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Ribbon Cutting Ceremony
Microelectronics Process Engineering Laboratory
College of Engineering September 25, 2003
Microelectronics Process Engineering Program Highlights
• BS degree curriculum• Fab-based courses• Enhancements to traditional BS curricula• Workforce development activities
Current process capabilities
Metal Depositionand Etch
DiffusionandOxidation
Photo-lithography
OxideRIE
Wet ChemEtch/Clean
Intel
Applied Materials
NovellusAMDCypress
Quintel
Current design facilities
• Hardware:– 500MHz Logic Analyzer– 40 Sun workstations– 280 Sunfire server
• CAD Software– Cadence Design Systems– Synopsys– Silvaco
Student Impact 2000-03ProE Courses
• Basic IC Processing (EE/MatE129)
– Fabricate and test devices
– NMOS technology
– 207 students
• Advanced Thin Film Processes (MatE/ChE166)
– Statistics/DOE
– Metrology and thin film dep/etching
– 32 students
• Microelectronics Mfgr Methods (EE/MatE167)
– CMOS technology/SPC
– Sea of Gates developed
– 37 students
Student Impact 2000-03Related Courses
• Electronic Design I (EE122)– Pilot study in which students designed
a current mirror• Introduction to Engineering (E10)
– Solar cell testing– 500 students/year
• Electronic Properties of Materials (MatE153)– Solar cell processing– 300 students/year
• Introduction to Materials (MatE25)– Lithography (souvenirs)– 250 student/year
Research Activity
• LDMOS devices• Nitride Gate oxide• MEMs projects• RIE characterization• Photovoltaics• Internships
Impact 2000-03Workforce Development
• Creating interest in semiconductor technology and engineering
• High school/community college instructor workshop
• SEMI’s Workforce Development Institute Workshop (HS students)
• Community college class visits• Discover Camp (high school students)
Next Big Things
• Addition of CVD/polysilicon growth – Allow self-aligned gate technology– Reduction in mask set– Allow Analog Leaf Cell manufacture entirely in-house – Allow MEMs research – Enhanced materials science component
• Analog-Mixed Signal (AMS) designs – very sensitive to manufacturing variations– Students will do design/manufacture/test– Enhancement to EE curriculum
• Materials Characterization Facility