James L. Dale116 Gerard DriveGoleta, CA 93117(805) 450-7210

An experienced semiconductor professional seeking full time employment with an organization that can fully utilize my expertise in moving new products and processed from R&D into volume production. My strengths are production line and yield management. I started in the semiconductor business in 1985 at Micron Technology. At that time there were only 600 employees. We had very poor quality and had to learn and develop what is now called Six Sigma practices on our own. Twenty years later the company had over 12,000 employees and manufacturing lines across the world with a capacity of over 50,000 wafers a week.

I am proficient with all Microsoft Office products, JMP statistical analysis software, and have recently started using Coventor MEMs Finite Elemental Analysis software.

References available on request.

Work Experience

2016 - Present FLIR Systems – Process Integration Manager

Management of an engineering group responsible for yield improvement of wafer based processes for uncooled infrared products. Create and execute the uncooled technology roadmap. This includes working with foundries and equipment supplies to plan capital spending to meet the yield and cost targets for all uncooled products.

2009 – 2016 FLIR Systems – Senior Process Development Engineer

Responsibilities include foundry engineering support and yield improvement for all uncooled infrared products. Research and Development of new uncooled IR detection technologies. Lead pixel process design engineer for uncooled IR products.

Major Accomplishments: Developed a production method for Vanadium Oxide deposition that greatly improves wafer to wafer repeatability, wafer throughput, and elimination of reworks.

Successful development, qualification, and production ramp of a 12um microbolometer process within 18 months.

Co-Inventor on multiple patents related to uncooled IR detection process technology and pixel design.

2007 – 2009 AMIS and ON Semiconductor - Technology Research and Design Engineer

Responsibilities included transfer, startup, and qualification of proprietary process technology in ON Semi production lines. Foundry customer support technical contact. Technology lead for Defense Department research projects related to process technology.

Major Accomplishments: Successful process transfer and qualification of a 25um microbolometer process.

1985 – 2007 Micron Semiconductor – Process Integration Engineer, Adv. DRAM Group, and others.

2003 – 2007: Senior Process Integration Engineer (Advanced DRAM) – Responsible for development and qualification of 78nm DRAM technology. Worked with a team of eleven engineers and technicians to develop a 78nm DRAM process technology on 200mm substrates and then transfer and qualify the process at two locations on 300mm substrates. Project completed six months ahead of schedule, first 300mm production wafers achieved yields of 90%.

Major Accomplishments:

Co-author for VLSI paper “A 78nm 6F2 DRAM technology for multigigabit densities”

2002 – 2003: Process Integration Engineer (Japan) – Responsible for transfer and qualification of 0.13um 8 feature squared and 6 feature squared DRAM architectures to the Japan production line.

Major Accomplishments: Determined root cause of variable retention time failures which delayed production qualification by six months.

1995 – 1998: Plasma Etch Section Manager (R&D DRAM pilot production line) – Responsible for all aspects of R&D plasma etch area. Managed a staff of 30+ process and equipment engineers, and technicians.

Major Accomplishments: Established equipment and process monitoring methods in the newly established R&D pilot production line. This became the benchmark for all other process sections.

1998 – 2001: Process Integration Engineer (Technology Transfer) – Responsible for transferring and qualifying Microns’ DRAM process technology to 3 newly acquired semiconductor fabs from Texas Instruments.

Major Accomplishments: Successful transfer and qualification of 0.21um, 0.18um, and 0.15um DRAM technologies. Became the world wide resource for process improvement for all five production lines.

1992 – 1994: Photolithography Manufacturing Engineer – Responsible for maintaining photolithography and metrology while on shift.

1987-1991: Plasma Etch Engineer – Responsible for maintaining the plasma etch production line while on shift. Shift Lead from 1989-1991.

Major Accomplishments: Developed a planarization process that enabled 1um metal pitch for SRAM products.

Established specs for all production and maintenance procedures in plasma etch that enabled ISO9000 certification. Established process control methods and reactions for all plasma etch processes. (Scrap was reduced by ~10% in the plasma etch area)

1985 – 1986: Wet Process Equipment Engineer – Responsible for equipment maintenance.

Major Accomplishments: Established production and maintenance procedures that enabled a 60% reduction of spin rinse dryers required for the production line.