yhx@ucla.edu

Narrow Bandgap Semiconductors: Antimonides and Other Materials

Brian Bennett, Naval Research Laboratory(202) 767-3665 • brian.bennett@nrl.navy.mil

Robert Biefeld, Sandia National Laboratories(505) 844-1556 • rmbiefe@sandia.gov

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Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu

Christine Wang, Massachusetts Institute of Technology(781) 981-4466 • wang@ll.mit.edu

Indium Nitride: Growth, Processing, Characterization, Theory and Devices

Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu

Yasushi Nanishi, Ritsumeikan University+81-77-561-2679 • nanishi@se.ritsumei.ac.jp

Joan Redwing, The Pennsylvania State University(814) 865-8665 • jmr31@psu.edu

William Schaff, Cornell University(607) 255-3974 • wjs2@cornell.edu

Spin-Dependent (or Spintronic) Electronic Materials

Michael Flatte, University of Iowa(319) 335-0201 • michael_flatte@mailaps.org

Xinyu Liu, University of Notre Dame(574) 631-9787 • xliu2@nd.edu

Chris Palmstrom, University of California, Santa Barbara(805) 893-3618 • cpalmstrom@ece.ucsb.edu

Nitin Samarth, The Pennsylvania State University(814) 863-0136 • nsamarth@psu.edu

Masaaki Tanaka, University of Tokyo+81-3-5841-6728 • masaaki@ee.t.u-tokyo.ac.jp

Dilute Nitride Semiconductors

Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu

Technical Program Topics

www.tms.org/EMC.html 15

Douglas Hall, University of Notre Dame(574) 631-8631 • dhall@nd.edu

Archie Holmes, University of Virginia(434) 924-7770 • archieholmes@virginia.edu

Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu

Charles Tu, University of California(858) 534-4687 • ctu@ece.ucsd.edu

Flexible Thin-Film Electronics

David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov

Thomas Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu

Thomas Kuech, University of Wisconsin(608) 263-2922 • kuech@engr.wisc.edu

William Wong, Palo Alto Research Center(650) 812-4660 • wsw@parc.com

Organic Thin Film and Crystalline Transistors: Devices, Materials and Processing

David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov

Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu

Alberto Salleo, Palo Alto Research Center(650) 812-5065 • asalleo@parc.com

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Organic-Inorganic Hybrid Photovoltaics

David Gundlach, National Institute of Standards and Technology(301) 975-2048 • david.gundlach@nist.gov

Julia Hsu, Sandia National Laboratories(505) 284-1173 • jwhsu@sandia.gov

Max Shtein, University of Michigan(734) 764-4312 • mshtein@umich.edu

Materials and Novel Concepts for UV Detectors and Emitters

Laura Rea, U.S. Air Force Research Laboratory(937) 255-6316 • laura.rea@wpafb.af.mil

Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu

Mike Wraback, U.S. Army Research Laboratory(301) 394-1459 • mwraback@arl.army.mil

OTHER/NEW AREAS

Compound Semiconductor Growth on Si Substrates

Ralph Dawson, University of New Mexico(505) 272-7820 • rdawson@chtm.unm.edu

Gene Fitzgerald, Massachusetts Institute of Technology(617) 158-7461 • eafitz@mit.edu

Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu

Fuel Cell and Battery Materials

Stephen Hackney, Michigan Technological University(906) 487-2170 • hackney@mtu.edu

Technical Program Topics

www.tms.org/EMC.html 17

Peter Moran, Michigan Technological University(906) 487-3095 • pdmoran@mtu.edu

Solar Cell Materials and Devices

Mark Goorsky, University of California(310) 206-0267 • goorsky@seas.ucla.edu

Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu

Glen Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu

Christian Wetzel, Rensselaer Polytechnic Institute(518) 276-3755 • wetzel@ieee.org

Jerry Woodall, Purdue University(765) 494-3479 • woodall@ecn.purdue.edu

Graphene and Carbon Nanotubes

Randy Feenstra, Carnegie Mellon University(412) 268-6961 • feenstra@cmu.edu

Tom Jackson, The Pennsylvania State University(814) 863-8570 • tnj1@psu.edu

Debdeep Jena, University of Notre Dame(574) 631-8835 • djena@nd.edu

Mark Miller, University of Utah(801) 587-7718 • mark.miller@ece.utah.edu

Randy Sandhu, Northrop Grumman Space Technology(310) 813-4815 • rajinder.sandhu@ngc.com

Glen Solomon, Stanford University(650) 725-6910 • solomon@stanford.edu

EMCElectronic Materials Conference

50thAnniversary

2008

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Technical Program Topics

Thermoelectrics and Thermionics

Mayank Bulsara, Massachusetts Institute of Technology(617) 258-7147 • mbulsara@mit.edu

Rachel Goldman, University of Michigan(734) 647-6821 • rsgold@umich.edu

Timothy Sands, Purdue University(765) 496-6105 • tsands@purdue.edu

Jeff Snyder, California Institute of Technology(626) 395-6220 • jsnyder@caltech.edu

Joint Session with DRC

Steven Koester, IBM TJ Watson Research Center(914) 945-2189 • skoester@us.ibm.com

Submit your abstract online at http://cmsplus.tms.org.

www.tms.org/EMC.html 1�

EMC Exhibition

The 2008 EMC exhibition will feature electronic materials-related technology and services from worldwide companies. Exhibitors will

bring equipment, publications, software and services, relative to electronic materials applications and research, to the floor. More than

400 professionals from corporations, universities and government laboratories, interested in electronic materials, will be attending.

To find out how your company can participate in the exhibition, contact TMS no later than Friday, June 6, 2008:

Joe Rostan, Exhibit Sales Representative(724) 776-9000, ext. 231 • (800) 759-4TMS • exhibits@tms.org

For Your CalendarFebruary 1, 2008 – Abstract Submission Deadline

April 4, 2008 – Notification of AcceptanceJune 4, 2008 – Advance Registration Deadline

June 25, 2008 – Welcoming Reception

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