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Pedge m1000e
Citation preview
5/22/2018 Pedge m1000e
1/42
One Dell WayRound Rock, Texas 78682
www.dell.com
Dell PowerEdge M1000e Modular EnclosureArchitecture
January 2008
By John Loffink, Engineer/Strategist
This white paper is for informational purposes only, and may contain typographical errors and technical inaccuracies. Thecontent is provided as is, without express or implied warranties of any kind.
Dell Enterprise White Paper
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Contents
Key Benefits 2Summary 2Index of Figures 3Index of Tables 3
Acronyms and Defini tions 4Background 7Server Modules 7PowerEdge M1000e Midplane and
I/O 17Power 28Cooling 34System Management 37Conclusion 42
Acknowledgments 42
Key Benefits
16servermodules
3x2(Redundant)I/Ofabrics
RedundantPower
RedundantCooling
RedundantChassisManagement
Controllers
AvocentiKVMinterface
LCDControlPanel
Summary
TheDellPowerEdgeM1000eModularServerEnclosure
isa
breakthrough
in
enterprise
server
architecture.
The
enclosureanditscomponentsspringfroma
revolutionary,groundupdesignincorporatingthelatest
advancesinpower,cooling,I/O,andmanagement
technologies.Thesetechnologiesarepackedintoa
highlyavailablerackdensepackagethatintegratesinto
standardDelland3rdparty1000mmdepthracks.
Theenclosureis10Uhighandsupports:
Upto16servermodules.
Upto6network&storageI/Ointerconnect
modules.
Ahighspeedpassivemidplaneconnectstheserver
modulesinthefrontandpower,I/O,and
managementinfrastructureintherearofthe
enclosure.
ComprehensiveI/Ooptionssupportduallinksof20
Gigabitspersecondtoday(with4xDDRInfiniBand)
withfuturesupportofevenhigherbandwidthI/O
deviceswhenthosetechnologiesbecomeavailable.
Thisprovideshighspeedservermodule
connectivitytothenetworkandstoragenowand
wellinto
the
future.
Thoroughpowermanagementcapabilitiesincluding
deliveringsharedpowertoensurefullcapacityof
thepowersuppliesavailabletoallservermodules.
Broadmanagementabilityincludingprivate
Ethernet,serial,USB,andlowlevelmanagement
connectivitybetweentheChassisManagement
Controller(CMC),Keyboard/Video/Mouseswitch,
andservermodules.
UptotwoChassisManagementControllers(CMC
1isstandard,2ndprovidesoptionalredundancy)and
1optional
integrated
Keyboard/Video/Mouse
(iKVM)switch.
Upto6hotpluggable,redundantPowerSupplies
and9hotpluggable,N+1redundantFanModules.
Page2
SystemFrontControlpanelw/LCDpanelandtwo
USBKeyboard/MouseandoneVideocrashcart
connections.
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Index of Figures
Figure1PossibleServerModuleSizes,FrontPanelView..................................................................... 8Figure
2
Example
Server
Module
Configurations .................................................................................. 8
Figure3DualSocketModularServerArchitecture................................................................................ 9Figure4ModularServerFabricI/OMezzanineCard,FibreChannel4Gbps .................................. 10Figure5M600DualSocketModularServerwithIntelProcessors .................................................... 13Figure6M605DualSocketModularServerwithAMDProcessors .................................................. 14Figure7HalfHeightModularServerFrontPanelView ..................................................................... 14Figure8 ModularServerRemoval......................................................................................................... 15Figure9PowerEdgeM1000eFrontView............................................................................................... 17Figure10PowerEdgeM1000eMidplaneFrontView........................................................................... 19Figure11PowerEdgeM1000eMidplaneRearView ............................................................................ 20Figure12HighSpeedI/OArchitecture.................................................................................................. 21Figure1310GEPotentialGrowthPath................................................................................................... 23Figure
14
PowerEdge
M1000e
Modular
Server
System
Bandwidth................................................... 23
Figure15PowerEdgeM1000eRearView .............................................................................................. 25Figure16DifferencebetweenPassthroughandSwitchModules ...................................................... 26Figure17I/OModule,DellPowerEdgeGigabitEthernetPassthrough ............................................ 26Figure18I/OModule,DellPowerEdgeGigabitEthernetSwitch ...................................................... 26Figure19PowerEdgeM1000eSinglePhasePDUPowerSystem....................................................... 30Figure20PowerEdgeM1000eThreePhasePDUPowerSystem........................................................ 30Figure21PowerEdgeM1000e2360WattPowerSupply ..................................................................... 31Figure22PowerRedundancyModes..................................................................................................... 32Figure23PowerArchitecture.................................................................................................................. 33Figure24PowerEdgeM1000eFan .......................................................................................................... 34Figure
25
Server
Module
Cooling
Air
Profile........................................................................................ 35
Figure26I/OModuleCoolingAirProfile ............................................................................................. 35Figure27PowerSupplyCoolingAirProfile......................................................................................... 36Figure28SystemManagementArchitectureSimplifiedBlockDiagram .......................................... 37Figure29PowerEdgeM1000eChassisManagementController........................................................ 38Figure30ChassisManagementControllerFrontPanel....................................................................... 38Figure31PowerEdgeM1000eiKVMModule ....................................................................................... 40Figure32iKVMFrontPanel .................................................................................................................... 41Figure33PowerEdgeM1000eLCDPanelRecessedPosition ............................................................. 41Figure34PowerEdgeM1000eLCDPanelDuringUsage.................................................................... 42Figure35LCDGraphicExamples........................................................................................................... 42Index of Tables
Table1ModularServerFabricI/OMezzanineFabricBandCOptions............................................ 11Table2TypicalModularServerFabricConfigurations....................................................................... 12Table3HalfHeightModularServerDimensions................................................................................. 13Table4HalfHeightServerModuleOptions ......................................................................................... 16Table5PowerEdgeM1000eModularSystemFeaturesandParameters........................................... 18
Page3
Table6RelativeComparisonofIndustryStandardHighSpeedI/O ................................................. 22
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Page4
Table7EthernetI/OModuleOptions..................................................................................................... 27Table8FibreChannelI/OModuleOptions........................................................................................... 27Table9InfiniBandI/OModuleOption................................................................................................... 28Table
10
Typical
Modular
Server
System
Rack
Height
and
Cable
Reduction .................................. 28Table11PowerEdgeM1000eSinglePhaseandThreePhasePDUOptions...................................... 29
Acronyms and Defini tions
1000BASEKXIEEEstandardfortransmissionof1GbpsEthernetoverbackplanes
1000M1000MegabitpersecondEthernet
100BaseT100MegabitpersecondEthernetoverTwistedPair
100M100MegabitpersecondEthernet
10GBASEKRIEEEstandardfortransmissionof10GbpsEthernetoverbackplanesusing1
differentiallanepair
10GBASEKX4
IEEE
standard
for
transmission
of
10
Gbps
Ethernet
over
backplanes
using
4
differentiallanepairs
10GE10GigabitEthernet
10M10MegabitpersecondEthernet
3G3Gbps
4G4Gbps
6G6Gbps
8G8Gbps
ACAlternatingCurrent
ACIAnalogConsoleInterface
ASICApplicationSpecificIntegratedCircuit
Bel10Decibels
BERBitErrorRate
BMCBaseboardManagementController
CDCompactDisk
CERC6CostEffectiveRAIDControllerversion6
CFMCubicFeetperMinute
CIMCommonInformationModel
CMCChassisManagementController
CLICommandLineInterface
CPUCentralProcessingUnit
DDRDoubleDataRate
DDR2DoubleDataRate2DynamicRandomAccessMemory
DHCP
Dynamic
Host
Configuration
Protocol
DIMMDualInlineMemoryModule
DVDDigitalVideoDisk
ECCErrorCorrectingCode
EIAElectronicIndustriesAlliance
FBDIMMFullyBufferedDIMM
FCFibreChannel
FPFullPower
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GB Gigabyte
GbpsGigabitspersecond
GEGigabitEthernet
Gen1
Generation
1
Gen2Generation2
GPIOGeneralPurposeI/O
GUIGraphicalUserInterface
HAHighAvailability
HBAHostBusAdapter
HCAHostControllerAdapter
HDDHardDiskDrive
HPCCHighPerformanceComputingCluster
IB InfiniBand
ICHInput/OutputControllerHub
I/O
Input/Output
iDRACIntegratedDellRemoteAccessController
iKVMIntegratedKVM
I/OInput/Output
IOHInput/OutputHub
IOMInput/OutputModule
IPCInterprocessCommunications
IPMIIntelligentPlatformManagementInterface
IPv6InternetProtocolversion6
IRIntegratedRAID
iSCSIInternetSCSI
ISOInternationalOrganizationforStandardization
KVM
Keyboard
Video
Mouse
LANLocalAreaNetwork
LCDLiquidCrystalDisplay
LEDLightEmittingDiode
LOMLANonMotherboard
LRLongReach
LVLowVoltage
MbpsMegabitspersecond
NICNetworkInterfaceCard
MB Megabyte
MCHMemoryControllerHub
MHz
MegaHertz
MVMidVoltage
N+0N(1,2,3)pluszero,nofaulttolerance
N+1N(1,2,3)plusone,faulttolerancewithonebackupunit
N+NN(1,2,3)plusN(1,2,3)withNbackupunits
NPIVN_PortIDVirtualization
OPSFOpenShortestPathFirst
Page5
OSOperatingSystem
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PCIePCIExpress,orPeripheralComponentInterconnectExpress
PDUPowerDistributionUnit
PMBusPowerManagementBus
QDR
Quad
Data
Rate
QOSQualityofService
R2Release2
RACADMRemoteAccessControllerandAdministrator
RAIDRedundantArrayofInexpensiveDisks
RIPRoutingInformationProtocol
SANStorageAreaNetwork
SASSerialAttachedSmallComputerSystemInterface,orSerialSCSI
SAS6/IRSASI/OCard6withintegratedRAID
SATASerialAdvancedTechnologyAttachment,orSerialATA
SDDCSingleDeviceDataCorrection
SDR
Single
Data
Rate
SFPSmallFormfactorPluggableTransceiver
SMASHCLPSystemsManagementArchitectureforServerHardwareCommandLineProtocol
SNMPSimpleNetworkManagementProtocol
SOLSerialoverLAN
SRShortReach
SSHSecureShell
SSLSecureSocketsLayer
TCP/IPTransmissionControlProtocol/InternetProtocol
TFTPTrivialFileTransferProtocol
TOETCP/IPOffloadEngine
USBUniversalSerialBus
VGA
Video
Graphics
Array
vKVMVirtualKVM
VLANVirtualLAN
vMediaVirtualMedia
VRRPVirtualRouterRedundancyProtocol
W2K3WindowsServer2003OperatingSystem
WOLWakeOnLAN
WSMANWebServicesforManagement
XMLExtensibleMarkupLanguage
XFP10GigabitSmallFormFactorPluggableTransceiver
Page6
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Background
ITISALLABOUTEFFICIENCY.ThenewPowerEdgeM1000eisdesignedtohelpyoubemore
efficientwith
your
time,
your
power
and
cooling,
your
investment,
and
your
systems
performance. ItisabreakthroughDellengineeredandpatentpendingdesignthatmaximizes
flexibility,powerandthermalefficiency,systemwideavailability,performance,and
manageability.Thechassisintegratesthelatestinmanagement,I/O,powerandcooling
technologiesinamodular,easytousepackage. Designedfromthegrounduptosupportcurrent
andfuturegenerationsofserver,storage,networking,andmanagementtechnologies,the
PowerEdgeM1000eincludestheheadroomnecessarytoscaleyourenvironmentforthefuture.
ThePowerEdgeM1000eModularServerEnclosuresolutionsupportsservermodules,network,
storage,andclusterinterconnectmodules(switchesandpassthroughmodules),ahigh
performanceandhighlyavailablepassivemidplanethatconnectsservermodulestothe
infrastructurecomponents,powersupplies,fans,integratedKVMandChassisManagement
Controllers(CMC).
The
PowerEdge
M1000e
uses
redundant
and
hot
pluggable
components
throughouttoprovidemaximumuptime.
Introducingnewlevelsofmodularitytoserverbasedcomputing,thePowerEdgeM1000e
providesidenticalandsymmetricfabricoptionsBandCforeachmodularserver. EthernetI/O
switchessupportI/OsubmodulesthatprovideexternalI/Oflexibilityofstackingports,10GE
copperports,or10GEopticalports. Truemodularityatthesystemandsubsystemlevelprovides
simplicityofextensionandenhancement,nowandinthefuture.
Server Modules
Virtuallyunlimitedinscalability,thePowerEdgeM1000eEnclosureprovidesultimateflexibility
in
server
processor
and
chipset
architectures.
Both
Intel
and
AMD
server
architectures
are
plannedforintroductionintotheinfrastructure,whilecuttingedgemechanical,electricaland
softwareinterfacedefinitionsenablemultigenerationalserversupportandexpansion.
ThePowerEdgeM1000eenclosuresupportsupto16HalfHeightservermodules,each
occupyingaslotaccessibleinthefrontoftheenclosure. ServerModulesotherthanstandard
HalfHeightformfactorarealsosupportedinthefuture,occupyingfullslotheights,dualslot
widths,orboth. Themechanicalslotsintheenclosurecansupportserversthataretwicethe
heightand/orwidthoftheHalfHeightmodule,asshowninFigure1.
ServerModulescanbefreelylocatedwithineach2x2HalfHeightquadrant.Themechanical
designofthePowerEdgeM1000ehassupportstructuresforHalfHeightServerModulesabove
orbelowDoubleWidthServerModules,andforHalfHeightServerModulessidebysidewith
FullHeight
Server
Modules,
as
shown
in
Figure
2.
Page7
ThefirsttwomodularserversavailableforthePowerEdgeM1000eModularEnclosureareHalf
Height2CPUsocket,8DIMMcapablesystems,withtwo2.5inchhotpluggableHardDiskslots,
andtwoflexiblefabricmezzaninecardsinadditiontothetwoonboard1GigabitEthernetLAN
onMotherboard(LOMs).AsimplifiedblockdiagramofthePowerEdgeM600modularservers
architecture,basedontheIntelprocessor/chipsetarchitecture,isshowninFigure3.
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Figure1PossibleServerModuleSizes,FrontPanelView
Figure2ExampleServerModuleConfigurations
Server Processors
ThefirstgenerationofHalfHeightservermodulessupportafullrangeofdualandquadcore
processorsineitherLowVoltage(4068W),MediumVoltage(8095W)orFullPower(120W)
profiles.
Somerestrictions
on
memory
support
may
apply
to
the
120W
quad
core
full
power
processors,baseduponthesystempowerenvelopeandcoolingcapabilities.BothAMDandIntel
processorarchitecturesaresupported.
Server Memory
MemorysupportinthefirstgenerationHalfHeightservermodulesiscomprisedof8DIMM
slots. IntelbasedarchitecturesuseFullyBufferedDIMMtechnology,whileAMDbased
Page8
architecturesuseDDR2DIMMtechnology. Interleaving(2waylockstep),ECC,memorysparing
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Figure3DualSocketModularServerArchitecture
andChipKill/SDDCaresupportedwithbothAMDandIntelbaseddesigns. Memorymirroring
issupportedonthePowerEdgeM600Intelbaseddesign. SupportingarangeofDIMMcapacities
from512MBto8GB,eachservermodulemaycontainamaximumof64GBofmemory.
Server I/O
Eachservermoduleconnectstotraditionalnetworktopologies,whileprovidingsufficient
bandwidthformultigenerationalproductlifecycleupgrades. I/Ofabricintegrationencompasses
networking,storage,
and
interprocess
communications
(IPC).
To
understand
the
PowerEdge
M1000earchitecture,itisnecessarytofirstdefinefourkeyterms:fabric,lane,linkandport.
Page9
Afabricisdefinedasamethodofencoding,transporting,andsynchronizingdatabetween
devices. ExamplesoffabricsareGigabitEthernet(GE),FibreChannel(FC)orInfiniBand(IB).
FabricsarecarriedinsidethePowerEdgeM1000esystem,betweenservermoduleandI/O
Modulesthroughthemidplane. Theyarealsocarriedtotheoutsideworldthroughthephysical
copperoropticalinterfacesontheI/Omodules.
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AlaneisdefinedasasinglefabricdatatransportpathbetweenI/Oenddevices. Inmodernhigh
speedserialinterfaceseachlaneiscomprisedofonetransmitandonereceivedifferentialpair. In
reality,asinglelaneisfourwiresinacableortracesofcopperonaprintedcircuitboard,a
transmitpositive
signal,
a
transmit
negative
signal,
a
receive
positive
signal,
and
a
receive
negativesignal.Differentialpairsignalingprovidesimprovednoiseimmunityforthesehigh
speedlanes.Variousterminologyisusedbyfabricstandardswhenreferringtolanes. PCIecalls
thisalane,InfiniBandcallsitaphysicallane,andFibreChannelandEthernetcallitalink.
Alinkisdefinedhereasacollectionofmultiplefabriclanesusedtoformasinglecommunication
transportpathbetweenI/Oenddevices. Examplesaretwo,fourandeightlanePCIe,orfourlane
10GBASEKX4. PCIe,InfiniBandandEthernetcallthisalink. Thedifferentiationhasbeenmade
herebetweenlaneandlinktopreventconfusionoverEthernetsuseofthetermlinkforboth
singleandmultiplelanefabrictransports.SomefabricssuchasFibreChanneldonotdefinelinks
astheysimplyrunmultiplelanesasindividualtransportsforincreasedbandwidth.Alinkas
definedhereprovidessynchronizationacrossthemultiplelanes,sotheyeffectivelyacttogether
asa
single
transport.
AportisdefinedasthephysicalI/Oendinterfaceofadevicetoalink. Aportcanhavesingleor
multiplelanesoffabricI/Oconnectedtoit.
TherearethreesupportedhighspeedfabricsperPowerEdgeM1000eHalfHeightservermodule,
withtwoflexiblefabricsusingoptionalpluginmezzaninecardsontheserver. Theportsonthe
servermoduleconnectviathemidplanetotheassociatedI/OModules(IOM)intherearofthe
enclosure,whichthenconnecttothecustomersLAN/SAN/IPCnetworks.
Figure4Modular
Server
Fabric
I/O
Mezzanine
Card,
Fibre
Channel
4Gbps
Page10
Thefirstembeddedhighspeedfabric(FabricA)iscomprisedofdualGigabitEthernetLOMsand
theirassociatedIOMsinthechassis. TheLOMsarebasedontheBroadcom5708NetXtremeII
Ethernetcontroller,supportingTCP/IPOffloadEngine(TOE)andiSCSIbootcapability.In
addition,fulliSCSIHBAcapabilitywithfullprotocoloffloadandabroaderarrayofOSboot
supportisplannedtobeavailableinearly2008. Whileinitiallyserversreleasedinthisseries
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haveadualGELOMconfiguration,thesystemmidplaneisdesignedtoallowfuturesupportfor
uptoquadGELOMsintheHalfHeightformfactor.
OptionalcustomerconfiguredfabricsaresupportedbyaddinguptotwodualportI/O
Mezzaninecards.
Each
Half
Height
server
module
supports
two
identical
I/O
Mezzanine
card
connectorswhichenableconnectivitytoI/OfabricsBandC.TheseoptionalMezzaninecards
offerawidearrayofEthernet(includingiSCSI),FibreChannel,andInfiniBandtechnologies,with
otherspossibleinthefuture. Figure4showsanexampleofadualportFibreChannel4Gigabits
persecond(Gbps)mezzaninecard.Liketheconnector,I/OMezzaninecardformfactorsare
commontobothfabricBandC,forahighlevelofflexibilityinfabricconfiguration.
Theoptionalmezzaninecardsaredesignedtoconnectvia8lanePCIetotheservermodules
chipset.ForPCIeGen1thisprovidesupto16Gbpsofdatabandwidthpermezzaninecard.
MezzaninecardsmayhaveeitheronedualportASICwith4or8lanePCIeinterfacesordual
ASICs,eachwith4lanePCIeinterfaces.BothPCIefabricsandexternalgoingfabricsarerouted
throughhighspeed,10Gigabitpersecondcapableairdielectricconnectorpinsthroughthe
planarandmidplane. Forbestsignalintegritythesignalsisolatetransmitandreceivesignalsfor
minimumcrosstalk. Differentialpairsareisolatedwithgroundpinsandsignalconnector
columnsarestaggeredtominimizesignalcoupling.
WakeonLAN(WOL)issupportedbytheservermodulesLOMs. EthernetWOLforFabricsB
andCisalsosupported. BootfromSANissupportedbyFibreChannelandiSCSIenabledcards.
ThePowerEdgeM1000esystemmanagementhardwareandsoftwareincludesFabric
ConsistencyChecking,preventingtheaccidentalactivationofanymisconfiguredfabricdeviceon
aservermodule. SincemezzaninetoI/OModuleconnectivityishardwiredyetfullyflexible,a
usercouldinadvertentlyhotplugaservermodulewiththewrongmezzanineintothesystem.
Forinstance,ifFibreChannelI/OModulesarelocatedinFabricCI/OSlots,thenallserver
modulesmust
have
either
no
mezzanine
in
fabric
C
or
only
Fibre
Channel
cards
in
fabric
C.
If
a
GEmezzaninecardisinaMezzanineCslot,thesystemautomaticallydetectsthis
misconfigurationandalertstheuseroftheerror.Nodamageoccurstothesystem,andtheuser
hastheabilitytoreconfigurethefaultedmodule.
Table1showsoptionsfortheinitialreleaseoffabricmezzaninesinthePowerEdgeM1000e
productline. ThesamemezzaninecardcanbeusedinFabricBorC. Table2showssome
typicalservermodule
FabricType Ports Speedperport Features
GigabitEthernet 2 1.25Gbps TOE,iSCSIboot,JumboFrames,
WOL
FibreChannel
4G
2
4.25
Gbps
Boot
from
SAN,
NPIV
FibreChannel8G* 2 8.50Gbps BootfromSAN,NPIV
4xDoubleDataRate
(DDR)InfiniBand*
2 20.00Gbps
10GigabitEthernet* 2 10.3125Gbps TOE,iSCSIoffload,JumboFrames
*planned
Page11
Table1ModularServerFabricI/OMezzanineFabricBandCOptions
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TypicalFabric
Configurations
FabricA FabricB FabricC
LowCostCompute
ClusterNode
2x1GELOM Empty Empty
Ethernet/SANserver
orHAClusterNode
2x1GELOM 2x1GEMezzanine 2xFC4Mezzanine
HighPerformance
ClusterNode
2x1GELOM 2x4DDRInfiniBand Empty
UnifiedFabric 2x1GELOM 2x1GEMezzanine 2x10GEMezzanine
HighPerformance
UnifiedFabric
2x1GELOM 2x10GEMezzanine 2x10GEMezzanine
Table2TypicalModularServerFabricConfigurations
fabricconfigurations,baseduponcurrentandfuturearchitecturalmodels.Speedandlanecount
increasesare
anticipated
for
future
mezzanine
releases.
Local Storage
Servermodulelocalstorageiscomprisedofuptotwo2.5inchHardDrives. Bothhotpluggable
SASandnonhotpluggableSATAharddrivesaresupported. Localstoragecontrolleroptions
includelowcostchipsetSATAI/O,SASDaughtercardwithintegratedRAID(SAS6/IR)orSAS
RAIDDaughtercardwithcacheandhighperformanceRAIDprocessor(CERC6/i).
Integrated Server Management
ThePowerEdgeM1000esupportstheintroductionofDellsnewIntegratedDellRemoteAccess
Controller(iDRAC)whichisintegratedoneachM600/605servermodule.iDRACcontains
featuresthat
are
typically
add
on
options
to
standard
monolithic
rack
based
servers.
The
iDRAC
addsvirtualMedia(vMedia)andvirtualKVM(vKVM)functionsaswellasoutofbandGUI
status/inventory.TraditionalIPMIbasedBaseboardManagementController(BMC)featureslike
hardwaremonitoringandpowercontrolaresupported. Additionally,onboardgraphicsand
keyboard/mouseUSBconnectstoanoptionalsystemlevelIntegratedKVM(iKVM)modulefor
localKVMaccess. FullUSBaccessisavailablethroughtheservermodulefrontpanel.
ThenewiDRACisconnectedtotheCMCviadedicated,fullyredundant100MbpsEthernet
connectionswiredthroughthemidplanetoadedicated24portethernetswitchontheCMC,and
exposedtotheoutsideworldthroughtheCMCsexternalManagementEthernetinterface
(10/100/1000M).ThisconnectionisdistinctfromthethreeredundantdataFabricsA,BandC.
UnlikepreviousgenerationsofDellservermodules,theiDRACsconnectivityisindependentof,
andinadditionto,theonboardGELOMsontheservermodule.EachservermodulesiDRAC
hasitsownIPaddressandcanbeaccessed,ifsecuritysettingsallow,directlythrougha
supportedbrowser,telnet,SSH,orIPMIclientonthemanagementstation.
Server Module and Packaging
Page12
Theservermoduleisasheetmetalmodulethathousestheserverplanarandhotplughard
drivesandisdesignedtobetoollessforanyassemblyordisassemblyoperation. Anypart
removalfromtheserverisintuitiveandrequiresnotools. Thisincludesthetopcover,planar
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Figure5M600DualSocketModularServerwithIntelProcessors
installation,harddrives,fabriccardsandremovableHardDrivecage.PhotosoftheM600and
M605bladesareshowninFigure5andFigure6respectively,whileoverallbladedimensionsare
showninTable3.
BladeMeasurement Dimension
Length 520mm
Height 193mm
Width 50mm
Table3HalfHeightModularServerDimensions
Server Module Front Panel
TheHalfHeightservermodulesfrontpanelprovidesaccesstotwohotpluggableharddrives,
twobootableUSBconnectors,oneserverpowerbuttonandonestatusindicator. Allserver
modulessupporthotpluggable2.5inchharddiskdrives. Thefrontpanelisvisibleinthephoto
inFigure7.
Server Module Removal and Translating Handle
Theservermoduleismanuallyinstalledbyaligningitwithoneoftheopenfrontslotlocations
andslidingituntiltheconnectorsbegintoengagewiththemidplane. Atranslatinghandle,
whichtravelsinthesamedirectionastheservermodule,isthenusedtofullyengageandlockit
inplace. Toremovetheservermodule,abuttonreleasesthetranslatinghandlelatch. The
handleisthenusedforpullingtheserveroutofthesystem,disengagingtheinternallatchasthe
handleispulledoutwardsandunmatingtheconnectors.
Page13
Dual Hard Disk DriveSlots, RAID underneath
8 DIMM Slots Two FabricMezzanine Cards
ChipsetTwo Processors
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Figure6M605DualSocketModularServerwithAMDProcessors
Figure7HalfHeightModularServerFrontPanelView
Thereareguidepinsonbothsidesoftheservermodulesignalconnectorforprecisealignmentto
thechassis. Keyingfeaturespreventtheservermodulefrominstallingupsidedown. Adefined
maximumslidingforceinsuresergonomicfriendliness,whileprecisionpointofcontact
positioningandcammingfeaturesensureproperconnectorwipeformaximumsignalquality.
Modularserverpowerisreceivedthroughadedicated2x3powerblock,withwidepowerpins
designatedinsuchawaytopreventpowerrailshortingincaseapinbendsforanyreason.
Page14
Dual Hard Disk DriveSlots, RAID underneath
4 DIMM Slots Two FabricMezzanine Cards
Chipset4 DIMM Slots
2 Processors(1 socket empty)
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Figure8ModularServerRemoval
Server Module Summary
Table4summarizesthefeaturesforthefirsttwoservermodulesshippingforthePowerEdge
M1000e. AdditionalservermodulesareexpectedtoshipfollowingthelaunchofthePowerEdge
M1000e,andthroughoutthelifetimeofthemodularsystem.
Page15
ServerModule M600 M605
Processor IntelXeonDualandQuadCore
40W,65W,80W,and120Woptions
AMDOpteron2000seriesDualand
QuadCore
68Wand95Woptions
Chipset Intel5000P(Blackford) NVIDIAMCP55
MemorySlots 8FullyBufferedDIMMs(667MHz) 8DDR2(667/800MHz)
MemoryCapacity 32GB(4GBx8)atlaunch
64GB
(8GB
x
8)
planned
Q108
32GB(4GBx8)atlaunch
64GB
(8GB
x
8)
planned
Q108
LOM 2xGEwithhardwareTCP/IP
OffloadEngineandiSCSIFirmware
Boot
UpgradetofulliSCSIoffloadvia
licensekey
2xGEwithhardwareTCP/IPOffload
EngineandiSCSIFirmwareBoot
UpgradetofulliSCSIoffloadvia
licensekey
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ServerModule M600 M605
FabricExpansion 2x8lanePCIemezzanine
daughtercards
1. DualportGEw/TOE
2. DualPortFC4(Emulex&Qlogic)
3. DualPort4xDDRInfiniBand
2x8lanePCIemezzanine
daughtercards
1. DualportGEw/TOE(*duetoPCIecontrollerlimitationsthedual5708S
TOEbasedcardcannotbeusedin
FabricC. Dellplanstoreleasean
integrateddualTOEsolutionto
resolvethislimitation.)
2. DualPortFC4(Emulex&Qlogic)
3. DualPort4xDDRInfiniBand
BaseboardManagement iDRACw/IPMI2.0+vMedia+
vKVM
iDRACw/IPMI2.0+vMedia+vKVM
LocalStorage
Controller
OptionsSATA
(chipset
based
no
RAID
or
hotplug)
SAS6/IR(R0/1)
CERC6/i(R0/1w/Cache)
SATA(chipset
based
no
RAID
or
hotplug)
SAS6/IR(R0/1)
CERC6/i(R0/1w/Cache)
LocalStorageHDD 2x2.5inchhotpluggableSASor
SATA
2x2.5inchhotpluggableSASorSATA
Video ATIRN50 ATIRN50
USB 2xUSB2.0bootableportsonfront
panelforfloppy/CD/DVD/Memory
2xUSB2.0bootableportsonfront
panelforUSB
floppy/CD/DVD/Memory
Console
VirtualKVM
via
iDRAC
IPMISerialoverLAN(SoL)via
iDRAC
RearmountediKVMswitch
ports(tierable)
FrontKVMportsonmodular
enclosurecontrolpanel
VirtualKVM
via
iDRAC
IPMISerialoverLAN(SoL)via
iDRAC
RearmountediKVMswitchports
(tierable)
FrontKVMportsonmodular
enclosurecontrolpanel
HAClustering FibreChannelandiSCSIbased
clusteringoptions
FibreChannelandiSCSIbased
clusteringoptions
OperatingSystems MicrosoftW2K3andW2K3R2,Red
HatEnterpriseLinux4/5,SuSELinux
EnterpriseServer9/10
MicrosoftW2K3andW2K3R2,Red
HatEnterpriseLinux4/5,SuSELinux
EnterpriseServer9/10
Page16
Table4HalfHeightServerModuleOptions
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PowerEdge M1000e Midplane and I/O
PowerEdge M1000e Front View
Server
modules
are
accessible
from
the
front
of
the
PowerEdge
M1000e
enclosure.
At
the
bottom
oftheenclosureisaflipoutmultipleangleLCDscreenforlocalsystemsmanagement
configuration,systeminformation,andstatus. ThefrontoftheenclosurealsocontainstwoUSB
connectionsforUSBkeyboardandmouse,avideoconnectionandthesystempowerbutton. The
frontcontrolpanelsUSBandvideoportsworkonlywhentheiKVMmoduleisinstalled,asthe
iKVMprovidesthecapabilitytoswitchtheKVMbetweentheblades.
Figure9PowerEdgeM1000eFrontView
TheDellPowerEdgeM1000esupportsuptosixteenHalfHeightservermodules. Thechassis
guideandretentionfeaturesaredesignedsuchthatalternativemoduleformfactorsarepossible.
See
the
Server
Module
section
for
more
details.
The
chassis
architecture
is
flexible
enough
that
server,storageorothertypesoffrontloadingmodulesarepossible.
Notvisiblyobvious,butimportantnonetheless,arefreshairplenumsatbothtopandbottomof
thechassis. Thebottomfreshairplenumprovidesnonpreheatedairtothepowersupplies,
enablinggroundbreakinglevelsofpowerdensity. Thetopfreshairplenumprovidesnon
preheatedairtotheCMC,iKVMandI/OModules. SeetheCoolingsectionformoredetails.
Page17
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Feature Parameter
ChassisSize 10Uhighrackmount
Bladesper
Chassis
16
Half
Height,
8
Full
Height
TotalBladesina42URack 64HalfHeight,32FullHeight
TotalI/OModuleBays 6(3redundantordualfabrics)
TotalPowerSupplies 6(3+3redundant)
TotalFanModules 9(8+1redundant)
ManagementModulesandInterfaces 2CMCs(1+1redundant),1iKVM,Front
ControlPanel,GraphicalLCDControlPanel
Width,notincludingrackears 447.5mm
Height 440.5mm
Depth,RearofEIAFlangetoRearofChassis 753.6mm
TotalSystemDepth(FrontBezeltoPSLatch): 835.99mm
Table5PowerEdgeM1000eModularSystemFeaturesandParameters
PowerEdge M1000e Midplane
Thoughhiddenfromviewinanactivelyrunningsystem,themidplaneisthefocalpointforall
connectivitywithinthePowerEdgeM1000eModularSystem. Themidplaneisalargeprinted
circuitboardprovidingpowerdistribution,fabricconnectivityandsystemmanagement
infrastructure. Additionallyitallowsairflowpathsforthefronttobackcoolingsystemthrough
ventilationholes.
Asisrequisiteforfaulttolerantsystems,thePowerEdgeM1000emidplaneiscompletelypassive,
withnohiddenstackingmidplanesorinterposerswithactivecomponents. I/OFabricsand
system
management
are
fully
redundant
from
each
hot
pluggable
item.
The
system
managementEthernetfabricisfullyredundantwhentwoCMCsareinstalled,withtwopointto
pointconnectionsfromeachservermodule.
I/Ofabricsareroutedthrough10Gbpscapablehighspeedconnectorsanddielectricmaterial. All
tracesaredifferential100ohmcharacteristicimpedance. Placementofconnectorsandpluggable
componentswasdeterminedbaseduponminimumroutingdistanceforhighspeedcriticalnets.
HighspeedI/Oconnectorholesarebackdrilledinthemidplanetominimizeelectricalstublength
andimprovehighspeedsignalintegrity. MidplanematerialisanimprovedFR408dielectric
material,providingbetterhighfrequencytransmissioncharacteristicsandlowerattenuation.The
I/OChannelshavebeensimulatedto10GBASEKRchannelmodels. Perindustrystandard
requirements,fabricsinternallysupportaBitErrorRateof1012orbetter. Atthesystemlevelthis
meansthat
a
high
level
of
investment
has
been
made
to
insure
scalable
bandwidth,
for
current
andfuturegenerationsofserverandinfrastructure.
Page18
Themidplaneservesastransportforapatentpendingtimedivisionmultiplexedserialbusfor
GeneralPurposeI/Oreduction. ThisserialbuscontributesgreatlytothemidplanesI/Olane
countreduction,whichistypicallyburdenedwithasignificantI/Opinandroutingchannelcount
oflargelystaticorlowspeedfunctions. Forinstance,allFibreChannelI/OPassthroughmodule
LEDandSFPstatusinformationiscarriedoverthisbus,whichaloneeliminatesoverone
hundredpointtopointconnectionsthatwouldotherwiseberequired.Thetimedivision
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multiplexedserialbusisfullyredundant,withhealthmonitoring,separatelinksperCMCand
errorcheckingacrossalldata.
Figure10PowerEdgeM1000eMidplaneFrontView
Thesystemisdesignedforreceptaclesonallmidplaneconnectorsandpinsonallpluggable
components,soanypotentialforbentpinsislimitedtothepluggablefieldreplaceableunit,not
tothesystem. ThiscontributestothehighreliabilityanduptimeofthePowerEdgeM1000e
modularsystem.
Themidplaneisphysicallyattachedtotheenclosurefrontstructuralelement. Itisalignedby
guidepinsandedgesinall3axes. Thisprovidesclosetolerancealignmentbetweentheserver
modulesandtheirmidplaneconnections.
Themidplanehasbeencarefullydesignedtominimizetheimpacttotheoverallsystemairflow.
Themidplanedesignwasevaluatedatvariouspointsthroughoutthedesigncycletomake
tradeoffsbetweenthermalperformanceandmidplanecosts. Earlyanalysisofthemidplane
showedlargeincreasesinairflowduetoamovefrom15%to20%midplaneopening. The
ventilationholesresultingfromthisexpansionareseeninFigure10andFigure11. These
changesaddedtothedemandingrequirementsofthemidplanedesign,butprovidedthebest
overallsystemsolution.
Page19
BladeSignalConnectors
Blade
PowerConnectors
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Figure11PowerEdgeM1000eMidplaneRearView
Whileyoumightthinkthatmultiplemidplanesarebetterfortheproduct,therereallyisno
systemadvantageifthemidplaneisproperlydesigned. Allmidplaneroutingisfullyisolated,
supportingallchassispower,fabric,systemmanagementandfaulttolerancerequirements.The
singleintegratedmidplanealsosimplifiesmanufacturingassembly,reducingnetacquisitioncost
tothecustomer.
PowerEdge M1000e I/O
I/Ois
fully
scalable
to
current
and
future
generations
of
server
modules
and
I/O
Modules.
There
arethreeredundantmultilanefabricsinthesystem,asillustratedinFigure12.
FabricAisdedicatedtoGigabitEthernet. Thoughinitialservermodulereleasesaredesignedas
dualGigabitEthernetLOMcontrollersontheservermoduleplanar,themidplaneisenabledto
supportuptofourGigabitEthernetlinksperservermoduleonFabricA. Potentialdata
bandwidthforFabricAis4GbpsperHalfHeightservermodule.
Page20
PowerSupplyConnectors
FanConnectors
I/O ModuleConnectors
LCD andControlPanelConnector
CMCConnectors iKVM
Connector
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OneimportantnewcapabilityinthePowerEdgeM1000eisfull10/100/1000MEthernetsupport
whenusingEthernetpassthroughmodules. Inthepast,customerswerelimitedtoconnecting
onlytoexternalswitcheswith1000Mports.Nowthesystemcanconnecttolegacyinfrastructure
whetherusing
Ethernet
passthrough
or
switch
technology.
This
technical
advance
uses
in
band
signalingon1000BASEKXtransport,andrequiresnouserinteractionforenablement.
External
Fabric
Connec-
tions
M1000e MidplaneHalf Height Modular Server (1 of 16)
Fabric B
Mezzanine
Fabric C
Mezzanine
Fabric A
LOM
Fabric A1
Ethernet
I/O Module
Fabric A2
EthernetI/O Module
Fabric B1
I/O Module
Fabric B2
I/O Module
Fabric C1
I/O Module
Fabric C2
I/O Module
1-2 lane
1-4 lane
1-4 lane
1-2 lane
MCH/
IOH
4-8 lane
PCIe
8 lane
PCIe
8 lane
PCIe
Half Height Modular Server (16 of 16)
Fabric B
Mezzanine
Fabric C
Mezzanine
Fabric A
LOM
MCH/
IOH
4-8 lane
PCIe
8 lane
PCIe
8 lane
PCIe
1-4 lane
1-4 lane
1-2 lane
1-2 lane
1-4 lane
1-4 lane
1-4 lane
1-4 lane
CPU
CPU
CPU
CPU
Figure12HighSpeedI/OArchitecture
Page21
FabricBandCareidentical,fullycustomizablefabrics,routedastwosetsoffourlanesfrom
mezzaninecardsontheservermodulestotheI/OModulesintherearofthechassis. Supported
bandwidthrangesfrom1to10Gbpsperlanedependingonthefabrictypeused. Table6shows
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comparativebandwidthbetweencurrentandforthcomingfabrics. SymbolRateisdefinedasthe
maximumfabricspeedwithalldataencodedasperitsencodingmechanism. DataRateisthe
maximumamountofactualdatabitsthatcanbetransportedonthefabric. Somefabricsare
definedas
single
lane
only,
while
others
are
defined
in
various
lane
increments
for
link
to
lane
aggregation,inordertoprovideincreasedtotalbandwidth.
Aseachmezzaninecardisconnectedbyan8lanePCIelinktotheserverchipset,thereareno
throttlepointsinthesystemwhereI/Obandwidthisconstricted. Whenmultilane10GBASEKR
becomesareality,DellanticipatesservermoduleswithPCIeGen2orbettersupport,providing
fullendtoendI/ObandwidthfromtheservermodulestotheI/OModules.
Fabric Encoding
SymbolRate
PerLane
(Gbps)
DataRate
PerLane
(Gbps)
DataRate
PerLink
(Gbps)
LanesPerLinkPer
IndustrySpecification
PCIeGen1 8B/10B 2.5 2 8
(4
lane) 1,
2,
4,
8,
12,
16,
32PCIeGen2 8B/10B 5 4 16(4lane) 1,2,4,8,12,16,32
PCIeGen3 scrambling 8 8 32(4lane) 1,2,4,8,12,16,32
SATA3G 8B/10B 3 2.4 2.4 1
SATA6G 8B/10B 6 4.8 4.8 1
SAS3G 8B/10B 3 2.4 2.4 1Any
SAS6G 8B/10B 6 4.8 4.8 1Any
FC4G 8B/10B 4.25 3.4 3.4 1
FC8G
8B/10B+
scrambling 8.5 6.8 6.8 1
IBSDR 8B/10B 2.5 2 8(4lane) 4,12
IBDDR 8B/10B 5 4 16(4lane) 4,12
IBQDR 8B/10B 10 8 32(4lane) 4,12
GE:1000BASE
KX 8B/10B 1.25 1 1 1
10GE:10GBASEKX4 8B/10B 3.125 2.5 10(4lane) 4
10GE:10GBASEKR 64B/66B 10.3125 10 10 1
Table6RelativeComparisonofIndustryStandardHighSpeedI/O
Ethernet Bandwidth Migration Path
Page22
ThebandwidthgrowthpathforEthernetisfromGEto10GE,supportedthroughthreebackplane
standardsdefinedbytheIEEE802.3apCommittee. 1000BASEKXsupportsGEthrough1.25
Gbpsdifferentialbackplanesignaling. 10GBASEKX4supports10GEthroughfourlanesof3.125
Gbpsdifferentialbackplanesignaling.Thefourlanesareaggregatedtoprovidethesumtotal10
Gbpsbandwidthrequirement. 10GBASEKRisanemergingIEEE802.3apstandardthatsupports
10GEthroughasinglelaneof10.3125Gbpsdifferentialbackplanesignaling. Intermsof
customerimpact,thismeansthattodaysmodularsystemsusing10GBASEKX4arelimitedto
one10GEchannelper4lanesofinternaldifferentialsignaling,whileinthefuturethosesame
lanescancarrymultiplelanesof10GBASEKRandprovidearesultantincreaseintotalsystem
throughput. SeeFigure13foranillustrationofthe10GEgrowthpath.Thisgrowthpathapplies
tobothFabricsBandC.
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GEfabricsusesinglelanesperlinkover1000BASEKX. Initially10GEistobesupportedthrough
10GBASEKX4,whichlikeInifiniBandusesfourlanesperlink.Astechnologymaturesand
enableshighlevelintegration,10GBASEKRisexpectedtoreplace10GBASEKX4asthe10GE
backplanetransport
of
choice,
enabling
10
Gbps
over
single
lanes
within
the
system
midplane.
Finally,multiplelanesof10GBASERpermezzaninecanprovideexpandedEthernetbandwidth
upto80Gbpsperfabricmezzanine.
2x10GE
Mezzanine using
4 lane
10GBASE-KX4
10GBASE-KX4
takes 4 lanes to
achieve 10 Gbps
data bandwidth,
2 links per
mezzanine for 20
Gbps total
2x10GE
Mezzanine using
1 lane
10GBASE-KR
10GBASE-KR
takes 1 lane to
achieve 10 Gbps
data bandwidth,
2 links per
mezzanine for 20
Gpbs total
2x4x10GE
Mezzanine using
multilane
10GBASE-KR
Up to 4 lanes of
10GBASE-KR
can achieve 40
Gbps data
bandwidth,
8 links per
mezzanine for 80
Gpbs total
Figure1310GEPotentialGrowthPath
Total System Bandwidth
Inmostcases,onlyasmallpercentageofthisbandwidthisusedinasystem,asillustratedin
Figure
14.
A
typical
configuration
is
defined
as
4
lanes
of
GE
and
2
lanes
of
Fibre
Channel
per
servermodule,anduseslessthan10%ofthesystemspotentialbandwidth. Anexampleofa
unifiedEthernetconfiguration,aggregatingallnetwork,storageandInterprocess
Communications onEthernetlinks,isshownas2lanesofGEand4lanesof10GEperserver
module,using25.7%ofsystempotentialbandwidth. AnexampleofaHighPerformance
0.0% 20.0% 40.0% 60.0% 80.0% 100.0%
MaximumPotentialBandwidth
HighPerformanceSAN/IPC
UnifiedEthernet
Typical
System
Configuration
TotalSystemBandwidth
Page23
Figure14PowerEdgeM1000eModularServerSystemBandwidth
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SAN/IPCconfigurationisshownas2lanesofGE,2lanesofFC8,and2lanesofQDRInfiniBand,
andstillusesonly35%ofPowerEdgeM1000epotentialbandwidth. Theresultsofthegraph
showthatthePowerEdgeM1000eisfullyscalableforI/Oinfrastructureneedsformany
generationsof
servers
and
switches.
AssumingafullpopulationofGEand10GbElanesinFabricsA,BandC,thePowerEdgeM1000e
candelivertheoreticaltotalbandwidthof5.44Terabitspersecond. However,thisextreme
bandwidthcomparisonmaynoteverbefullyrealizedinrealworldapplicationusage. Italso
doesnotaddressfactorssuchasflexibilityoffabricmigrationpaths.
ThePowerEdgeM1000eisdesignedforfullsupportofallnear,mediumandlongtermI/O
infrastructureneeds. WhilethePowerEdgeM1000esystemsbandwidthcapabilitiesleadthe
industry,thePowerEdgeM1000eisalsointelligentlydesignedformaximumcost,flexibilityand
performancebenefit. Anexampleofthisistheroutingofdual4lanepathsforFabricsBandC,
anddual2lanepathsinFabricA. Inthenearterm,10GBASEKX4routingsupports10GE
connectivity. 10GBASEKX4routingusesall4lanes,eachrunningata2.5Gbpsdatarateto
achievetotallinkdatabandwidthof10Gbps. Todayandintheneartermfuture,10GBASEKX4
isthemostcosteffective,ubiquitoussolutionfor10GEfabricsovermidplanes. Afully
configuredsystemsupports2x2GEand2x210GEimplementationswith10GBASEKX4routing,
supportingtheleadingedgeofunifiednetworktopologies. Suchaconfigurationcould,for
instance,provideredundant10GElinksperbladefortraditionalnetworktraffic,andanotherset
ofredundant10GElinksforiSCSIorFibreChannelOverEthernet(FCoE)networkedstorage.
I/OModulesarefullycompatibleacrossslots. WhileFabricAisdedicatedtotheservermodule
LOMs,requiringEthernetswitchorpassthroughmodulesforI/OslotsA1andA2,FabricsBand
CcanbefreelypopulatedwithEthernet,FibreChannelorInfiniBandsolutions. AspartofDells
efforttosimplifyIT,thereisnoconfusingsupportmatrixtofollowformezzaninesorI/O
modules
and
no
multiplication
of
mezzanine
and
I/O
Module
form
factors
and
design
standards,
withresultantcompatibilityorconfigurationconcerns.Dellsupportsonemezzaninedesign
standardandoneI/OModuledesignstandardfortruemodularcomputing.
PowerEdge M1000e Rear View
TherearofthePowerEdgeM1000eEnclosurecontainssystemmanagement,cooling,powerand
I/Ocomponents.AtthetopoftheenclosureareslotsfortwoChassisManagementCardsandone
integratedKeyboard/Video/Mouseswitch. TheenclosureshipsbydefaultwithasingleCMC,
withthecustomerhavingtheoptionofaddingasecondCMCtoprovideafullyredundant,
activestandbyfaulttolerantsolutionformanagementaccessandcontrol.
InterleavedinthecenterofthechassisarefansandI/OModules. Thisarrangementoptimizesthe
balanceof
airflow
through
the
system,
allowing
lower
pressure
buildup
in
the
system
and
resultinginlowerairflowrequirementsforthefans.
Page24
I/OModulesareusedaspairs,withtwomodulesservicingeachservermodulefabricandfully
redundant.I/OModulesmaybepassthroughsorswitches.Passthroughmodulesprovidedirect
1:1connectivityfromeachLOM/mezzaninecardportoneachservermoduletotheexternal
network. SwitchesprovideanefficientwaytoconsolidatelinksfromtheLOMorMezzanine
cardsontheservermodulestouplinksintothecustomersnetwork. TheEnclosureaboveis
shownwith10/100/1000MbEthernetandFC4PassthroughModules.Figure16showsthe
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differencebetweenthesetwotypesofIOMs.Figure17showstheDellGigabitEthernet
PassthroughModule.
Figure15PowerEdgeM1000eRearView
TheDellandCiscoEthernetswitchesforthePowerEdgeM1000eenclosureuniquelydemonstrate
thelevel
of
forethought
that
went
into
the
design
of
the
I/O
modules.
These
Ethernet
switch
modulesintroducesubmoduleI/Oexpansionformaximumflexibilityandextension,acapability
neverbeforeofferedinmodularsystems.Theyprovideasinglehardwaredesignthatallows
scalingfromalowcostallGEsolution,toasolutionthatutilizesswitchstackingtechnologiesto
interconnectmultipleswitcheswithinorbetweenchassis,and/ortoasolutionthatsupportsallof
theseplus10GEuplinkstothecorenetworkwithflexibleinterfacetypes,bothcopperand
optical. Figure18showstheDellPowerConnectGigabitEthernetSwitchModulewithitstwo
submodulebaysavailableforswitchI/Oexpansion.
Page25
iKVMCMCs1 blank
Fans
I/O Modules(blank inmiddle)
Power Supplies(3 blanks to left)
5/22/2018 Pedge m1000e
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External Fabric ConnectionsM1000e Midplane
Passthrough Module
Switch Module
Switch
PHY
PHY
PHY
PHY
PHY
.server2data.
.server1data.
.server4data.
.server3data.
.server1data.
.server2data.
.server3data.
.server4data.
.server5data.
.server6data.
.server7data.
.server8data.
.server5data.server6data.server7data.server8data.
Representation of
data passing over the
midplane from the
server module
mezzanine cards.
Only four ports are
shown per IOM.
A Passthrough Module electrically buffers the
signal and may perform some low level link layer
conversion. The data is not touched and all
data streams maintain a one to one
correspondence to the data from the mezzanine.
A Switch Module logically combines multiple
streams of data onto one or more streams
coming out from the system. The data is then
electrically buffered and formatted for the
proper external interface.
Figure16DifferencebetweenPassthroughandSwitchModules
Figure17I/OModule,DellPowerEdgeGigabitEthernetPassthrough
Page26
Figure18I/OModule,DellPowerEdgeGigabitEthernetSwitch
5/22/2018 Pedge m1000e
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TheinitialoptionsforI/OModulesareoutlinedinTable7,Table8andTable9.Dellplansfuture
I/OModulereleasessupportingalltechnologyupgradepaths,including8GFC,QDRIBand
10GE.
I/OModule/Features
10/100/1000MEthernet
Passthrough
DellPowerConnectM6220EthernetSwitch
CiscoCatalystBladeSwitch3032*,3130SG*,
3130SX*
Internal
ports
16 16 16
External
ports
16x
10/100/1000M
4xfixedcopper10/100/1000M
plus2ofthefollowingoption
modules:
1)2x24Gstackingports
2)2x10GOptical(XFPSR/LR)
uplinks
3)2x10GcopperCX4uplinks
4)2
x
10GBASE
T
copper
uplinks*
3032:4fixedcopper10/100/1000M+2
optionalbayseachsupporting2x1G
copperoropticalSFPs
3130SG:Above+2x32GStackwise
PlusStackingports
3130SX:
Above+upto2xX2modulesfor10G
CX4or
SR/LR
uplinks
Speed 10/100/1000M Internalports 1G
Externalports
FixedRJ45 10/100/1000M
CX4uplink 10GE
OpticalXFP 10GE
10GBASET10GE
Internalports 1G
ExternalportsFixedRJ45
10/100/1000M
X2CX4uplink 10GE
X2SR/LRMOptical 10GE
Manage
ability
N/A CLI/Web CLI/Web,Ciscomgmttools
Features Supportfor
10/100/1000M
speeds(hardset
andauto
negotiation)
Layer3routing(OSPF,RIP,
VRRP),10GEconnections,
Stacking,IPv6,Layer2/3QOS,
AccessControlLists
L2switching,BaseL3routing(static
routes,RIP),AccessControllists,L2/3
QoS
OptionalupgradestoIPServices(Adv.
L3protocolsupport)andAdvancedIP
Services(IPv6)
*planned
Table7EthernetI/OModuleOptions
I/OModule/
Features
EmulexFC4Passthrough Brocade4424AccessGatewayandFC4Switch
Internalports 16 8/16
Externalports 16x4GSFP 4/8x4GSFP
Speed
1/2/4G
1/2/4G
Manageability N/A CLI/Web,
BrocadeandEMCFabricManagementtools
Features N/A AccessGatewayModeenablesNPIVfunctionalityon
externalports(enhancedinteroperability,simplified
setup,doesntconsumeanFCdomain)
12or24portenablementoptions
Page27
Table8FibreChannelI/OModuleOptions
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I/OModule/
Features
CiscoSFSM7000InfiniBandSwitch*
Internalports 16
External
ports
8
Copper
or
Optical
ports
Speed 4xDDR
Manageability Fabricbasedmanagement
*planned
Table9InfiniBandI/OModuleOption
Atthebottomofthechassisarethesystempowersupplies. Seethepowersectionformore
detailsonpowersupplyoperationandthepowersysteminfrastructure.
Cable Management
Oneoftheadvantagesofamodularserversystemisthereductionincablemanagementneeds
withina
rack
system.
The
inclusion
of
fabric
switches,
integrated
KVM
and
system
management
aggregationattheCMCsprovidessixfoldorbettercablereduction.Table10showsa
comparisonofatypicalreductionavailablewhenusingthePowerEdgeM1000eModularsystem
withintegratedswitches,comparedtotraditionalrackandstackcomponents.The
configurationinthetableassumesaserverwithfourEthernetportsandtwoFibreChannelports.
InsupportofthePowerEdgeM1000eDellisreleasinganimprovedmodularsystemcable
managementsystemtoeasesysteminstallationinDellorotherindustrystandardracks.
Component RackHeight ACpower
cables
Ethernet
Cables
FCCables KVM
Cables
2socketserver 1Ux16 2x16 4x16 2x16 USBx16+
VGAx16
KVM 1U 1 USBx1+
VGAx1
Ethernet
Switches
1Ux4 1x4 4x4
FCSwitches 1Ux2 1x2 2x2
TotalRack 23Uheight 39ACcables 72Ethernet
Cables
36FC
Cables
USBx17+
VGAx17
PowerEdge
M1000e
Equivalent
10Uheight 6ACcables 16Ethernet
Cables
4FCCables USBx1+
VGAx1
Table10TypicalModularServerSystemRackHeightandCableReduction
Power
Page28
Dellleadstheindustryinpower/performanceefficiencywithitsEnergySmartproducts,andthe
PowerEdgeM1000econtinuesthistradition. Amodularsystemhasmanyadvantagesover
standardrackmountserversintermsofpoweroptimization,andthisaspectwasafocalpoint
throughoutthePowerEdgeM1000esconceptualizationanddevelopment. Thekeyareasof
interestarePowerDeliveryandPowerManagement.
5/22/2018 Pedge m1000e
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Power Delivery
InsupportofthePowerEdgeM1000e,DellintroducesaSinglePhase60AmpPDUandaThree
Phase30AmpPDU. Becausethreephase30Amppoweristhemostcommondatacenterhigh
powerfeed,
the
system
has
been
sized
to
fit
perfectly
within
that
envelope,
taking
one
three
phase30Ampfeedpersetofthreepowersuppliesunderanyloadingcondition.Thethreephase
powergridiscomplementedbythe3+3redundantpowersystemofthePowerEdgeM1000e.
FeaturesforthePDUsareshowninTable11.PDUssupportworldwidestandardhighpower
connectionsforeaseofinstallation,andstandardzeroUverticalmountingwithinDellracks.
TypicalconfigurationsforthePowerEdgeM1000ewithsinglephaseandthreephasePDUsare
showninFigure19andFigure20.
Feature SinglePhasePDU ThreePhasePDU
Mounting 1UHorizontalorzeroUvertical
Outlets 3xC19
InputVoltage Singlephase200to240VAC
nominal
3phase200to240VAC
nominal
LineFrequency 47to63Hertz
RecommendedACservice 60Amps 30Amps(NA/Japan),32
Amps(International)
FixedInputPlug/CordRating IEC30960APin&Sleeve
Plug
NEMAL1530P(NA/Japan),
IEC3094pole,4wire,380415
VAC,32A(International)
OutputRating
Voltage
200
240
VAC
60/50
Hz,
1
phase
OutputRatingCurrent
(IEC320C19)
16Amps
CircuitBreaker,OverCurrent
Protection
20A,peroutletreceptacle
Table11PowerEdgeM1000eSinglePhaseandThreePhasePDUOptions
ThepowerdistributioninsidethePowerEdgeM1000eModularServerSystemconsistsofa3+3
redundantpowersupplysystem,locatedintherearbottomofthechassis. Eachpowersupplyis
ratedat2360W. Withcurrentsharingbetweenpowersupplies,totalsystemredundantpoweris
approximately6700W
in
a
3+3
power
supply
configuration.
Page29
ThePowerEdgeM1000eprovidesindustryleadingpowerefficiencyanddensity,accomplished
throughhighlyefficientcomponents,improveddesigntechniquesandafreshairplenumthat
reducestheairtemperaturetothepowersupplycomponents. Loweroperatingtemperature
equatestohigherpowerdensityforthepowersupply,exceeding21Wattspercubicinch,and
higherpowerefficiency,betterthan86%at20%load,andhigheratheavierloads,approaching
91%efficiencyundernormaloperatingconditions.
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Figure19PowerEdgeM1000eSinglePhasePDUPowerSystem
PSU-1
2360W
PSU-6
2360W
PSU-52360W
PSU-4
2360W
PSU-3
2360W
PSU-2
2360W
Three
Phase
30 Amp
PDU-1
12
Three Phase
Power Cord
(30 Amp
Service)
Three
Phase30 Amp
PDU-2
Three Phase
Power Cord(30 Amp
Service)
3
123
13.8 Amps
Single Phase
24 AmpsThree Phase
Page30
Figure20PowerEdgeM1000eThreePhasePDUPowerSystem
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Figure21PowerEdgeM1000e2360WattPowerSupply
PowerefficiencyinthePowerEdgeM1000edoesnotstopwiththepowersupply. Everyaspectof
efficiencyhasbeentweakedandimprovedfrompreviousdesigns,addingmorecoppertoPC
boardpowerplanestoreduceI2Rlosses,improvedinductorsandothercomponents,increasing
efficienciesofDCDCconverters,andreplacingsomelinearvoltageregulatorswithmore
efficientswitchingregulators.
PowerredundancyinthePowerEdgeM1000esupportsanynecessaryusagemodel. The
PowerEdgeM1000erequiresthree2360Wattpowersuppliestopowerafullypopulatedsystem
orsixpowersuppliesinafullyredundantsystem. Figure22showstypicalpowerredundancy
models. IntheN+Npowersupplyconfiguration,thesystemprovidesprotectionagainstACgrid
lossorpowersupplyfailures. Ifonepowergridfails,threepowersupplieslosetheirACsource,
andthethreepowersuppliesontheothergridremainpowered,providingsufficientpowerfor
thesystemtocontinuerunning.IntheN+1configurationonlypowersupplyfailuresare
protected,notgridfailures. Thelikelihoodofmultiplepowersuppliesfailingatthesametimeis
remote. IntheN+0configurationthereisnopowerprotectionandanyprotectionmustbe
providedatthenodeorchassislevel. TypicallythiscaseisanHPCCorotherclustered
environmentwhereredundantpowerisnotaconcern,sincetheparallelismoftheprocessing
nodesacrossmultiplesystemchassisprovidesalltheredundancythatisnecessary.
Themidplanecarriesall12VoltDCpowerforthesystem,bothmainpowerandstandbypower.
TheCMCs,LCDandControlPanelarepoweredsolelyby12VoltStandbypower,insuringthat
chassislevelmanagementisoperationalinthechassisstandbystate,wheneverACpoweris
present.Theservermodules,I/OModules,Fans,andiKVMarepoweredsolelyby12VoltMain
power.
Page31
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Page32
Figure22PowerRedundancyModes
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Figure23PowerArchitecture
Power Management
Powerisnolongerjustaboutpowerdelivery,itisalsoaboutpowermanagement. The
PowerEdgeM1000eSystemaddsanumberofadvancedpowermanagementfeatures. Mostof
thesefeaturesoperatetransparentlytotheuser,whileothersrequireonlyaonetimeselectionof
desiredoperating
modes.
Sharedpowertakesadvantageofthelargenumberofresourcesinthemodularserver,
distributingpoweracrossthesystemwithouttheexcessmarginrequiredindedicatedrack
mountserversandswitches. ThePowerEdgeM1000eintroducesanadvancedpowerbudgeting
feature,controlledbytheCMCandnegotiatedinconjunctionwiththeiDRAConeveryserver
module. Priortoanyservermodulepoweringup,throughanyofitspowerupmechanismssuch
asACrecovery,WOLorasimplepowerbuttonpress,theservermoduleiDRACperformsa
sophisticatedpowerbudgetinventoryfortheservermodule,baseduponitsconfigurationof
CPUs,memory,I/Oandlocalstorage. Oncethisnumberisgenerated,theiDRACcommunicates
thepowerbudgetinventorytotheCMC,whichconfirmstheavailabilityofpowerfromthe
systemlevel,baseduponatotalchassispowerinventory,includingpowersupplies,iKVM,I/O
Modules,fans
and
server
modules.
Since
the
CMC
controls
when
every
modular
system
element
powerson,itcannowsetpowerpoliciesonasystemlevel.
Page33
IncoordinationwiththeCMC,iDRAChardwareconstantlymonitorsactualpowerconsumption
ateachservermodule. Thispowermeasurementisusedlocallybytheservermoduletoinsure
thatitsinstantaneouspowerconsumptionneverexceedsthebudgetedamount. Whilethe
systemadministratormaynevernoticethesefeaturesinaction,whattheyenableisamore
aggressiveutilizationofthesharedsystempowerresources. Nolongeristhesystemflying
blindinregardstopowerconsumption,andthereisnodangerofexceedingpowercapacity
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availability,whichcouldresultinaspontaneousactivationofpowersupplyovercurrent
protectionwithoutthesefeatures.
Thesystemadministratorcanalsosetprioritiesforeachservermodule. Thepriorityworksin
conjunctionwith
the
CMC
power
budgeting
and
iDRAC
power
monitoring
to
insure
that
the
lowestprioritybladesarethefirsttoenteranypoweroptimizationmode,shouldconditions
warranttheactivationofthisfeature.
ThePowerEdgeM1000eintroducescompliancetoPMBusSpecification1.1,usingthisnewpower
managementstandardforstatus,measurementandcontrol. PowerEdgeM1000epowersupplies
continuouslymonitorACinputcurrent,voltageandpower,enablingexposureofdatatoDell
OpenManageITAssistantortootherenterpriselevelmanagementtools. Realtimepower
consumptionisnowviewablepersystem.
Cooling
The
cooling
strategy
for
the
PowerEdge
M1000e
supports
a
low
impedance,
high
efficiency
designphilosophy. Drivinglowerairflowimpedanceallowsthesystemtodrawairthroughthe
systemataloweroperatingpressurethancompetitivesystems. Insomecases,thiscanbeupto
40%lessbackpressurethansimilarlyconfiguredcompetitiveproducts. Thelowerbackpressure
reducesthesystemfanpowerconsumedtomeettheairflowrequirementsofthesystem.
Thelowimpedancedesigniscoupledwithahighefficiencyairmovingdevicedesigned
explicitlyforthePowerEdgeM1000e. Theefficiencyofanairmovingdeviceisdefinedasthe
workoutputofthefanascomparedtotheelectricalpowerrequiredtorunthefan. Thesystem
fanoperatesatefficienciesupto40%greaterthantypicalaxialfansonthemarket,which
correlatesdirectlyintosavingsinthecustomersrequiredpowertocool.
Figure24PowerEdgeM1000eFan
Page34
Thehighefficiencydesignphilosophyalsoextendsintothelayoutofthesubsystemswithinthe
PowerEdgeM1000e. TheServerModules,I/OModules,andPowerSuppliesareincorporated
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intothesystemwithindependentairflowpaths. Thisisolatesthesecomponentsfrompreheated
air,reducingtherequiredairflowconsumptionsofeachmodule.
Figure25ServerModuleCoolingAirProfile
Figure26I/OModuleCoolingAirProfile
Page35
Server Module Inlet(M1000e front view)
I/O Module Inlet(M1000e front view)
IOM Locations and Airflow Direction(M1000e back view)
I/O Cooling Air Profile(M1000e side view)
Server Module Cooling Air Profile(M1000e side view)
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TheServerModulesarecooledwithtraditionalfronttobackcooling. AsshowninFigure25,the
frontofthesystemisdominatedbyinletareafortheindividualservermodules. Theairpasses
throughtheservermodules,throughventingholesinthemidplane,andisthendrawnintothe
fanswhich
exhaust
the
air
from
the
chassis.
There
are
plenums
both
upstream
of
the
midplane,
betweenthemidplaneandtheblades,anddownstreamofthemidplane,betweenthemidplane
andthefans,tomoreevenlydistributethecoolingpotentialfromthethreecolumnsoffans
acrosstheservermodules.
TheI/OModulesuseabypassducttodrawambientairfromthefrontofthesystemtotheI/O
Moduleinlet,asseeninFigure26. Thisductislocatedabovetheservermodules. Thiscoolairis
thendrawndownthroughtheI/OModulesinatoptobottomflowpathandintotheplenum
betweenthemidplaneandfans,fromwhereitisexhaustedfromthesystem.
ThePowerSupplies,locatedintherearofthesystem,usebasicfronttobackcooling,butdraw
theirinletairfromaductlocatedbeneaththeservermodules,asseeninFigure27. Thisinsures
thatthepowersuppliesreceiveambienttemperatureair.
Figure27PowerSupplyCoolingAirProfile
Thishardwaredesigniscoupledwithathermalcoolingalgorithmthatincorporatesthe
following:
ServerModulelevelthermalmonitoringbytheiDRAC
I/OModulethermalhealthmonitors
FancontrolandmonitoringbytheCMC
TheiDRAConeachservermodulescalculatestheamountofairflowrequiredonanindividual
servermodulelevelandsendsarequesttotheCMC. Thisrequestisbasedontemperature
conditionsontheservermodule,aswellaspassiverequirementsduetohardwareconfiguration.
Concurrently,eachIOMcansendarequesttotheCMCtoincreaseordecreasecoolingtotheI/O
subsystem. TheCMCinterpretstheserequests,andcancontrolthefansasrequiredtomaintain
ServerandI/OModuleairflowatoptimallevels.
Page36
Power Supply Inlet(M1000e front view)
Power Supply Cooling Air Profile(M1000e side view)
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FansareN+1redundant,meaningthatanysinglefancanfailwithoutimpactingsystemuptime
orreliability. Intheeventofafanfailure,systembehaviorisdependentontheresultant
temperaturesofthesystem,asmonitoredbytheServerModuleiDRACandI/OModules.The
CMCcontinues
to
interpret
the
airflow
needs
of
each
server
and
I/O
module
to
control
the
fan
speedsappropriately. Thesystemdoesnotrampthefanstofullspeedintheeventofafan
failureunlessdeemednecessarybyonboardmonitoring.
ThePowerEdgeM1000eisengineeredforgoodsoundqualityinaccordancewiththeDell
Enterpriseacousticalspecification. Comparedtopreviousgenerationsofproductsthefanshave
morelevelsofcontrol,allowingmuchfinertuningofthefanbehavior.Firmwareisoptimizedto
choosethelowestfanspeedsandthereforethelowestacousticaloutputforanyconditionand
configuration.
System Management
DellsPowerEdgeM1000emodularserverdeliversmajorenhancementsinmanagementfeatures.
Thesefeatures
are
based
on
direct
customer
feedback
and
assist
customers
deploying
modular
serversintheirenvironment. Eachsubsystemhasbeenreviewedandadjustedtooptimize
efficiencies,minimizingtheimpactstoexistingmanagementtoolsandprocesses,andproviding
futuregrowthopportunitiestostandardsbasedmanagement.
Blade-16
CMC 1
L2+ Switch
CMC MPUChassis
Mngmt
CMC 2
L2+ Switch
CMC MPUChassis
Mngmt
Blade-1
iDRAC iDRAC
IOM-1
Mgmt
IOM-6
Mgmt
Local KVM
Management Network 1
Management Network 2
Analog
video, USB
Keyboard
and mouse
I2C
Power
Supply 1
Power
Supply 2
Power
Supply 6
Chassis
buttons, FRU,
LEDs
PWM, TACH
Intranet Intranet
OSCAR
FAN 1 FAN 2 FAN 9
I2C
LCD Panel
Figure28SystemManagementArchitectureSimplifiedBlockDiagram
Page37
Figure28illustratesthemanagementconnectionswhichtransferhealthandcontroltraffic
throughoutchassis. Thesystemmanagementfabricisarchitectedfor100BaseTEthernetover
differentialpairsroutedtoeachmodule.Therearetwo100BaseTinterfacesbetweenCMCs,one
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switchedandoneunswitched.AllsystemmanagementEthernetisroutedfor100Mbps
signaling.EverymodulehasamanagementnetworklinktoeachCMC,withredundancy
providedatthemodulelevel. Failureofanyindividuallinkcausesfailovertotheredundant
CMC.
Chassis Management Controller (CMC)
ChassismanagementisaccessedandmanagedbytheChassisManagementControllerorCMC.
ThePowerEdgeM1000epossessesatleastoneCMCandsupportsanoptionalredundant
module,eachoccupyingaslotaccessiblethroughtherearofthechassis. Redundancyis
providedinanActiveStandbypairingofthemodulesandfailoveroccurswhentheactive
modulehasfailedordegraded. TheCMCinterfacesthroughdualstacking10/100/1000Ethernet
portsandoneserialport. TheCMCserialportinterfaceprovidescommonmanagementofupto
sixI/Omodulesthroughasingleconnection.
Figure29PowerEdgeM1000eChassisManagementController
Page38
Figure30ChassisManagementControllerFrontPanel
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TheCMCprovidessecureremotemanagementaccesstothechassisandinstalledmodules. It
managesorfacilitatesthemanagementofthefollowing:
Status, Inventory and Alerting for server modules, chassis infrastructure and I/O
Modules
CentralizedconfigurationforiDRAC,I/OModulesandCMC
SSL/SSH
Powersequencingofmodulesinconjunctionwiththedefinedchassispowerstates
Powerbudgetmanagementandallocation
Configurationoftheembeddedmanagementswitch,whichfacilitatesexternalaccessto
manageablemodules.
Remoteusermanagement
Userinterfaceentrypoint(web,telnet,SSH,serial)
Monitoring and alerting for chassis environmental conditions or component health
thresholds. Thisincludesbutisnotlimitedtothefollowing:
o
Real
time
power
consumption
o Powersupplies
o Fans
o Powerallocation
o Temperature
o CMCredundancy
o I/Ofabricconsistency
SMASHCLPfeaturesprovidingchassisservermodulepowercontrolfunctions
WSMAN
CIMXML
SNMP
RACADM
Ethernettraffic
management
(firewall)
Ethernetswitchmanagement
PrivateVLAN
PrivateDHCPservice
PrivateTFTPservice
VirtualMedia
VirtualKVMinterfacebetweentheIPnetworkandtheservermoduleiDRACvKVM
FirmwaremanagementofCMC,IOM,iDRAC,iKVM
Integrated Dell Remote Access Controller (iDRAC)
Theservermodulebasemanagementsolutionincludesadditionalfeaturesforefficient
deploymentand
management
of
servers
in
a
modular
server
form
factor.
The
base
circuit,
which
integratestheBMCfunctionwithhardwaresupportforVirtualKVM(vKVM)andVirtualMedia
(vMedia),iscalledtheintegratedDellRemoteAccessControlleroriDRAC.iDRAChastwo
Ethernetconnections,oneforeachCMC,providingsystemmanagementinterfaceredundancy.
Page39
DellmodularserversnowincludevKVMasastandardfeature,routingtheoperatorskeyboard
output,mouseoutputandvideobetweenthetargetservermoduleandaconsolelocatedonthe
systemmanagementIPnetwork.WithuptotwosimultaneousvKVMsessionsperblade,remote
managementnowsatisfiesvirtuallyanyusagemodel. vMediaisalsonowstandard,providing
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emulationofUSBDVDR/W,USBCDR/W,USBFlashDrive,USBISOimageandUSBFloppy
overanIPinterface. ConnectiontovKVMandvMediaisthroughtheCMC,withencryption
availableonaperstreambasis.
Highlightsof
the
iDRAC
solution
include
the
following:
Dedicatedmanagementinterfaceforhighperformancemanagementfunctions
VirtualMedia
VirtualKVM
IPMI2.0OutOfBandmanagement
SerialoverLANredirection
SMASHCLP
Bladestatusandinventory
Activepowermanagement
IntegrationwithActiveDirectory
Security,LocalandActiveDirectory
Integrated Keyboard and Mouse Controller
ThemodularenclosuresupportsoneoptionalIntegratedKVM(iKVM)module. Thismodule
occupiesasingleslotaccessiblethroughtherearofthechassis. TheiKVMredirectslocalserver
modulevideo,keyboard,andmouseelectricalinterfacestoeithertheiKVMlocalportsorthe
PowerEdgeM1000efrontpanelports. TheiKVMallowsasingledonglelessVGAmonitor,USB
keyboard,andUSBmousetobeattachedandthenmovedbetweenservermodulesasneeded
throughanonscreendisplayselectionmenu. TheiKVMalsohasanAnalogConsoleInterface
(ACI)compatibleRJ45portthatallowstheiKVMtotietheinterfacetoaKVMappliance
upstreamoftheiKVMviaCAT5cabling. DesignedwithAvocenttechnology,theACIport
reducescostandcomplexitybygivingaccessforsixteenserversusingonlyoneportonan
external
KVM
Switch.
Figure31PowerEdgeM1000eiKVMModule
Page40
TheiKVMcontainsanewseventeenthbladefeature,connectingtheCMCCommandLine
InterfaceviatheKVMswitchandallowingtextbaseddeploymentwizardsonVGAmonitors.
iKVMfirmwareisupdatedthroughtheCMC.
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Figure32iKVMFrontPanel
Control Panel and LCD
The
control
panel
contains
the
local
user
interface.
Functions
include
chassis
level
diagnostic
LEDs,LCDdisplayandpowerbutton. Thisdeviceisnothotpluggableandisalwayspowered,
eveninchassisstandbymode.
Figure33PowerEdgeM1000eLCDPanelRecessedPosition
Page41
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Page42
Figure34PowerEdgeM1000eLCDPanelDuringUsage
TheChassisLCDshowschassisinformation,chassisstatusandfaults,majorservermodulefaults
andprovides
an
interface
for
server
module
and
CMC
network
configuration.
Included
is
an
errormessagewhennoCMCispresentinthechassis.ServiceTag,AssetTagandIPAddressare
noweasilyvisibleoneveryPowerEdgeM1000emodularsystemthroughtheLCDdisplay. The
LCDpanelcanberetractedintothechassisbody,orextendedandangledoncedeployedforfull
visibilitynomatterwherethePowerEdgeM1000eismountedintherack.
*Graphicimagesmaydifferfromfinalproduct
Figure35LCDGraphicExamples
Conclusion
ThePowerEdgeM1000eModularServerEnclosureisabreakthroughinenterpriseclassserver
design.DelloptimizedthenewPowerEdgeM1000eModularServerEnclosureandM600/605
ServerModulesto:
Maximizeflexibility modularI/O,power,cooling,andmanagementarchitecture.
Maximizelongevity optimizedpowerandcoolingdesignsupportscurrentandfuture
generationsofservermodulesandI/O.I/Obandwidthtosupportnotonlytodaysgeneration
of10GbEthernet,20GbpsInfiniBandand4GbpsFibreChannel,butupto40GbpsQDR
InfiniBand,10GbpsSerialEthernet,and8GbpsFibreChannel.
Lower
TCO
lower
cost
than
monolithic
servers
with
equivalent
features.
Best
in
class
power
andcoolingefficiency.
Acknowledgments
TheauthorwouldliketothankRichardCrisp,MikeRobertsandK.C.Coxefortheir
contributionstothiswhitepaper.