SITARA™ Microprocessors

Процессоры SITARA для промышленных применений

Q1 2012

Mikhail Sokolov, Texas Instruments

ARM & ARM+ portfolio

2

Video

Accelerators

+

DSP

+

ARM

DSP

+

ARM ARM • Point of Sale

• Portable Data Terminals

• Human Machine Interface

• Networked Audio

• Test and Measurement

• Power & Energy Management

• Industrial Vision & Control

• Networked Audio & Video

• Media Servers

• Video Security

• Video Conferencing

Advanced GUIs &

Displays,

Connectivity

Advanced GUIs &

Displays, Connectivity,

Intensive Signal

Processing

Advanced GUIs &

Displays, Connectivity,

Video Acceleration

SITARA

INTEGRA

DAVINCI

AM18x • 375/450MHz

• 10/100 Enet, SATA

• SDRAM / LPDDR1 /DDR2

• 10ku $5 - $8

AM37x • 800MHz/1GHz

• LPDDR1

• 10ku $12 - $24

AM35x • 600MHz

• 10/100 Enet, CAN

• LPDDR1 / DDR2

• 10ku $12 - $17

AM335x • Up to 720 MHz

• 1G-Enet switch,

TSC/ADC

• LPDDR1/DDR2/DDR3

• 10ku $8 - $20

Production Development Sampling

AM4x Next • More Interface Options

• Increased Security Features

Concept

I

C

S

S

3

D

3

D Cortex-A8

Cortex-A8

Cortex-A8

ARM9

Cortex-A9

AM2x Next • More Interface Options

• Increased Security Features

• Lower Power

Cortex-A7

AM389x • Up to 1.5 GHz

• 2x GbE, HDMI,

• 2x PCIe, 2x SATA

• 2xDDR2 / DDR3

• 10ku $29 - $31

AM387x • Up to 1.0 GHz

• GbE, HDMI, PCIe, SATA

• 2xLPDDR1 / DDR2/ DDR3

• 10ku $22 - $32 3

D

Cortex-A8 Cortex-A8

Sitara ARM® Processor Roadmap

3

D

I

C

S

S

3

D

AM2x Next • More Interface Options

• Increased Security Features

Dual Cortex-A7

Per

form

ance

+ In

tegr

atio

n

Available Now | 2012 | 2013 | 2014

= PRU Industrial Communication Sub System

= 3D Graphics Accelerator

= Recently Announced

3D

ICSS

POS Applications with SITARA

Everything you need for Electronic Point of Service

• Enable fast, secure transactions

– High-performance ARM® microprocessors with graphics accelerators

– Integrated security features – secure boot, cryptographic accelerators,

secure middleware to support ARM® Trustzone among others

• Lower development costs and time to market

– Complete turnkey POS reference design to kick start development

– PCI pre-evaluation to reduce certification time of end product

– Cost reduction through system integration

• Scalability to customize products

– Broad portfolio of embedded processors, power management, motor

drivers, connectivity, precision analog and standard logic

– Scalable pin-to-pin compatible processors allow addition of features like

scanning (DSP), video advertising (media accelerators) etc.

ARM® MPU for EPOS today

Key Features AM37x AM335x

CPU Cortex-A8 Cortex-A8

CPU Speed 600/800/1000 MHz 600 MHz

L1D/L1p Cache (KB) 32/32 32/32

L2 Cache (KB) 256 256

Shared SRAM (KB) 64 64+128

DDR Memory Interface mDDR mDDR/DDR2

DDR Memory Clock (MHz) 200 200

DDR Memory Bus Width 32-bit 16-bit

Touchscreen Support 1 1

Ethernet - 1 Gig

SPI / I2C / UART / USB 4 / 3 / 3 / 4 2 / 3 / 6 / 2

Camera 1 (10-bit) -

Display/LCD Ctrl 24 RGB 24b RGB

Graphics Engine 3D 3D

IO Voltage 1.8v 1.8V/3.3V

Package Type BGA BGA

Temp Range (Celsius) -40° to 90° -40° to 90°

NOTE: The above is not a complete list of features

AM3715/03 Cortex™-A8 based processors

L3/L4 Interconnect

Memory Interface Connectivity

USB HS Host x3

USB OTG

I2C x3

WDT x2

NAND

Timers

MCSPI x4

McBSP x5

MMC/SD/SDIO x3

GP x12

UART w/ IrDA

HDQ/ 1-wire

UART x3

Serial Interface

LPDDR1

3D Graphics

Accelerator (AM3715 only)

Video

Processing

Front End

Video

Input

(12-bit)

Display Subsystem

10 bit DAC

10 bit DAC

LCD Controller

Video Encoder

ARM®

Cortex™-A8 800MHz/1 GHz

32K/32K L1

256K L2

64K SRAM

AM3715/03 Processors

Benefits • 2000DMIPS for OS’s like Linux, Win CE, RTOS • Up to 30% reduction in power • 20M polygons per second for robust GUIs

Sample Applications

• Smart connected devices • Patient monitoring • Single board computers • Low power PC

Power

• Dynamic Voltage and Frequency Scaling (DVFS) • Total Power: 735mW (800MHz) • Standby Power: 0.1mW (600MHz)

Schedule and packaging • Production: Now • CBP: 12x12mm PBGA, 0.4mm pitch, 515-ball,

Package on Package (PoP) • CBC: 14x14mm PBGA, 0.5mm pitch, 515-ball, PoP • CUS: 16x16mm PBGA, 0.65mm pitch. 423-ball.

Utilizes Via Channel™ array technology with 0.8mm pitch plus design rules

Peripheral limitations may apply among different packages

Some features may require third party support

All speeds shown are for commercial temperature range only

7

AM335x Cortex™-A8 based processors

Benefits • High performance Cortex-A8 at ARM9/11 prices • Rich peripheral integration reduces complexity and cost

Sample Applications

Software and development tools • Linux, Android, WinCE and drivers direct from TI • StarterWare enables quick and simple programming of and

migration among TI embedded processors • RTOS (QNX, Wind River, Mentor, etc) from partners • Full featured and low cost development board options

Power Estimates • Total Power: 600mW-1000mW • Standby Power: ~25mW • Deep Sleep Power: ~5-7mW Schedule and packaging • Samples: October 31, 2011; Production: 2Q’12 • Dev. Tools: Order open October 31, 2011 • Prelim docs: available today • Packaging: 13x13, 0.65mm via channel array

15x15, 0.8mm

• Home automation

• Home networking

• Gaming peripherals

• Consumer medical

appliances

• Printers

• Building automation

• Smart toll systems

• Weighing scales

• Educational consoles

• Advanced toys

• Customer premise equipment

• Connected vending machines

Availability of some features, derivatives, or packages may be delayed from initial silicon

availability

Peripheral limitations may apply among different packages

Some features may require third party support

All speeds shown are for commercial temperature range only

* 720 MHz only available on 15x15 package. 13x13 is planned for 500 MHz.

** Use of TSC will limit available ADC channels.

SED: single error detection/parity

ARM® Cortex-A8

up to 720* MHz

L3/L4 Interconnect

Serial Interface

32K/32K L1 w/SED

256K L2 w/ECC

64K RAM

64K Shared

RAM

Display

24 bit LCD Ctrl (WXGA)

Touch Scr. Ctrl.**

Security

w/ crypto acc. PRU SS

PRU x2 200 MHz

12K RAM w/SED

Peripherals 8K P. w/SED

8K D. w/SED

System

Memory Interface

LPDDR1/DDR2/DDR3

NAND/NOR (16b ECC)

Parallel

EDMA

Timers x8

WDT

RTC

eHRPWM x3

eQEP x3

eCAP x3

JTAG/ETB

ADC (8ch)

12-bit SAR**

UART x6

SPI x2

I2C x3

McASP x2

(4ch)

CAN x2

(2.0B)

MMC/SD/

SDIO x3

GPIO

USB 2.0 OTG

+ PHY x2

EMAC 2port

10/100/1G

w/1588 &

switch

(MII,RMII, RGMII)

Graphics

PowerVR

SGX

3D Gfx

EPOS: ARM® MPU Roadmap Increased Integration to reduce system cost

Security IC from 3rd Party

TODAY: 2-Chip Solution w/ External Security Controller

• TI ARM® Cortex-A8 MPU

• Non-TI Security Controller

Available Today

In 2012: 1-Chip Solution w/ Integrated Security Controller

• TI ARM® Cortex-A9 MPU with

integrated security

Available in 2012

AM37x

AM35x Security

Controller

Integrated Security

AMxxx

NEXT

Enables scaling of application features across platform of products

EPOS Reference Design Kit (RDK) Modular Point of Sale reference design with support for NFC

KEY FEATURES TI’s ARM Cortex®-A8 microprocessor (up to 1 GHz)

WindowsCE6, Linux and Android OS support

Multiple Card interfaces

Magnetic Stripe Reader (MSR)

IC Card (Smart Card) Interface

RFID/NFC reader

1D/2D bar code scanner

Thermal Printer

WLAN and WWAN Modem (2.5G/3G)

3.5” LCD with touch screen

Production hardware

PCI-PTS pre-evaluation by RFI Global (accredited lab)

Security Software License from ViewAt ( NRE or

Royalty)

Availability: Now (WinCE6)

January 2012 (Linux)

February 2012 (Android)

Pre-evaluated to pass PCI-PTS certification!

Customize to your needs: Counter-top POS Terminal (w/o Barcode)

Mobile POS (w/ Cellular Support)

Portable Data Terminal (No Financial Transactions)

Full featured POS-PDT Terminal

Developed, sold and supported by TI partner ViewAt

MSRP: US$ 998

For more info: ti.com/epos

EPOS RDK: Software Architecture

Board Support Package

OS Kernel

• Linux – Open Source – TI

supported

• Android – Open Source – TI

supported

• Windows Embedded CE – TI

Supported

AM3715 Hardware with SGX530 and NEON

Application Level Software

User Interface “Applications”

Security SW

• Secure Keypad

• Secure Smart

Card

• Secure

Magnetic Card

• Secure LCD

• SW crypto algo

• Secure Boot

Application Framework – API Layer

“Applications”`

System

• WIFI

• USB

• Camera

• RFID/NFC

• 3G/WCDMA

• Serial

• Memory

• Printer

• Power Mgmt

TI Base SW/Components

3rd party/Customer

Secure Kernel

MAXQ1850 Secure

Execution

Environment

• System Secure Boot

• Self Checking

• Hardware Crypto cores

• Key Management

• Tamper prevention

MAXQ1850* HW

* MAXQ1850 is a Maxim Security Microcontroller

Thin Client Applications on SITARA/Davinci

What is a Thin Client?

Sink (Client)

Source (Server) Thin Client A thin client is a small centrally

managed computer, typically

without HDD. Processing is

done remotely in the cloud.

Thin Client Benefits • Enhanced Security

• Enhanced Manageability

• Reduced Cost of Ownership

• Lower Power

Many industries including

healthcare, finance and

education require this level of

security and control.

Tomorrow’s Thin-Client Features

• Today Thin Clients are mainly based on x86 architecture,

many will move to ARM solution

– Today dominated by VIA, Intel, AMD

– Local OS: Windows Embedded, Linux

• Uncompromised computing experience with security and

convenience of cloud-based computing

– Responsive

– Multimedia enabled

– Power-efficient http://it.umsicht.fraunhofer.de/PCvsTC/index_en.html

– Secure

– Cost-effective

– Small

Thin Client TI Platforms: DM814x and AM387x (DSP Accelerated, 3D capable)

Now :

Thin Client – Zero Client

Next Generation Remote desktop (Virtual Desktop)

Ultra low power, Full multimedia, Full 3D graphic , High resolution, Multiple screens.

Switched Central Resource (SCR)

Peripherals

Memory Interfaces

DM8148

USB

2.0

x2

GPIO GMAC

Switch

PCIe McASP

x6

SPDIF

McBSP

I2C/

SPI

x4

UART

x6 DCAN

x2

DDR3

x2

SDIO

/SD

x3

Async

EMIF/

NAND

SATA2

Display

On-Screen

Display

Resizer

SD DAC (x2)

HDMI PHY

HD Video I/O (x2)

Video I/O

HD Video

Coprocessor

(x1)

3D Graphics

Engine

(not in

DM8147)

ARM micro-

processor

Fixed/ Floating

point DSP

ARM

Cortex

A8 TM

C674x

DSP

Core

(not in

DM8146)

DM814x Processor Cores

ARM Cortex A8™ (MPU) up to 1 GHz C674x™ Floating Point DSP Core up to 720 MHz

Memory ARM: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2 DSP: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2 Two DDR-800 Controllers

Coprocessors/Subsystem HD VICP 2.0 Accelerator at 320 MHz

– Real-Time HD Encode /Decode 3D Graphics engine Display Subsystem

Peripherals

Gigabit EMAC Switch USB 2.0 Ctlr/PHY x 2 PCIe 2.0

SATA 3.0Gbps DDR3 – 800 x2 SD/SDIO x3 McASP x6, McBSP SPI, GPIO, I2C, UART, DCAN

Power Total Power – Typical 3 W

Package 23x23, 0.8mm pitch, 684 ball BGA

• Via Channels enable low cost design rules -- 4 mil traces and 10/20 mil escape vias

Video accelerators:

• 1080p60 HD capability

• DSP fully available for Analytics and other

data processing

Back to: DM roadmap | product positioning

Up to 2000 Dhrystone MIPS

• Utilize ARM for OS and application

processing & networking

Display Subsystem • Up to two HD and one SD simultaneous outputs

with 2D/3D graphics

3240 MFLOPS

• Natively supports single/

double-precision floating

point

AM387x Cortex™-A8 based processors Differentiated Features and Benefits • Gigabit Ethernet Switch with 2x MACS and

IEEE1588 support enables fast and reliable

network connectivity

• PCIe gen2 with integrated PHY enables a

5.0GT/s connection to backplanes, FPGAs,

or expansion cards like USB 3.0 or 802.11n

• Connect to abundant storage with SATA2.0

support at 3.0Gbps, PHY included

• Video output for two different displays at up

to 1080p60 each, and HDMI out

• 2W power consumption for fan-less, heat

sink-less, enclosed designs

Software and development tools • Linux, WinCE, and Android drivers direct

from TI

• RTOS (QNX, Green Hills, etc) from partners

Schedule and packaging • Samples and Dev. Tools: Now

• Production: 4Q’11

• Packaging: 23x23, 0.8 mm, 684 ball

* Initial sampling will be for the XAM3874BCYE at 720 MHz

** Annex D only

ARM® Cortex-A8 800 MHz/ 1.0 GHz*

L3/L4 Interconnect

Serial Interface

32K/32K L1

512K L2

Display

Display processor

Resizer

System

Memory Interface

Parallel

EDMA x4

Timers x8

WDT

UART x6

SPI x4

I2C x4

McASP x6

CAN x2

MMC/SD/

SDIO x3

GPIO

USB 2.0 + PHY x2

(host & device)

EMAC 2port

10/100/1G

w/1588** &

switch

(GMII, MII, RMII,

RGMII)

Graphics (AM3874 only)

PowerVR

SGX

3D Gfx

Security

AES, 3DES

RNG

PCIe (2.0)

McBSP

SPDIF

LPDDR1/DDR2/3 x2 SATA (3Gbps)

Async EMIF/NAND

HS OSD SD OSD

SD Encoder SD DAC x2

HDMI Xmit

(w/HDCP) HDMI PHY

HD Video I/O x2

64K RAM 128K

Shared RAM

HD Encoder

DM8148’s Provides Value for Thin Clients Single platform supports multiple VDI protocols

• Performance – TI’s Powerful 750Mhz C6x DSP processor and HDVICP

accelerate VDI (Virtual Desktop Infrastructure) performance

– Citrix HDX – 24fps @ 720p with accelerated multimedia redirection (H.264,VC-1)

– RemoteFX – 15000+ Rectangles Per Second (RPS) which equals

1920x1280x25fps

• Programmable – Future proofs clients for long term deployments

– RemoteFX for Win8 in development (Q4 2012)

– Could add support for other emerging protocols

• Integration – Display subsystem drives dual displays (1920x1280x2)

– Additional interfaces for GigE Switch, USB, PCIe, SATA, UART, DDR3

• Low Power consumption ARM Cortex A8 based SoC enables

<5 watt client – can support POE power supplies, fanless design

• Size Small form factor – easily embedded in monitors, projectors, and other

end equipments

Thin Client RDK Hardware: Updated Information

• Ultra-compact fanless design

• DM8148, 1Ghz

• 1GB DDR3

• 4 USB ports

• Dual Display: DVI-D + DVI-I

• Optional WiFi Module

• Supports VESA mount and Kensington

lock

• ErP 2013 Specification off mode 0.5W

• 6 Layer PCB

• Available May 2012

Dimension : 15.5 x 13.3 x 2.9 cm

( 6.1 x 5.23 x 1.12 inch)

Volume: 598 ml

All in One

• One HW platform can support all thin client SW

• TI is the partner with all of them

• VMWARE available from partners

20

RemoteFX

Thin Client with TI Processor

Partners

TI has been working to identify several partners who could help in the solution development:

Canonical (integration, Linux RDP, Linux OS, Support, Updates) Cloudium (integration, Linux RDP, complete application) iTap (integration, Linux RDP) ThinLinx (integration, Linux RDP)

Industrial Communications on SITARA

Industrial communications is the heart of industrial automation – Connect to Control

• Industrial Automation System = HMI + PLC + Sensors + Motor

Control

• Connectivity is the heart of automation for greater productivity

• TI is uniquely positioned to provide efficient & scalable system

solutions HW (Analog & Processor) + SW (communications &

applications)

TI solves the complex communications problem by integrating multi-protocol support in the ARM SoCs

Host

Interface

MCU Or

MPU

Ind Comm ASIC/FPGA

AM1810 (Profibus) AM3357/9 (Multi-

protocols)

ARM CPU

Shared Memory

PRU

Subsystem

PRU

UART/MII

Timer

• MCU/MPU for application

• External ASIC/FPGA for communications (especially for slave)

Typical Solution – Today

• System BOM savings (>40%) by eliminating the external ASIC

• Supports multiple protocols using the same hardware (PRU is completely programmable)

• Easily adapt to changing standards or create own (myProtocol)

• Scalable solution for HMI, PLC and I/O devices

TI’s ARM + PRU solution = 4

benefits

EtherCAT Slave

Devices

• AM335x

Features

• ARM Cortex A8

• Beckhoff EtherCAT stack – Free production license for ETG members (ETG membership is free)

• Compatible with other third party EtherCAT stacks

• Uses SYS/BIOS RTOS from TI

• TLK100/TLK110 Industrial Ethernet transceiver

Benefits

• Lower ASIC cost and reduced PCB area

• EtherCAT Master /slave integrated on application processor

Availability

• AM335x sampling NOW

• Guaranteed long term availability

25

MII AM3357-

275MHz MPU

EtherCA

T

Availability

2010 2011 2012

TLK100

EtherCAT

Slave Stack

TLK100

TLK110 Ethernet

PHY

AM335x

MII

EtherCA

T

TLK100

TLK110 Ethernet

PHY

EtherCAT Master

Devices

• AM18xx

• AM35xx

• AM335x

• Several other Sitara devices with Ethernet peripheral

SW

• Master stack from 3Ps - 3S/CoDeSys or ETG

• Linux and other HLOS support from TI

• Compatible with third party OS/RTOS

Benefits

• Lower cost and power and PCB area

• EtherCAT Master/Slave integrated on application processor

Support

• TI’s Industrial SDK with Linux

• 3rd party free/commercial protocol stack

Availability

• AM18xx and AM35xx available now

• AM335x sampling NOW

• Guaranteed long term availability

26

MII

AM18xx

AM35xx

AM335x

EtherCA

T

Availability

2010 2011 2012

AM18xx

TLK100

AM35xx

TLK100

TLK110

AM335x

Industrial Fieldbus Engine (ICE)

Sensor & Ethernet Module

Host Interface USB JTAG

Power

Temp

Sensor

SPI

Flash

MMC

TPS65910

24V I/O 8 x LEDs DDR2 TLK110

6 x LEDs

DPRAM

NOR FLASH

70

mm

90mm

Industrial Communications on SITARA

TI PLC/6LowPAN Data Concentrator Platform (PRIME and G3)

AM1808

UART(3)

ARM926

RJ45

AFE03x

F28069

Octave

EMAC

SCI-A

To Core Network

To PLC Network

2-Chip Solution: ARM926 based AM180x or L138 as application processor, TMS320F28069+AFE03x as PLC

PHY+lowerMAC sub-system

3-phase reference design system built on field proven PLC PHY+MAC

Support both G3 and PRIME standards

NIB Management to handle 1200s PLC service nodes, 256 switches and 3600 connections (PRIME)

Linux OS 2.6x on ARM926 to support MAC and above SW stack

Convergence to both IPv6 (G3 and PRIME) and IEC61334-4-32 (PRIME)

COSEM/DLMS demo application framework*

30

PLC / 6LowPAN Data Concentrator EVM

EVM Price ~ $695

Production May 2011

<1Ghz RF

Zigbee

802.15.4

USB

Prime

PLC module

GPS

header

OMAP

L138

AIC34

Analog

I/O x2

Ethernet

DDR

LCD

Connector

• 3-phase power system:

• 3 current and voltage

Inputs plus neutral.

• Isolation to prevent damage

from high voltages, currents

• OMAP-L138 processor • Integra DSP + ARM for

Control, communications and

Signal processing.

• Full Linux BSP supported by TI

• High performance AIC provides

16-bit sampling at low SNR.

• Supports control and data

communications • Ethernet, PLC, <1Ghz RF

• RS232, CAN

Hardware Features

• Designed to best practices

for high-speed systems • Good Ref design for passing

ESD system tests.

•8 Power Inputs (4 current/4 voltage)

RS232

RS232

CAN

WL1271 Wi-Fi + Bluetooth for SITARA

Platform Overview

TI wireless connectivity: Your best choice

Find the right connectivity solution

• Industry’s broadest portfolio of proven wireless connectivity

solutions

• Support for a wide array of applications

Get to market quickly

• Complementary connectivity solutions for TI embedded

processors

• “Out-of-the-box” tools and software solutions

• Extensive support infrastructure for hassle-free development

Leverage TI’s proven experience

• 10+ years connectivity experience with over 1 billion units

shipped

• Broad industry knowledge across various technologies and

markets

• Ongoing technology and product investments

Bluetooth

®

technology

Bluetooth

® LE

technology

Wi-Fi

NFC

ZigBee®

technology 6LoWPAN

GPS

IEEE

802.15.4

ANT

RFID

ZigBee®

RF4CE

Sub-1 GHz Sub-2.4

GHz

PurePath

™

Wireless

…and

more to

come!

WL1271 Features and Benefits

Best-in-class coexistence

More connections in

parallel

Simplified design process

Best-in-class Wi-Fi

idle-connect current and

Bluetooth power

Access to cutting-edge

features

Simplified design process

Reduced operating costs

and time to market

Best in class link budget

Increased range

Dense combo integration : Wi-Fi 802.11a/b/g/n,

Bluetooth 2.1 + EDR

Enhanced WiFi/Bluetooth inter-core communication prioritizes

packet scheduling

Enhanced Low Power (ELP) mechanism allows sleeping

between WiFi beacons (0.7mA avg power), and fast wakeup time

Low power scan results in 1/3rd the Bluetooth power consumption

(145uA) than traditional reception window scan

Open source compliant driver (mac802.11)

Roadmap to new features (e.g. WiFi Direct, BLE)

Fully integrated, pre-certified modules available

Pre-integration of module and host controller, including hardware

reference design, software stack, and application code

Coexistence

Low Power

Software

System Integration

Typical WLAN transmit power: +12.5dBm, 65Mbps, OFDM (n)

Typical WLAN receiver sensitivity: -73dBm, 65Mbps

+9.5dBm increased Bluetooth transmit power

-92dBm Bluetooth receiver sensitivity

Performance

First widely available platform to support Wi-Fi Direct™

Wi-Fi Direct enables users to connect directly with each others’ devices

to share content or display it on a nearby screen for easy viewing.

Devices can directly connect to each other, regardless of whether an

infrastructure network is available.

The

performance

of Wi-Fi, with

the ability to

directly

connect!

Other WL1271 Markets

Portable Consumer

eBook, Portable media player,

Internet radio

Industrial and Home Automation Smart metering, Thermostat, Control tablets

Video Camera, Conferencing, Console

Portable Enterprise Portable data terminal, Education tablets

Smart Machines Vending machines, Toll systems, Printers

36

SDIO

Applications

AM335x ARM Cortex A8

WL12xx Driver

Wi-Fi Management

(mac80211 Driver)

Security

Supplicant

User Mode

Kernel Mode

TCP/IP Stack

DHCP Client

DNS

MPU SDIO Driver

(Wi-Fi)

Socket API

WL1271 RF

Front

End

38.4MHz

Oscillator

WL1271-TypeTN

BlueZ Stack and Profiles

UART

Open OBEX

MPU UART Driver

(Bluetooth)

• TI Platforms enable complete system integration of module and host MPU

• Primary WL1271 engagement model is through TI Platforms

• WL1271-TypeTN platform includes AM335x

WL1271 MPU Platform block diagram

DC/DC Converter

Filter

ECS Partner Network

Low cost WiFi modules

Porting and customer support

GPS modules

Platform support

Low-cost WiFi Modules

Processor porting and support

WinCE Platform Support Customization

BT Platform Support

BT Customization

Linux Platform Support

Customization

Bluetooth modules

Bluetooth Stack and Profile provider

Catalog WiFi/BTH modules On-board design services

Modules, customization

support, design services