Ryan B. Wicker, Ph.D. - Faculty Profiles - The University of ...hb2504.utep.edu/vitas/emac.docx · Web viewCo-founded start-up focused on specializing in self-test (Built-in Self

Eric W. MacDonald Detailed Academic Curriculum Vitae Page 1

Eric MacDonald, Ph.D., P.E.Professor, Department of Electrical and Computer EngineeringTexas Instruments Endowed Professor Deputy Editor, Additive Manufacturing, Elsevier PublishingAssociate Director, W.M. Keck Center for 3D InnovationThe University of Texas at El Paso

TABLE OF CONTENTS

Eric MacDonald At A Glance.............................................................................................................2

Education.........................................................................................................................................2

Professional Experience....................................................................................................................2Endowed Appointments.............................................................................................................................3Industry Experience....................................................................................................................................3Technology Spin-Off Company Activities.....................................................................................................3Courses Taught...........................................................................................................................................4Significant Course Development.................................................................................................................4Research Laboratory Development.............................................................................................................5Consulting Activities...................................................................................................................................5Professional Societies.................................................................................................................................5Patents and Patent Applications.................................................................................................................6Awards and Honors....................................................................................................................................6

Scholarly Activity..............................................................................................................................7Journal Articles...........................................................................................................................................7Conference and Other Publications............................................................................................................8Invited Presentations................................................................................................................................13

Research Activity............................................................................................................................14Sponsored Post-doctoral Scholars.............................................................................................................14Graduate Students Completed..................................................................................................................14

Ph.D. Students..............................................................................................................................................14M.S. Students...............................................................................................................................................14

Students In Progress.................................................................................................................................15Ph.D. Students..............................................................................................................................................15M.S. Students...............................................................................................................................................15

Sponsored Projects...................................................................................................................................16

Professional Service Activity...........................................................................................................19Proposal, Journal, and Conference Reviews..............................................................................................19Department Service..................................................................................................................................19College Service.........................................................................................................................................19University Service.....................................................................................................................................19Other Professional Service........................................................................................................................19

Last Updated January 16, 2016


Eric W. MacDonald, Ph.D., P.E.Professor, Department of Electrical and Computer EngineeringTexas Instruments Endowed Professor Associate Director, W.M. Keck Center for 3D Innovation, web: keck.utep.eduDeputy Editor, Additive Manufacturing, Elsevier Publishing web: www.elsevier.comDirector, ASICs Laboratory, web: www.asics.ece.utep.eduThe University of Texas at El Paso

ERIC MACDONALD AT A GLANCEFunded as principal investigator with over $3,700,000 and over $10,000,000 as Co-PI.Proposed over $80,000,000 worth of research as PI at UTEP in 10 years.World leader in applying 3D printing to fabricate structural electronics.Co-founded start-up company acquired by Silicon Valley firm in 2003.Fulbright Scholar – teaching and performing research in Fall 2011 in Chile.Deputy Editor of Elsevier Journal of Additive Manufacturing.Faculty Fellowships at NASA and Navy in summers of 2004 and 2007, respectively.3 patents filed and several disclosures in process – one patent licensed by Toshiba.Taught/teach class annually in which student designs are fabricated successfully in silicon.Graduated 20 MS (1 in process) and 2 PhDs (2 in process), and mentored 2 postdocs.

EDUCATIONPh.D. in Electrical and Computer Engineering, May 2002

The University of Texas at AustinDissertation: “Testability of Silicon on Insulator Circuits”, Advisor: Nur Touba

M.S. in Electrical and Computer Engineering, December 1997B.S. in Electrical and Computer Engineering, December 1993

PROFESSIONAL EXPERIENCEThe University of Texas at El Paso, Department of Electrical and Computer Engineering

Professor September 2014 – PresentAssociate Professor Sept 2009 – August 2014Assistant Professor Sept 2003 – Aug 2009

Universidad Técnica Federico Santa María, Valparaíso Chile:Fulbright Scholar, US State Department, July 2011 - Dec 2011

Fulbright recipient teaching a course (part English / part Spanish) in chip design in which nine student designs were fabricated for free by MOSIS in ON Semiconductor 0.5u CMOS.

SPAWAR Navy, Faculty Fellowship, June 2007 - Aug 2007Developed low power chips for highly sensitive flux gate magnetometers.

NASA Jet Propulsion Laboratory, Faculty Fellowship, June 2004 - Aug 2004Developed robust low power chips for MEMS based accelerometer.


ENDOWED APPOINTMENTS

The University of Texas at El PasoTexas Instruments Endowed Professorship Sep 2012 – present

INDUSTRY EXPERIENCE

PDAT Technologies, Inc. - Austin, Texas Sep 2002–Aug 2003Co-founded start-up focused on specializing in self-test (Built-in Self Test - BIST) circuitry for

embedded memories of ICs. Developed software to generate optimized Verilog code capable of testing and repairing memories with specific test patterns targeted to the 6T layout of the SRAM design. PDAT was acquired by Magma Design Automation, Inc. in 2004.

IBM, Inc. - Austin, Texas Mar 1998–Aug 2002Served as technical lead for design / integration team developing PowerPC cores and chips at

both the logic (Verilog) and circuit level (0.18u to 90nm IBM CMOS). Chips included the first commercial SOI microprocessor (used by Apple prior to conversion to Intel) as well as a family of system-on-chip designs based on the PowerPC architecture. The last project included leading an IBM Research Division-initiated investigation of low power architectures.

Motorola, Inc. - Austin, Texas June 1993–Mar 1998Served as design, device and product engineer for DSP processors for 0.8u to 0.25u CMOS

technology families. Duties included improving reliability and yield improvement.

TECHNOLOGY SPIN-OFF COMPANY ACTIVITIES

Co-Founder, Printed Device Concepts, Inc. April 2013 – presentEl Paso, Texas PDC is a contract manufacturing company specializing in structural and printed electronic

devices that enable advanced, 3D electronic packages and founded in April 2013 by Dan Muse, David Medina, Eric MacDonald, and Ryan Wicker

Founder, El Paso Instruments, LLC, Jan 2008 – PresentEl Paso, Texas El Paso Instruments LLC is a small business based in West Texas focusing on transfer of

technologies born from the laboratories of the University of Texas at El Paso. Started in 2008 the company seeks investor funding and federal grants to commercialize early stage academic intellectual property. http://www.elpasoinstruments.com

Co-Founder, Prognosticon, LLC, January 2006 – Dec 2006Las Cruces, New Mexico Prognosticon was a New Mexico based company that successfully received SBIR funding

(Phase 1) from the Navy to investigate non-traditional health monitoring techniques for electronic systems and components.


COURSES TAUGHT

1. EE 3376 - Microcontrollers I (junior); Motorola 68HXS12 version - Spring 2004 through Spring 2012. Textbook: Designing with Microcontrollers, by Thomas Almy. Laboratory board: Dragon12 from Wytec (wytec.com).

2. EE 3376 - Microcontrollers I (junior); Texas Instruments MSP430 version – Fall 2012 through present. Textbook: MSP430 MSP430 Microprocessor Basics, by John Davies. Laboratory board: Texas Instruments MSP430 Launch Pad.

3. EE 2369 – Logic Design (sophomore); Logic Design , by Charles Roth – Fall 2003.

4. EE 5369 – CMOS Digital Integrated Circuits (graduate); CMOS Digital Integrated Circuits: Design and Analysis, by Sung Mo Kang, Yusuf Leblebici – Spring 2005-2012.

5. EE 5376 – ASIC Design and Test Methodologies (graduate); No textbook. – Fall 2004-2012. Course includes having term project (Verilog design) emulated in a Xilinx Spartan 3D FPGA and then subsequently sent for fabrication through MOSIS’s 0.5u CMOS educational program.

SIGNIFICANT COURSE DEVELOPMENT

1. EE 3376 – Microprocessors 1 (undergraduate). Converted junior level course introducing students to assembly language and embedded systems to be based on Texas Instruments MSP430 microcontroller. The processor with an associated Launch Pad development board allowed for reduction in student cost of purchasing and is helping to foster a stronger industrial relationship with Texas Instruments.

2. EE 5369 – CMOS Digital Integrated Circuits (graduate) A graduate course developed from scratch focusing on transistor level design of standard cell libraries, IOs and memories – with significant laboratory emphasis focusing on my industrial circuit design experience. During a tour of Intel in Chandler, AZ, eight UTEP alumni mentioned that this course and the next and helped them with securing a position at Intel.

3. EE 5375 – ASIC Design and Test Methodologies (graduate); A graduate course developed from scratch, which introduces Verilog and then explores issues with fault tolerance and design for testability. Labs are performed on inexpensive Digilent Basys FPGA boards (Xilinx Spartan 3E) with emphasis on industrial level designs. A final term project – based on similar project completed in a course in Chile during my Fulbright - is run through a CAD methodology (Synopsys and/or Cadence) including design for test and ending with a MOSIS Educational Program fabrication – which provides five silicon packaged chips in the subsequent semester to each student design team – normally worth thousands of dollars to fabricate.


RESEARCH LABORATORY DEVELOPMENT

W.M. Keck Center for 3D Innovation – 3D Printed Electronics Laboratory Expanded the Keck Center with the addition of the 3D Printed Electronics Laboratory expansion in part as a result of a $9 million grant ($3 million state, $3 million

UT System, and $3 million industry match) as part of the State of Texas Emerging Technology Fund to formally expand activities in 3D Printed Electronics within the Keck Center. Subsumed in the Keck Center, the 3D Printed Electronics Laboratory is a one of kind laboratory that focuses on the design and fabrication of 3D electronic systems with enhanced AM systems that include additional processes for placing components and embedding conductors during AM process interruptions.

Investigating and developing commercialization opportunities for technology developed within the W.M. Keck Center for 3D Innovation.

ASICs Laboratory A 600 square foot laboratory dedicated to chip design and evaluation. Six cubicles with

high performance Linux machines loaded with all major chip design CAD packages (Cadence, Synopsys, Mentor) with 15 successful chips designed and fabricated including Single Event Upset tolerant chips, a chip for a local business and three to control a Navy magnetometer.

The lab has several collaborators with radiation capabilities including: Texas A&M’s Cyclotron Institute, White Sand Missile Range and Kirtland Air Force Base.

CONSULTING ACTIVITIES

Magma Design Automation Inc., 2005-2006Provided guidance in integrating PDAT software (co-founded start-up CAD software that integrated Built-in Self Test (BIST) circuits into ASIC chips with on-board SRAMs.

Envision Tec, Inc., Santa Clara, California 2005Provided expertise on multi-domain clocking with regards to automating clock gating.

nScrypt, Inc., Orlando, Florida 2007-2011Investigated multiple strategies for using additive manufacturing to produce 3D geometries with embedded electronics.

NASA’s Jet Propulsion Laboratory 2007Investigated detection of tampering during fabrication by providing fingerprinting.

nVision Biomedical, Inc. 2013Investigation of detection and identification of implants in the human body.

PROFESSIONAL SOCIETIES

Institute of Electrical and Electronic Engineering (Senior Member)American Society for Engineering Education (current)Tau Beta Pi and Sigma Xi (Honorary Societies)


PATENTS AND PATENT APPLICATIONS

1. “Voltage Controlled Oscillator Utilizing Threshold Voltage Control of Silicon-On-Insulator MOSFETs,” U.S. Patent 6,133,799, 2000.

2. “Silicon-On-Insulator Body-Contacted Dynamic Memory,” U.S. Patent 6,111,778, 2000. This patent was part of patent licensing agreement between IBM and both Sony and Toshiba and was discussed in the EE Times article entitled “Toshiba’s DRAM Cell piggybacks on SOI Wafer”.

3. “Clock Multiplexer for Dynamic Frequency Scaling,” U.S. Patent #6,886,106 2005.

4. “Push-Pull Amplifier for use in Generating a Reference Voltage” U.S. Patent Application 09/734,373.

5. “An Algorithm for Calculating the Redundancy Allocation for a Memory with Multi-Dimensional Redundancy” U.S. Patent Application 10/668,651. Central IP during the acquisition of PDAT Technologies (my start-up) by Magma Design Automation, Inc. Subsequently, Synopsys acquired Magma and elected to not pursue full patenting.

6. At least five patent applications underway focusing on different aspects of using 3D printing to fabricate electronics.

AWARDS AND HONORS

1. Best Paper, 25th Annual Solid Freeform Fabrication Symposium, Austin Texas, 20142. Outstanding Paper Award Winner at the Literati Network Awards for Excellence 20133. UTEP Department of Electrical and Computer Engineering

Significant Research Achievements 20134. UTEP Department of Electrical and Computer Engineering

Up and Coming Researcher 20105. UTEP Department of Electrical and Computer Engineering

Miguel Izquierdo Award for Teaching 20086. UTEP Office of Research and Sponsored Projects

Recognition of Obtaining External Funding for Research7. DARPA Design Subthreshold Logic Design Contest – “Low Voltage SEU-resilient Flip-Flop”

Winners received free fabrication in MIT Lincoln Labs 0.13u 300mV CMOS. Resulting chips were irradiated (Heavy Ions) at Texas A&M Cyclotron Institute. The UTEP design never failed due to soft errors while unprotected cells failed.

8. Faculty Fellowship, NASA Jet Propulsion Laboratory9. NASA JPL New Technology Award (NTA) 200510. Faculty Fellowship, SPAWAR, Office of Naval Research11. Tau Beta Pi and Sigma Xi


SCHOLARLY ACTIVITY (1060 citations, h-index 15, i-index 23 as of January 2016 from Google Scholar)

JOURNAL ARTICLES

1. Roberson D, Wicker R, MacDonald E. Ohmic Curing of 3D Printed Silver Interconnects for Structural Electronics. ASME Journal of Electronic Packaging. 2015

2. M. Liang, C Shemelya, E. MacDonald, R. Wicker, H. Xin, “3D Printed Microwave Patch Antenna via Fused Deposition Method and Ultrasonic Wire Mesh Embedding Technique”, IEEE Antennas and Wireless Propagation Letters, Issue 99, 2015.

3. S. Gaytan, M. Cadena, H. Karim, D. Delfin, Y. Lin, D. Espalin, E. MacDonald, R.B. Wicker, “Fabrication of barium titanate by binder jetting additive manufacturing technology”, Ceramics International, Elsevier, 2015.

4. C. Shemelya, A. Rivera, A. Torrado Perez, C. Rocha, M. Liang, X. Yu, C. Kief, D. Alexander, J. Stegeman, H. Xin, R. Wicker, E. MacDonald, D. Roberson, “Mechanical, Electromagnetic, and X-Ray Shielding Characterization of a 3D Printable Tungsten/Polycarbonate Polymer Matrix Composite for Space Based Applications,” Journal of Electronic Materials, 2014.

5. C. Shemelya, F. Cedillos, E. Aguillera, D. Muse, D. Espalin, R. Wicker, E. MacDonald “"Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3D Printing Applications," IEEE Sensors Journal, Vol. 15. Iss. 2, 2015.

6. D. Espalin, D. Muse, F. Medina, E. MacDonald, and R.B. Wicker, “3D Printing Multi-Functionality: Structures with Electronics,” International Journal of Advanced Manufacturing Technology, Volume 72, Issue 5-8, pp. 963-978, 2014.

7. A. J. Lopes, I. H. Lee, E. MacDonald1, R. Quintana, and R. Wicker, “Laser Curing of Silver-Based Conductive Inks for In Situ 3D Structural Electronics Fabrication in Stereolithography”, Journal Materials Processing Technology, Volume 214, Issue 9, pp. 1935-1945, 2014.

8. E. MacDonald; R. Salas; D. Espalin; M. Perez; E. Aguilera; D. Muse; R. Wicker, "3D Printing for the Rapid Prototyping of Structural Electronics," Access IEEE, Vol. 2, 2014.

9. J. Mireles, H.C. Kim, I.H. Lee, D. Espalin, F. Medina, E. MacDonald, and R.B. Wicker, “Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys,” Journal of Electronic Packaging, 2012.

10. D.A. Roberson, R.B. Wicker, and E. MacDonald, “Ohmic Curing of Printed Silver Conductive Traces,” Journal of Electronic Materials, Volume 41, Issue 9, pp. 2553-2566 2012.

11. R.B. Wicker and E.W. MacDonald, “Multi-Material, Multi-Technology Stereolithography,” Virtual and Physical Prototyping, Volume 7, Number 3, pages 181-194, 2012.

12. D.A. Roberson, R.B. Wicker, and E. MacDonald, “Microstructural Characterization of Electrically Failed Conductive Traces Printed from Ag Nanoparticle Inks,” Materials Letters, Volume 76, pp. 51-54, 2012.


13. A. Chavan, P. Palakurthi, E. MacDonald, J. Neff, E. Bozeman, “Heavy Ion Characterization of a Radiation Hardened Flip-Flop Optimized for Subthreshold Operation,” Journal of Low Power Electronics and Applications, March 2012.

An article about a DARPA contest-winning design and the subsequent fabrication at MIT Lincoln Labs and irradiation for soft errors at Texas A&M’s Cyclotron Institute.

14. A. Lopes, E. MacDonald, and R.B. Wicker, “Integrating Stereolithography and Direct Print Technologies for 3D Structural Electronics Fabrication,” Rapid Prototyping Journal, Volume 18, Issue 2, 2012, pages 129-143.

A seminal piece in the use of 3D Printing to fabricate electronics. Paper was chosen as an Outstanding Paper Award Winner at the Literati Network Awards for Excellence 2013.

15. M.D. Irwin, D. A. Roberson, R. I. Olivas, R. B. Wicker, and E. MacDonald, ”Conductive Polymer-Coated Threads as Electrical Interconnects in E-Textiles”, Journal of Intelligence Community Research and Development, permanently available on Intelink, 2012.

16. M.D. Irwin, D.A. Roberson, R.I. Olivas, R.B. Wicker and E. MacDonald, “Conductive Polymer-Coated Threads as Electrical Interconnects in e-Textiles,” Fibers and Polymers, Volume 12, Number 7, 2011, pages 904-910, 2011.

17. D.A. Roberson, R.B. Wicker, L.E. Murr, K. Church, and E. MacDonald, “Microstructural and Process Characterization of Conductive Traces Printed from Ag Particulate Inks,” Materials Letters, Volume 4, Issue 6, pages 963-979, 2011.

18. D.A. Roberson, E. MacDonald, K. Church, and R.B. Wicker, “Failure Investigation of Direct Write Pen Tips,” Journal of Failure Analysis and Prevention, Volume 10, Number 6, pages 504-507, 2010.

19. H. Kim, J.W. Choi, E. MacDonald, and R.B. Wicker, “Slice Overlap Detection Algorithm for Process Planning in Multiple Material Stereolithography,” International Journal of Advanced Manufacturing Technology, Volume 46, Issue 9, pp. 1161-1170, 2010.

20. J.W. Choi, E. MacDonald, R.B. Wicker, “Multi-Material Micro-stereolithography,” International Journal of Advanced Manufacturing Technology, Volume 49, Issue 5, pages 543-551, 2010.

21. E. MacDonald, N. Touba, “Delay Testing of Partially-Depleted Silicon-On-Insulator Integrated Circuits,” IEEE Transactions on VLSI, Oct, 2006.

22. K Nowka, G. Carpenter, E. MacDonald, H. Ngo, B. Brock, T. Nguyen. “A 32-bit PowerPC System-on-a-Chip with Support for Dynamic Voltage and Frequency Scaling,” IEEE Journal of Solid-State Circuits, Vol. 37, No.11, pp. 1441-1447, Nov 2002.

CONFERENCE AND OTHER PUBLICATIONS

1. M. Liang; Y. Xiaoju; Shemelya, C.; MacDonald, E.; H. Xin, "3D printed multilayer microstrip line structure with vertical transition toward integrated systems," Microwave Symposium, 2015 IEEE MTT-S International, pp.1-4, 17-22 May 2015.

2. M. Liang, C Shemelya, E. MacDonald, R. Wicker, H. Xin, “Fabrication of microwave patch antenna using additive manufacturing technique”, IEEE Radio Science Meeting, 2014.


3. W. M. Marshall, J. Stegeman, M. Zemba, A. Kwas, E. MacDonald, C. Shemelya, C. Kief, “Using Additive Manufacturing to Print a CubeSat Propulsion System,” AIAA Propulsion and Energy Forum.

4. C. M. Shemelya, M. Zemba, M. Liang, D. Espalin, C. Kief, H. Xin, E. W. MacDonald, R.B. Wicker, “3D PRINTING MULTI-FUNCTIONALITY: Embedded RF Antennas and Components,” The 9th European Conference on Antennas and Propagation, 2015.

5. Craig Kief, Jim Aarestad, Eric MacDonald, Corey Shemelya, David Roberson, Ryan Wicker, Andy M. Kwas, Mike Zemba, Keith Avery, Richard Netzer, William Kemp, “Printing Multi-Functionality: Additive Manufacturing for CubeSats,” Proceedings of the AIAA Space 2014 Conference and Exposition, San Diego, CA, August 4-7, 2014.

6. D. Roberson, C. Shemelya, E. MacDonald, R. Wicker, “Expanding the Applicability of FDM-Type Technologies through Materials Development”, Solid Freeform Fabrication Symposium, August 2014. One of 12 BEST PAPERs Award at the 25th annual symposium.

7. A. Kwas, E. MacDonald, C. J. Kief, R. Wicker, C. Soto, L. Bañuelos, J. Aarestad, B. Zufelt, J. D. Stegeman, C. Tolbert, “Printing Multi-Functionality: Additive Manufacturing for CubeSats”, AIAA SPACE 2014 Conference and Exposition, August 2014.

8. D. Espalin, M.A. Perez, E. MacDonald, R.B. Wicker, “Developing a Multi3D System for Aerospace Components with Embedded Electronics”, Solid Freeform Fabrication Symposium, August 2014.

9. P.A. Roddy, C.Y. Huang, J. Lyke, J. Baur, M. Durstock, E. MacDonald , “3D Printing for Spacecraft Multi-Functional Structures”, AGU Fall Meeting, 2013

10. M. Liang, X. Yu, C. Shemelya, D. Roberson, E. MacDonald, R. Wicker and H. Xin, "Electromagnetic materials of artificially controlled properties for 3D printing applications" Antennas and Propagation Society International Symposium, 2014.

11. M. Liang, C. Shemelya, E. MacDonald, R. Wicker and H. Xin "Fabrication of microwave patch antenna using additive manufacturing technique" Antennas and Propagation Society International Symposium, 2014.

12. C Shemelya, F Cedillos, E Aguilera, E Maestas, J Ramos, D Espalin, D Muse, R. Wicker E. MacDonald “3D printed capacitive sensors”, IEEE Sensors, 2013, Baltimore MD.

13. I. Santos, E. MacDonald, “Delay Insensitive logic with Increased Fault Tolerance and Optimized for Subthreshold Operation” IEEE SOI-3D Subthreshold Microelectronics Conference, 2013

14. D. Zubia, S. Almeida, A. Talukdara, J. Mireles, and E. MacDonald, “SnO2-based memristors and the potential synergies of integrating memristors with MEMS” proceedings of SPIE the international society for optical engineering, Vol. 8373, pp. 52, 2012.

15. C. Gutierrez, R. Salas, G. Hernandez, D. Muse, R. Olivas, E. MacDonald, M.D. Irwin, R.B. Wicker, K. Church, M. Newton and B. Zufelt, “CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing,” Proceedings from the IMAPS Symposium, Nov. 2011.


16. A. Chavan, P. Palakurthi, A. Kurian, E. Bozeman, J. Neff, E. MacDonald, “Heavy Ion Characterization of a Novel Radiation Hardened Flip-Flop at Sub- and Super- Threshold Voltage Operation”, IEEE Subthreshold Microelectronics Conference, September 26, 2011.

17. R. Baca, A. Chavan, M. Alamillo, P. Palakurthi, A. Kurian, E. Bozeman, J. Neff, E. MacDonald, “An Ultra Low Power Subthreshold Sigma Delta DAC”, IEEE Subthreshold Microelectronics Conference, September 26, 2011.

18. D. Richie, E. MacDonald, M. Markulik, J. Neff, E. Bozeman “Distributed Integrated Circuit Design”, DoD High Performance Computing Modernization Program User’s Group, May 2011.

19. A. Chavan, Eric MacDonald, Joe Neff, Eric Bozeman “Radiation Hardened Flip-Flop Design for Super and Sub Threshold Voltage Operation”, IEEE Aerospace Conference, March 2011.

20. R. Olivas, Rudy Salas, Dan Muse, Eric MacDonald, Ryan Wicker, “Structural Electronics through Additive Manufacturing and Micro-Dispensing” IMAPS Nationals Conference, Oct. 2010.

21. K. Church E. MacDonald, R. Wicker, “Multi-material Micro-stereolithography”, SPIE, Vol. 49, pp. 543-551, 2010.

22. M. Irwin, E. MacDonald, R. Wicker, “Electronics Embedded into Textiles”, Intelligence Community Post Doc Colloquium, April 2010.

23. D. Muse, S. Pritchard, E. MacDonald, K. Church, M. Newton, X. Chen R. Wicker, “Improvement of Adhesion and Reliability of Conductive Inks on Flexible Liquid Crystal Polymer Substrates”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.

24. M. Newton, D. Muse, S. Pritchard, E. MacDonald, K. Church, M. Newton, X. Chen R. Wicker, “Direct Print Technology for Fabricating Mechanical Sensors”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.

25. S. Castillo, D. Muse, E. MacDonald, R. Wicker, "Electronics Integration in Conformal Substrates Fabricated with Additive Manufacturing", Solid Freeform Fabrication Symposium, August 2009.

26. J.W. Choi, H.C. Kim, E. MacDonald, R. Wicker, "Slice Overlap Detection Algorithm for the Process Planning for Multiple Material Stereolithography", International Journal of Advanced Manufacturing Technology, in press.

27. D. Muse, E. MacDonald, K. Church, R. Wicker, “Reliability of Printed Conductors on Liquid Crystal Polymers”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.

28. X. Chen, D. Muse, D. Roberson, M. Alamillo, E. MacDonald, K. Church, R. Wicker, “Direct Printed Technology for Mechanical Strain Gauges”, International Microelectronic and Packaging Conference, San Francisco, CA November. 2009.

29. K. Church E. MacDonald, Patrick Clark, Frank Medina, Ryan Wicker, “Reliability of Printed Conductors on Flexible Substrates”, Materials Research Society, San Francisco, CA April. 2009.

30. E. MacDonald, Dan Muse, Misael Navarrete, Frank Medina, Ryan Wicker, “Enhancements to a 3D sensor Fabricated in Solid Freeform Fabrication”, IMAPS Workshop Orlando, Fl, Feb. 2009.

31. E. MacDonald, session chair, Digital Printing session, IMAPS Workshop Orlando, Fl, Feb. 2009.


32. E. MacDonald, Ken Church, Patrick Clark, Frank Medina, Ryan Wicker, “Flexible Hybrid Electronics using Direct Printing”, IEEE Flexible Electronics and Displays Conference, Feb. 2009.

33. E. DeNava, Misael Navarrete, Mohammed Alawneh, Silvia Castillo, Marlene Contreras, Dan Muse, Eric MacDonald and Ryan Wicker, “Three-Dimensional Off-Axis Component Placement and Routing for Electronics Integration using Solid Freeform Fabrication,” 18th Annual Solid Freeform Fabrication Symposium, University of Texas at Austin, August 6-8, 2008.

34. A. Chavan, E. MacDonald, J. Neff, N. Liu, “A Novel Floating Gate Circuit Family with Subthreshold Swing for Ultra-low Power Operation“, International Symposium on Circuits and Systems, Seattle, May 2008.

35. E. MacDonald, Ryan Wicker, “Advanced 3D Packaging using Solid Freeform Fabrication” Invited presentation at the Advanced Packaging Workshop, Kirtland Air Force Base, March 2008.

36. A. Biswas, J. Ferreira-Pinto, E. MacDonald, “Design of a Prototype for a Novel rehabilitative Device for Speech Through Multi-Modal Biomedical Feedback and Control,” Southwest Biomedical Engineering Conference, UTEP, May 2008.

37. A. Chavan, E. MacDonald, “Ultra-Low Voltage Level Shifters to Interface Sub and Super Threshold Reconfigurable Logic Cells,” IEEE Aerospace Conference, March 2008.

38. M. Navarrete, A. Lopes, J. Acuna, R. Estrada, E. MacDonald, J. Palmer, and R. Wicker, “Integrated Layered Manufacturing of a Novel Wireless Motion Sensor System with GPS,” 18th

Annual Solid Freeform Fabrication Symposium, University of Texas at Austin, August 6-8, 2007.

39. C. Robinson, B. Stucker, K. Coperich Branch, J. Palmer, B. Strassner, M. Navarrete A. Lopes, E. MacDonald, Frank Medina, and Ryan Wicker, “Fabrication of a Mini-SAR Antenna Array using Ultrasonic Consolidation and Direct Write,” 2nd International Conference on Rapid Manufacturing, Loughborough University, United Kingdom, July 11-12, 2007.

40. A. Chavan, G. Dukle, E. MacDonald, B. Graniello (Intel), “Robust Flip-Flop Design for Subthreshold Logic”, Reconfig 2006, IEEE Conference on Reconfigurable Computing, San Luis Potosi, Mexico, Sept. 2006

41. A. Lopes, M. Navarrete, F. Medina, J. Palmer, E. MacDonald, R. Wicker, “Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form,” Solid Freeform Fabrication Symposium, University of Texas at Austin, August 14-16, 2006.

42. D. Keymeulen (NASA JPL), I. Ferguson (NASA JPL), E. MacDonald, D. Foor, “Tuning of MEMS devices using Evolutionary Computation and Open Loop Frequency Response,” IEEE Aerospace Conference, March 2006.

43. E. MacDonald, S. Starks, S. Blake, “A Solar-Power Design competition to Inspire Interest in Engineering, Science and Mathematics of Pre-College Students” IEEE Aerospace Conference 2006 Conf., Mar. 2006.

44. B. Graniello, E. MacDonald, “Subthreshold Logic for Temperature-Sensitive MEMS”, TexMEMs 2005 Conference, El Paso, Oct. 2005.


45. B. Graniello, B. Rodriguez, A. Chavan, E. MacDonald, “Optimized Circuit Styles for Subthreshold Logic”, Electro 2005 Conf., Oct. 2005.

46. S. Starks, S. Blake and E. MacDonald, “Stimulating Pre-College Interest in Science, Engineering and Mathematics through Space-Oriented Activities,” ASEE Annual Conference, June 2005.

47. S. Starks, S. Blake and E. MacDonald, “An Overview of Space-Oriented Activities for K-12 Students,” 2005 ASEE-Gulf Southwest Conference, Corpus Christi, TX, March 2005.

48. K. Joshi, E. MacDonald, “Ripple Scan Clocking for Low Power Test”, VLSI Test Symposium, Monterey, CA, May 2005.

49. I. Ferguson (NASA JPL), E. MacDonald, D. Foor “Control of a MEMs Gyroscope”, IEEE Aerospace Conference, March 2005.

50. S. Ghosh, N. Touba, E. MacDonald, “Low-power Weighted Pseudo-random BIST Using Special Scan Cells”, Great Lakes Symposium on VSLI, May 2004.

51. D. Adams, R. Abbott, X. Bai, Eric MacDonald, “A Integrated Built-In Self Test Solution for Embedded Memories,” Invited Presentation, Memory Design and Test Workshop, , May 2004.

52. E. MacDonald, N. Touba, “Very Low Voltage Testing of SOI Integrated Circuits”. Proceedings of the VLSI Test Symposium, Apr 25-30, Monterrey, California, April 2002. Also presented in the Latin American Test Workshop in Montevideo, Uruguay Feb 2002.

53. K. Nowka, G. Carpenter, E. MacDonald, T. Ngo, B. Brock, K. Ishii, T. Burns, “A Frequency and Voltage Dynamically Scalable Processor”. In the proceedings of IEEE International Solid State Circuits Conference, pp. 480-481, San Francisco, California, February 2002.

54. E. MacDonald, N. Touba, “Testing Domino Circuits in SOI Technology,” Asian Test Symposium, Taipei, Taiwan, 2001.

55. E. MacDonald, N. Touba, “Delay Testing SOI Circuits: Challenges with the History Effect,” Proceedings of the International Test Conference, Oct 1999.


INVITED PRESENTATIONS

1. E. MacDonald, panelist “Future of 3D Printing”, E. MacDonald, Space 2.0, Infocast, Santa Clara, CA, September 2015.

2. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Talca, Curicó, Chile, August 3.

3. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Terapacá, Arica, Chile, June 28th. (Cancelled due to Chilean miner’s strike in Calama).

4. E. MacDonald, “3D Printing Multifunctionality”, Universidad de Concepción, Concepción, Chile, June 28th.

5. E. MacDonald, “3D Printing Multifunctionality”, Universidad Técnica Federico Santa María, Chile, June 12.

6. E. MacDonald, “3D Printing Research Overview of the University of Texas at El Paso”, Northrop Grumman, Space Park, LA, CA, April 8, 2015.

7. E. MacDonald, panelist “Frontiers in 3D Printing”, Additive Disruption, Infocast, San Jose, CA, March 8, 2015.

8. E. MacDonald, “3D Printing Multi-Functionality”, United Technologies Corporation (UTC) Additive Manufacturing Conference, Hartford, Connecticut, September, 2014.

9. E. MacDonald, “3D Printing Multi-Functionality: America Makes investment”, KITECH 3D Printing International Forum, Taegu, South Korea, July, 2014.

10. E. MacDonald, “3D Printing Multi-Functionality: Mechanical Structures with Electronics”, First Annual BITS Conference 2014, Dalian, People’s Republic of China, June 2014.

11. E. MacDonald, “Panel on Additive Manufacturing for Automotive Applications” MainForum 2014, Monterrey, Mexico, March 2014.

12. E. MacDonald, “Panel on Additive Manufacturing for Aerospace Applications” American Institute of Aeronautics and Astronautics ScienceTech 2014, Maryland, January 2014.

13. E. MacDonald, “3D Printing of Multi Functional Structures” IEEE Mexico, Saltillo, Mexico, November 2013.

14. E. MacDonald, “Printing Multi-Functionality: Structural with Electronics” Kirtland AFB, Albuquerque, August 2013.

15. E. MacDonald, “Texas Instruments Technology in 3D Printed Structural Electronics at the University of Texas at El Paso”, Texas Instruments’ Analog Design Summit, Dallas Texas, July 2013.

16. E. MacDonald, “Invited Lecture on Additive Manufacturing”, MIGAS Doctoral Summer School, Grenoble France, July 2010.

17. E. MacDonald, “Advanced 3D and Flexible Packaging” Invited presentation at a colloquium in the Department of Electrical and Computer Engineering, New Mexico State University, Las Cruces, New Mexico, April 2008.


RESEARCH ACTIVITY

SPONSORED POST-DOCTORAL SCHOLARS

1. Michael Irwin, Intelligence Community Post Doc Program – 2009 - 2011PhD Chemistry from Northwestern University. August 2009Appointed 2011 as tenure-track assistant professor at UTEP Department of Chemistry

2. Corey Shemelya, Intelligence Community Post Doc Program – 2013 - 2015PhD Electrical Engineering from Tufts University, May 2013.

GRADUATE STUDENTS COMPLETED

Ph.D. Students 1. Ameet Chavan Ph.D. in Computer Engineering, May 2010.

Dissertation title: “Robust Subthreshold Logic for Reconfigurable Architectures”- Appointed (Fall 2012) as a tenure track associate professor in the School of Electronics,

Sreenidhi Institute of Science and Technology, Hydrabad, India. -

2. David Roberson Ph.D. in Materials Science and Engineering, December 2011. Dissertation: “A Method for the Curing of Metal Particle Loaded Conductive Inks and Pastes”- Appointed (Fall 2012) as a tenure track assistant professor in the Department of

materials science and Metallurgy, The University of Texas at El Paso.- Awarded Air Force Office of Research Young Investigator Award, January 2014.

3. Praveen Palakurthi Ph.D. in Computer Engineering, December 2014. Dissertation: “Ultra-low Power Data Acquisition”- Working for INF Microsensors, San Diego, California developing Office of Naval Research

sensor technology in a start-up.

M.S. Students1. Kirti Joshi, MSEE, May 2005, working at Intel, Austin, TX2. Alfredo Perez, Jr., MSEE, Aug 2005, doctoral candidate at Texas A&M3. Ben Graniello, MSCE, Dec. 2005, working at Intel, Chandler AZ4. Gaurav Dukle, MSCE, May 2007, working at Intel, Folsom CA5. Rajashekar Kowdley, MSCE, Aug 2006, working at Micron, VI6. Jaime Gutierrez, MSEE, May 2007, working at Eaton in South Carolina7. Sergio Valezquez, MSEE, May 2007, working at Rockwell, IA8. Karla Enriquez, MSEE, May 2008, working at Intel, Chandler, AZ9. Giancarlo Rayas, MSEE, May 2008 working at Hawker Beechcraft, KS10. Victor Gutierrez, MSEE, May 2008, working at Intel, Chandler, AZ11. Misael Navarette, MSEE, Dec 2008, worked at Raytheon, Boston MA12. Jonathan Cervantes, MSEE, May 2009, working at UTEP


13. Sujith Chakra, MSEE Project 2010, working at Intel, Chandler, AZ14. Richard Olivas, MSEE, May 2010, working at Intel, Austin TX15. Miguel Alamillo, MSEE, May 2010, working at Intel, Chandler, AZ16. Ricardo Baca, MSEE, December 2010, working at Intel in Guadalajara, Mexico17. Matt Markulik, MSEE, December 2011, working Case New Holland, Pennsylvania.18. Dan Muse, MSEE, August 2012, working as a Research Engineer in Keck Center.19. Cassie Gutierrez, MSEE, May 2012, PhD student at the University of New Mexico.20. Rudy Salas, MSEE, May 2013, interning at Intel, Austin, TX.21. Ivan Santos, MSEE, December 2013, working at Texas Instruments, Dallas, TX.22. Adrian Melendez, MSEE, Dec. 2015, working at General Motors, Austin, TX23. Graciela Bribiescas, BSEE, Aug 2015 working at White Sands Missile Range, NM24. Karla Leyva, BSEE, Aug, 2015 Interned at CIA, working at Texas Instruments, Dallas, Tx

STUDENTS IN PROGRESS

Ph.D. Students1. Misael Navarrete (Ph.D. student in Electrical and Computer Engineering)

- Research: 3D Printed Antennas- Returned to school after 2 years at Raytheon in Boston, MA- Expected Graduation date of May 2017

2. Jonathan Cervantes (Ph.D. student in Electrical and Computer Engineering) - Research: Analog VLSI design and test- Expected Graduation date of May 2018

3. Callum Bailey (Ph.D. student in Electrical and Computer Engineering) - Research: 3D Printed Robotics- Undergraduate from Oxford in Chemistry, with five years of petroleum experience- Expected Graduation date of May 2018

M.S. Students1. Luis Bañuelos, MSEE, Dec. 2015, funded by UTRC2. Efrain Aguilera – 3D Printed motors and laser welding for interconnect


SPONSORED PROJECTS

I have raised over $3,800,000 of external funding (federal/industrial) as principal investigator and $12,00,000 including awards as Co-PI. Over $80,000,000 of proposed funding has been proposed over 100 proposals since arriving at UTEP in 2003 per UTEP’s research office database (a very conservative estimate excluding many informal venues like whitepapers).

1. Collaborative Research: Workforce Development Training - DoD (PI: Eric MacDonald) Agency: National Center Defense Manufacturing and Machining Period: 9/1/2011 through 4/31/2016Amount Requested: $134,000

2. Low Cost Industrial Multi3D Manufacturing System (PI: Ryan Wicker) Agency: America Makes (NAMII) Period: 8/1/2014 through 1/31/2017

Amount Requested: $2,000,000 (UTEP $1,000,000)

3. Collaborative Research: Design of Negative Stiffness Metamaterials (PI: Eric MacDonald) Agency: National Science Foundation Period: 11/1/2014 through 10/31/2017Amount Requested: $111,000

4. Collaborative Research: Investigation of Novel 3D Printing Technology for Microwave Frequency Applications (PI: Eric MacDonald)

Agency: National Science FoundationPeriod: 10/1/2014 through 9/30/2017Amount Requested: $180,000

5. Monolithic Fabrication of Multi-function Heterogeneous Systems (PI: Ryan Wicker) Agency: National Science FoundationPeriod: 6/1/2014 through 5/30/2015Amount Requested: $180,000

6. Investigation and Testing of Direct Manufacturing Technology for Aerospace Tooling (PI: Ryan Wicker)

Agency: Lockheed MartinPeriod: 3/1/2014 through 12/31/2015Amount Requested: $338,992

7. 3D Printing Multi-Functionality: AM for Aerospace Applications (PI: Ryan Wicker) Agency: America Makes (NAMII) Period: 3/1/2014 through 8/31/2015

Amount Requested: $2,469,114 (UTEP $660,000)

8. Printing the Complete CubeSat (PI, Eric MacDonald, UTEP, Craig Kief UNM) Agency: NASA through UNMPeriod: 9/18/2013 through 9/17/2015Amount Requested: $300,000 (UTEP $169,000)


9. Direct Digital Manufacturing For T700-701D Intermediate Maintenance (PI, Ryan Wicker) Agency: General Electric GlobalPeriod: 10-1-12 through 9-30-15Amount Requested: $900,000

10. e-Textile Applications – IC Post Doc (PI, Eric MacDonald) Agency: Intelligence CommunityPeriod: 6-1-13 through 5-31-15Amount Requested: $240,000

11. Implementation of Infrared Imaging Feedback in Electron Beam Melting (PI, Ryan Wicker, Co-PIs, Frank Medina, Eric MacDonald, Larry Murr)

Agency: Lockheed Martin CorporationPeriod: 4-1-11 through 5-31-12Amount Awarded: $139,865

12. For the Direct Print of Electromagnetically Responsive Structures (PI, Eric MacDonald, Co-PIs, Ryan Wicker, Ken Church)

Agency: Lockheed Martin Corporation Period: 3-1-10 through 5-31-13Amount Awarded: $463,835 (4 installments, $121269, $117,566, $125,000, and $100,000)

13. Electronics printed into textiles – IC Post Doc (PI, Eric MacDonald) Agency: Intelligence CommunityPeriod: 9-1-9 through 5-31-11Amount Requested: $240,000

14. Low Risk, Rapid Product Development using Additive Manufacturing for an Electronic Gaming Die (PI, Ryan Wicker, Co-PI, Eric MacDonald)

Agency: Loya Innovation FundPeriod: 9-1-11 through 8-31-12Amount Awarded: $50,000

15. Distributed Integrated Circuit Design (PI, Eric MacDonald) Agency: High Performance Technologies, Inc – PETTT Grant through Army Research Labs.Period: 3-5-10 through 8-31-11Amount Awarded: $160,304 (2 installments, $42,394 and $117,910)

16. Circuit Printing on Doubly Curved 3D Surfaces (PI, Eric MacDonald, Co-PIs, Ken Church and Ryan Wicker)

Agency: Lockheed Martin CorporationPeriod: 3-5-10 through 12-31-10Amount Awarded: $246,050 (2 installments, $124,800 and $121250)


17. Wearable Electronics with Conformal and Flexible Interconnect and Antennas – IC Post Doc (PI, Eric MacDonald, Co-PI, Ryan Wicker)

Agency: Department of Defense (Central Intelligence Agency through the National Geospatial Intelligence Agency)

Period: 7-1-09 through 9-6-11Amount Requested: $240,000

18. For the Development of Resistive Inkjet Inks (PI, Eric MacDonald, Co-PI, Ryan Wicker) Agency: Lockheed Martin CorporationPeriod: 5-1-09 through 12-10-09Amount Awarded: $185,000

19. Development of Emerging Technology Utilization Plan (PI, Ricardo Pineda, Co-PIs, Ryan Wicker, Larry Murr, Eric MacDonald, Ramana Chintalapalle, David Zubia, Oscar Salcedo)

Agency: Lockheed Martin CorporationPeriod: 11-15-08 through 12-20-08Amount Awarded: $200,000

20. Integrating Field Programmable Gate Arrays on Flexible, Thin and Layered Substrates (PI, Ken Church, nScrypt Inc., UTEP PI, Eric MacDonald, Co-PI, Ryan Wicker)

Agency: Department of Defense, Air Force SBIR Phase IIPeriod: 4-3-09 through 12-31-10Amount Awarded: $750,000 ($276,800 to UTEP)

21. Miniaturized 3D Embedded Electronics Integration (PI, Eric MacDonald, Co-PI, Ryan Wicker) Agency: Department of Defense (Space & Missile Defense Command through the Homeland

Protection Institute)Period: 10-1-07 through 3-22-10Amount Awarded: $847,828


PROFESSIONAL SERVICE ACTIVITY

PROPOSAL, JOURNAL, AND CONFERENCE REVIEWS

1. Proposal Reviewer, Agency for Innovation by Science and Technology, Flanders, Belgium.2. Journal Reviewer (3 paper), IEEE Transactions on Circuits and Systems-Part II.3. Journal Reviewer (1 paper), IEEE Journal of Display Technology.4. Journal Reviewer (1 paper), International Journal of Electronics Technology.5. Journal Reviewer (4 papers), IEEE Transactions of the VLSI.6. Journal Reviewer (1 paper), Journal of Reliable Computing.7. Journal Reviewer (2 papers), VLSI Test Symposium.8. Journal Reviewer (1 paper), AIP Biomicrofluidics.9. National Science Foundation, Nanotechnology Program Proposal Review Panel10. Fulbright Peer Review Southern Cone Region Committee – 2013-2016

DEPARTMENT SERVICE

1. Member, Computer Engineering Curriculum, Fall 2003-present2. Member, Computer Lab Equipment, Fall 2003 –present3. Member, Senior Design Committee – off an on over 10 years, many teams sponsored4. Chair, Department Remodeling Committee –Fall 2006 – Fall 20085. Chair, Department Award Committee –Fall 2006 – Fall 20096. Coordinator, Department Industrial Advisory Board, Fall 2006 – Fall 2008

COLLEGE SERVICE

1. Chair, College Key Strategic Direction in Graduate Studies, Fall 2005-Fall 20062. Chair, Faculty Search Committee, 2 positions, September 2009 – May 2010. 3. Chair, Faculty Search Committee 1 position, September 2013 – present.

UNIVERSITY SERVICE

1. Senator, University Faculty Senate, September 2008 – August 2010.2. Chair, Academic Policy Committee, September 2011 – August 2012.3. Member, Intellectual Property Council, June 2013-Present.

OTHER PROFESSIONAL SERVICE

1. TexMEMS publication Committee, UTEP workshop on MEMs, summer 20052. IEEE El Paso Branch Treasurer, 2003-present3. Member, Organizing Committee, IMAPS Advanced Technology Workshop on 3D and

Conformable Printed, Hilton Garden Inn, El Paso, Texas, February 22-23, 2012.4. Session Chair, Built-In Self Test session, International Test Synthesis Workshop, March 2009.5. Session Chair, Digital Printing session, IMAPS Workshop Orlando, FL, Feb. 2009.6. Coordinating Chair, 3D Printing Multi-functionality session, International Symposium on

Flexible Automation, Hyogo, Japan, 2013.7. Deputy Editor of Elsevier Journal, Additive Manufacturing8. Session Chair, Printed Electronics, Defense Manufacturing Conference, December 2014.

Documents

Ryan B. Wicker, Ph.D. - Faculty Profiles - The University of ...hb2504.utep.edu/vitas/emac.docx · Web viewCo-founded start-up focused on specializing in self-test (Built-in Self