Report of Technical Vice President

Rolf Aschenbrenner

IEEE CPMT BoG, Dallas, Nov. 2004

Technical Committees

• Currently 18 „active“ Technical Committees

• TC-Opto Fiber Optics and Photonics New TC Chair: Dr. Sue Law, Australian Photonics /OFTC

• TC-Assy IC and Package Assembly Vacant

• TC-DIP: Len Schaper is convinced that there is no need for an own CPMT committee on Discrete and Integral Passives and would like to step down as a chair

• 12 TC web pages are up to date

• Little feedback about TC activities after two inquiries by mail

Technical Committees

Technical Committee Activities 2004 Activities planned for 2005

TC-M MaterialsTC Chair: Rajen Chanchanir.chanchani@ieee.org

TC-M sponsored conferences - Advanced Packaging Materials Conference, Atlanta, March 24 - 26- Polytronic 2004, Portland, Sept. 12 – 15- 2004 International Symposium on Electronic Materials and Packaging (EMAP 2004), Penang, Malaysia, Dec. 5 – 7Successful TC-M meeting at ECTC, Las Vegas,June 3-14 attendees- Discussed topics: concerns over the long turn-around time for Transactions publications; the future Packaging Materials Conference

TC-ASTR Accelerated Stress Testing and ReliabilityTC Chair: Mark Gibbelmark.gibbel@jpl.nasa.gov

TC-Opto Fiber Optics & PhotonicsTC Chair: Sue Laws.law@oftc.usyd.edu.au

TC-Test Electrical TestsTC Chair: Bruce KimBruce.Kim@asu.edu

- few activities- plan to update the webpage- work with workshops

Technical Committee Activities 2004 Activities planned for 2005

TC-EDMS Electrical Design, Modeling and SimulationTC Chair: Madhavan Swaminathanmadhavan.swaminathan@ee.gatech.edu

Workshops technically sponsored by TC EDMS:- Signal Propagation on Interconnects (SPI), Heidelberg, May- Future Directions in IC and Package Design (FDIP), Portland, Oct.. - Electr. Performance of Electronic Packaging (EPEP), Portland, Oct.- Electrical Design and Advanced Packaging of Systems (EDAPS), Kyoto, Nov.Other activities:- Yearly TC-EDMS meeting, Portland, Oct. 24- Initiating a standardization sub-committee for package power distribution led by Ravi Kaw (Agilent), Kickoff meeting Oct. 24- Initiating a standardization sub-committee for package IBIS and driver macro-modeling led by Paul Franzon (NC State), Kickoff meeting, Oct. 24

Workshops sponsored by TC-EDMS:- SPI- FDIP- EPEP- EDAPS, Bangalore, India, Nov (financial sponsorship needed from CPMT)

TC-Therm Thermal Management and Thermo-Mechanical DesignTC Chair: Tony Makt.mak@ieee.org

- TC-Therm meeting at the ECTC, Las Vegas

TC-Ed EducationTC-Chair: Rao Tummalarao.tummala@ee.gatech.edu

- TC-Ed session is sponsored at the 54th ECTC - One TC-Ed session is planned for the 55th ECTC

Technical Committee Activities 2004 Activities planned for 2005

TC-ECCC Electrical Contacts, Connectors and CablesTC Chair: Jerry Witterg.witter@ieee.org

TC-DIP Discrete and Integral PassivesTC Chair: Leonard W. Schaperschaper@uark.edu

- no activities- work relationship with CARTS broke away- IMAPS and IPC are doing workshops on integrated passives, so there is no need for CPMT to have its own committee - Len Schaper would like to step down as chair if a successor could be fournd- Possibility: CPMT Components Committee is declared ECTC Components & RF Committee

TC-Assy IC and Packaging AssemblyTC Chair: Vacant

TC-HDSB High Density Substrates and BoardsTC Chair: Yoshitaka Fukuokaweisti.fukuoka@rose.zero.ad.jp

- System Packaging Japan Workshop technically associated by TC-HDSB, Hakone, February- TC-HDSB Committee Meeting, Las Vegas, June - Plenary session in conjunction with 2004 ECTC as small workshop of TC-HDSB, Las Vegas, June- TC-HDSB Committee Meeting, Tokyo, August

- Plenary Session in conjunction with 2005 ECTC as small workshop of TC-HDSB, Orlando, June

TC-MEMS MEMS and Sensor PackagingTC Chair: Erik Jungerju@izm.fhg.de

- TC-MEMS committee meeting at the ECTC, Las Vegas, June and at the DTIP in Montreux, June- For the ECTC a subcommittee has especially been created concerning the topic MEMS Packaging

- An event especially supported by the TC- MEMS is planned to take place at an international meeting

Technical Committee Activities 2004 Activities planned for 2005

TC-NANO Nano PackagingTC Chair: Rao Tummalarao.tummala@ee.gatech.edu

- TC-NANO meeting at the ECTC, Las Vegas

TC-PEP Power Electronics PackagingTC Chair: Douglas Hopkinsd.hopkins@ieee.org

- TC-PEP is regrouping- Tried to find support for a 3rd bi-annual workshop on power packaging, but found little support

TC-RF+W RF and WirelessTC Chair: Craig A. Gawc.a.gaw@ieee.org

- Primary activity (during the past years as well): work with ECTC‘s Components & RF committee to increase the number of submissions to ECTC in the RF & microwave area, TC-RF+W put out a call for papers for an ECTC session focused on „RF & Microwave Component-Like Modules“; increased submissions during the past years For the first time the „Components & RF“ subcommittee and TC-RF+W was given 3 sessions at the ECTC 2004- durng the past years joint meeting at ECTC of TC- RF+W and the ECTC „Components & RF“ committee to plan the next ECTC conference (10- 12 attendees)-TC-RF+W co-chair, Manos Tentzeris, has presented a short –course on RF & microwave packaging at the ECTC for the past several years

TC-SP Systems PackagingTC Chair: Erich Klinkeklink@de.ibm.com

- 2004 IEEE Systems Packaging Japan Workshop, 2/2 – 2/4

- 2005 IEEE Systems Packaging European Workshop (1/31-2/2)- 3s Workshop, Atlanta, Sept.

Technical Committee Activities 2004 Activities planned for 2005

TC-WLP Wafer Level PackagingTC Chair: Michael Töppermichael.toepper@izm.fhg.de

- TC-WLP meeting at the ECTC- Call for the special WLP section in the Transactions IEEE-CPMT „Advnced Packaging“ planned for 2005 will be publsihed Q4/2004

- Special WLP section in the Transactions IEEE-CPMT Advanced Pacakging- TC-WLP meeting at the ECTC 2005- Workshop WLP

TC-EM Electronics ManufacturingTC Chair: Walter J. Trybulaw.trybula@ieee.org

TC-EM has supported the following activities:- ECTC conference (professional development courses were offered during the meeting with TC-EM people teaching one of them)- IEMT conference, San Jose, July, was held in conjunction with SEMI (professional development courses were offered during the meeting with TC-EM people teaching one of them)- IEEE Litho Workshop, Whistler, July

TC-GEMP Green Electronics, Manufacturing and PackagingTC Chair: Hansjörg Griesegriese@izm.fhg.de

- Asian Green Electronics Conference IEEE/CPMT, Invited Talk and Tutorial, Hong Kong, Shenzen, China, January- ISEE 2004, IEEE/CS, Phoenix, USA- Magel 2004, June, La Rochelle, France- PB Free Summit, IEC, April, Geneva, Schwitzerland- HDI 2004 IEEE/CPMT, July, Shanghai, China- Workshop EcoDesign, Jan., Wuxi, China- Electronic Goes Green 2004, Sep., Berlin, Germany- FED-Congress, Sept. 04, Neu-Ulm, Germany- Europe Electronic Technology Colloquium, March, Polonia, Spanien- IPC/JEDEC Lead-Free Electronics Conference, Oct., Frankfurt, Germany- Intl. Symposium on Remanufacturing and EcoDesign, Oct., Seoul, Korea- Conf. on Business Impacts of WEEE and RoHS, Oct. Singapore- TC Meeting at EGG 2004, Sept. Berlin

- Asian Green Electronics Conference IEEE/CPMT, Invited Talk and Tutorial, Shanghai, China, March- ISEE 2005, IEEE/CS, New Orleans, USA- Environmental Congress, Tokyo, Japan- Workshop EcoDesign, Wixi, China- Workshop at Electronica/Productronica/Semicon, Shanghai, China- ECO DESIGN 2005 IEEE/CPMT, Tokyo, Japan, Dec.,- Tutorial- TC Meeting: 12/06/04 at ECO DESIGN, Tokyo

TC-M Materials ECTC, Las Vegas

TC Therm Thermal Management ECTC, Las Vegas, and Thermo-Mechanical Design

TC-HDSB High Density Substrates ECTC, Las Vegas, and Boards and Tokyo, August

TC-MEMS MEMS and Sensor Packaging ECTC, Las Vegas and DTIP,

Montreux

Annual TC Meetings

Annual TC Meetings

TC-Nano Nano Packaging ECTC, Las Vegas

TC-RF+W TC RF and Wireless ECTC, Las Vegas

TC-WLP Wafer Level Packaging ECTC, Las Vegas

TC-EDMS Electrical Design, Portland, OctoberModeling and Simulation

TC-GEMP Green Electroncis, EGG 2004, Berlin, Sept.Manufacturing and Packaging

Motion

In case that a new topic comes up it should not directly be transformed into a technical committee but become a task force for the first three years. If the task force results to be successful a decision should be taken whether the task force becomes a technical committee or not.

• Mr. Griese from the NEMI Roadmap Committee Environmentally Concious Electronics presented a 48 paper report about the actual situation of the activities

• Len Schaper from the NEMI Roadmap Committee Passive Components reported no recent involvement with the NEMI effort due to lacking funding

• Erik Jung from the NEMI Roadmap Committee Packaging reported a first draft in order to incorporate companies into the NEMI Roadmap

Nemi Activities