Reduce SMT Changeover Time

Bose Lean EnterpriseBose Confidential

Project : Reduce SMT Changeover Time

Presented by : Damian Murphy Denis

Bose Lean Enterprise

• Reduce SMT changeover time by 40% from 30 minutes to 18 minutes for ALL HED conversions.

Challenge


PlanStep 1: Define and Breakdown ProblemStep 2: Grasp Current ConditionStep 3: Set a Target ConditionStep 4: Conduct Root Cause and Gap

AnalysisStep 5: Identify Potential Countermeasures


PROBLEM STATEMENT • Current SMT changeover time is

30 minutes vs. goal of 18 minutes (40% reduction).

IMPACT STATEMENT• Without reducing changeover time we

will waste 3.5 days / month or 42 days / year as non productive workdays!

• This accumulated conversion time is impacting our efficiency especially so when we start to move towards medium or high mix with double shifts.

Step 1: Define & Break Down Problem

Team Lead: Damian M Denis

Champion: Mr. Ahmad Zamsari Zakaria

Team Members:Roszamzura AbRashidLeow Yen ThingNiven Lam

TEAM


Step 2: Grasp Current Condition

- The highest set-up time spent per day is at 240 minutes (16.67%) of total production time (1440 minutes).

- Average set-up time is at 175 minutes per day (almost 3 hrs / day).

- The above trend is showing the frequency time is increasing!

Min

Date 6-Jan 7-Jan 8-Jan 9-Jan 13-Jan

14-Jan

15-Jan

20-Jan

21-Jan

22-Jan

23-Jan

27-Jan

28-Jan

29-Jan

0

50

100

150

200

250

300

Change Over (Min)

Trend Line


Step 2: Grasp Current Condition

Question:- What is the highest contributor of SMT

set-up time?


- Top 2 contributor is Siplace setup (10 mins) & Dek setup (8 mins).

- Much of these activities are very much focused at in-line activities thus making the set-up time to be at 30 mins.

Step 2: Grasp Current Condition Online Changeover Sequencing Results

No. Process Time (mins) Sequencing

1 Load PCB on conveyor 2 Check PCB p/n before

loading into conveyor

2 2D Barcode setup 2 Set 2D barcode based

on latest BOM. Test run for 1st board

3 Dek setup 8 Remove old stencil and send to cleaning area.

Start cleaning process for old stencil Setup support block. Load new

program

Load new stencil and apply solder

paste

Perform knead paste for 2 boards.

If good ready to run.

4 Koh Young setup 2 Load new program Test run for 1st board If good ready to run.

5 Siplace setup 10 Remove previous material & send to

Supermarket

Push out new material from Supermarket to

SMT

Load new material into Siplace machine

Load new program Scan material Scan table Scan Siplace

machine

Manual confirm PUP, Pitch and attach MSD

label

Test run 2 boards

Handload component (if have) Tech. verify If good, ready

to run

6 Reflow setup 2 Scan new programTemp. setting and rail

width are adjusted automaticaly

7 AOI setup 2 Load new program 1st board verification If good ready to start mass-pro (for BSS)

8 ICT setup 2 Load new program 2nd board verification If good ready to start mass-pro (for TSS)

30 mins


TARGET CONDITION• All SMT HED model changeover

will have a new flow to meet the 18 minutes SMT changeover time.

GOAL• Reduce EACH conversion time

to 18 minutes by 27 Feb 2014.

Step 3: Set a Target ConditionOBSTACLES

- That this changeover requires all parties to play exact/specific role to achieve the stated 18 minutes.


Step 4: Conduct Root Cause & Gap Analysis

WHY SMT Changeover

takes 30 minutes for each setup?

Debugging 1st PCBA AOI

verification

Shortage of materials from

Supermarket/WH

Debugging 2nd PCBA AOI

verification

Materials comes with quality

issues

Confirming PUP, Pitch etc are done in-line

Cleaning process for old

stencil done inline

Scanning of materials are done in-line

No F1 mindset in doing set-up

change

Movement between incoming & outgoing

gantry tables

Push out new material from

Supermarket to SMT

Measurement Materials

Manpower Machine

MethodProblem Statement


Step 4: Conduct Root Cause & Gap Analysis

The fishbone diagram shows 2 pertinent issues:-

1) Those in red are direct causes.

2) Those in yellow are indirect causes of 30 mins SMT set-up time.

a) First, we will focus on direct causes to reduce the gap to achieve 18 mins.

b) But it is also equally important to have a change in mindset in achieving this whilst employing process changes as well.

c) The F1 mindset will complement very well with the prescribed process changes to achieve 18 mins.


Step 5: Identify Potential Countermeasures

1) Training on F1 set-up concept.

2) Scanning of material is done off-line at Supermarket.

3) All PUP, Pitch and MSD label preparation is done off-line at Supermarket too.

4) All complete gantry table are to be brought from Supermarket into SMT line ahead 30 mins before conversion.

5) Cleaning of stencil is ONLY done once SMT begins its proper run.

Timeline

Key Milestone Date

1) F1 concept training

6th Feb onwards

2) Offline scanning

10th Feb

3) PUP, Pitch & MSD off-line

12th Feb

4) Gantry table readiness

14th Feb

5) Stencil cleaning offline

6th Feb


Step 5: Identify Potential Countermeasures

Timeline

Key Milestone Date

1st PCBA AOI & ICT speed up

6th Feb

1st PCBA AOI & ICT speed up

6th Feb

Hilite WH & Planner for shortages

5th Feb

Hilite SQE & Planner for quality issues

5th Feb

6) 1st PCBA AOI & ICT verification is speed up.

7) 1st PCBA AOI & ICT verification is taken out.

8) To hilite to WH & Planner if there is any material shortages.

9) To hilite to SQE & Planner if there is any material quality issue incl. packaging issue.


DoStep 6: Develop & Test CountermeasuresStep 7: Refine & Finalize

CountermeasuresStep 8: Implement Countermeasures


After brainstorming the team agrees on a set of solutions based on their knowledge & experience.

In addition, we use the prioritization matrix to help us to zero in on some of the important decision criteria and we found it correlates with the team decision as well.

The below shows the solution the team have opted to implement as subject matter expertise:-i. F1 mind-set trainingii. Offline material scanningiii. Gantry table replacement readinessiv. PUP, Pitch & MSD readinessv. Offline stencil cleaning

Brainstorming & Subject Matter Expertise

Step 6: Develop & Test Countermeasures


Analysis of the above matrix is on the next slide.

Selection Criteria Business Impact Resource Availability Effort/Impact Ability to leverage Weighted SumList of potential countermeasures: 3 4 5 2F1 Training 5 9 5 9 94Offl ine material scanning 9 9 9 9 252Gantry table placement 1 9 9 9 252PUP, Pitch & MSD readiness 5 9 9 9 248Offl ine stencil cleaning 1 5 9 9 2121st PCBA ICT verification 1 1 1 5 602nd PCBA AOI verification 1 5 1 5 32Materials shortage from WH 1 1 5 1 16Materials with incoming quality issue 5 1 5 5 36

LEGEND Relationship 1 Weak Relationship5 Medium Relationship9 Strong Relationship

Countermeasure Selection thru Prioritization Matrix




Countermeasure Selection

The above matrix clearly shows which countermeasures should be prioritized to get the best/optimum result with the given resources we have at SMT.

The one with the most impactful countermeasures are hilited in red.

So, which countermeasures are selected?


Step 7: Refine & Finalize Countermeasures

The Finalized Countermeasures

Actions Status Lesson learnt Show results Doc. Update Define KPI Owner

F1 set-up concept training

Done

To be included in all SMT DL orientation training

Training records

Yes NA OperationsOffl ine PUP, Pitch & MSD label Done Step 1 No NA Training/Ops.Offl ine material scanning Done Step 2 No NA Training/Ops.Placing gantry table ahead (no waiting time) Done Step 3 No NA Training/Ops.

Offl ine stencil cleaning

Done

To be done once the line complete verification and start to rum as normal

Reduce Dek setup from 8 to 3

minsNo NA Training/Ops.

Reduce Siplace setup from 10 to

3 mins


Step 8: Implement Countermeasures

Progress checks – Below is the timeline to wrap up all countermeasures by end of Feb 2014.

Bose Malaysia - 18mins. SMT Changeover ReadinessDepartment : SMT Operations

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

F1 Concept Mindset Training

Offline Material Scanning

Gantry Table Placement

18 mins Changeover Fully Implemented

CountermeasuresFeb'14

PUP, Pitch & MSD Readiness

Offline Stencil Clening

Training for all DL & GL

To be done by Supermarket team



To be done once prod. starts running

All systems

go!


CheckStep 9: Measure Process Performance


No. Process Time (mins) Sequencing1 Load PCB on

conveyor 2 Check PCB p/n before loading into conveyor

2 2D Barcode setup 2 Set 2D barcode based on latest BOM.

Test run for 1st board

3 Dek setup 3 Remove old stencil and send to cleaning area.

Setup support block. Load new program

Load new stencil and apply solder

pastePerform knead

paste for 2 boards. If good ready

to run.

4 Koh Young setup 2 Load new program Test run for 1st board If good ready to run.

5 Siplace setup 3 Remove previous material & send to

Supermarket

Load new material into

Siplace machineLoad new program Scan table Scan Siplace

machineTest run 2

boardsHandload

component (if have)

Tech. verify

If good, ready to run

6 Reflow setup 2 Scan new programTemp. setting and

rail width are adjusted

automatically

7 AOI setup 2 Load new program 1st board verification

If good ready to start mass-pro (for BSS)

8 ICT setup 2 Load new program 2nd board verification

If good ready to start mass-pro (for TSS)

18 mins.

New Online Changeover Sequencing Results

Step 9: Measure Process Performance

Financial Benefits : - Decreasing the time per set-up will increase the number of set-ups conducted in a given time



New Online Changeover Sequencing Results

All changeover has been reduce to 18 mins (0.3 hrs) beginning 3 Mar 2014 at all SMT line schedule.

Financial Benefits : - Increasing the number of set-ups will result in more production opportunity though SMT.



Financial Benefits : - Decreasing the time per set-up will result in the ability to run smaller batch/kit sizes through SMT

Monitoring:-1) All SMT production schedule from 27 Feb 2014 onwards

has reflected the new changeover time at 18 mins.2) Monitoring was done from 27 Feb – 6 Mar 2014 and the

result during WW10 is as per the new changeover time.

Reflection:-3) All process change must be coupled with paradigm shift

to maximize the benefits of any projects.


ActStep 10: Refine, Standardize and Stabilize

the processStep 11: Monitor Process PerformanceStep 12: Evaluate Results, Share Learning


Steps 10 – 12: Standardize / Monitor Performance / Share Learning

Standards

- All SMT production schedule for HED will reflect the new changeover time (0.3 hrs.) from 3 March 2014.

- To implement this improvement on other new SMT lines that are to be set-up in BSM.

Yokoten Opportunities

Next Steps- To reduce SMT changeover time for ASD/Automotive

models.


QUESTIONS?

COMMENTS?

Documents

Reduce SMT Changeover Time