PowerLAN Gateway Battery Management Controller with ... · PowerLAN™ Master Gateway Battery Management Controller With PowerPump™ Cell Balancing ... load conditions. ... cell

1FEATURES

APPLICATIONS

DESCRIPTION

bq78PL114

www.ti.com ................................................................................................................................................ SLUS850B–SEPTEMBER 2008–REVISED APRIL 2009

PowerLAN™ Master Gateway Battery Management ControllerWith PowerPump™ Cell Balancing Technology

– bq78PL114S12: < 300 µA Active, < 185 µAStandby, < 85 µA Ship, and < 1 µA

23• bq78PL114 Designed for Managing 3- toUndervoltage Shutdown8-Series-Cell Battery Systems

• Accurate, Advanced Temperature Monitoring• bq78PL114S12 Firmware Upgrade Supports 3-of Cells and MOSFETs With up to 12 Sensorsto 12-Series-Cell Battery Systems

• Fail-Safe Operation of Pack Protection– Adds Support for LCD and Electronic PaperCircuits: Up to Three Power MOSFETs andDisplays or EPDsOne Secondary Safety Output (Fuse)– Configurable for 11-A, 26-A, or 110-A

• Fully Programmable Voltage, Current, Balance,Operating Currentsand Temperature-Protection Features• Systems With More Than Four Series Cells

• External Inputs for Auxiliary MOSFET ControlRequire External bq76PL102 Dual-CellMonitors • Smart Battery System 1.1 Compliant via

SMBus• SmartSafety Features:– Prevention: Optimal Cell Management– Diagnosis: Improved Sensing of Cell • Portable Medical Instruments and TestProblems Equipment– Fail Safe: Detection of Event Precursors • Mobility Devices (E-Bike)

• Rate-of-Change Detection of All Important Cell • Uninterruptible Power Supplies and Hand-HeldCharacteristics: Tools– Voltage– Impedance– Cell Temperature The bq78PL114 master gateway battery controller is

part of a complete Li-Ion control, monitoring, and• PowerPump Technology Transfers Chargesafety solution designed for large series cell strings.Efficiently From Cell to Cell During All

Operating Conditions, Resulting in Longer The bq78PL114 and bq78PL114S12 along withbq76PL102 PowerLAN™ dual-cell monitors provideRun Time and Cell Lifecomplete battery-system control, communications,– bq78PL114S12 Adds User-Configurableand safety functions for a structure of three up toPowerPump Cell-Balancing Modes twelve series cells. This PowerLAN system provides

• High-Resolution 18-Bit Integrating Delta-Sigma simultaneous, synchronized voltage and currentCoulomb Counter for Precise Charge-Flow measurements using one A/D per-cell technology.Measurements and Gas Gauging This eliminates system-induced noise from

measurements and allows the precise, continuous,• Multiple Independent Δ-Σ ADCs: One-per-Cellreal-time calculation of cell impedance under allVoltage, Plus Separate Temperature, Current,operating conditions, even during widely fluctuatingand Safety load conditions.

• Simultaneous, Synchronous Measurement ofPowerPump technology transfers charge betweenPack Current and Individual Cell Voltagescells to balance their voltage and capacity. Balancing• Very Low Power Consumption is possible during all battery modes: charge,

– bq78PL114: < 250 µA Active, < 150 µA discharge, and rest. Highly efficient charge-transferStandby, < 40 µA Ship, and < 1 µA circuitry nearly eliminates energy loss while providing

true real-time balance between cells, resulting inUndervoltage Shutdownlonger run-time and improved cycle life.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerLAN, PowerPump, bqWizard are trademarks of Texas Instruments.3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

http://focus.ti.com/docs/prod/folders/print/bq78pl114.html

DESCRIPTION (CONTINUED)

bq78PL114

SLUS850B–SEPTEMBER 2008–REVISED APRIL 2009................................................................................................................................................ www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

Temperature is sensed by up to 12 external sensors and one on-chip sensor. This permits accurate temperaturemonitoring of each cell individually. Firmware is then able to compensate for the temperature-induced effects oncapacity, impedance, and OCV on a cell-by-cell basis, resulting in superior charge/ discharge and balancingcontrol.

External MOSFET control inputs provide user- definable direct hardware control over MOSFET states. Smartcontrol prevents excessive current through MOSFET body diodes. Auxiliary inputs can be used for enhancedsafety and control in large multicell arrays.

The bq78PL114 is completely user-configurable, with parametric tables in flash memory to suit a variety of cellchemistries, operating conditions, safety controls, and data reporting needs. It is easily configured using thesupplied bqWizard™ graphical user interface (GUI). The device is fully programmed and requires no algorithm orfirmware development.

The bq78PL114 can be upgraded to the bq78PL114S12 by downloading the bq78PL114S12 firmware. Thefirmware can be downloaded using the bqWizard application or during manufacturing. Upgrading to thebq78Pl114S12 changes the functionality of the LED1–LED5, LEDEN, and N/C pin #29. The bq78PL114S12 pinfunctions of LED1/SEG1–LED5/SEG5, PSH/BP/TP, and FIELD support LED, LCD, and electronic paper displays(EPDs). The user can configure the bq78PL114S12 for the desired display type.

In this document all descriptions for the bq78PL114 apply to the bq78PL114S12 except where differentbq78PL114S12 functionality is specifically described.

2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated

Product Folder Link(s): bq78PL114


http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLUS850B&partnum=bq78PL114


FLA

SH

PRE

CHG

EFCID

EFCIC

SMBus

DSG

SMBCLK

SMBDAT

SPROT

CSBAT

CSPACK

GPIO6

CE

LL

4Voltage

Temp

Balance

V4

P4N

P4S

XT4

V3

P3N

P3S

XT3

V2

P2N

P2S

XT2

CE

LL

3Voltage

Temp

BalanceC

ELL

2Voltage

Temp

Balance

CE

LL

1Voltage

Temp

Balance

2.5 V LDOVLDO1 Watchdog

Coulomb Counter CCBAT

CCPACKCurrent A/D

Core / CPU

Measure

I/O

Safety

SR

AM

RSTN

InternalTemperature

RISC

CPU

InternalOscillator

ResetLogic

First-Level Safetyand

FET Control

Second-LevelSafety

LED1–5,LEDEN

B0320-02

PowerLANCommunication

Link

P-LAN

V1

P1N

P1S

XT1

bq78PL114


Figure 1. bq78PL114 Internal Block Diagram

Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3





Core / CPU

Measure

I/O

Safety

B0320-03

FLA

SH

PRE

CHG

EFCID

EFCIC

SMBus

DSG

SMBCLK

SMBDAT

SPROT

CSBAT

CSPACK

GPIO7

CE

LL

4Voltage

Temp

Balance

V4

P4N

P4S

XT4

V3

P3N

P3S

XT3

V2

P2N

P2S

XT2

CE

LL

3Voltage

Temp

BalanceC

ELL

2Voltage

Temp

Balance

CE

LL

1Voltage

Temp

Balance

2.5 V LDOVLDO1 Watchdog

Coulomb Counter CCBAT

CCPACKCurrent A/D

SR

AM

RSTN

InternalTemperature

RISC

CPU

InternalOscillator

ResetLogic

First-Level Safetyand

FET Control

Second-LevelSafety

LED1–5/SEG1–5,PSH/BP/TP,FIELD


Link

P-LAN

V1

P1N

P1S

XT1

bq78PL114


Figure 2. bq78PL114S12 Internal Block Diagram






bq76PL102 CellMonitor WithPowerPumpBalancing

Pow

erL

AN

Com

munic

ation

Lin

k

PowerLANMaster GatewayBattery Controller

bq78PL114

PackPositive

PackNegative

Example 8-cell configuration shown

– +

SM

Bus

RS

EN

SE

Pack P

rote

ction

Circuits a

nd F

use

B0332-01

bq76PL102 CellMonitor WithPowerPumpBalancing

bq78PL114


Figure 3. Example bq78PL114 PowerLAN Multicell System Implementation (8 Cells)







Link

Po

we

rLA

NM

aste

r G

ate

wa

y B

att

ery

Co

ntr

olle

rb

q7

8P

L11

4S

12

Pa

ck

Po

sitiv

e

Pa

ck

Ne

ga

tive

Exa

mp

le 1

2-c

ell

co

nfig

ura

tio

n s

ho

wn

SMBus

RSENSE

Pack ProtectionCircuits and Fuse

B0

33

2-0

2

bq

76

PL

10

2D

ua

l-C

ell

Mo

nito

rb

q7

6P

L1

02

Du

al-C

ell

Mo

nito

rB

q7

6P

L1

02

Du

al-C

ell

Mo

nito

rB

q7

6P

L1

02

Du

al-C

ell

Mo

nito

r

V1

X1

TV

2X

2T

V3

X3

TV

4X

4T

V1

T1

V2

T2

V1

T1

V2

T2

V1

T1

V2

T2

V1

T1

V2

T2

1

2

3

4

5

6

7

8

9

10

11

12

bq78PL114


Figure 4. Example bq78PL114S12 System Implementation (12 Cells)






AVAILABLE OPTIONS

P0023-16

bq78PL114RGZ Package

(Top View)

CHG

SD

O0

DSG

SD

I1

PRE

P1N

EFCIC

P2S

EFCID

P2N

CCBAT

SD

O2

CCPACK

SD

I3

VLDO1

P3

S

CSBAT

P3

N

CSPACK

P4

S

OSCI

P4

N

OSCO

P-L

AN

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

LED5

VS

S

LED4

V1

LED3

XT

1

LED2

XT

2

LED1

V2

LEDEN

VLD

O2

SPROT

V3

NC

XT

3

NC

XT

4

NC

V4

NC

SM

BD

AT

RSTN

SM

BC

LK

36

35

34

33

32

31

30

29

28

27

26

25

48

47

46

45

44

43

42

41

40

39

38

37

Thermal Pad

bq78PL114


ORDERING INFORMATIONPackage Temperature Quantity,Product Cell Configuration (1) Package Ordering NumberDesignator Range Transport Media

bq78PL114RGZT 250, tape and reelQFN-48, 7-mmbq78PL114 3 to 8 series cells RGZ –40°C to 85°C× 7-mm bq78PL114RGZR 2500, tape and reelbq78PL114S Firmware download3 to 12 series cells N/A N/A N/A N/A12 and upgrade

(1) For configurations consisting of more than four series cells, additional bq76PL102 parts must be used.

Figure 5. bq78PL114 Pinout

bq78PL114 TERMINAL FUNCTIONSNAME NO. TYPE (1) DESCRIPTION

CCBAT 6 IA Coulomb counter input (sense resistor), connect to battery negativeCCPACK 7 IA Coulomb counter input (sense resistor), connect to pack negativeCHG 1 O Charge MOSFET control (active-high, low opens MOSFET)CSBAT 9 IA Current sense input (safety), connect to battery negativeCSPACK 10 IA Current sense input (safety), connect to pack negativeDSG 2 O Discharge MOSFET control (active-high, low opens MOSFET)EFCIC 4 I External charge MOSFET control input

(1) I – input, IA – analog input, O – output, OA – analog output, P – power






bq78PL114


bq78PL114 TERMINAL FUNCTIONS (continued)NAME NO. TYPE (1) DESCRIPTION

EFCID 5 I External discharge MOSFET control inputLED1 32 O LED1 – open-drain, active-lowLED2 33 O LED2 – open-drain, active-lowLED3 34 O LED3 – open-drain, active-lowLED4 35 O LED4 – open-drain, active-lowLED5 36 O LED5 – open-drain, active-lowLEDEN 31 IO LEDEN – common-anode drive (active-low) and pushbutton inputNC 26 IO Connect 1-MΩ resistor to VSSNC 27 I Connect 1-MΩ resistor to VSSNC 28, 29 O No connectOSCI 11 I External oscillator input (no connect, internal oscillator used)OSCO 12 O External oscillator output (no connect, internal oscillator used)P1N 15 O Charge-balance gate drive, cell 1 northP2S 16 O Charge-balance gate drive, cell 2 southP2N 17 O Charge-balance gate drive, cell 2 northP3N 21 O Charge-balance gate drive, cell 3 northP3S 20 O Charge-balance gate drive, cell 3 southP4N 23 O Charge-balance gate drive, cell 4 northP4S 22 O Charge-balance gate drive, cell 4 southP-LAN 24 IO PowerLAN I/O to external bq76PL102 nodesPRE 3 O Precharge MOSFET control (active-high)RSTN 25 I Device reset, active-lowSDI1 14 I Connect to SDO0 via a capacitorSDI3 19 I Internal PowerLAN connection – connect to SDO2 through a 0.01-µF capacitorSDO0 13 O Requires 100-kΩ pullup resistor to VLDO1SDO2 18 O Internal PowerLAN connection – connect to SDI3 through a 0.01-µF capacitorSMBCLK 37 IO SMBus clock signalSMBDAT 38 IO SMBus data signalSPROT 30 O Secondary protection output, active-high (FUSE)V1 47 IA Cell-1 positive inputV2 44 IA Cell-2 positive inputV3 42 IA Cell-3 positive inputV4 39 IA Cell-4 positive inputVLDO1 8 P Internal LDO-1 output, bypass with 10-µF capacitor to VSSVLDO2 43 P Internal LDO-2 output, bypass with 10-µF capacitor to V2VSS 48 IA Cell-1 negative inputXT1 46 IA External temperature-sensor-1 inputXT2 45 IA External temperature-sensor-2 inputXT3 41 IA External temperature-sensor-3 inputXT4 40 IA External temperature-sensor-4 input– – P Thermal pad. Connect to VSS






P0023-20

bq78PL114S12RGZ Package

(Top View)

CHG

SD

O0

DSG

SD

I1

PRE

P1N

EFCIC

P2S

EFCID

P2N

CCBAT

SD

O2

CCPACK

SD

I3

VLDO1

P3S

CSBAT

P3

N

CSPACK

P4S

OSCI

P4

N

OSCO

P-L

AN

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

LED5/SEG5

VS

S

LED4/SEG4

V1

LED3/SEG3

XT

1

LED2/SEG2

XT

2

LED1/SEG1

V2

PSH/BP/TP

VLD

O2

SPROT

V3

FIELD

XT

3

NC

XT

4

NC

V4

NC

SM

BD

AT

RSTN

SM

BC

LK

36

35

34

33

32

31

30

29

28

27

26

25

48

47

46

45

44

43

42

41

40

39

38

37

Thermal Pad

bq78PL114


Figure 6. bq78PL114S12 Pinout

bq78PL114S12 TERMINAL FUNCTIONSNAME NO. TYPE (1) DESCRIPTION

CCBAT 6 IA Coulomb counter input (sense resistor), connect to battery negativeCCPACK 7 IA Coulomb counter input (sense resistor), connect to pack negativeCHG 1 O Charge MOSFET control (active-high, low opens MOSFET)CSBAT 9 IA Current sense input (safety), connect to battery negativeCSPACK 10 IA Current sense input (safety), connect to pack negativeDSG 2 O Discharge MOSFET control (active-high, low opens MOSFET)EFCIC 4 I External charge MOSFET control inputEFCID 5 I External discharge MOSFET control inputFIELD 29 O EPD field segmentLED1/SEG1 32 O LED1 – open-drain, active-low, LCD and EPD segment 1LED2/SEG2 33 O LED2 – open-drain, active-low, LCD and EPD segment 2LED3/SEG3 34 O LED3 – open-drain, active-low, LCD and EPD segment 3LED4/SEG4 35 O LED4 – open-drain, active-low, LCD and EPD segment 4LED5/SEG5 36 O LED5 – open-drain, active-low, LCD and EPD segment 5N/C 26, 27 IO Connect 1-MΩ resistor to VSSN/C 28 O No connectOSCI 11 I External oscillator input (no connect, internal oscillator used)

(1) I – input, IA – analog input, O – output, OA – analog output, P – power






bq78PL114


bq78PL114S12 TERMINAL FUNCTIONS (continued)NAME NO. TYPE (1) DESCRIPTION

OSCO 12 O External oscillator output (no connect, internal oscillator used)P1N 15 O Charge-balance gate drive, cell 1 northP2N 17 O Charge-balance gate drive, cell 2 northP2S 16 O Charge-balance gate drive, cell 2 southP3N 21 O Charge-balance gate drive, cell 3 northP3S 20 O Charge-balance gate drive, cell 3 southP4N 23 O Charge-balance gate drive, cell 4 northP4S 22 O Charge-balance gate drive, cell 4 southP-LAN 24 IO PowerLAN I/O to external bq76PL102 nodesPRE 3 O Precharge MOSFET control (active-high)PSH/BP/TP 31 IO Pushbutton detect for LED display, LCD backplane, EPD top plane and charge pumpRSTN 25 I Device reset, active-lowSDI1 14 I Connect to SDO0 via a capacitorSDI3 19 I Internal PowerLAN connection – connect to SDO2 through a 0.01-µF capacitorSDO0 13 O Requires 100-kΩ pullup resistor to VLDO1SDO2 18 O Internal PowerLAN connection – connect to SDI3 through a 0.01-µF capacitorSMBCLK 37 IO SMBus clock signalSMBDAT 38 IO SMBus data signalSPROT 30 O Secondary protection output, active-high (FUSE)V1 47 IA Cell-1 positive inputV2 44 IA Cell-2 positive inputV3 42 IA Cell-3 positive inputV4 39 IA Cell-4 positive inputVLDO1 8 P Internal LDO-1 output, bypass with 10-µF capacitor to VSSVLDO2 43 P Internal LDO-2 output, bypass with 10-µF capacitor to V2VSS 48 IA Cell-1 negative inputXT1 46 IA External temperature-sensor-1 inputXT2 45 IA External temperature-sensor-2 inputXT3 41 IA External temperature-sensor-3 inputXT4 40 IA External temperature-sensor-4 input– – P Thermal pad. Connect to VSS






ABSOLUTE MAXIMUM RATINGS (1)

RECOMMENDED OPERATING CONDITIONS

bq78PL114


over operating free-air temperature range (unless otherwise noted)

RANGE UNITSTA Operating free-air temperature (ambient) –40 to 85 °CTstg Storage temperature –65 to 150 °CV4–V3 Maximum cell voltage –0.5 to 5.0 VV3–V2 Maximum cell voltage –0.5 to 5.0 VV2–V1 Maximum cell voltage –0.5 to 5.0 VV1–VSS Maximum cell voltage –0.5 to 5.0 VVoltage on LEDEN, SPROT, CCBAT,CCPACK, CSBAT, CSPACK, XT1, XT2, Maximum voltage on any I/O pin with respect to VSS –0.5 to (VLDO1 + 0.5) VOSCI, OSCO, P-LANVoltage on PSH/BP/TP (bq78PL114S12) Maximum voltage range with respect to VSS –0.5 to (VLDO1 + 0.5) VVoltage on LED1–LED5 Maximum voltage on I/O pin with respect to VSS –0.5 to 5.5 VVoltage on LED1/SEG1–LED5/SEG5 Maximum voltage on I/O pin –0.5 to 5.5 V(bq78PL114S12)

(V2 – 0.5) toVoltage on XT3, XT4 Maximum voltage range with respect to V2 V(VLDO2 + 0.5)EFCIC, EFCID Maximum voltage range with respect to VSS –0.5 to 5.5 VVoltage on SMBCLK, SMBDAT Maximum voltage range with respect to VSS –0.5 to 6 VVoltage on PRE, CHG, DSG Maximum voltage range with respect to VSS –0.5 to (VLDO1 + 0.5) VCurrent through PRE, CHG, DSG, Maximum current source/sink 20 mALED1–LED5, P-LANCurrent throughLED1/SEG1–LED5/SEG5, Maximum current source/sink 20 mA(bq78PL114S12, LED mode)VLDO1 maximum current Maximum current draw from VLDO 20 mA

JEDEC, JESD22-A114 human-body model, R = 1500 Ω, C =ESD tolerance 2 kV100 pFLead temperature, soldering Total time < 3 seconds 300 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.


MIN NOM MAX UNITVSUP Supply voltage—V1, V2, V3, V4 2.3 4.5 VVStartup Minimum startup voltage—V1, V2 2.9 VVIN Input cell voltage range—V(n+1) – V(n), n = 1, 2, 3, 4 0 4.5 VCVLDO1 VLDO 1 capacitor—VLDO1 2.2 10 47 µFCVLDO2 VLDO 2 capacitor—VLDO2 2.2 10 47 µFCVn Cell-voltage capacitor—Vn 1 µF






ELECTRICAL CHARACTERISTICS

DC Characteristics

Voltage-Measurement Characteristics

bq78PL114


TA = –40°C to 85°C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNITVCELL

(1) Operating range Cells balanced 2.3 4.5 VIDD Operating-mode current Measure / report state, bq78PLL114 250 µA

Measure / report state, bq78PLL114S12 300ISTBY Standby-mode current SMBCLK = SMBDAT = L, bq78PLL114 100 µA

SMBCLK = SMBDAT = L, 185bq78PLL114S12

ISHIP Ship-mode current bq78PLL114 30 µAbq78PLL114S12 85

Extreme cell under voltage All cells < 2.7 V and any cell < ECUV setIECUV 1 µAshutdown current pointVOL SPROT, LEDEN, IOL < 4 mA 0 0.5 V

PSH/BP/TP(bq78PL114S12),FIELD(bq78PL114S12)

VOH(2) SPROT, LEDEN, IOH < –4 mA VLDO1 – 0.1 V

PSH/BP/TP(bq78PL114S12),FIELD(bq78PL114S12)

VIL SPROT, LEDEN, 0.25 VLDO1 VPSH/BP/TP(bq78PL114S12),FIELD(bq78PL114S12)

VIH SPROT, LEDEN, 0.75 VLDO1 VPSH/BP/TP(bq78PL114S12),FIELD(bq78PL114S12)

(1) Device should be configured to enter shutdown state when cell voltages are below 2.5 V.(2) Does not apply to SMBus pins.


PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range 2.5 4.5 VResolution <1 mV

25°C ±5Accuracy mV

0°C to 60°C ±10






Current-Sense Characteristics

Coulomb-Counter Characteristics (1) (2)

Current-Sense (Safety) Characteristics (1)

Internal Temperature-Sensor Characteristics (1)

bq78PL114



PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range (1) (bq78PL114) –0.2 0.2 VMeasurement range (2) (bq78PL114S12, 3-mΩ –0.077 0.077 Vsense resistor)Measurement range (2) (bq78PL114S12, 1-mΩ –0.1 0.1 Vand 10-mΩ sense resistors)Input offset TA = 25°C ±50 µVOffset drift TA = 0°C to 60°C 0.5 µV/°CResolution (bq78PL114) 18 µVResolution (bq78PL114S12, 3-mΩ sense 6.9 µVresistor)Resolution (bq78PL114S12, 1-mΩ and 10-mΩ 10 µVsense resistors)Full-scale error (3) TA = 25°C ±0.1%Full-scale error drift TA = 0°C to 60°C 50 PPM/°C

(1) Default range. Corresponds to ±10 A using a 5-mΩ sense resistor.(2) The bq78PL114S12 firmware upgrade supports three sense-resistor options, 10 mΩ, 3 mΩ, and 1 mΩ.(3) After calibration. Accuracy is dependent on system calibration and temperature coefficient of sense resistor.


PARAMETER TEST CONDITIONS MIN TYP MAX UNITResolution 5 nVhIntergral nonlinearity 0.008%Snap-to-zero (deadband) ±100 (3) µV

(1) Shares common input with current-sense section(2) After calibration. accuracy is dependent on system calibration and temperature coefficient of sense resistor.(3) Corresponds to 20 mA using 5-mΩ sense resistor


PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range –0.312 0.312 V

Short-circuit detection 10Resolution mV

Overcurrent detection, charge and discharge 1.25

(1) Post calibration: Dependent on system calibration and temperature coefficient of sense resistor. Uncertainty is 1.5 LSB.


PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range –30 85 °CResolution 0.1 °CAccuracy (1) –30° to 85° ±1 °C

(1) After calibration






LDO Voltage Characteristics (1)

External Temperature-Sensor(s) Typical Characteristics (1)

SMBus Characteristics (1)

bq78PL114



PARAMETER TEST CONDITIONS MIN TYP MAX UNITVLDO1 LDO1 operating voltage, referenced to TA = –40C to 85C, load = 200 µA 2.425 2.5 2.575 V

VSSVLDO2 LDO2 operating voltage, referenced to V2 TA = –40C to 85C, load = 2 mA 2.425 2.5 2.575 V

(1) After calibration


PARAMETER TEST CONDITIONS MIN TYP MAX UNITMeasurement range (2) –40 90 °CResolution 0.2 °C

25° ±1Accuracy (3) °C

0° to 85° ±2

(1) Typical for dual-diode (MMBD4148 or equivalent) external sensor using recommended circuit(2) Range of diode sensors may exceed operational limits of IC and battery cells.(3) Typical behavior after calibration, final result dependent on specific component characteristics


PARAMETER TEST CONDITIONS MIN TYP MAX UNITVIL Input low voltage 0 0.8 VVIH Input high voltage 2.1 5.5 VVOL Output low voltage 350-µA sink current 0 0.4 VCI Capacitance, each I/O pin 10 pFfSCL SCLK nominal clock frequency TA = 25°C 100 kHz

VBUS 5 V nominal 13.3 45.3RPU

(2) Pullup resistors for SCLK, SDATA kΩVBUS 3 V nominal 2.4 6.8

(1) SMBus timing and signals meet the SMBus 2.0 specification requirements under normal operating conditions. All signals are measuredwith respect to PACK-negative.

(2) Pullups are typically implemented external to the battery pack, and are selected to meet SMBus requirements.






bq78PL114PowerLAN

Gateway BatteryManagement

Controller

RPRE

+ PACK+

–

SMBCLK

SMBDAT

RSENSE

PACK–

XT1–XT4

TemperatureSensor (typ.)

SPROT

LED1–LED5

Typical six-cell configuration shown.Additional cells added via PowerLAN connection.Some components omitted for clarity.

V2

V3

V4

V1

VLDO2

CRFI

VLDO1

RSTN

SDO2

SDI3

EFCID

EFCIC

One of 4 externalsensors shown

P-LAN

5

CELL 6

CELL 5

V2

V1

SDI1

SDO0

Level-Shift Circuits

CH

G

DS

G

PR

E

ES

D P

rote

ction

SM

Bus

Au

x F

ET

Co

ntr

ol

Th

erm

al P

ad

VS

S

CS

BA

T

CC

BA

T

CC

PA

CK

CS

PA

CK

Ce

ll B

ala

ncin

gC

ircu

its

Ce

ll B

ala

ncin

g C

ircu

its

bq

76

PL

102

CELL 4

CELL 3

CELL 2

CELL 1

S0342-02

bq78PL114


Figure 7. bq78PL114 Simplified Example Circuit Diagram






FEATURE SET

Primary (First-Level) Safety Features

Secondary (Second-Level) Safety Features

Charge Control Features

Gas Gauging

Display Types

bq78PL114


The bq78PL114 implements a breadth of system protection features which are easily configured by thecustomer. First-level protections work by controlling the MOSFET switches. These include:• Battery cell over/undervoltage protection• Pack over/undervoltage protection• Charge and discharge overcurrent protection• Short-circuit protection• External MOSFET control inputs (EFCIx) with programmable polarity• Up to 12 external temperature inputs for accurate cell and MOSFET monitoring• Watchdog timer protection• Brownout detection and protection against extreme pack undervoltage

The bq78PL114 can detect more serious system faults and activate the SPROT pin, which can be used to openan in-line chemical fuse to permanently disable the pack. Secondary optional features include• Fully independent of first-level protections• SmartSafety algorithms for early detection of potential faults

– Temperature abnormalities (variances, extremes, rate of change, etc.)– Disconnected cell voltage inputs– Cell imbalance exceeds safety limits– Impedance rise due to cell or weld strap fault

• MOSFET failure or loss of MOSFET control• Safety overvoltage, pack and cell• Safety overtemperature, limits for both charge and discharge• Safety overcurrent, charge and discharge• Failed current measurement, voltage measurement, or temperature measurement

• Meets SMBus 2.0 and Smart Battery System (SBS) Specification 1.1 requirements• Active cell balancing using patented PowerPump technology, which eliminates unrecoverable capacity loss

due to normal cell imbalance• Balancing-current monitoring to detect cell problems• Simultaneous, synchronous measurement of all cell voltages in a pack• Simultaneous, synchronous measurement of pack current with cell voltages• Reports target charging current and/or voltage to an SBS Smart Charger• Reports the chemical state-of-charge for each cell and pack• Supports precharging and zero-volt charging with separate MOSFET control• Programmable, Chemistry-specific parameters• Fault reporting

• The bq78PL114 accurately reports battery cell and pack state-of-charge (SOC). No full charge/dischargecycle is required for accurate reporting.

• State-of-charge is reported via SMBus and optional display.• 18-bit integrating delta-sigma ADC coulomb counter, with programmable snap-to-zero value

• The bq78PL114 drives a three- to five-segment LED display in response to a pushbutton (LEDEN) inputsignal. Each LED pin can sink up to 10 mA.






Lifetime Logging (Readable via SMBus)

Forensic Data Logging (Readable via SMBus)

Power Modes

OPERATION

bq78PL114


• The bq78PL114S12 drives a three- to five-segment static liquid-crystal display.• The bq78PL114S12 drives a three- to five-segment electronic paper display. An external 15-V voltage source

is required. E Ink Corporation supplies this type of display.

The display type is selected via the parameter set.

• Recording of faults, events, anomalies, minimum and maximum values• Maximum/minimum temperature• Maximum/minimum pack voltage• Maximum/minimum cell voltage in a pack• Maximum charge and discharge currents

• Last known full capacity of each cell• Cycle count and/or cumulative number of ampere-hours delivered by the battery• Battery pack status: being charged, discharged, or at rest• Balancing effort required by each bank of cells to maintain balance• Last 10 failures causing first-level safety action• Forensic data up-loadable to host CPU via SMBus

• Normal Mode: The bq78PL114 performs measurements and calculations, makes decisions, and updatesinternal data approximately once per second. All safety circuitry is fully functional in this mode.

• Standby Mode: The bq78PL114 performs as in normal mode, but at a dramatically reduced rate to lowerpower consumption at times when the host computer is inactive or the battery system is not being used. Allsafety circuitry remains fully functional in this mode.

• Ship Mode: The bq78PL114 disables (opens) all the protection MOSFETs, and continues to monitortemperature and voltage, but at a reduced measurement rate to dramatically lower power consumption.Environmental data is saved in flash as a part of the historical record. Safety circuitry is disabled in this mode.The device does not enter this power state as a part of normal operation; it is intended for use after factoryprogramming and test. Entry occurs only after a unique SMBus command is issued. Exit occurs when theSMBus lines return to an active state.

• Extreme Cell Undervoltage (ECUV) Shutdown Mode: In this mode, the bq78PL114 draws minimal currentand the charge and discharge protection MOSFETs are disabled (opened). The precharge MOSFET remainsenabled when a charge voltage is present. Safety circuitry is disabled in this mode. The device does not enterthis mode as a part of normal operation; it enters this state during extreme cell undervoltage conditions(ECUV). The ECUV threshold is programmable between 2.3 V and 2.7 V, with 2.5 V being typical.

OVERCURRENTSTATE ENTRY CONDITION EXIT CONDITIONPROTECTIONNormal operation as determined by firmware Firmware directed to the following operatingActive Fully active modesNo load current flowing for predeterminedStandby Fully active Load activitytime

Ship Not active Protected SMBus command SMBus becomes activeExtreme cell Not active (precharge Vcell charge above ECUV recovery thresholdEnabled when Vcell < ECUVundervoltage enabled) (2.7 V/cell typical)

The bq78PL114 battery-management controller serves as a master controller for a Li-Ion battery systemconsisting of up to 8 cells in series. The bq78PL114S12 firmware upgrade supports up to 12 cells in series. Anynumber of cells may be connected in parallel; other system or safety issues limit the number of parallel cells. Thebq78PL114 provides extraordinarily precise state-of-charge gas gauging along with first- and second-level packsafety functions. Voltage and current measurements are performed synchronously and simultaneously for allcells in the system, allowing a level of precision not previously possible in battery management. Temperature is






PowerLAN Communication Link

Safety

Cell Balancing

bq78PL114


measured by up to four additional external temperature sensors. With the bq78PL114S12 firmware upgrade, upto eight more are available in remote bq76PL102 dual-cell battery monitors. Coulomb counting is capturedcontinuously by a dedicated 18-bit integrating delta-sigma ADC in the bq78PL114. The CPU in the bq78PL114 isalso responsible for system data calculations, black-box forensic data storage, and communicating parametersvia the SMBus interface. The bq78PL114S12 firmware can be downloaded to existing bq78PL114 parts usingthe bqWizard GUI or during the manufacturing checkout process.

PowerLAN technology is Texas Instruments’ patented serial network and protocol designed specifically forbattery management in a multicell system environment. The PowerLAN link is used to initiate and reportmeasurements of cell voltage and temperature, and control cell balancing. The bq78PL114 serves as the mastercontroller of the PowerLAN link and can interface to multiple bq76PL102 dual-cell battery monitors, whichmeasure and balance additional cells. The bq78PL114 monitors the first three or four cells, and bq76PL102s canbe added to monitor more series cells.

The PowerLAN link isolates voltages from adjacent bq76PL102 devices to permit high-voltage stack assemblywithout compromising precision and accuracy. The PowerLAN link is expandable to support up to 12 cells inseries. Each bq76PL102 handles voltage and temperature measurements, as well as balancing for two cells. ThePowerLAN link provides high ESD tolerance and high immunity to noise generated by nearby digital circuitry orswitching currents. Each bq76PL102 has both a PowerLAN input and PowerLAN output: Received data isbuffered and retransmitted, permitting high numbers of nodes without loss of signal fidelity. Signals arecapacitor-coupled between nodes, providing dc isolation.

Unique in the battery-management controller market, the bq78PL114 simultaneously measures voltage andcurrent using independent and highly accurate delta-sigma ADCs. This technique removes virtually all systemicnoise from measurements, which are made during all modes of battery operation: charge, discharge, and rest.The bq78PL114 also directs all connected bq76PL102 dual-cell battery monitors to measure each cell voltagesimultaneously with the bq78PL114 measurements. Battery impedance and self-discharge characteristics arethus measured with an unprecedented level of accuracy in real time. The bq78PL114 applies this preciseinformation to SmartSafety algorithms to detect certain anomalies and conditions which may be indicative ofinternal cell faults, before they become serious problems.

The bq78PL114 uses its enhanced measurement system to detect system faults including cell under- andovervoltage, cell under- and overtemperature, system overvoltage, and system overcurrent. First-level safetyalgorithms first attempt to open the MOSFET safety switches. If this fails, second-level safety algorithms activatethe SPROT output, normally used to open a fuse and provide permanent, hard protection for the systems.External MOSFET control inputs with programmable polarity can also be used to operate the safety MOSFETsunder control of user supplied circuitry. The bq78PL114 continuously monitors these inputs. If any MOSFET failsto open when commanded; the 2nd level safety algorithms also activate the SPROT output. All first- andsecond-level safety algorithms have fully programmable time delays to prevent false triggering.

Patented PowerPump cell balancing technology drastically increases the useful life of battery packs byeliminating the cycle life fade of multi-cell packs due to cell imbalance. PowerPump technology efficientlytransfers charge from cell to cell, rather than simply bleeding off charging energy as heat as is typically done withresistive-bleed balancing circuits. Balancing is configurable and may be performed during any battery operationalmodes: charge, discharge, or rest. Compared to resistive bleed balancing, virtually no energy is lost as heat. Theactual balance current is externally scalable and can range from 10 mA to 1 A (100 mA typical) depending oncomponent selection and system or cell requirements.

A variety of techniques, such as simple terminal voltage, terminal voltage corrected for impedance andtemperature effects, or state-of-charge balancing, is easily implemented by the bq78PL114. By tracking thebalancing required by individual cells, overall battery safety is enhanced, often allowing early detection of softshorts or other cell failures. Balancing is achieved between all cells within the pack as dynamically determined bythe bq78PL114.






Outputs

bq78PL114


Charge ControlThe CHG and PRE outputs are ordinarily used to drive MOSFET transistors controlling charge to the cell stack.Charge or precharge mode is selected based on the present cell voltage compared to the user-definable cellprecharge, undervoltage, and temperature thresholds. When below these limits, the PRE signal is active and theCHG signal is inactive. This turns on the precharge MOSFET and is used to charge a depleted system through acurrent-limiting series resistor. When all cell voltages are above the limit and the temperature is above the chargetemperature minimum, then the CHG output also becomes active and enables the charge MOSFET to turn on,providing a high-current path between charger and battery cells.

The CHG and PRE MOSFET control outputs are both disabled (low) when any cell reaches the safety cutoff limitor temperature threshold. During active charging modes (and above cell voltage thresholds), the dischargeMOSFET is also enabled to avoid excessive heating of the body diode. Similarly, the charge MOSFET is activeduring discharge, provided current flow is in the correct direction and no safety violations are present.

The bq78PL114S12 firmware upgrade supports the following configurable cell-balancing features:• Super-pump mode. When enabled this allows 60%–70% pump availability when there are no active safety

events and current is not flowing. While in super-pump mode, temperature rate-of-rise features are notavailable.

• Option to disable cell balancing during discharge• Option to disable cell balancing during charge

The CHG and PRE outputs are intended to drive buffer transistors acting as inverting level shifters.

Discharge ControlThe DSG output operates similarly to control-system discharging. It is enabled (high) by default. If a cell voltagefalls below a programmable threshold, or excessive current or other safety related fault is sensed, the DSGoutput is disabled (low) to prevent damage to the cells.

All facets of safely charging and discharging the cell stack are controlled by user-definable parameters whichprovide precise control over MOSFET states. Both system and cell over- and undervoltage limits are provided, aswell as programmable hysteresis to prevent oscillation. Temperature and current thresholds are also provided,each with independent timers to prevent nuisance activations.

The DSG output is intended to drive a buffer transistor acting as an inverting level-shifter.

DisplayThe bq78PL114 shows state-of-charge indication on a five-LED display in a bar-graph format. LEDEN is adual-function pin. One function is to control current to the LED display array. It also serves as an input thatmonitors for closure of a state-of-charge indicator (SOCi) push-button switch.

The bq78PL114S12 shows state-of-charge indication on LED, static liquid crystal, and electronic paper displaysor EPDs in a bar-graph-type format. The parameter set allows selection of display type and configuration.PSH/BP/TP is a multifunction pin. In LED display mode, PSH serves as an input that monitors for closure of astate-of-charge indicator (SOCi) push-button switch. In LCD mode, this pin is used to drive the LCD backplane.In EPD mode, this pin drives the top plane common signal of the display.

For both the bq78PL114 and bq78PL114S12, in LED display mode the signals LED1/SEG1–LED5/SEG5 arecurrent-sinking outputs designed to drive low-current LEDs.

For the bq78PL114S12 firmware in LCD and EPD modes, the LED1/SEG1–LED5/SEG5 pins drive the activesegments through external buffer transistors. In EPD mode, the FIELD pin drives the display background field.

Electronic paper displays require an external power supply, typically 15 V, to power the display. In EPD, modethe bq78PL114S12 strobes the display outputs for a user- programmable period of milliseconds to drive anexternal voltage multiplier or charge pump to the required display supply voltage. The display segments are thenupdated in a manner that ensures the required 0-Vdc segment voltage offset is maintained and keeps theexternal power supply at its nominal voltage.






Inputs

bq78PL114


Current MeasurementCurrent is monitored by four separate ADCs. All use the same very low-value sense resistor, typically 10, 5, 3, or1 milliohms in series with the pack negative connection. CCBAT and CCPACK connections to the sense resistoruse an R/C filter for noise reduction. (CSBAT and CSPACK are direct connections used for secondary safety).The bq78PL114 requires a 5-milliohm sense resistor. The bq78PL114S12 can be configured to use 10-, 3-, or1-milliohm sense resistors. When configured to use a 1-milliohm sense resistor, the maximum available packcapacity increases to 655 Ah from 65 Ah.

A 14-bit delta-sigma ADC is used to measure current flow accurately in both directions. The measurements aretaken simultaneously and synchronously with all the cell voltage measurements, even those cells measured bybq76PL102 dual-cell battery monitors.

Coulomb CountingA dedicated coulomb counter is used to measure charge flow with 18-bit precision in both directions by acalibrated, integrating delta-sigma ADC. This allows the bq78PL114 to keep very accurate state-of-charge (SOC)information and battery statistics. A small deadband is applied to further reduce noise effects. The coulombcounter is unique in that it continues to accumulate (integrate) current flow in either direction even as the rest ofthe internal microcontroller is placed in a very low power state, further lowering power consumption withoutcompromising system accuracy.

Safety CurrentTwo additional ADCs are used to directly monitor for overcurrent or short-circuit current conditions, independentlyof the internal function. This provides a direct and rapid response to insure pack integrity and safe operation byopening the appropriate MOSFETs. These functions are implemented in hardware, and do not require firmwarefor functionality.

Voltage MeasurementVoltage measurement is performed by four independent delta-sigma ADCs which operate simultaneously andare triggered synchronously so that all voltages are read at precisely the same moment. The bq78PL114coordinates the attached bq76PL102 dual-cell battery monitors so they also perform their cell voltagemeasurements in sync with the bq78PL114 voltage and current measurements. Voltage measurements areconverted with better than 1 mV of resolution, providing superior accuracy. One-ADC-per-cell technology meansthat voltage is also measured simultaneously with current, permitting accurate, real-time cell impedancecalculation during all operating conditions. This technique also provides greatly enhanced noise immunity andfiltering of the input signal without signal loss.

Temperature MeasurementXT1–XT4 are dedicated temperature-sensor inputs. Each external sensor consists of a low-cost silicon diode(dual diode in one package is recommended) and capacitor combination. Temperatures for cells 5 and above aremeasured by up to four external bq76PL102(s), and the temperature data is received by the bq78PL114 orbq78PL114S12 over the PowerLAN link for processing. The bq78PL114 or bq78PL114S12 can report all ofthese temperatures individually. The bq78PL114 allows multiplexed configuration of up to twelve temperaturesensors. This permits the pack designer to measure temperatures of all cells and other items such as the chargeand discharge MOSFETs. The bq78PL114S12 firmware uses the internal temperature sensor of the device forboard temperature measurements.

EFCIxThe external MOSFET control inputs are for user control of MOSFETs based on external circuitry and conditions.The polarity of the input signal is user-programmable. These pins can be used to force the protection MOSFETsto an OFF state.






COMMUNICATIONS

SMBus

Smart Battery Data (SBData)

bq78PL114


The bq78PL114 uses the industry-standard Smart Battery System’s two-wire System Management Bus (SMBus)communications protocol for all external communication. SMBus version 2.0 is supported by the bq78PL114, andincludes clock stretching, bus fault time-out detection, and optional packet error checking (PEC). For additionalinformation, see the www.smbus.org and www.sbs-forum.org Web sites.

The data content and formatting of the bq78PL114 information conforms to the Smart Battery System’s (SBS)Smart Battery Data specification, version 1.1. See the SBS/SMBus site at www.sbs-forum.com for furtherinformation regarding these specifications.

This SBS Data (SBData) specification defines read/write commands for accessing data commonly required inlaptop computer applications. The commands are generic enough to be useful in most applications.

Because the bq78PL114 provides a wealth of control and battery information beyond the SBData standard, newcommand codes have been defined by Texas Instruments. In addition, new battery data features, such asstate-of-health, use newly defined extended SBData command codes. Standard SMBus protocols are used,although additional data values beyond those defined by the Smart Battery Data specification are employed. (Forexample, the bq78PL114 typically is used in a multicell battery system and may report individual cell voltages forup to eight cells. The bq78PL114S12 can report individual cell voltages for up to 12 cells. The SBData commandset only defines four cell-voltage registers.)






SBS Standard Data Parameter List (Abridged) (1)

bq78PL114


Command Data Type Description00 R/W word (unsigned) Manufacturer Access01 R/W word (unsigned) Remaining Capacity Alarm Level02 R/W word (unsigned) Remaining Time Alarm Level03 R/W word (unsigned) Battery Mode04 R/W word (unsigned) At Rate value used in AtRate calculations05 Read word (unsigned) At Rate Time to Full06 Read word (unsigned) At Rate Time to Empty07 Read word (Boolean) At Rate OK08 Read word (unsigned) Pack Temperature (maximum of all individual cells)09 Read word (unsigned) Pack Voltage (sum of individual cell readings)0A Read word (unsigned) Pack Current0B Read word (unsigned) Average Pack Current0C Read word (unsigned) Max Error0D Read word (unsigned) Relative State of Charge0E Read word (unsigned) Absolute State of Charge0F Read word (unsigned) Remaining Pack Capacity10 Read word (unsigned) Full Charge Capacity11 Read word (unsigned) Run Time to Empty12 Read word (unsigned) Average Time to Empty13 Read word (unsigned) Average Time to Full14 Read word (unsigned) Charging Current15 Read word (unsigned) Charging Voltage16 Read word (unsigned) Battery Status17 Read word (unsigned) Cycle Count18 Read word (unsigned) Design Capacity19 Read word (unsigned) Design Voltage1A Read word (unsigned) Specification Information1B Read word (unsigned) Manufacture Date1C Read word (unsigned) Serial Number1D–1F Reserved20 Read block (string) Pack Manufacturer Name (31 characters maximum)21 Read block (string) Pack Device Name (31 characters maximum)22 Read block (string) Pack Chemistry23 Read block (string) Manufacturer Data24–2E Reserved2F R/W Block Optional Manufacturer Function 530–3B Reserved3C R/W word (unsigned) Optional Manufacturer Option 4 (Vcell 1)3D R/W word (unsigned) Optional Manufacturer Option 3 (Vcell 2)3E R/W word (unsigned) Optional Manufacturer Option 2 (Vcell 3)3F R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 4)40 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 5)41 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 6)42 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 7)43 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 8)44 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 9, bq78PL114S12 only)

(1) Parameters 0x00–0x3F are compatible with the SBDATA specification.






bq78PL114


Command Data Type Description45 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 10, bq78PL114S12 only)46 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 11, bq78PL114S12 only)47 R/W word (unsigned) Optional Manufacturer Option 1 (Vcell 12, bq78PL114S12 only)48–4F Unused50–55 Reserved56–57 Unused58–5A Reserved5B–5F Unused60–62 Reserved63–6F Unused70 Reserved71–FF Unused

NOTE:

The bq78PL114 allows mapping of the eight cell voltage SBS locations to be differentthan its base address of 0x3C. The bq78PL114S12 does not support this feature.






REFERENCE SCHEMATICS

equi v

ale

nt

resis

tance

Used f

or

Safe

ty E

vents U

sed f

or

Devic

e T

em

p.

T1 =

CELL 1

TEM

P.

T2 =

CELL 2

TEM

P.

T3 =

CELL 3

TEM

P.

TEM

P-F

ETS =

FET T

EM

P. &

USED

FO

R S

AFETY.

TEM

P-P

CB =

TEM

P. O

F U

4

sta

r gro

und p

oin

t lo

cate

d a

t R3

Keep t

his

connection t

o B

ATT-

as s

hort

and L

ow

Z a

s p

ossib

le.

1CHG

2DSG

3PRE

4EFCIC

5EFCID

6

CCBAT

7CCPACK

8VLD

O1

9

CSBAT

10CSPACK

11

OSCI

12

OSCO

13

SD

O0

14

SD

I1

15

P1N

16

P2S

17

P2N

18

SD

O2

19

SD

I3

20

P3S

21

P3N

22

P4S

23

P4N

24

P-L

AN

25

RSTN

26

NC

27

NC

28

NC

29

SELECT

30SPROT

31

LED

EN

32

LED

1

33

LED

2

34

LED

3

35

LED

4

36

LED

5

37

SM

BCLK

38

SM

BD

AT

39

V4

40

XT4

41

XT3

42

V3

43

VLD

O2

44

V2

45

XT2

46

XT1

47

V1

48

VSS

49TAB

U4 bq78PL114

C5

10uF

R44

10K

C38

0.1

uF

C27

1000pF

C28

10uF

C43

0.1

uF

C7

1.0

uF

R5

100K

C11

1000pF

R28

4.7

K

R27

4.7

K

R49

100R

R50

100R

R54

100R

R55

100R

R43

1.0

M

R51

1.0

M

C40

1.0

uF

C39

1.0

uF

C41

1.0

uF

R10

2K

R30

20K

R29

20K

C12

3300pF

C13

3300pF

Q1-A

FD

C6327C

Q1-B

FD

C6327C

L1

4.7

uH

C30

22uF

D10

MA21D

3800L

D9

MA21D

3800L

1234

SM

BU

S-P

ORT

R3

0.0

05R

R6

1.0

M

Z1

5.6

VD

C

T3

MM

BD

4148SE

C6

1000pF

TEM

P-P

CB

MM

BD

4148SE

C45

1000pF

TEM

P-F

ETS

MM

BD

4148SE

C46

1000pF

R9

2K

R11

20K

R12

20K

C14

3300pF

C15

3300pF

Q2-A

FD

C6327C

Q2-B

FD

C6327C

L2

4.7

uH

D5

MA21D

3800L

D6

MA21D

3800L

PACK+

PACK-

D S

GQ

11

MM

BFJ2

01

Q12

BC846ALT

1G

Vcebr=

65V

R53

560K

R56

200K

ZR2

12.0

VD

C

BZT52C12-7

-F

R58

30K

R59

1.0

M

Q13

D S

GQ

8

MM

BFJ2

01

Q9

BC846ALT

1G

Vcebr=

65V

R40

560K

R41

200K

ZR1

12.0

VD

C

BZT52C12-7

-F

R45

30K

R46

1.0

M

Q10

C60

0.1

uF

C61

0.1

uF

Q15

BC846ALT

1G

Vcebr=

65V

R17

1.0

M

R52

30K

R60

1.0

M

Q16

R18

C1

22uF

C2

22uF

R19

1.0

MR25

1.0

M

D23

D24

D25

D26

D27

S1

C3

1000pF

Q14

BSS138

C4

0.1

uF

Q17

FD

V304P

R1

100K

T1

MM

BD

4148SE

C8

1000pF

T2

MM

BD

4148SE

C16

1000pF

C42

0.1

uF

C50

0.1

uF

-+

CELL1

-+

CELL2

-+

CELL3

VSS

VLD

O1

VSS

VSS

VSS

VLD

O1

VLD

O1

S0

01

bq78PL114


This configuration applies to the bq78PL114 only. The bq78PL114S12 has a different configuration for three-celloperation.

Figure 8. bq78PL114 Reference Schematic (3 Series Cells)






bq78PL114S12

1CHG

2DSG

3PRE

4EFCIC

5EFCID

6

CCBAT

7CCPACK

8VLD

O1

9

CSBAT

10CSPACK

11

OSCI

12

OSCO

13

SD

O0

14

SD

I1

15

P1N

16

P2S

17

P2N

18

SD

O2

19

SD

I3

20

P3S

21

P3N

22

P4S

23

P4N

24

P-L

AN

25

RSTN

26

N/C

27

N/C

28

N/C

29

FIE

LD

30SPROT

31

LED

EN

/PSH

/BP/T

P

32

LED

1/S

EG

1

33

LED

2/S

EG

2

34

LED

3/S

EG

3

35

LED

4/S

EG

4

36

LED

5/S

EG

5

37

SM

BCLK

38

SM

BD

AT

39

V4

40

XT4

41

XT3

42

V3

43

VLD

O2

44

V2

45

XT2

46

XT1

47

V1

48

VSS

49TAB

U4

C5

10uF

R44

10K

C27

0.0

1uF

C28

10uF

C43

0.1

uF

C7

1.0

uF

R5

100K

C11

0.0

1uF

R28

4.7

K

R27

4.7

K

R49

100R

R50

100R

C9

10uF

C10

0.0

1uF

R54

100R

R55

100R

R43

1.0

M

R51

1.0

M

15

V1

12

V2

14

T1

13

T2

11

N/C

10

N/C

3N

/C

8P2N

7P2S

6P1N

5P1S

2VLD

O

16

VPP

9

SDO4

SDI

17TAB

1VSS

U3

BQ

76PL102

C40

1.0

uF

C44

1.0

uF

C39

1.0

uF

C41

1.0

uF

1234

SM

BU

S-P

ORT

R3

Various

R6

1.0

M

Z1

5.6

VD

C

T3

C6

0.0

1uF

T4

C37

0.0

1uF

C29

10uF

C51

10uF

T6

C52

0.0

1uF

C48

0.0

1uF

PACK+

PACK-

Q11

Q12

R53

560K

R56

200K

ZR2

12.0

VD

C

R58

30K

R59

1.0

M

Q13

Q8

Q9

R40

560K

R41

200K

ZR1

12.0

VD

C

R45

100K

R46

1.0

M

Q10

C60

0.1

uF

C61

0.1

uF

Q15

BC846ALT

1GR17

1.0

M

R52

100K

Q16

R18

R19

1.0

MR25

1.0

M

D23

D24

D25

D26

D27

S1

T1

C8

0.0

1uF

T2

C16

0.0

1uFC42

0.1

uF

C50

0.1

uF

-+CELL1

-+CELL2

-+CELL3

-+CELL4

-+CELL5

-+CELL6

-+CELL8

-+CELL9

-+CELL10

T5

C45

0.0

1uF

C46

10uF

C49

0.0

1uF

15

V1

12

V2

14

T1

13

T2

11

N/C

10

N/C

3N

/C

8P2N

7P2S

6P1N

5P1S

2VLD

O

16

VPP

9

SDO4

SDI

17TAB

1VSS

U2 B

Q76PL102

C53

10uF

C54

10uF

T7

C55

0.0

1uF

T8

C57

0.0

1uF

C92

10uF

15

V1

12

V2

14

T1

13

T2

11

N/C

10

N/C

3N

/C

8P2N

7P2S

6P1N

5P1S

2VLD

O

16

VPP

9

SDO4

SDI

17TAB

1VSS

U6 B

Q76PL102

C94

10uF

C95

10uF

T11

C96

0.0

1uF

T12

C98

0.0

1uF

-+CELL7

R15

100R

C3

0.0

1uF

R16

200K

ZR3

12.0

VD

C

VSS

VLD

O1

VSS

VSS

VSS

VSS

P1N

P2S

P2N

P3S

P3N

P4S

P4N

P5S

P5N

P6S

P6N

P7S

P7N

P8S

P8N

P9S

P9N

P10S

CELL1

CELL2

CELL3

CELL4

CELL5

CELL6

CELL7

CELL8

CELL9

CELL10

VSS

VSS

S002a

bq78PL114


Figure 9. bq78PL114S12 Reference Schematic (10 Series Cells) (Sheet 1 of 2)






R2

2.0

K

R4

20K

R7

20K

C58

3300pF

C59

3300pF

Q18-A

Q18-B

L8

4.7

uH

C62

22uF

D1

D2

R8

2.0

K

R21

20K

R22

20K

C63

3300pF

C64

3300pF

Q19- A

Q19-B

L9

4.7

uH

D3

D4

R23

2.0

K

R26

20K

R42

20K

C65

3300pF

C66

3300pF

Q20-A

Q20-B

L10

4.7

uH

C67

22uF

D19

D20

R47

2.0

K

R48

20K

R57

20K

C68

3300pF

C69

3300pF

Q21-A

Q21-B

L11

4.7

uH

C70

22uF

D21

D22

R61

2.0

K

R62

20K

R63

20K

C71

3300pF

C72

3300pF

Q22-A

Q22-B

L12

4.7

uH

C73

22uF

D28

D29

R64

2.0

K

R65

20K

R66

20K

C74

3300pF

C75

3300pF

Q23-A

Q23-B

L13

4.7

uH

C76

22uF

D30

D31

R67

2.0

K

R68

20K

R69

20K

C77

3300pF

C78

3300pF

Q24-A

Q24-B

L14

4.7

uH

D32

D33

C90

22uF

C91

22uF

C1

22uF

R9

2.0

K

R10

20K

R11

20K

C2

3300pF

C12

3300pF

Q1-A

Q1-B

L1

4.7

uH

C13

22uF

D5

D6

R12

2.0

K

R13

20K

R14

20K

C14

3300pF

C15

3300pF

Q2-A

Q2-B

L2

4.7

uH

C17

22uF

D7

D8

CELL1

CELL2

CELL3

CELL4

CELL5

CELL6

CELL7

VSS

P1N

P2S

P3N

P4S

P2N

P3S

P5S

P5N

P4N

P6N

P7S

P6S

P8S

P7N

CELL8

CELL9

CELL10

P8N

P9N

P10S

P9S

S0

02

b

bq78PL114


bq78PL114S12 Reference Schematic (10 Series Cells) (Sheet 2 of 2)






bq78PL114S12

29

32

33

34

35

8

36

31

48

Vss

49

TAB

39

FIELD

LED1/SEG1

LED2/SEG2

LED3/SEG3

LED4/SEG4

VLDO1

LED5/SEG5

PSH/BP/TPV4

FIELD

SEG5

SEG4

SEG3

SEG2

SEG1

TPC 1

2

3

4

5

6

7

NTS4001NT1G

NTS4001NT1G

NTS4001NT1G

NTS4001NT1G

NTS4001NT1G

1MΩ 1MΩ 1MΩ 1MΩ 1MΩ 1MΩ 1MΩ

XF2L-0735-1/

OMRON/ZIFF

BAT54STA

3 2

1

BAT54STA

3 2

1

BAT54STA

3 2

1

1µF 25V1µF 25V1µF 25V

1µF 25V1µF 25V 4.7µF 25V

100Ω

1MΩ

E-Ink SDC3PET 5-Bar,

Part Number:520-1285

NTS4001-NT1G

NTS4001-NT1G

1MΩ

1MΩ

1MΩ

1MΩ

1MΩ

S003

bq78PL114


NOTE: For reference only. Actual display used may require different operating voltage. Consult with display vendor.

Figure 10. Reference Schematic (Electronic-Paper Display Connections)






1

6

5

4

3

2

EX

CE

L8

-Se

gm

en

t

Dis

pla

y0

40

8

S8

BP

S1

S2

S3

S4

9

S6

7

S7

8

S5

bq78PL114S12

32

33

34

35

36

8

31

48

Vss

49

TAB

44

LED1/SEG1

LED3/SEG3

LED4/SEG5

LED5/SEG5

VLDO1

PSH/BP/TPV2

NTS4001NT1G

NTS4001NT1G

NTS4001NT1G

NTS4001NT1G

1MΩ 1MΩ 1MΩ 1MΩ 1MΩ 1MΩ

1MΩ

NTS4001-NT1G

NTS4001-NT1G

1MΩ

1MΩ

1MΩ

1MΩ

To +ve

of Cell 2

LED2/SEG2

S004

bq78PL114


NOTE: For reference only. Actual display used may require different operating voltage. Consult with display vendor.

Figure 11. Reference Schematic (LCD Connections)






PACKAGE OPTION ADDENDUM

www.ti.com 11-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish MSL Peak Temp(3)

Op Temp (°C) Top-Side Markings(4)

Samples

BQ78PL114RGZR NRND VQFN RGZ 48 2500 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 78PL114BQ

BQ78PL114RGZT NRND VQFN RGZ 48 250 Green (RoHS& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR -40 to 85 78PL114BQ

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is acontinuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

http://www.ti.com/productcontent

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

BQ78PL114RGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2

BQ78PL114RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 12-Jan-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ78PL114RGZR VQFN RGZ 48 2500 367.0 367.0 38.0

BQ78PL114RGZT VQFN RGZ 48 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 12-Jan-2015

Pack Materials-Page 2

http://www.ti.com/lit/SLUA271

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

http://www.ti.com/audio

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