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  • PGS(Pyrolytic Graphite Sheet) Graphite SheetPGS(PGS(PPyrolytic yrolytic GGraphite raphite SSheet) Graphite Sheetheet) Graphite Sheet

    Panasonic Electronic Device Co.,Ltd

    Panasonic Electronic Device Hokkaido Co.,Ltd

  • PGS Graphite SheetPGS Graphite SheetPGS Graphite Sheet

    c ax

    is

    a-b plane

    3.3543.35610

    Characteristics Thickness Density

    a-b planec axis

    Electrical conductivity Tensile strength

    Thermal conductivity

    Specifications0.100.05

    1 /

    600 to 800 / Approx. 15 /

    10000 / 19.6

    0 100 200 300 400 500 600 700 800

    Coefficient of thermal conductivity /

    Ordinary Graphite

    Aiuminium

    Pure copper (hard)

    PGS (Pyrolytic Highly Oriented Graphite Sheet) is made of graphite with a structure thatis close to a single crystal. This is achieved by highly-oriented polymer film sheet, a processwhich has never been implemented before.PGS is a heat sink sheet with high thermal conductivity and high flexibility.

  • 22

    The decrease in Thermal resistance and Thermal spread

    11

    The conduction of thermal

    Thermal spread

    A B

    Heat sink

    Heat source(MPUs, PAs, graphics chips, etc.)

    PGS Graphite sheet

    PGS Graphite sheet

    Heat source

    PGS Graphite sheetHeat source

    Package

    Without PGS

    Heat sink

    Surface temperature of the package

    PGS inserted

    PGS Graphite sheetHeat sink

    Package

    Two functions of PGS Graphite SheetTwo functions of PGS Graphite SheetTwo functions of PGS Graphite Sheet

  • Thermal Transfer (1)Thermal Transfer (1)Thermal Transfer (1)

    Heater1010mm V=V(W)

    PGSCuAl

    size181800.1mm

    PGSPGSCuCuAlAl

    [ Heater ON ]

    after 10 sec

  • PGSCuAl

    PGSPGSCuCuAlAl

    Thermal Transfer (2)Thermal Transfer (2)Thermal Transfer (2)

    Heater1010mm V=V(W)

    size181800.1mm

    [ Heater OFF ]

    after 20 sec

  • measuring method

    Heater P= 12W

    Sample Size :90900.3mm

    Heater Size :1010mm

    at

    Aluminum Copper PGS Graphite Sheet

    after 30 minutes

    Thermal Transfer (3)Thermal Transfer (3)Thermal Transfer (3)

  • 22

    The decrease in Thermal resistance and Thermal spread

    11

    The conduction of thermal

    Thermal spread

    A B

    Heat sink

    Heat source(MPUs, PAs, graphics chips, etc.)

    PGS Graphite sheet

    PGS Graphite sheet

    Heat source

    PGS Graphite sheetHeat sourcePackage

    Without PGS

    Heat sink

    Surface temperature of the package

    PGS inserted

    PGS Graphite sheetHeat sink

    Package

    Two functions of PGS Graphite SheetTwo functions of PGS Graphite SheetTwo functions of PGS Graphite Sheet

  • 0.0

    0.1

    0.2

    0.3

    0.4

    0.5

    0.6

    0.7

    0.8

    0.9

    1.0

    0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0

    Pressurekg/cm2

    Therm

    al re

    sist

    ance

    /W

    )

    Ordinary Graphite

    Phase change

    Silicon GreaseLow resistance PGS

    PGS Graphite Sheet

    Silicon sheet

    Thermal InterfaceThermal InterfaceThermal Interface

    Transistor

    Heat Radiator

    Screw (M3)

    SampleThermocouple

    Measurement of thermal resistance at high pressure

    Measuring ; Transistor methodThe sample is placed between the transistor andthe heat radiator.And voltage loaded to transistor under pressure.Then voltage loaded to transistor, with addingpressure by driving the screw.

    The thermal resistance (R) is calculated fromtemperature difference between transistor (temperature t1) and radiator (temperature t2 ). -Specimen size ;S= 3.00 cm2 -Transistor ; MTO-3P(Shin Dengen)

    calculating equation ; R=( t1- t2 ) x S / W (c cm2/W) -Radiator ; 100 x 40 x 22 mm -Wattage ; 0.341 V x 20 A = 6.82 W -Measuring temperature ; thermocouples

  • PGS Graphite Sheet application developmentPGS Graphite Sheet application development

    Acrylic adhesion attached type

    Standard sample

    Thickness

    Structure

    Features

    Multilayered type

    Silicon layeredDouble-sided type

    Type PGS only

    Silicon layered One-sided type

    Silicon

    Acrylic double-sidedadhesive tape

    Acrylicadhesive

    Silicon

    Part No. EYGS182310 EYGM121810SS EYGM121810SWEYGC091210CEYGA091210A

    Separating paper

    Conductiveadhesivetape

    Conductive adhesive tape attached type

    EYGM091210CT

    Withstandtemperature

    W/mK

    W/mK

    W/mK

    W/mK

    W/mK

    Thermalconductivity

    W/mK

    Usable up to 400C

    Low thermal resistance

    Conductivity

    Insulation

    Strong adhesion

    Low thermal resistance

    Thin adhesive

    Conductivity

    Acrylic double-sidedadhesive tape

    Separating paper

    EYGA091210B

    W/mK

    Low thermal resistance

    Adhesive type

    Double-sided adhesive tape attached type

    Double-sided adhesive tape attached type

    Polyimide tape attached type

    Polyimide tape

    EYGA091210K

    W/mK

    High insulation

    High heat resistance

    High mechanical strength

    Polyester tape attached type

    Polyester tape

    EYGA091210P

    W/mK

    Insulation

    High mechanical strength

    Insulation type

    Cushioning properties

    One-side insulation

    Cushioning properties

    Both-side insulation

    Separating paper

    Separating paper

  • Application examplesApplication examples

  • DVD Drive (Reading&Writing)DVD Drive (Reading&Writing)

    Each Graphite Sheet carries the heat generated in the laser unit to the metal chassis.

    Optical Pick -UpOptical Pick -Up

    *** Graphite Sheet

    mm

    mm

    1. Optical Pick-Up for DVD1. 1. Optical Pick-Up for DVDOptical Pick-Up for DVD

    Metal Chassis

    Attaching PGS Graphite Sheet

    Laser Unit(contains Laser Diodeand Control IC)

    Heat Release from LaserHeat Release from LaserDiode and Control ICDiode and Control IC

    Attaching PGS Graphite Sheet

  • Cross Section

    2. Mobile Phone2. 2. Mobile PhoneMobile Phone

    CASE

    (HeatSource)Circuit BoardCase

    Graphite Sheet

    The heat spot of the case can go down by Graphite sheet attached to the backside of the case.

    The heat spot cool 8 or 9 C.

    Isolator (Heat Source)

    [Non- graphite Sheet] Small Size and

    Light Weight Type

    PGS

    [ Non- graphite Sheet] [Graphite Sheet Attached]

    The Temp. on the outsidesurface of the case

    Riseof9.23deg

    Surface Temperature under the normal working (while calling

    Riseof18.81deg

  • Substrate

    PlasmaTarget

    Backing plate

    Cooling platePGS Graphite Sheet

    3. Semiconductor manufacturing equipment3. Semiconductor manufacturing equipment

    Sputtering

    [ Target temperature rise ]

    PGS inserted

    Without PGS

    after 2.5hours after 5.0hours90 degrees Celsius or higher 65 to 70 degrees Celsius

    PGS can efficiently cool sputtering targets. It can be easily replaced and reused.

    90 degrees Celsius or higher 70 to 75 degrees Celsius

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