RF-ZM-SL01 Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee ...RF-ZM-SL01 V1.0 - Jan., 2020 Shenzhen RF-star Technology Co., Ltd. Page 3 of 22 operation - 2 × Watchdog Timer with

RF-ZM-SL01 Low-Power 2.4 GHz IEEE

802.15.4 and ZigBee Module

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

Jan. 19th, 2020

RF-ZM-SL01

www.szrfstar.com V1.0 - Jan., 2020

Shenzhen RF-star Technology Co., Ltd. Page 1 of 22

ZigBee Module List

Chipset Core FLASH

(KB)

RAM

(KB) Model Antenna

Dimension

(mm)

TX

Power

(dBm)

Range

(M) Photo

CC2530 8051 256 8

XZZ-TIM2 PCB /

IPEX 18 34.4 20

PCB: 1000

IPEX: 1500

XZZ-TIM3 PCB /

IPEX 16 26.2 4.5

PCB: 400

IPEX: 600

XZZ-TIM4 PCB /

IPEX 16 26.2 20

PCB: 1000

IPEX: 1500

WE1005 PCB 16 22 4.5 300

RF-ZM-1338A PCB /

IPEX 16.8 22 3

PCB: 300

IPEX: 450

RF-ZM-1738A PCB /

IPEX 16.8 27.9 17

PCB: 550

IPEX: 850

RF-ZM-TI01 PCB 15.1 22.3 4.5 300

EFR32

MG1B232 M4 256 32

3B32_V102 PCB /

IPEX 14.8 20.4 19.5

PCB: 1000

IPEX: 1500

RF-ZM-SL01 PCB 14 21 19.5 1000

Note:

1. The communication distance is the longest distance obtained by testing the module's maximum transmission power

in an open and interference-free environment in sunny weather.

2. Click the picture to buy modules.

3. All modules with PCB antenna and IPEX connector are dispatched with PCB antenna only by default. If IPEX

connector is needed, pls check with me before quotation.

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RF-ZM-SL01



1 Device Overview

1.1 Description

RF-ZM-SL01 module is based on EFR32MG1B232F256GM32-C0 of Silicon Labs. The EFR32MG1B232F256GM32-C0

is a true system-on-chip (SoC) solution for ZigBee, Thread and multiprotocol, and it supports the following modulation

formats: 2/4 (G)FSK with fully configurable shaping, BPSK / DBPSK TX, OOK / ASK, shaped OQPSK / (G)MSK,

configurable DSSS and FEC. The module enables industry-leading energy efficiency, ultra-fast wakeup times, a scalable

power amplifier and no-compromise MCU. It integrates 32-bit ARM Cortex-M4 core with 40 MHz maximum operating

frequency, PA with up to +19.5 dBm and balun.

1.2 Key Features

• Low Power Wireless System-on-Chip

- High-performance 32-bit 40 MHz ARM

Cortex®-M4 with DSP instruction and floating-

point unit for efficient signal processing

- Embedded Trace Macrocell (ETM) for

advanced debugging

- Flash: 256 KB

- RAM: 32 KB

- 2.4 GHz radio operation

- Transmit power: up to 19 dBm

• Supported Modulation Formats

- 2/4 (G)FSK with fully configurable shaping

- PSK / DBPSK TX

- OOK / ASK

- Shaped OQPSK / (G)MSK

- Configurable DSSS and FEC

• Supported Protocols

- ZigBee

- Thread

• Wide Operation Range

- Power supply: 1.8 V ~ 3.8 V

- Integrated DCDC, down to 1.8 V output with

up to 200 mA load current for system

- Standard temperature range: -40 ℃ ~+85 ℃

• Peripherals

- 12-bit 1 Mbps SAR Analog to Digital

Converter (ADC)

- 2 × Analog Comparator (ACMP)

- 2 × Digital to Analog Converter (VDAC)

- 3 × Operational Amplifier (Opamp)

- Digital to Analog Current Converter (IDAC)

- Low-Energy Sensor Interface (LESENSE)

- Multi-channel Capacitive Sense Interface

(CSEN)

- Up to 54 pins connected to analog channels

(APORT) shared between analog peripherals

- Up to 65 general purpose I/O pins with output

state retention and asynchronous interrupts

- 8 Channel DMA Controller

- 12 Channel peripheral Reflex System (PRS)

- 2 × 16-bit Timer / Counter

3 or 4 Compare / Capture / PWM

channels

- 2 × 32-bit Timer / Counter

3 or 4 Compare / Capture / PWM

channels

- 32-bit Real Time Counter and Calendar

- 16-bit Low Energy Timer for waveform

generation

- 32-bit Ultra Low Energy Timer / Counter for

periodic wake-up from any Energy Mode

- 3 × 16-bit Pulse Counter with asynchronous

http://www.szrfstar.com/

RF-ZM-SL01



operation

- 2 × Watchdog Timer with dedicated RC

oscillator

- 4 × Universal Synchronous / Asynchronous

Receiver / Transmitter (UART / SPI /

SmartCard (ISO 7816) / IrDA / I2S)

- Low Energy UART (LEUARTTM)

- 2 × I2C interface with SMBus support and

address recognition in EM3 Stop

• Low Energy Consumption

- RX current at 250 kbps, DSSS-OQPSK, 2.4

GHz: 10.8 mA

- RX current at 1 Mbps, GFSK, 2.4 GHz: 10.0

mA

- TX current at 0 dBm, 2.4 GHz: 8.5 mA

- 70 μA/MHz in Active Mode (EM0)

- 1.5 μA EM2 DeepSleep current (16 kB RAM

retention and RTCC running from LFRCO)

- Wake on Radio with signal strength detection,

preamble pattern detection, frame detection

and timeout

• High Receiver Performance

- -94.8 dBm sensitivity at 1 Mbit/s GFSK, 2.4

GHz

- -91.3 dBm sensitivity at 2 Mbit/s GFSK, 2.4

GHz

- -102.7 dBm sensitivity at 250 kbps DSSS-

OQPSK, 2.4 GHz

1.3 Applications

• IoT multi-protocol device

• Connected home

• Lighting

• Health and wellness

• Metering

• Home automation

• Building automation

• Security

1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-ZM-SL01

12 GPIOs

Reset

LC Balun Antenna Matching

38.4 MHz

Power Filter

EFR32 PCB Antenna

IPEX Connector

Power Supply 2.3 V ~ 3.6 V


RF-ZM-SL01



1.5 Part Number Conventions

The part numbers are of the form of RF-ZM-SL01 where the fields are defined as follows:

Figure 2. Part Number Conventions of RF-ZM-SL01

RF ZM SL

Company Name

RF-STAR

Wireless Type

ZigBee Module

Chipset Manufacturer

Silicon Labs

- - 01

Module Version

The First Version


RF-ZM-SL01



Table of Contents

ZigBee Module List ............................................................................................................................................................ 1

1 Device Overview ............................................................................................................................................................. 2

1.1 Description ............................................................................................................................................................ 2

1.2 Key Features ....................................................................................................................................................... 2

1.3 Applications .......................................................................................................................................................... 3

1.4 Functional Block Diagram .............................................................................................................................. 3

1.5 Part Number Conventions .............................................................................................................................. 4

Table of Contents ................................................................................................................................................................ 5

Table of Figures ................................................................................................................................................................... 6

Table of Tables ..................................................................................................................................................................... 6

2 Module Configuration and Functions ...................................................................................................................... 7

2.1 Module Parameters ........................................................................................................................................... 7

2.2 Module Pin Diagram ......................................................................................................................................... 8

2.3 Pin Functions ....................................................................................................................................................... 8

3 Specifications ................................................................................................................................................................. 10

3.1 Recommended Operating Conditions ..................................................................................................... 10

3.2 Handling Ratings .............................................................................................................................................. 10

3.3 Power Consumption ....................................................................................................................................... 10

3.3.1 3.3 V without DC-DC Converter .................................................................................................... 10

3.3.2 3.3 V with DC-DC Converter .......................................................................................................... 11

3.4 RF Characteristics ........................................................................................................................................... 12

3.4.1 Transmitter ............................................................................................................................................. 12

3.4.2 Receiver ................................................................................................................................................. 13

4 Application, Implementation, and Layout ............................................................................................................. 15

4.1 Module Photos .................................................................................................................................................. 15

4.2 Recommended PCB Footprint .................................................................................................................... 15

4.3 Schematic Diagram ......................................................................................................................................... 16

4.4 Basic Operation of Hardware Design ...................................................................................................... 16

4.5 Trouble Shooting .............................................................................................................................................. 18

4.5.1 Unsatisfactory Transmission Distance ........................................................................................ 18


RF-ZM-SL01



4.5.2 Vulnerable Module .............................................................................................................................. 18

4.5.3 High Bit Error Rate ............................................................................................................................. 18

4.6 Electrostatics Discharge Warnings ........................................................................................................... 18

4.7 Soldering and Reflow Condition ................................................................................................................. 19

4.8 Optional Packaging ......................................................................................................................................... 20

6 Revision History ............................................................................................................................................................ 21

7 Contact Us ....................................................................................................................................................................... 22

Table of Figures

Figure 1. Functional Block Diagram of RF-ZM-SL01 .................................................................................. 3

Figure 2. Part Number Conventions of RF-ZM-SL01 .................................................................................. 4

Figure 3. Pin Diagram of RF-ZM-SL01 ............................................................................................................. 8

Figure 4. Photos of RF-ZM-SL01 ...................................................................................................................... 15

Figure 5. Recommended PCB Footprint of RF-ZM-SL01 (mm) ............................................................ 15

Figure 6. Schematic Diagram of RF-ZM-SL01 ............................................................................................ 16

Figure 7. Recommendation of Antenna Layout ........................................................................................... 17

Figure 8. Recommended Reflow for Lead Free Solder ............................................................................ 19

Figure 9. Optional Packaging Mode ................................................................................................................. 20

Table of Tables

Table 1. Parameters of RF-ZM-SL01 ................................................................................................................. 7

Table 2. Pin Functions of RF-ZM-SL01............................................................................................................. 8

Table 3. Recommended Operating Conditions of RF-ZM-SL01 ........................................................... 10

Table 4. Handling Ratings of RF-ZM-SL01 ................................................................................................... 10

Table 5. Power Consumption 3.3 V without DC-DC Converter ............................................................. 10

Table 6. Power Consumption 3.3 V with DC-DC Converter ................................................................... 11

Table 7. Table of RF Transmitter ....................................................................................................................... 12

Table 8. Table of RF Receiver ............................................................................................................................ 13

Table 9. Temperature Table of Soldering and Reflow ................................................................................ 19


RF-ZM-SL01



2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-ZM-SL01

Chipset Silicon Labs: EFR32MG1B232F256GM32-C0

Supply Power Voltage 2.3 V ~ 3.6 V, recommended to 3.3 V

Frequency 2400 MHz ~ 2483.5 MHz

Transmit Power -30.0 dBm ~ +19.5 dBm

Receiving Sensitivity -98 dBm

Crystal 38.4 MHz

RAM 32 KB

Flash 256 KB

Package SMT Packaging

Frequency Error ±20 kHz

Dimension 21.0 mm x 14.0 mm x (1.7± 0.1) mm

Type of Antenna PCB antenna

Operating Temperature -40 ℃ ～ +85 ℃

Storage Temperature -40 ℃ ～ +125 ℃

RX Current (1 Mbps GFSK) 8.7 mA

RX Current (250 kbps 0-QPSK DSSS) 9.8 mA

TX Current @ 0 dBm 8.2 mA

Deep Sleep Mode 5.5 µA


RF-ZM-SL01



2.2 Module Pin Diagram

Figure 3. Pin Diagram of RF-ZM-SL01

2.3 Pin Functions

Table 2. Pin Functions of RF-ZM-SL01

Pin Name Chip Pin Pin Type Description

1 GND GND GND Ground

2 VCC VCC SYS_POWER Power supply: 2.3 V ~ 3.6 V. Recommended to 3.3 V.

3 PD13 PD13 GPIO GPIO (5V)



6 PA0 PA0 GPIO GPIO, UART_TX

7 PA1 PA1 GPIO GPIO, UART_RX

8 PB11 PB11 GPIO GPIO (5V), PTLDATA

9 PB12 PB12 GPIO GPIO (5V)




RF-ZM-SL01



12 IOVDD IOVDD I/O_POWER Digital IO power supply

13 VDCDC DVDD Internal DCDC Internal DCDC out 1.8 V


15 PF2 PF2 GPIO GPIO (5V)

16 PF3 PF3 GPIO GPIO (5V)

17 PC10 PC10 GPIO GPIO (5V)

18 PC11 PC11 GPIO GPIO (5V)

19 SWC PF0 SWCLK Debugger SWCLK

20 SWD PF1 SWDIO Debugger SWDIO

21 RES RESETn RESET Reset. Active low.


23 EXT_ANT EXT_ANT External Antenna Connect to the external antenna



RF-ZM-SL01



3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of RF-ZM-SL01

Items Condition Min. Typ. Max. Unit

Operating Supply Voltage Battery Mode 2.3 3.3 3.6 V

Operating Temperature / -40 +25 +85 ℃

Environmental Hot Pendulum / -20 +20 ℃/min

3.2 Handling Ratings

Table 4. Handling Ratings of RF-ZM-SL01

Items Condition Min. Typ. Max. Unit

Storage Temperature Tstg -40 +25 +125 ℃

Human Body Model HBM ±2000 V

Moisture Sensitivity Level 2

Charged Device Model ±500 V

3.3 Power Consumption

3.3.1 3.3 V without DC-DC Converter

Table 5. Power Consumption 3.3 V without DC-DC Converter

Measured on the RF-ZM-SL01 reference design with TA = 25 ℃, VDD = 3.3 V, unless otherwise noted.

Boldface limits apply over the entire operating range, TA = –40°C to +85°C, VDD = 2 V to 3.6 V, and fc = 2400 MHz to

2483.5 MHz.

Parameter Test Conditions Min. Typ. Max. Unit

IACTIVE

Current consumption in

EM0 mode with all

peripherals disabled

38.4 MHz crystal, CPU running while

loop from flash1 130 µA/MHz

IEM1


EM1 mode with all

peripherals disabled

38.4 MHz crystal1 65 µA/MHz

IEM2 Current consumption in Full 32 kB RAM retention and RTCC 3.3 µA


RF-ZM-SL01



EM2 mode running from LFXO

IEM3 Current consumption in

EM3 mode

Full 32 kB RAM retention and

CRYOTIMER running from ULFRCO 2.8 6 µA

IEM4H Current consumption in

EM4H mode

128 byte RAM retention, RTCC

running from LFXO 1.1 µA

128 byte RAM retention,

CRYOTIMER running from ULFRCO 0.65 µA

128 byte RAM retention, no RTCC 0.65 1.3 µA

IEM4S Current consumption in

EM4S mode No RAM retention, no RTCC 0.04 0.11 µA

Note:

1. CMU_HFXOCTRL_LOWPOWER=0.

3.3.2 3.3 V with DC-DC Converter

Table 6. Power Consumption 3.3 V with DC-DC Converter



2483.5 MHz.


IACTIVE_DCM


EM0 mode with all

peripherals disabled,

DCDC in low Noise DCM

mode2



IACTIVE_CCM


EM0 mode with all


DCDC in low Noise CCM

mode1



IEM1_DCM


EM1 mode with all


DCDC in low Noise DCM

38.4 MHz crystal1 49 µA/MHz


RF-ZM-SL01



mode2

IEM2


EM2 mode, DCDC in LP

mode3

Full 32 kB RAM retention and RTCC


IEM3 Current consumption in

EM3 mode

Full 32 kB RAM retention and


IEM4H Current consumption in

EM4H mode

128 byte RAM retention, RTCC


128 byte RAM retention,


128 byte RAM retention, no RTCC 0.58 µA

IEM4S Current consumption in

EM4S mode No RAM retention, no RTCC 0.04 µA

Note:

1. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD.

2. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=4), ANASW=DVDD.

3. DCDC Low Power Mode = Medium Drive (PFETCNT=NFETCNT=7), LPOSCDIV=1, LPCMPBIAS=0,

LPCLIMILIMSEL=1.

4. CMU_HFXOCTRL_LOWPOWER=0.

3.4 RF Characteristics

3.4.1 Transmitter

Table 7. Table of RF Transmitter



2483.5 MHz.


POUTMAX Maximum TX power PAVDD connected directly to

external 3.3 V supply 19.5 dBm

POUTMIN Minimum active TX

power CW -30 dBm

POUTSTEP Output power step size -5 dBm output power 0 dBm 1 dB

0 dBm output power 0.5 dB


RF-ZM-SL01



POUTMAX

POUTVAR-V Output power variation

vs supply at POUTMAX

1.85 V VVREGVDD 3.3 V

PAVDD connected directly to

external supply, for output

power > 10.5 dBm

4.5 dB

1.85 V VVREGVDD 3.3 V using

DCDC converter

2.2 dB

POUTVAR_T

Output power variation

vs temperature at

POUTMAX

From 40 ℃ to +85 ℃, PAVDD

connected to DCDC output 1.5 dB


connected to DCDC output 2.2 dB


connected to external supply 1.5 dB


connected to DCDC external

supply

3.4 dB

POUTVAR_F

Output power variation

vs RF frequency at

POUTMAX

-over RF tuning frequency range 0.4 dB

FRANGE RF tuning frequency

range 2400 2483.5 MHz

3.4.2 Receiver

Table 8. Table of RF Receiver


FRANGE RF tuning frequency

range 2400 2483.5 MHz

SPURRX Receive mode maximum

spurious emission

30 MHz to 1 GHz -57 dBm

1 GHz to 12 GHz -47 dBm

SPURRX_FCC

Max spurious emissions

during active receive

mode, per FCC Part

216 MHz to 960 MHz, conducted

measurement -55.2 dBm

Above 960 MHz, conducted -47.2 dBm


RF-ZM-SL01



15.109 (a) measurement

RFSENSETRIG Level above which

RFSENSE will trigger2 CW at 2.45 GHz -24 dBm

RFSENSETHRES Level below which

RFSENSE will trigger2 CW at 2.45 GHz -50 dBm

SENS2GFSK 1 % PER sensitivity 2 Mbps 2GFSK signal1 -89.2 dBm

250 kbps 2GFSK signal -99.1 dBm

Note:

1. Channel at 2420 MHz will have degraded sensitivity. Sensitivity could be as high as -83 dBm on this channel.

2. RFSENSE performance is only valid from 0 ℃ to 85 ℃. RFSENSE should be disabled outside this temperature

range.


RF-ZM-SL01



4 Application, Implementation, and Layout

4.1 Module Photos

Figure 4. Photos of RF-ZM-SL01

4.2 Recommended PCB Footprint

Figure 5. Recommended PCB Footprint of RF-ZM-SL01 (mm)


RF-ZM-SL01



4.3 Schematic Diagram

Figure 6. Schematic Diagram of RF-ZM-SL01

4.4 Basic Operation of Hardware Design

1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and

the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the

power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the

power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.

4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.

If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top

Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital


RF-ZM-SL01



part of module and routed in the Bottom Layer (all copper is well grounded).

5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer

or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect

the module performance. It is recommended to stay away from the module according to the strength of the

interference. If circumstances permit, appropriate isolation and shielding can be done.

7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended

to stay away from the module according to the strength of the interference. If circumstances permit, appropriate

isolation and shielding can be done.

8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for

example: USB 3.0.

9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the

antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality

antenna extension wire can be used to extend the antenna to the outside of the case.

10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

11. The recommendation of antenna layout.

The inverted-F antenna and IPEX connector position on PCB is free space electromagnetic radiation. The location

and layout of antenna is a key factor to increase the data rate and transmission range.

Therefore, the layout of the module antenna location and routing is recommended as follows:

（1） Place the antenna on the edge (corner) of the PCB.

（2） Make sure that there is no signal line or copper foil in each layer below the antenna.

（3） It is the best to hollow out the red part of the antenna position in the following figure so as to ensure that S11

of the module is minimally affected.

Figure 7. Recommendation of Antenna Layout

Note: The hollow-out position is based on the antenna used.


RF-ZM-SL01



4.5 Trouble Shooting

4.5.1 Unsatisfactory Transmission Distance

1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.

Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The

performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to

the ground.

2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.

3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the

metal shell.

4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The

higher the data rate, the closer the distance.

5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower

the voltage, the smaller the power is.

6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.

4.5.2 Vulnerable Module

1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.

3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.

If there is no special demand, it is not recommended to use at too high or too low temperature.

4.5.3 High Bit Error Rate

1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or

modify the frequency and channel to avoid interferences.

2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.

3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

4.6 Electrostatics Discharge Warnings

The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions

below:

1. According to the anti-static measures, bare hands are not allowed to touch modules.

2. Modules must be placed in anti- static areas.

3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.

Static may result in the degradation in performance of module, even causing the failure.


RF-ZM-SL01



4.7 Soldering and Reflow Condition

1. Heating method: Conventional Convection or IR/convection.

2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5

3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.

4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.

5. Peak temperature: 245 ℃.

Table 9. Temperature Table of Soldering and Reflow

Profile Feature Sn-Pb Assembly Pb-Free Assembly

Solder Paste Sn63 / Pb37 Sn96.5 / Ag3.0 /

Cu0.5

Min. Preheating Temperature (Tmin) 100 ℃ 150 ℃

Max. Preheating Temperature (Tmax) 150 ℃ 200 ℃

Preheating Time (Tmin to Tmax) (t1) 60 s ~ 120 s 60 s ~ 120 s

Average Ascend Rate (Tmax to Tp) Max. 3 ℃/s Max. 3 ℃/s

Liquid Temperature (TL) 183 ℃ 217 ℃

Time above Liquidus (tL) 60 s ~ 90 s 30 s ~ 90 s

Peak Temperature (Tp) 220 ℃ ~ 235 ℃ 230 ℃ ~ 250 ℃

Average Descend Rate (Tp to Tmax) Max. 6 ℃/s Max. 6 ℃/s

Time from 25 ℃ to Peak Temperature (t2) Max. 6 minutes Max. 8 minutes

Time of Soldering Zone (tP) 20±10 s 20±10 s

Figure 8. Recommended Reflow for Lead Free Solder


RF-ZM-SL01



4.8 Optional Packaging

Figure 9. Optional Packaging Mode

Note: Default tray packaging.


RF-ZM-SL01



6 Revision History

Date Version No. Description Author

2016.09.27 V1.0 The initial version is released. Aroo Wang

2018.08.02 V1.0 Update company address. Aroo Wang

2020.01.19 V1.0 Add ZigBee module list. Sunny Li

Note:

1. The document will be optimized and updated from time to time. Before using this document, please make sure it is

the latest version.

2. To obtain the latest document, please download it from the official website: www.szrfstar.com.


RF-ZM-SL01



7 Contact Us

SHENZHEN RF-STAR TECHNOLOGY CO., LTD.

Shenzhen HQ:

Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China

Tel.: 86-755-3695 3756

Chengdu Branch:

Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000

Tel.: 86-28-6577 5970

Email: [email protected], [email protected]

Web.: www.szrfstar.com

http://www.szrfstar.com/mailto:[email protected]://www.szrfstar.com/

ZigBee Module List1 Device Overview1.1 Description1.2 Key Features1.3 Applications1.4 Functional Block Diagram1.5 Part Number Conventions

Table of ContentsTable of FiguresTable of Tables2 Module Configuration and Functions2.1 Module Parameters2.2 Module Pin Diagram2.3 Pin Functions

3 Specifications3.1 Recommended Operating Conditions3.2 Handling Ratings3.3 Power Consumption3.3.1 3.3 V without DC-DC Converter3.3.2 3.3 V with DC-DC Converter

3.4 RF Characteristics3.4.1 Transmitter3.4.2 Receiver

4 Application, Implementation, and Layout4.1 Module Photos4.2 Recommended PCB Footprint4.3 Schematic Diagram4.4 Basic Operation of Hardware Design4.5 Trouble Shooting4.5.1 Unsatisfactory Transmission Distance4.5.2 Vulnerable Module4.5.3 High Bit Error Rate

4.6 Electrostatics Discharge Warnings4.7 Soldering and Reflow Condition4.8 Optional Packaging

6 Revision History7 Contact Us

Documents

RF-ZM-SL01 Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee ...RF-ZM-SL01 V1.0 - Jan., 2020 Shenzhen RF-star Technology Co., Ltd. Page 3 of 22 operation - 2 × Watchdog Timer with