By: Dr. Harshad MehtaFounder and CEO

November 4, 2010

Phase 1

1

Funded in part by the Energy Storage Systems Program of the U.S. Department Of Energy through Sandia National Laboratories

ETO-Based StatCom

Purpose of Project Develop a 1.67MVA Full ETO-Based

Bridge for Incorporation in a 10-MVA ETO-Based StatCom

Field Test at BPA (Bonneville Power

Administration) Lab

Evolution of Project Department of Energy (DOE)

Energy Storage Program BPA North Carolina State University

(NCSU) developed the Emitter Turn-Off Thyristor (ETO) and design for a Laboratory ready 10-MVA StatCom

Silicon Power Corporation (SPCO) in FY2009 started to take Government supplied Designs and Equipment obtained from NCSU to work toward a practical and cost effective ETO-Based StatCom

BACKGROUND OBJECTIVE

2

TECHNICAL APPROACH

ELECTRICAL MECHANICAL THERMAL PACKAGING

3

ELECTRICAL STATUS

Electrical Simulation Boost Converter H-Bridge

Static Test Boost Test Low Power H-Bridge

Test High Power H-Bridge

Test (Limited)

4

Static Test FixtureBoost Test Fixture

H-Bridge Test Fixture

MECHANICAL STATUS

Enclosure Stress Analysis Complete

5

Resultant Displacement in the structural frame corresponding to loads

Stress distribution across the framework

Factor of Safety for the frame

THERMAL STATUS ETO-Based Half-Bridge Clamp /Snubber

6

2030405060708090

0 20 40 60 80

Tem

pera

ture

(Deg

C)

Time (mins)

Thermal Response at High power (10.97 KW)Plot for Clamp-circuit section

Ambient Air

Fin inlet-Mid

Fin outlet-Top

Fin outlet-Mid

Fin outlet-Bot

Heatpipe-Evap block

Temperature Limit20

30

40

50

60

70

80

90

0 20 40 60 80

Tem

pera

ture

(Deg

C)

Time (mins)

Thermal Response at High power (10.97 KW)Plot for Half-bridge section

Fin inlet-E1 block-Mid

Fin outlet-E1 block-Top

Fin outlet-E1 block-Top

Fin outlet-E1 block-Mid

Fin outlet-E1 block-Bot

Heat pipe-Evap block E1

Fin inlet-D1 block-Mid

Fin outlet-D1 block-Top

Fin outlet-D1 block-Mid

Fin outet-D1 block-Bot

Heat pipe-Evap block D1

Temperature Limit

PACKAGING STATUS

Component Placement ETO-Based Half-Bridge Clamp Circuit

Half-Bridge

Half-Bridge Half-Bridge

Clamp Circuit

7

TEST RESULTS

Static 4 ETO Modules Passed 3 ETO Modules Failed

Boost 4 ETO Modules Passed (see

graphs) 3 ETO Modules Failed

8

0

500

1000

1500

2000

0

500

1,000

1,500

2,000

0 20 40 60 ETO

Pea

k V

olta

ge (p

eak

volt

s)

ETO

Pea

k Cu

rren

t (pe

ak a

mps

)

Supply Voltage

Boost Converter ETO Single Pulse

001

002

003

004

001

002

003

004

0

500

1000

1500

2000

2500

0

500

1000

1500

2000

2500

3000

0 20 40 60 ETO

Pea

k V

olta

ge (p

eak

volt

s)

ETO

Pea

k Cu

rren

t (pe

ak a

mps

)

Supply Voltage (volts)

Boost Converter ETO Multiple Pulses

001

002

003

004

001

002

003

004

Voltage Curves

Current Curves

Voltage Curves

Current Curves

ETO #

ETO #

TEST RESULTS (cont.)

Thermal Velocity Views

9

Front view (2KW Heat pipe ducts)Right-side view (1Kw Heat pipe duct)

Right-side view (Resistor section)Top viewTop view (Resistor section)

TEST RESULTS (cont.)

ETO-Based H-Bridge Low Power 2 ETO Modules Needed Repair All 4 ETO Modules Demonstrated Soft-Switching Success in Driving ETO’s in Various Modes:

Resistive Load R-L Load R-C Load

Over-Current

10

•Blue Traces Voltage Across Inductor

•Red Traces Current Across Inductor

ACCOMPLISHED

Static Testing

Electrical and Control SimulationMechanical Analysis and Simulation

Thermal Analysis and Simulation

Boost TestingETO-Based H-Bridge Low Power Testing

Mechanical / Thermal Fabrication

Electrical Fabrication

Thermal Testing

11

Final Report Published and Cost Proposal for Phase 2 & 3 Submitted

NEXT STEPS

Wafers Fabricated on a Standard IC Line Standard SPCO Die Size (12mm) Voltage and Current Sharing Thermal Management

Air Cooled (No Liquids) Individual Control at Die Level Hybrid SGTO-ETO Function at Die Level

12

190mm

140m

m

SPCO-ETO Power Section 22600 mm2

Std. ETO Power Section 41800mm2

SPCO-ETO is54% Area of Std. ETO and 30% Less Weight!

Hybrid Architecture

NEXT STEPS (cont.)

Standard Cabinet Size Modular Air Cooled Sectionalized by

Function Serviceability Optional Redundancy Scalable Portable

System Architecture

13

COMPARISONSPCO-ETO-Based H-Bridge NCSU-ETO-Based H-Bridge

ETO-

102” X 60” X 72”, 440640 cu. In.

This can Easily Fit a StandardNEMA Outdoor Enclosure

2ft 2ft

7.5ft

14

CONCLUSIONS/RECOMMENDATIONS

Phase 1 Objectives Accomplished

High Power Testing Limited by Devices

Phase 2 Proposal Submitted to Develop a Commercially Feasible Product

Vision : M (Manufacturable), U (Usable), S (Sellable), T (Technology)

15

ACKNOWLEDGEMENTS

16

D.O.E. ENERGY PROGRAM for FUNDING

B.P.A. for the SYSTEM REQUIREMENTS

S.N.L. for TECHNICAL DIRECTION

N.C.S.U. ETO REQUIREMENTS