o RD_FASE2: 2015 Activities and Funding G. Darbo – INFN / Genova 23 January 20145

RD_FASE2

2015 Activities and Funding

RD_FASE2 Pixel & HVR_CCPD Joint Meeting23 January 2015

G. Darbo – INFN / Genova

Indico: https://agenda.infn.it/conferenceDisplay.py?confId=9145

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 2

2015 Activities 1/3

•  Sensor  with  FBK  –  Work  in  progress:  •  IBL  like  3D  sensor  on  6”  wafers  

•  batch  completed  from  FBK.  Test  structures  show  good  breakdown  behaviour.  Defect  rate  higher  than  IBL.  

•  No  totally  good  FE-­‐I4  devices  out  of  the  whole  batch:  we  should  consider  if  we  have  second  quality  Iles  worth  bump-­‐bonding  with  FE-­‐I4  and  test  in  the  beam  an  lab.  Probably  not  worth  to  irradiate  FE-­‐I4  modules  

•  Planar  sensors  (FBK  batch2)  with  SiSi  DWB  substrates    

•  batch  completed,  good  yield!    

•  One  wafer  will  be  bonded  at  Selex  now  by  ATLAS  (5  at  IZM  by  CMS)  to  FE-­‐I4  to  study  BB  and  beXer  qualify  substrates.  We  should  consider  a  second  wafer  at  Selex  with  sensor  thinning  

•  CMS  is  planning  5  wafer  BB  at  IZM,  sensor  thinning,  back  metallisaIon  with  a  mask  aYer  thinning,  BCB  isolaIon  of  the  electronic  chips.  Some  FE-­‐I4  modules  (single/double)  inside  their  order  with  IBL  contract  residual  pre-­‐paid  processing.  

•  should  consider  test  beam?  IrradiaIon  of  modules?  

•  3D  Sensors  with  new  technology  (SiSi  DWB)  and  layout  (FBK  batch  3)  will  be  available  in  late  spring/summer  

•  Consider  modules  /  test  beam  /  irradiaIon  in  the  second  half  of  2015.  

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 3

2015 Activities 2/3 •  Bump-­‐bonding:  for  tes(ng  FBK  sensors  and  to  develop  for  future  RD53  

requirements  (high-­‐density  bump-­‐bonding  with  indium)  

•  Complete  experience  with  FE-­‐I4:  use  planar  SiSi  DWB  batch  of  sensors  and  a  new  FE-­‐I4  wafer  (unthinned)  +  available  thin  chip  

•  Try  thinning  of  planar  SiSi  DWB  –  Important  experience  for  future  3D  on  new  substrates.  

•  Discuss  with  Selex  Management  future  of  BB  with  12”  wafers,  high  density  of  bumps,  and  interest  to  be  compeIIve  and  qualified  for  possible  ITK  producIon.  

•  Decide  how  to  proceed  with  Selex  aYerward.  

•  Module  Assembly  and  Test,  IrradiaBon,  Test-­‐beam:  plan  30-­‐40  modules  with  FBK  sensor  designs  and  FE-­‐I3/FE-­‐I4  chips.  

•  We  should  coordinate  with  Barcelona  and  other  sensor  communiIes  for  3D  sensor  studies  in  test-­‐beam  and  aYer  irradiaIon  –  this  is  inside  ITk  

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 4

2015 Activities 2/3 •  Mechanics  and  CO2  cooling:  

•  We  propose  to  contribute  to  ATLAS  stave  R&D,  thermal  simulaIon  and  test  with  CO2  plant  

•  ExperIse  mainly  on  Milano,  interest  of  Genova.  We  should  evaluate  manpower  in  both  group  and  see  how  to  contribute.  Funding  will  be  made  available  in  2015.  

•  MulB-­‐module  R/O:  use  leading  experience  of  ROD  designer  (BO)  to  develop  a  16  module  table-­‐top  road  for  architecture  study  and  for  test-­‐beam  applica(on.  

•  See  Paolo’s  talk  –  several  acIviIes  and  proposals  in  ITk  •  Need  steering  of  the  project  coordinated  within  ITk.  

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 5

Funding   INFN  agreed  on  a  ~2  M€  of  RD_FASE2  funding  envelopes  • 3  year  funding  • ~50  %  for  Pixel  acIviIes    Money  will  come  from  “Giunta”.  •  Should  be  available  by  end  of  the  month,  the  database  is  sIll  empty  • CSN1  in  September  2015  has  almost  fully  assigned  what  requested.  Finanziamenti 2015

CSN1- Settembre 2014 21

proposte '' 2015''' ATL' CMS' Com'

tracker'

3D' '' '' ''AE' '' ''HV' 100.5' ''BB' '' ''MOD' '' ''Mod'R0' '' ''cooling' '' ''

Totali' 150' 133.5' 107.5'391'

TrackTrig'

WP1%sim' '' ''WP2%transm' '' ''WP3%New'AM' '' ''Wp4%packing' '' ''

Totali' 0' 0' 115'115'

RPC'

electrodes' '' 10' 15'Prototypes' '' 28'front%end' '' 5' 45'eco%gas' '' 15'GIF++' '' 20'

Totali' 0' 15' 123'138'

BIS7/8'16'chambers' '' '' ''

Totali' 0' 0' 0'0'

MUONS'DT' '' 11'''GEM' '' ''

Totali' 0' 11' 0'11'

Lar'

DC'power' 20' ''trigger' 20' ''

Totali' 40' 0' 0'40'

TileCal'

Sviluppo'FE' '' 15'''TEST'parZtori' '' ''

Totali' 0' 15' 0'15'

EndCap'

fibre+pmt+proto' '' 101'''

Totali' 0' 101' 0'101'

''

Grand'Total' 190' 275.5' 345.5'811'

Richieste TotaliATLAS 51.5 + (100.5)CMS 133.5Common 98.5Total 283.5 + (100.5)

Richieste  (presentate  in  CSN1)  Possono  essere  lievemente  differenI  dal  database  

Proposta  Referee  

             Tasca  HV-­‐CMOS  -­‐>  funds  given  in  CSN5    

X  

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 6

RD_FASE2 – “Richieste 2015” (1/2)

  Legend:                ATLAS                Common  ATLAS  /  CMS                Tasca  HV-­‐CMOS      

A?vità   Descrizione   BO   CS   GE   MI   TN   UD  

3D  6"  Wafer  procurement  (SOI,  wafer  bonding,  epi)    -­‐        -­‐        -­‐        -­‐        10.0      -­‐      PicoScope  6407  DigiIzer  with  1.5  GHz  probes  and  accessories.    -­‐        -­‐        -­‐        -­‐        8.5      -­‐      

BB  

6"  dummy  wafers  -­‐  test  deposiIon  on  6"  and  high-­‐density  bumps  (150  k-­‐bumps/chip)    -­‐        -­‐        -­‐        20.0      -­‐        -­‐      

BB  for  3D  sensor  test      -­‐        -­‐        24.0      -­‐        -­‐        -­‐      

MOD  Upgarde  R/O  Systems    -­‐        2.0      2.0      2.0      -­‐        2.0    

Module  assembly  and  irradiaIon,  RD  on  flex    -­‐        -­‐        10.0      -­‐        -­‐        -­‐      

MM-­‐R/O   MulI  module  R/O    15.0      -­‐        -­‐        -­‐        -­‐        -­‐      

CO2/µCH   Develop  µ-­‐channel  cooling    -­‐        -­‐        -­‐        10.0      -­‐        -­‐      

Total  requested  by  ATLAS  Groups    15.0      2.0      36.0      32.0      18.5      2.0    

105.5    

Richieste TotaliATLAS 51.5 + (100.5)CMS 133.5Common 98.5Total 283.5 + (100.5)

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 7

Activities in ITk ITk  management  looking  at  interest  of  Countries  in  ITk  R&D’s  

  Table  from  discussion  with  Paolo.  Comments?  

For  discussion  

Italy& Bologna& PIX&PIX&PIX&

HV/HR&CMOS&sensors&Off/detector&DAQ&Simulation&

Genoa& PIX&PIX&PIX&PIX&PIX&PIX&PIX&

3D&sensor&development&HV/HR&CMOS&sensors&Hybridization&Module&development,&construction&and&testing&Local/Global&support&design&Off/detector&DAQ&Simulation&

Cosenza& PIX&PIX&

3D&sensor&development&Simulation&

Lecce& PIX& Simulation&Milan& PIX&

PIX&PIX&PIX&PIX&PIX&PIX&PIX&COM&

HV/HR&CMOS&sensors&3D&sensor&development&RD53&Hybridization&Module&development&and&testing&Local/Global&support&design&and&production&Off/detector&electronics&(LV&power&supplies)&Simulation&Off/line&software&

Udine& PIX&PIX&PIX&

3D&sensor&development&Module&development&and&testing&On/line&monitoring&

Trento& PIX&PIX&PIX&

3D&sensor&development&HV/HR&CMOS&sensors&Module&development&and&testing&

&

RD_FASE2: 2015 Activities and Funding G.Darbo – INFN / Genova 23 January 20145 8

AIDA-2020 : Funded !   AIDA-­‐2020  Funded  !  • AIDA-­‐2020  has  been  officially  selected  by  the  EC  with  a  funding  of  10  M€.  

  The  project  has  a  ranking  of  14.5/15  with  • 5/5  excellence  •   5/5  impact  • 4.5  implementaIon  

  The  grant  agreement    procedure  is  quite  fast  

  Groups  in  ATLAS  who  have  been  funded:  •  Genova  • Milano  •  Trento  

European Commission - Research - Participants Proposal Submission Forms

Page 1 of 125 Last saved 02/09/2014 at 17:46H2020-CP.pdf - Ver1.88 20140729

Horizon 2020Call: H2020-INFRAIA-2014-2015

Topic: INFRAIA-1-2014-2015Type of action: RIA

Proposal number: 654168

Proposal acronym: AIDA-2020

Table of contents

Section Title Action

1 General information

2 Participants & contacts

3 Budget

4 Ethics

5 Call-specific questions

How to fill in the formsThe administrative forms must be filled in for each proposal using the templates available in the submission system. Some data fields in the administrative forms are pre-filled based on the previous steps in the submission wizard.

This proposal version was submitted by Laurent Serin on 02/09/2014 12:04:24 CET. Issued by the Participant Portal Submission Service.

INFRAIA-1-2014-2015 AIDA-2020

WP1-MGT Project management and coordination

WP2-NA1 Innovation and outreach

WP13-JRA1Innovative gas

detectors

WP14-JRA2Infrastructure for

advanced calorimeters

WP15-JRA3Upgrade of beam and

irradiation test infrastructure

WP10-TA1Beam test facilities

WP12-TA3Detector

characterisation facilities

WP11-TA2Irradiation test

facilities

WP3-NA2Advanced software

WP7-NA6Advanced hybrid pixel detectors

WP4-NA3Microelectronics and

interconnections

WP6-NA5Novel high voltage and resistive CMOS sensors

WP8-NA7Large scale cryogenic liquid

detector

WP5-NA4Data acquisition system for

beam tests

WP9-NA8New support structures and

micro-channel cooling

Transnational Access

Networking

Joint Research

Figure 3.1: Work Package structure and interactions (Pert chart)

25